Lenovo ThinkSystem ST650 V2 User manual

ThinkSystem ST650 V2
Maintenance Manual
Machine Types: 7Z74 and 7Z75

Note
Before using this information and the roduct it su orts, be sure to read and understand the safety
information and the safety instructions, which are available at:
htt ://thinksystem.lenovofiles.com/hel /to ic/safety_documentation/ df_files.html
In addition, ensure that you are familiar with the terms and conditions of the Lenovo warranty for your server,
which can be found at:
htt ://datacentersu ort.lenovo.com/warrantylooku
Second Edition (July 2021)
© Copyright enovo 2021.
LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered ursuant to a General Services
Administration (GSA) contract, use, re roduction, or disclosure is subject to restrictions set forth in Contract No. GS-35F-
05925.

Contents
Safety . . . . . . . . . . . . . . . . . . v
Safety ins ection checklist . . . . . . . . . . . vi
Chapter 1. Introduction . . . . . . . . . 1
Server form factor . . . . . . . . . . . . . . . 1
S ecifications . . . . . . . . . . . . . . . . 1
Particulate contamination . . . . . . . . . . 8
Firmware u dates . . . . . . . . . . . . . . . 9
Tech Ti s . . . . . . . . . . . . . . . . . 13
Security advisories . . . . . . . . . . . . . 13
Power on the server . . . . . . . . . . . . . 13
Power off the server . . . . . . . . . . . . . 13
Chapter 2. Server components . . . . 15
Front view . . . . . . . . . . . . . . . . . 16
Front anel . . . . . . . . . . . . . . . 21
Rear view . . . . . . . . . . . . . . . . . 24
Rear view LEDs . . . . . . . . . . . . . 26
External LCD diagnostics handset. . . . . . 27
System board com onents . . . . . . . . . . 33
System board LEDs . . . . . . . . . . . 35
System board switches . . . . . . . . . . 36
Server locks . . . . . . . . . . . . . . . . 38
Back lates and back lanes . . . . . . . . . . 39
2.5-inch drive back lanes . . . . . . . . . 39
3.5-inch drive back lanes . . . . . . . . . 40
3.5-inch drive back late. . . . . . . . . . 41
Power distribution board connectors . . . . . . 41
Parts list. . . . . . . . . . . . . . . . . . 42
Power cords . . . . . . . . . . . . . . 46
Chapter 3. Internal cable routing . . . 47
Back lane and back late cable routing . . . . . 48
Front anel cable routing . . . . . . . . . . . 48
Front USB cable routing . . . . . . . . . . . 49
GPU cable routing . . . . . . . . . . . . . . 50
Internal CFF RAID ada ter cable routing . . . . . 50
M.2 boot ada ter cable routing. . . . . . . . . 51
O tical drive cable routing. . . . . . . . . . . 52
PCIe slot 8 cable routing . . . . . . . . . . . 52
Power distribution board cable routing . . . . . . 53
Ta e drive cable routing . . . . . . . . . . . 54
Chapter 4. Hardware replacement
procedures . . . . . . . . . . . . . . . 57
Installation guidelines . . . . . . . . . . . . 57
Safety ins ection checklist. . . . . . . . . 58
System reliability guidelines . . . . . . . . 59
Working inside the server with the ower on . . 59
Handling static-sensitive devices . . . . . . 60
2.5-inch hot-swa drive back lane re lacement . . 60
Remove a 2.5-inch hot-swa drive
back lane . . . . . . . . . . . . . . . 60
Install a 2.5-inch hot-swa drive back lane . . 62
2.5-inch drive re lacement from 3.5-inch drive
bay. . . . . . . . . . . . . . . . . . . . 63
Remove a 2.5-inch drive from a 3.5-inch drive
bay . . . . . . . . . . . . . . . . . . 64
Install a 2.5-inch drive into a 3.5-inch drive
bay . . . . . . . . . . . . . . . . . . 65
3.5-inch hot-swa drive back lane re lacement . . 66
Remove a 3.5-inch hot-swa drive
back lane . . . . . . . . . . . . . . . 67
Install a 3.5-inch hot-swa drive back lane . . 68
3.5-inch sim le-swa drive back late
re lacement . . . . . . . . . . . . . . . . 69
Remove a 3.5-inch sim le-swa drive
back late . . . . . . . . . . . . . . . 69
Install a 3.5-inch sim le-swa drive
back late . . . . . . . . . . . . . . . 71
Air baffle re lacement . . . . . . . . . . . . 72
Remove the air baffle . . . . . . . . . . . 72
Install the air baffle . . . . . . . . . . . . 74
CMOS battery (CR2032) re lacement . . . . . . 76
Remove the CMOS battery (CR2032) . . . . 76
Install the CMOS battery (CR2032) . . . . . 78
Drive re lacement . . . . . . . . . . . . . . 79
Remove a sim le-swa drive . . . . . . . . 80
Install a sim le-swa drive. . . . . . . . . 81
Remove a hot-swa drive . . . . . . . . . 83
Install a hot-swa drive . . . . . . . . . . 84
EIA brackets re lacement . . . . . . . . . . . 86
Remove the EIA brackets . . . . . . . . . 86
Install the EIA brackets . . . . . . . . . . 88
Ex ansion drive cage re lacement . . . . . . . 90
Remove the ex ansion drive cage . . . . . . 90
Install the ex ansion drive cage. . . . . . . 91
Fan and fan cage re lacement . . . . . . . . . 93
Remove a hot-swa fan . . . . . . . . . . 93
Install a hot-swa fan . . . . . . . . . . . 94
Remove the fan cage assembly . . . . . . . 95
Install the fan cage assembly . . . . . . . . 97
Flash ower module re lacement . . . . . . . . 98
Remove a flash ower module . . . . . . . 98
Install a flash ower module . . . . . . . . 100
© Co yright Lenovo 2021 i

