Lenovo 7D75 User manual

ThinkSystem SR650 V3
System Configuration Guide
Machine Types: 7D75, 7D76, 7D77

Note
Before using this information and the roduct it su orts, be sure to read and understand the safety
information and the safety instructions, which are available at:
htt s:// ubs.lenovo.com/safety_documentation/
In addition, be sure that you are familiar with the terms and conditions of the Lenovo warranty for your server,
which can be found at:
htt ://datacentersu ort.lenovo.com/warrantylooku
Fourth Edition (June 2023)
© Copyright Leno o 2023.
LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered ursuant to a General Services
Administration (GSA) contract, use, re roduction, or disclosure is subject to restrictions set forth in Contract No. GS-35F-
05925.

Contents
Contents . . . . . . . . . . . . . . . . . i
Safety . . . . . . . . . . . . . . . . . . iii
Safety ins ection checklist . . . . . . . . . . . iv
Chapter 1. Introduction . . . . . . . . . 1
Features. . . . . . . . . . . . . . . . . . . 1
Tech Ti s . . . . . . . . . . . . . . . . . . 2
Security advisories . . . . . . . . . . . . . . 2
S ecifications . . . . . . . . . . . . . . . . 3
Technical s ecifications . . . . . . . . . . . 3
Mechanical s ecifications . . . . . . . . . . 7
Environmental s ecifications . . . . . . . . . 9
Management o tions. . . . . . . . . . . . . 12
Chapter 2. Ser er components . . . . 17
Front view . . . . . . . . . . . . . . . . . 17
Front I/O module . . . . . . . . . . . . . . 22
Rear view . . . . . . . . . . . . . . . . . 25
To view . . . . . . . . . . . . . . . . . 34
System-board-assembly layout . . . . . . . . 35
System-board-assembly connectors. . . . . 36
System-board-assembly switches. . . . . . 37
System LEDs and diagnostics dis lay . . . . . . 39
Drive LEDs . . . . . . . . . . . . . . . 39
Front o erator anel LEDs . . . . . . . . . 40
Integrated diagnostics anel . . . . . . . . 42
External diagnostics handset . . . . . . . . 47
Rear system LEDs . . . . . . . . . . . . 53
XCC system management ort LEDs. . . . . 54
Power su ly LEDs . . . . . . . . . . . 54
System-board-assembly LEDs . . . . . . . 55
LEDs on the firmware and RoT security
module . . . . . . . . . . . . . . . . 58
Chapter 3. Parts list . . . . . . . . . . 61
2.5-inch drive bay chassis. . . . . . . . . . . 62
3.5-inch drive bay chassis. . . . . . . . . . . 67
Power cords . . . . . . . . . . . . . . . . 71
Chapter 4. Unboxing and setup . . . . 73
Server ackage contents . . . . . . . . . . . 73
Identify the server and access the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 73
Server setu checklist . . . . . . . . . . . . 75
Chapter 5. System configuration . . . 77
Set the network connection for the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 77
Set front USB ort for Lenovo XClarity Controller
connection. . . . . . . . . . . . . . . . . 78
U date the firmware . . . . . . . . . . . . . 79
Configure the firmware . . . . . . . . . . . . 82
Memory module configuration . . . . . . . . . 83
Enable Software Guard Extensions (SGX). . . . . 84
RAID configuration . . . . . . . . . . . . . 84
De loy the o erating system. . . . . . . . . . 85
Back u the server configuration . . . . . . . . 86
Appendix A. Getting help and
technical assistance . . . . . . . . . . 87
Before you call . . . . . . . . . . . . . . . 87
Collecting service data . . . . . . . . . . . . 88
Contacting Su ort . . . . . . . . . . . . . 89
Appendix B. Documents and
supports . . . . . . . . . . . . . . . . 91
Documents download . . . . . . . . . . . . 91
Su ort websites . . . . . . . . . . . . . . 91
Appendix C. Notices. . . . . . . . . . 93
Trademarks . . . . . . . . . . . . . . . . 94
Im ortant notes . . . . . . . . . . . . . . . 94
Electronic emission notices . . . . . . . . . . 94
Taiwan Region BSMI RoHS declaration . . . . . 95
Taiwan Region im ort and ex ort contact
information . . . . . . . . . . . . . . . . 95
© Co yright Lenovo 2023 i