Foot stands re lacement . . . . . . . . . . . 102
Remove the foot stands . . . . . . . . . . 102
Install the foot stands . . . . . . . . . . . 104
Front bezel re lacement . . . . . . . . . . . 105
Remove the front bezel . . . . . . . . . . 105
Install the front bezel . . . . . . . . . . . 106
Front door re lacement. . . . . . . . . . . . 107
Remove the front door . . . . . . . . . . 107
Install the front door . . . . . . . . . . . 109
Front anel board assembly re lacement. . . . . 110
Remove the front anel board assembly . . . 110
Install the front anel board assembly . . . . 111
Full-length GPU ada ter re lacement . . . . . . 113
Remove a full-length GPU ada ter . . . . . 113
Install a full-length GPU ada ter . . . . . . 114
GPU filler re lacement . . . . . . . . . . . . 116
Remove a GPU filler . . . . . . . . . . . 116
Install a GPU filler . . . . . . . . . . . . 118
Heat sink Torx T30 nut re lacement . . . . . . . 119
Remove a heat sink Torx T30 nut . . . . . . 119
Install a heat sink Torx T30 nut . . . . . . . 121
Internal CFF ada ter re lacement. . . . . . . . 122
Remove the internal CFF ada ter . . . . . . 122
Install the internal CFF ada ter . . . . . . . 124
Intrusion switch re lacement . . . . . . . . . 127
Remove the intrusion switch . . . . . . . . 127
Install the intrusion switch . . . . . . . . . 128
M.2 boot ada ter re lacement . . . . . . . . . 130
Remove the M.2 boot ada ter . . . . . . . 130
Install the M.2 boot ada ter . . . . . . . . 131
M.2 drive re lacement . . . . . . . . . . . . 133
Remove an M.2 drive . . . . . . . . . . . 133
Adjust the retainer on the M.2 boot
ada ter . . . . . . . . . . . . . . . . 134
Install an M.2 drive . . . . . . . . . . . . 135
Memory module re lacement . . . . . . . . . 137
Remove a memory module . . . . . . . . 137
Install a memory module . . . . . . . . . 139
NVLink bridge re lacement . . . . . . . . . . 141
Remove an NVLink bridge . . . . . . . . . 141
Install an NVLink bridge . . . . . . . . . . 142
O tical drive cage re lacement. . . . . . . . . 144
Remove the o tical drive cage . . . . . . . 144
Install the o tical drive cage . . . . . . . . 145
O tical drive or ta e drive re lacement . . . . . 147
Remove an o tical drive or a ta e drive. . . . 147
Install an o tical drive or a ta e drive. . . . . 150
Remove the 5.25-inch drive bay ada ter
assembly . . . . . . . . . . . . . . . 153
Install the 5.25-inch drive bay ada ter
assembly . . . . . . . . . . . . . . . 156
PCIe ada ter holder re lacement . . . . . . . . 159
Remove a PCIe ada ter holder . . . . . . . 160
Install a PCIe ada ter holder . . . . . . . . 161
PCIe ada ter re lacement. . . . . . . . . . . 162
Remove a PCIe ada ter . . . . . . . . . . 162
Install a PCIe ada ter . . . . . . . . . . . 164
Power distribution board re lacement . . . . . . 166
Remove the ower distribution board . . . . 166
Install the ower distribution board . . . . . 168
Power su ly unit re lacement . . . . . . . . . 170
Remove a hot-swa ower su ly. . . . . . 170
Install the hot-swa ower su ly . . . . . . 173
Processor and heat sink re lacement . . . . . . 177
Remove a rocessor and heat sink . . . . . 177
Se arate the rocessor from carrier and heat
sink. . . . . . . . . . . . . . . . . . 181
Install a rocessor and heat sink . . . . . . 183
Server cover re lacement . . . . . . . . . . . 188
Remove the server cover . . . . . . . . . 188
Install the server cover . . . . . . . . . . 190
System board re lacement (trained technician
only) . . . . . . . . . . . . . . . . . . . 192
Remove the system board . . . . . . . . . 192
Install the system board . . . . . . . . . . 196
U date the machine ty e and serial
number . . . . . . . . . . . . . . . . 198
Enable TPM/TCM . . . . . . . . . . . . 200
Enable UEFI Secure Boot . . . . . . . . . 202
T4 filler re lacement . . . . . . . . . . . . . 203
Remove a T4 filler . . . . . . . . . . . . 203
Install a T4 filler . . . . . . . . . . . . . 204
Com lete the arts re lacement . . . . . . . . 206
Chapter 5. Problem
determination . . . . . . . . . . . . . 207
Event logs . . . . . . . . . . . . . . . . . 207
Light ath diagnostics . . . . . . . . . . . . 209
General roblem determination rocedures . . . . 209
Resolving sus ected ower roblems . . . . 209
Resolving sus ected Ethernet controller
roblems . . . . . . . . . . . . . . . 210
Troubleshooting by sym tom . . . . . . . . . 211
Drive roblems . . . . . . . . . . . . . 211
Fan roblems . . . . . . . . . . . . . . 213
Intermittent roblems. . . . . . . . . . . 213
Keyboard, mouse, or USB-device
roblems . . . . . . . . . . . . . . . 214
Memory roblems . . . . . . . . . . . . 215
Monitor and video roblems . . . . . . . . 219
ii ThinkSystem ST650 V2 Maintenance Manual

Network roblems . . . . . . . . . . . . 221
Observable roblems. . . . . . . . . . . 221
O tional-device roblems . . . . . . . . . 223
Power on and ower off roblems . . . . . . 224
Processor roblems . . . . . . . . . . . 225
Serial-device roblems . . . . . . . . . . 226
Software roblems. . . . . . . . . . . . 226
Appendix A. Hardware
disassembling for recycle . . . . . . . 229
Disassemble the server for chassis recycle . . . . 229
Appendix B. Getting help and
technical assistance . . . . . . . . . . 231
Before you call . . . . . . . . . . . . . . . 231
Collecting service data . . . . . . . . . . . . 232
Contacting Su ort . . . . . . . . . . . . . 233
Appendix C. Notices. . . . . . . . . . 235
Trademarks . . . . . . . . . . . . . . . . 236
Im ortant notes . . . . . . . . . . . . . . . 236
Telecommunication regulatory statement. . . . . 236
Electronic emission notices . . . . . . . . . . 237
Taiwan BSMI RoHS declaration . . . . . . . 237
Taiwan im ort and ex ort contact information . . . 237
Index . . . . . . . . . . . . . . . . . . 239
© Co yright Lenovo 2021 iii

iv ThinkSystem ST650 V2 Maintenance Manual

Safety
Before installing this roduct, read the Safety Information.
Antes de instalar este roduto, leia as Informações de Segurança.
在安装本产品之前，请仔细阅读 Safety Information （安全信息）。
Læs sikkerhedsforskrifterne, før du installerer dette rodukt.
Lees voordat u dit roduct installeert eerst de veiligheidsvoorschriften.
Ennen kuin asennat tämän tuotteen, lue turvaohjeet kohdasta Safety Information.
Avant d'installer ce roduit, lisez les consignes de sécurité.
Vor der Installation dieses Produkts die Sicherheitshinweise lesen.
Prima di installare questo rodotto, leggere le Informazioni sulla Sicurezza.
Les sikkerhetsinformasjonen (Safety Information) før du installerer dette roduktet.
Antes de instalar este roduto, leia as Informações sobre Segurança.
© Co yright Lenovo 2021 v

Antes de instalar este roducto, lea la información de seguridad.
Läs säkerhetsinformationen innan du installerar den här rodukten.
Safety inspection checklist
Use the information in this section to identify otentially unsafe conditions with your server. As each machine
was designed and built, required safety items were installed to rotect users and service technicians from
injury.
CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. enovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products.
Important: Electrical grounding of the server is required for o erator safety and correct system function.
Pro er grounding of the electrical outlet can be verified by a certified electrician.
Notes:
1. The roduct is not suitable for use at visual dis lay work laces according to §2 of the Work lace
Regulations.
2. The set-u of the server is made in the server room only.
Use the following checklist to verify that there are no otentially unsafe conditions:
1. Make sure that the ower is off and the ower cord is disconnected.
2. Check the ower cord.
• Make sure that the third-wire ground connector is in good condition. Use a meter to measure third-
wire ground continuity for 0.1 ohm or less between the external ground in and the frame ground.
• Make sure that the ower cord is the correct ty e.
To view the ower cords that are available for the server:
a. Go to:
htt ://dcsc.lenovo.com/#/
vi ThinkSystem ST650 V2 Maintenance Manual