ii ThinkSystem SR650 V3 System Configuration Guide

Safety
Before installing this roduct, read the Safety Information.
Antes de instalar este roduto, leia as Informações de Segurança.
在安装本产品之前，请仔细阅读 Safety Information （安全信息）。
Læs sikkerhedsforskrifterne, før du installerer dette rodukt.
Lees voordat u dit roduct installeert eerst de veiligheidsvoorschriften.
Ennen kuin asennat tämän tuotteen, lue turvaohjeet kohdasta Safety Information.
Avant d'installer ce roduit, lisez les consignes de sécurité.
Vor der Installation dieses Produkts die Sicherheitshinweise lesen.
Prima di installare questo rodotto, leggere le Informazioni sulla Sicurezza.
Les sikkerhetsinformasjonen (Safety Information) før du installerer dette roduktet.
Antes de instalar este roduto, leia as Informações sobre Segurança.
© Co yright Lenovo 2023 iii

Antes de instalar este roducto, lea la información de seguridad.
Läs säkerhetsinformationen innan du installerar den här rodukten.
Safety inspection checklist
Use the information in this section to identify otentially unsafe conditions with your server. As each machine
was designed and built, required safety items were installed to rotect users and service technicians from
injury.
Note: The roduct is not suitable for use at visual dis lay work laces according to §2 of the Work lace
Regulations.
Note: The set-u of the server is made in the server room only.
CAUTION:
This equipment must be installed or ser iced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. Leno o assumes that you are qualified in
the ser icing of equipment and trained in recognizing hazards energy le els in products. Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location.
Important: Electrical grounding of the server is required for o erator safety and correct system function.
Pro er grounding of the electrical outlet can be verified by a certified electrician.
Use the following checklist to verify that there are no otentially unsafe conditions:
1. If your working condition necessitates the server being owered off or you intend to ower off, make
sure that the ower cord is disconnected.
S002
CAUTION:
i ThinkSystem SR650 V3 System Configuration Guide

The power-control button on the de ice and the power switch on the power supply do not turn off
the electrical current supplied to the de ice. The de ice also might ha e more than one power
cord. To remo e all electrical current from the de ice, ensure that all power cords are
disconnected from the power source.
Note: Under certain circumstances, owering off the server is not a rerequisite. Refer to the
recautions before conducting any tasks.
2. Check the ower cord.
• Make sure that the third-wire ground connector is in good condition. Use a meter to measure third-
wire ground continuity for 0.1 ohm or less between the external ground in and the frame ground.
• Make sure that the ower cord is the correct ty e.
To view the ower cords that are available for the server:
a. Go to:
htt ://dcsc.lenovo.com/#/
b. Click Preconfigured Model or Configure to order.
c. Enter the machine ty e and model for your server to dis lay the configurator age.
d. Click Power ➙ Power Cables to see all line cords.
• Make sure that the insulation is not frayed or worn.
3. Check for any obvious non-Lenovo alterations. Use good judgment as to the safety of any non-Lenovo
alterations.
4. Check inside the server for any obvious unsafe conditions, such as metal filings, contamination, water or
other liquid, or signs of fire or smoke damage.
5. Check for worn, frayed, or inched cables.
6. Make sure that the ower-su ly cover fasteners (screws or rivets) have not been removed or tam ered
with.
© Co yright Lenovo 2023