b. In the Customize a Model ane:
1) Click Select Options/Parts for a Model.
2) Enter the machine ty e and model for your server.
c. Click the Power tab to see all line cords.
• Make sure that the insulation is not frayed or worn.
3. Check for any obvious non-Lenovo alterations. Use good judgment as to the safety of any non-Lenovo
alterations.
4. Check inside the server for any obvious unsafe conditions, such as metal filings, contamination, water or
other liquid, or signs of fire or smoke damage.
5. Check for worn, frayed, or inched cables.
6. Make sure that the ower-su ly cover fasteners (screws or rivets) have not been removed or tam ered
with.
© Co yright Lenovo 2021 vii

viii ThinkSystem ST650 V2 Maintenance Manual

Chapter 1. Introduction
The ThinkSystem ST650 V2 server is a 4U tower server designed for erformance and ex ansion for various
IT workloads. With the modular design, the server is flexible to be customized for maximum storage ca acity
or high storage density with selectable in ut/out ut o tions and tiered system management.
Performance, ease of use, reliability, and ex ansion ca abilities were key considerations in the design of the
server. These design features make it ossible for you to customize the system hardware to meet your needs
today and rovide flexible ex ansion ca abilities for the future.
The server comes with a limited warranty. For details about the warranty, see: htt s://su ort.lenovo.com/us/
en/solutions/ht503310
For details about your s ecific warranty, see: htt ://datacentersu ort.lenovo.com/warrantylooku
Server form factor
The ThinkSystem ST650 V2 server is designed to su ort both tower and rack form factors.
You can change the server from tower form factor to rack form factor by installing the tower to rack
conversion kit. For instructions on how to install the tower to rack conversion kit, refer to “Install the tower to
rack conversion kit” in the ThinkSystem ST650 V2 Setup Guide.
Specifications
The following information is a summary of the features and s ecifications of the server. De ending on the
model, some features might not be available, or some s ecifications might not a ly.
Table 1. Specifications
Specification Description
Dimension 4U server
• Height:
– Without foot stand: 448 mm (17.64 inches)
– With foot stand: 461.4 mm (18.17 inches)
• Width:
– Without foot stand: 174.2 mm (6.86 inches)
– With foot stand: 247.4 mm (9.74 inches)
• De th:
– Without front door: 710.8 mm (27.98 inches)
– With front door: 733.8 mm (28.89 inches)
Weight (depending on the
configuration)
• 2.5-inch drive configuration:
– Maximum: 39.28 kg (86.60 lb)
• 3.5-inch drive configuration:
– Maximum: 46.23 kg (101.92 lb)
© Co yright Lenovo 2021 1

Table 1. Specifications (continued)
Specification Description
Processor Su orts multi-core Intel Xeon rocessors, with integrated memory controller and Intel
Mesh UPI (Ultra Path Interconnect) to ology.
• Su orts u to two 250W rocessors
• Designed for the LGA 4189 socket
• Scalable u to 52 cores (with two rocessors installed)
• Su orts u to 4 UPI links at 11.2 GT/s
Notes:
• Only two-socket ty e CPUs are su orted in two CPU configurations.
• UPI function is only available when two or more rocessors are installed.
For a list of su orted rocessors, see:
htt s://static.lenovo.com/us/en/server roven/index.shtml
Memory • Minimum: 16 GB
• Maximum:
– 2048 GB using registered DIMMs (RDIMMs)
– 3072 GB using registered DIMMs (RDIMMs) and Persistent Memory Modules
(PMEM)
• Slots: thirty-two DIMM slots
• Su orts:
– 16 GB, 32 GB, 64 GB TruDDR4 3200 MHz RDIMM
– 128 GB Persistent Memory Modules (PMEM)
For a list of su orted memory modules, see:
htt s://static.lenovo.com/us/en/server roven/index.shtml
Drive bays (varies by
model)
Drive bays and drives su orted by your server vary by model.
• Storage drive bays:
– Server models with 3.5-inch sim le-swa drive bays
– Su orts u to twelve SATA drives
– Server models with 3.5-inch hot-swa drive bays
– Su orts u to sixteen SAS/SATA drives
– Su orts u to eight SAS/SATA drives and eight NVMe drives
– Server models with 2.5-inch hot-swa drive bays
– Su orts u to thirty-two SAS/SATA drives
– Su orts u to sixteen SAS/SATA drives and sixteen NVMe drives
• O tical drive bays
– Two o tical drive bays
– Su orts u to one ta e drive (RDX or LTO) and one o tical disk drive
Notes:
• The server su orts the installation of 2.5-inch SSDs in a 3.5 inch disk bay through
the use of a conversion kit. See “Install a 2.5-inch drive into a 3.5-inch drive bay” on
age 65 for details.
• When GPUs are installed, only two back lanes or back lates are su orted and no
o tical drive or ta e drive can be installed.
2ThinkSystem ST650 V2 Maintenance Manual

Table 1. Specifications (continued)
Specification Description
M.2 drive Su orts u to two M.2 drives:
• 42 mm (2242)
• 60 mm (2260)
• 80 mm (2280)
• 110 mm (22110)
Expansion slots Nine PCIe ex ansion slots are available:
• Slot 1: PCIe4 x16, 75W, Full-height, half-length
• Slot 2: PCIe4 x8 (o en end), 75W, Full-height, half-length
• Slot 3: PCIe4 x16, 75W, Full-height, half-length
• Slot 4: PCIe4 x8 (o en end), 75W, Full-height, half-length
• Slot 5: PCIe4 x16, 75W, Full-height, half-length
• Slot 6: PCIe4 x8 (o en end), 75W, Full-height, half-length
• Slot 7: PCIe4 x16, 75W, Full-height, half-length
• Slot 8: PCIe3 x8 (o en end), 75W, Full-height, half-length (requires additional cable
connection, see “PCIe slot 8 cable routing” on age 52)
• Slot 9: PCIe4 x8 (o en end), 75W, Full-height, half-length
Notes: When Slot 8 is used:
• U to 6 NVMe drives can be su orted in 3.5-inch configurations with two NVMe/
AnyBay back lanes.
• U to 14 NVMe drives can be su orted in 2.5-inch configurations with two NVMe/
AnyBay back lanes.
• 3.5-inch configurations with two NVMe/AnyBay back lanes and no NVMe Retimer
Ada ter or one NVMe Retimer Ada ter is not su orted.
• 2.5-inch configurations with two NVMe/AnyBay back lanes and two NVMe Retimer
Ada ters or three NVMe Retimer Ada ters are not su orted.
Onboard NVMe
connectors
Four onboard NVMe connectors are available:
• PCIe 1: Gen3
• PCIe 2: Gen3
• PCIe 3: Gen4
• PCIe 4: Gen4 when connected to back lane, Gen3 when connected to PCIe slot 8
enable connector.
Input/Output (I/O)
features
• Front anel
– One USB 2.0 connector with Lenovo XClarity Controller management
– One USB 3.2 Gen 1 connector
• Rear anel
– One External LCD diagnostics handset connector
– Four USB 3.2 Gen 1 connectors
– Two 10Gb Ethernet connectors
– One VGA connector
– One serial- ort-module slot
– One XClarity Controller network connector (RJ-45 Ethernet connector)
Network • Two 10Gb ethernet connectors
• One XClarity Controller network connector (RJ-45 Ethernet connector)
Notes:
• Use CAT6A UTP cables rated at 625 MHz bandwidth for the 10Gb on-board LAN.
• Wake-on-LAN (WoL) is not su orted on 10Gb ethernet connector under Windows
OS.
Cha ter 1.Introduction 3

Table 1. Specifications (continued)
Specification Description
Storage controller • Twelve onboard SATA orts (only the first 8 drives can be configured using Intel
VROC SATA RAID)
• Eight onboard NVMe orts (Intel VROC NVMe RAID)
• NVMe Retimer Ada ter (Intel VROC NVMe RAID)
• The following SAS/SATA RAID/HBA o tions are available for this server:
– ThinkSystem 430-8i SAS/SATA 12Gb HBA (No RAID)
– ThinkSystem 430-8e SAS/SATA 12Gb HBA (No RAID)
– ThinkSystem 430-16i SAS/SATA 12Gb HBA (No RAID)
– ThinkSystem 430-16e SAS/SATA 12Gb HBA (No RAID)
– ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb Internal HBA (No RAID)
– ThinkSystem RAID 530-8i PCIe 12Gb Ada ter (RAID 0, 1, 10, 5, 50)
– ThinkSystem RAID 930-8i 2GB Flash PCIe 12Gb Ada ter (RAID 0, 1, 10, 5, 50, 6,
60)
– ThinkSystem RAID 930-8e 4GB Flash PCIe 12Gb Ada ter (RAID 0, 1, 10, 5, 50, 6,
60)
– ThinkSystem RAID 940-8i 4GB Flash PCIe Gen4 12Gb Ada ter (RAID 0, 1, 10, 5,
50, 6, 60)
– ThinkSystem RAID 940-8i 8GB Flash PCIe Gen4 12Gb Ada ter (RAID 0, 1, 10, 5,
50, 6, 60)
– ThinkSystem RAID 530-16i PCIe 12Gb Ada ter (RAID 0, 1, 10)
– ThinkSystem RAID 930-16i 4GB Flash PCIe 12Gb Ada ter (RAID 0, 1, 10, 5, 50, 6,
60)
– ThinkSystem RAID 940-16i 8GB Flash PCIe Gen4 12Gb Ada ter (RAID 0, 1, 10, 5,
50, 6, 60)
– ThinkSystem RAID 940-16i 8GB Flash PCIe Gen4 12Gb Internal Ada ter (RAID 0,
1, 10, 5, 50, 6, 60)
– ThinkSystem RAID 940-32i 8GB Flash PCIe Gen4 12Gb Ada ter (RAID 0, 1, 10, 5,
50, 6, 60)
Notes:
• ThinkSystem RAID 940-32i 8GB Flash PCIe Gen4 12Gb Ada ter can only be installed
in slot 9 in one CPU configurations, and installed in slot 9, 5, 6, 7, or 8 in two CPU
configurations.
• Onboard SATA 8-11 connector can only su ort ACHI mode when ThinkSystem M.2
NVMe 2-Bay RAID Enablement Kit or ThinkSystem M.2 SATA 2-Bay RAID
Enablement Kit is installed.
• Drives connected to SATA 6-7 (from onboard SATA 4-7 connector) cannot be used
for bootable Windows system disk when in RAID mode.
For a list of su orted ada ters, see:
htt s://static.lenovo.com/us/en/server roven/index.shtml
Fans Su orts u to four hot-swa fans:
• 9238 single-rotor hot-swa fans
• 9256 dual-rotor hot-swa fans
Note: Single-rotor hot-swa fans cannot be mixed with dual-rotor hot-swa fans.
4ThinkSystem ST650 V2 Maintenance Manual