i ThinkSystem SR650 V3 System Configuration Guide

Chapter 1. Introduction
The ThinkSystem SR650 V3 server (7D75, 7D76, 7D77) is a 2-socket 2U rack server, based on the 4th
generation Intel Xeon Scalable rocessor family. With a very configuration-rich offering, it is a great choice
for enter rises of all sizes that need industry-leading reliability, management, and security, as well as
maximizing erformance and flexibility for future growth.
Figure 1. ThinkSystem SR650 V3
Features
Performance, ease of use, reliability, and ex ansion ca abilities are key considerations in the design of your
server. These design features make it ossible for you to customize the system hardware to meet your needs
today and rovide flexible ex ansion ca abilities for the future.
Your server im lements the following features and technologies:
• Features on Demand
If a Features on Demand feature is integrated in the server or in an o tional device that is installed in the
server, you can urchase an activation key to activate the feature. For information about Features on
Demand, see:
htt s://fod.lenovo.com/lkms
• Leno o XClarity Controller (XCC)
The Lenovo XClarity Controller is the common management controller for Lenovo ThinkSystem server
hardware. The Lenovo XClarity Controller consolidates multi le management functions in a single chi on
the server system board assembly. Some of the features that are unique to the Lenovo XClarity Controller
are enhanced erformance, higher-resolution remote video, and ex anded security o tions.
The server su orts Lenovo XClarity Controller 2 (XCC2). For additional information about Lenovo XClarity
Controller 2 (XCC2), refer to htt s://sysmgt.lenovofiles.com/hel /to ic/lxcc_frontend/lxcc_overview.html.
• UEFI-compliant ser er firmware
Lenovo ThinkSystem firmware is Unified Extensible Firmware Interface (UEFI) com liant. UEFI re laces
BIOS and defines a standard interface between the o erating system, latform firmware, and external
devices.
Lenovo ThinkSystem servers are ca able of booting UEFI-com liant o erating systems, BIOS-based
o erating systems, and BIOS-based ada ters as well as UEFI-com liant ada ters.
Note: The server does not su ort Disk O erating System (DOS).
• Large system-memory capacity
The server su orts u to 32 TruDDR5 memory DIMMs o erating at u to 4800 MHz. For more
information about the s ecific ty es and maximum amount of memory, see “Technical s ecifications” on
age 3.
© Co yright Lenovo 2023 1

• Large data-storage capacity and hot-swap capability
The server models su ort front, middle, and rear drive bays, scalable u to 20 x 3.5-inch hot-swa drives
or 40 x 2.5-inch hot-swa drives. See “Technical s ecifications” on age 3 for more information.
With the hot-swa feature, you can add, remove, or re lace hard disk drives without turning off the server.
• Lightpath Diagnostics
Light ath Diagnostics rovides LEDs to hel you diagnose roblems. For more information about the
Light ath Diagnostics, see “System LEDs and diagnostics dis lay” on age 39.
• Mobile access to Leno o Ser ice Information website
The server rovides a QR code on the system service label, which is on the cover of the server, that you
can scan using a QR code reader and scanner with a mobile device to get quick access to the Lenovo
Service Information website. The Lenovo Service Information website rovides additional information for
arts installation, re lacement videos, and error codes for server su ort.
• Acti e Energy Manager
Lenovo XClarity Energy Manager is a ower and tem erature management solution for data centers. You
can monitor and manage the ower consum tion and tem erature of Converged, NeXtScale, System x,
and ThinkServer servers, and im rove energy efficiency using Lenovo XClarity Energy Manager.
• Redundant networking connection
The Lenovo XClarity Controller rovides failover ca ability to a redundant Ethernet connection with the
a licable a lication installed. If a roblem occurs with the rimary Ethernet connection, all Ethernet
traffic that is associated with the rimary connection is automatically switched to the o tional redundant
Ethernet connection. If the a licable device drivers are installed, this switching occurs without data loss
and without user intervention.
• Redundant cooling
The redundant cooling by the fans in the server enables continued o eration if one rotor of a fan fails.
• ThinkSystem RAID support
The ThinkSystem RAID ada ter rovides hardware redundant array of inde endent disks (RAID) su ort
to create configurations, su orting RAID levels 0, 1, 5, 6, 10, 50, and 60.
Tech Tips
Lenovo continually u dates the su ort website with the latest ti s and techniques that you can use to solve
issues that your server might encounter. These Tech Ti s (also called retain ti s or service bulletins) rovide
rocedures to work around issues or solve roblems related to the o eration of your server.
To find the Tech Ti s available for your server:
1. Go to htt ://datacentersu ort.lenovo.com and navigate to the su ort age for your server.
2. Click on How To’s from the navigation ane.
3. Click Article Type ➙ Solution from the dro -down menu.
Follow the on-screen instructions to choose the category for the roblem that you are having.
Security ad isories
Lenovo is committed to develo ing roducts and services that adhere to the highest security standards in
order to rotect our customers and their data. When otential vulnerabilities are re orted, it is the
res onsibility of the Lenovo Product Security Incident Res onse Team (PSIRT) to investigate and rovide
2ThinkSystem SR650 V3 System Configuration Guide