Table 1. Specifications (continued)
Specification Description
Power supply Su orts u to two ower su lies with N+N redundancy:
• ThinkSystem 2400W (230V) v2 Platinum hot-swa ower su ly
• ThinkSystem 1800W (230V) v2 Platinum hot-swa ower su ly
• ThinkSystem 1100W (230V/115V) v2 Platinum hot-swa ower su ly
• ThinkSystem 750W (230V) v2 Titanium hot-swa ower su ly
• ThinkSystem 750W(230/115V) v2 Platinum hot-swa ower su ly
Notes:
• 100V+ is only allowed on the following:
– 750W Platinum
– 1100W Platinum
• 200V+ is only allowed on the following:
– 750W Platinum
– 750W Titanium
– 1100W Platinum
– 1800W Platinum
– 2400W Platinum
CAUTION:
• 240 V dc input (input range: 180-300 V dc) is ON Y supported in Chinese
Mainland.
• Power supplies with 240 V dc are not hot-swappable. To remove the power
cord, ensure you have turned off the server or disconnected the dc power
sources at the breaker panel.
• In order for the ThinkSystem products to operate error free in both a DC or AC
electrical environment, a TN-S earthing system which complies to 60364-1 IEC
2005 standard has to be present or installed.
Minimal configuration for
debugging
• One rocessor in rocessor socket 1
• One DRAM DIMM in DIMM slot 14
• One ower su ly in PSU slot 1
• One drive with RAID ada ter and back lane or back late (if OS is needed for
debugging)
• Three single rotor fans in fan slot 1, 2, and 4.
• One fan filler in fan slot 3.
Cha ter 1.Introduction 5

Table 1. Specifications (continued)
Specification Description
Environment The ThinkSystem ST650 V2 server com lies with ASHRAE Class A2 s ecifications.
De ending on the hardware configuration, some models com ly with ASHRAE Class A3
and Class A4 s ecifications. System erformance may be im acted when o erating
tem erature is outside ASHRAE A2 s ecification.
• Air tem erature:
– O erating
– ASHRAE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient
tem erature decreases by 1°C for every 300 m (984 ft) increase in altitude
above 900 m (2,953 ft).
– ASHRAE Class A3: 5°C to 40°C (41°F to 104°F); the maximum ambient
tem erature decreases by 1°C for every 175 m (574 ft) increase in altitude
above 900 m (2,953 ft).
– ASHRAE Class A4: 5°C to 45°C (41°F to 113°F); the maximum ambient
tem erature decreases by 1°C for every 125 m (410 ft) increase in altitude
above 900 m (2,953 ft).
– Server off: -10°C to 60°C (14°F to 140°F)
– Shi ment/storage: -40°C to 60°C (-40°F to 140°F)
• Maximum altitude: 3,050 m (10,000 ft)
• Relative Humidity (non-condensing):
– O erating
– ASHRAE Class A2: 8% to 80%; maximum dew oint: 21°C (70°F)
– ASHRAE Class A3: 8% to 85%; maximum dew oint: 24°C (75°F)
– ASHRAE Class A4: 8% to 90%; maximum dew oint: 24°C (75°F)
– Shi ment/storage: 8% to 90%
• Particulate contamination
Attention: Airborne articulates and reactive gases acting alone or in combination
with other environmental factors such as humidity or tem erature might ose a risk to
the server. For information about the limits for articulates and gases, see
“Particulate contamination” on age 8.
Acoustical noise
emissions
The server has the following acoustic noise emissions declaration:
• Sound ower level (LWAd)
– Idling:
– Min: 5.0 Bel
– Ty ical: 5.6 Bel
– GPU: 7.2 Bel
– O erating:
– Min: 5.6 Bel
– Ty ical: 5.6 Bel
– GPU: 8.5 Bel
• Sound ressure level (L Am):
– Idling:
– Min: 37 dBA
– Ty ical: 41 dBA
– GPU: 57 dBA
– O erating:
– Min: 41 dBA
– Ty ical: 41 dBA
– GPU: 69 dBA
6ThinkSystem ST650 V2 Maintenance Manual

Table 1. Specifications (continued)
Specification Description
Notes:
• The fans will tem orarily run at higher s eeds on system boot due to rocessor
ower calibration.
• These sound levels were measured in controlled acoustical environments according
to rocedures s ecified by ISO7779 and are re orted in accordance with ISO 9296.
• The declared acoustic sound levels are based on the s ecified configurations, which
may change slightly de ending on configuration/conditions.
– Min configuration: one 105W rocessor, four 16 GB DIMMs, two 480 GB SSD
drives, two onboard 10GB LAN orts, one 750W ower su ly unit.
– Ty ical configuration: two 125W rocessors, sixteen 32 GB DIMMs, eight SAS
hard disk drives, one 530-8i RAID Ada ter, two onboard 10GB LAN orts, two
750W ower su ly units.
– GPU configuration: two 165W rocessors, thirty-two 64 GB DIMMs, eight SAS
hard disk drives, one 930-8i RAID ada ter, two onboard 10GB LAN orts, eight
Nvidia Tesla T4 GPU ada ters, two 1800W ower su ly units.
• The declared acoustic noise levels may increase greatly, if high- ower com onents
are installed such as high- ower NICs, high- ower rocessors and GPUs.
• Government regulations (such as those rescribed by OSHA or Euro ean Community
Directives) may govern noise level ex osure in the work lace and may a ly to you
and your server installation. The actual sound ressure levels in your installation
de end u on a variety of factors, including the number of racks in the installation; the
size, materials, and configuration of the room; the noise levels from other equi ment;
the room ambient tem erature, and em loyee's location in relation to the equi ment.
Further, com liance with such government regulations de ends on a variety of
additional factors, including the duration of em loyees' ex osure and whether
em loyees wear hearing rotection. Lenovo recommends that you consult with
qualified ex erts in this field to determine whether you are in com liance with the
a licable regulations.
Ambient temperature
management
Adjust ambient tem erature when s ecific com onents are installed:
Note: Ensure that you observe the fan installation rules and sequence in “Technical
rules for system fans” in the ThinkSystem ST650 V2 Setup Guide.
• Kee ambient tem erature to 30°C or lower when one or more of the following
com onents are installed.
– Processors with 205 to 250 watts
– GPU ada ter
• Kee ambient tem erature to 35°C or lower when one or more of the following
com onents are installed.
– Processors with 165 to 195 watts
– Thirty-two registered DIMMs (RDIMMs) with 64 GB or less
– Persistent Memory Modules (PMEM)
– Retimer
– ThinkSystem Mellanox ConnectX series ada ter
– Fibre Channel ada ter
– NVMe drive
– RAID/HBA ada ter
– External NIC ada ter
Cha ter 1.Introduction 7

Table 1. Specifications (continued)
Specification Description
• Kee ambient tem erature to 40°C or lower when one or more of the following
com onents are installed.
– Processors with 135 to 150 watts
• Kee ambient tem erature to 45°C or lower when one or more of the following
com onents are installed.
– Processors with 120 watts or less
– Thirty-two registered DIMMs (RDIMMs) with 32 GB or less
– Two back lanes/back lates
Operating systems
Su orted and certified o erating systems:
• Microsoft Windows Server
• VMware ESXi
• Red Hat Enter rise Linux
• SUSE Linux Enter rise Server
References:
• Com lete list of available o erating systems: htt s://lenovo ress.com/osig.
• OS de loyment instructions: See “De loy the o erating system” in Setup Guide.
Particulate contamination
Attention: Airborne articulates (including metal flakes or articles) and reactive gases acting alone or in
combination with other environmental factors such as humidity or tem erature might ose a risk to the
device that is described in this document.
Risks that are osed by the resence of excessive articulate levels or concentrations of harmful gases
include damage that might cause the device to malfunction or cease functioning altogether. This
s ecification sets forth limits for articulates and gases that are intended to avoid such damage. The limits
must not be viewed or used as definitive limits, because numerous other factors, such as tem erature or
moisture content of the air, can influence the im act of articulates or environmental corrosives and gaseous
contaminant transfer. In the absence of s ecific limits that are set forth in this document, you must
im lement ractices that maintain articulate and gas levels that are consistent with the rotection of human
health and safety. If Lenovo determines that the levels of articulates or gases in your environment have
caused damage to the device, Lenovo may condition rovision of re air or re lacement of devices or arts
on im lementation of a ro riate remedial measures to mitigate such environmental contamination.
Im lementation of such remedial measures is a customer res onsibility.
8ThinkSystem ST650 V2 Maintenance Manual

Table 2. imits for particulates and gases
Contaminant imits
Gaseous Severity level G1 as er ANSI/ISA 71.04-19851, which states that the reactivity rate of co er
cou ons shall be less than 300 Angstroms er month (Å/month, ≈ 0.0039 μg/cm2-hour weight
gain).2 In addition, the reactivity rate of silver cou ons shall be less than 200Å/month (≈ 0.0035
μg/cm2-hour weight gain).3 The reactive monitoring of gaseous corrosivity must be conducted
a roximately 5 cm (2 in.) in front of the rack on the air inlet side at one-quarter and three-quarter
frame height off the floor or where the air velocity is much higher.
Particulate Data centers must meet the cleanliness level of ISO 14644-1 class 8. For data centers without
airside economizer, the ISO 14644-1 class 8 cleanliness might be met by choosing one of the
following filtration methods:
• The room air might be continuously filtered with MERV 8 filters.
• Air entering a data center might be filtered with MERV 11 or referably MERV 13 filters.
For data centers with airside economizers, the choice of filters to achieve ISO class 8 cleanliness
de ends on the s ecific conditions resent at that data center.
The deliquescent relative humidity of the articulate contamination should be more than 60%
RH.4
Data centers must be free of zinc whiskers.5
1 ANSI/ISA-71.04-1985. Environmental conditions for process measurement and control systems: Airborne
contaminants. Instrument Society of America, Research Triangle Park, North Carolina, U.S.A.
2 The derivation of the equivalence between the rate of co er corrosion growth in the thickness of the corrosion
roduct in Å/month and the rate of weight gain assumes that Cu2S and Cu2O grow in equal ro ortions.
3 The derivation of the equivalence between the rate of silver corrosion growth in the thickness of the corrosion
roduct in Å/month and the rate of weight gain assumes that Ag2S is the only corrosion roduct.
4 The deliquescent relative humidity of articulate contamination is the relative humidity at which the dust absorbs
enough water to become wet and romote ionic conduction.
5 Surface debris is randomly collected from 10 areas of the data center on a 1.5 cm diameter disk of sticky
electrically conductive ta e on a metal stub. If examination of the sticky ta e in a scanning electron microsco e
reveals no zinc whiskers, the data center is considered free of zinc whiskers.
Firmware updates
Several o tions are available to u date the firmware for the server.
You can use the tools listed here to u date the most current firmware for your server and the devices that are
installed in the server.
Note: Lenovo ty ically releases firmware in bundles called U dateX ress System Packs (UXSPs). To ensure
that all of the firmware u dates are com atible, you should u date all firmware at the same time. If you are
u dating firmware for both the Lenovo XClarity Controller and UEFI, u date the firmware for Lenovo XClarity
Controller first.
Best ractices related to u dating firmware is available at the following location:
htt ://lenovo ress.com/LP0656
Important terminology
• In-band update. The installation or u date is erformed using a tool or a lication within an o erating
system that is executing on the server’s core CPU.
Cha ter 1.Introduction 9

• Out-of-band update. The installation or u date is erformed by the Lenovo XClarity Controller collecting
the u date and then directing the u date to the target subsystem or device. Out-of-band u dates have no
de endency on an o erating system executing on the core CPU. However, most out-of-band o erations
do require the server to be in the S0 (Working) ower state.
• On-Target update. The installation or u date is initiated from an O erating System executing on the
server’s o erating system.
• Off-Target update. The installation or u date is initiated from a com uting device interacting directly with
the server’s Lenovo XClarity Controller.
• UpdateXpress System Packs (UXSPs). UXSPs are bundled u dates designed and tested to rovide the
interde endent level of functionality, erformance, and com atibility. UXSPs are server machine-ty e
s ecific and are built (with firmware and device driver u dates) to su ort s ecific Windows Server, Red
Hat Enter rise Linux (RHEL) and SUSE Linux Enter rise Server (SLES) o erating system distributions.
Machine-ty e-s ecific firmware-only UXSPs are also available.
See the following table to determine the best Lenovo tool to use for installing and setting u the firmware:
Note: The server UEFI settings for o tion ROM must be set to Auto or UEFI to u date firmware using
Lenovo XClarity Administrator or Lenovo XClarity Essentials. For more information, see the following Tech
Ti :
htt s://datacentersu ort.lenovo.com/us/en/solutions/ht506118
Tool
In-
band
update
Out-
of-
band
up-
date
On-
target
update
Off-
target
update
Graphi-
cal user
inter-
face
Com-
mand- line
interface
Sup-
ports
UXSPs
enovo XClarity Provisioning
Manager V3
Limited to core system firmware only
√2√ √ √
enovo XClarity Controller
Su orts core system firmware and
most advanced I/O o tion firmware
u dates
√ √ √ √
enovo XClarity Essentials OneC I
Su orts all core system firmware, I/O
firmware, and installed o erating
system driver u dates
√ √ √ √ √ √
enovo XClarity Essentials
UpdateXpress
Su orts all core system firmware, I/O
firmware, and installed o erating
system driver u dates
√ √ √ √ √ √
enovo XClarity Essentials Bootable
Media Creator
Su orts core system firmware and I/O
firmware u dates. You can u date the
Microsoft® Windows® o erating
system, but device drivers are not
included on the bootable image
√ √ √ √ √
enovo XClarity Administrator
Su orts core system firmware and I/O
firmware u dates
√1√2√ √
10 ThinkSystem ST650 V2 Maintenance Manual