information to our customers so they may ut mitigation lans in lace as we work toward roviding
solutions.
The list of current advisories is available at the following site:
htt s://datacentersu ort.lenovo.com/ roduct_security/home
Specifications
Summary of the features and s ecifications of the server. De ending on the model, some features might not
be available, or some s ecifications might not a ly.
Refer to the below table for s ecifications categories and the content of each category.
Specification
category
“Technical s ecifications” on
age 3
“Mechanical s ecifications” on
age 7
“Environmental s ecifications”
on age 9
Content • Processor
• Memory
• Internal drives
• Ex ansion slots
• Storage controller
• Gra hics rocessing units
(GPU)
• Integrated functions and I/O
connectors
• Network
• System fan
• Power su lies
• O erating systems
• Minimal configuration for
debugging
• Dimension
• Weight
• Acoustical noise emissions
• Ambient tem erature
management
• Particulate contamination
Technical specifications
Summary of the technical s ecifications of server. De ending on the model, some features might not be
available, or some s ecifications might not a ly for your server model.
Processor
Su orts multi-core Intel Xeon rocessors, with integrated memory controller and Intel Mesh UPI (Ultra Path
Interconnect) to ology.
• U to two 4th Gen Intel Xeon scalable rocessors with the new LGA 4677 socket
• U to 60 cores er socket
• U to 4 UPI links at u to 16 GT/s
• Thermal Design Power (TDP): u to 350 watts
For a list of su orted rocessors, see htt s://server roven.lenovo.com.
Cha ter 1.Introduction 3

Memory
• Slots: 32 dual inline memory module (DIMM) connectors that su ort u to 32 TruDDR5 DIMMs
• Memory module ty e:
– TruDDR5 4800 MHz RDIMM: 16 GB (1Rx8), 32 GB (2Rx8)
– TruDDR5 4800 MHz 10x4 RDIMM: 32 GB (1Rx4), 64 GB (2Rx4)
– TruDDR5 4800 MHz 9x4 RDIMM: 32 GB (1Rx4), 64 GB (2Rx4)
– TruDDR5 4800 MHz 3DS RDIMM: 128 GB (4Rx4), 256 GB (8Rx4)
• S eed: O erating s eed de ends on rocessor model and UEFI settings.
– 4800 MT/s for 1 DIMM er channel
– 4400 MT/s for 2 DIMMs er channel
• Minimum memory: 16 GB
• Maximum memory: 8 TB: 32 x 256 GB 3DS RDIMMs
For a list of su orted memory modules, see htt s://server roven.lenovo.com.
Internal dri es
• Front drive bays:
– U to 24 x 2.5-inch hot-swa SAS/SATA/NVMe drives
– U to 12 x 3.5-inch hot-swa SAS/SATA drives
– U to 4 x 3.5-inch hot-swa NVMe drives
• Middle drive bays:
– U to 8 x 2.5-inch hot-swa SAS/SATA/NVMe drives
– U to 4 x 3.5-inch hot-swa SAS/SATA drives
• Rear drive bays:
– U to 8 x 2.5-inch hot-swa SAS/SATA drives
– U to 4 x 3.5-inch hot-swa SAS/SATA drives
– U to two 7mm drives
• U to two internal M.2 drives
Expansion slots
• U to ten PCIe slots in the rear and two PCIe slots in the front
• One OCP module slot
PCIe slot availability is based on riser selection and rear drive bay selection. See “Rear view” on age 25 and “PCIe
slots and PCIe ada ters” in User Guide or Hardware Maintenan e Guide.
4ThinkSystem SR650 V3 System Configuration Guide

Storage controller
• SAS/SATA HBA ada ters
– ThinkSystem 4350-8i SAS/SATA 12Gb HBA
– ThinkSystem 4350-16i SAS/SATA 12Gb HBA
– ThinkSystem 440-8i SAS/SATA PCIe Gen4 12Gb HBA
– ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb HBA
– ThinkSystem 440-16i SAS/SATA PCIe Gen4 12Gb Internal HBA*
– ThinkSystem 440-8e SAS/SATA PCIe Gen4 12Gb HBA
– ThinkSystem 440-16e SAS/SATA PCIe Gen4 12Gb HBA
• SAS/SATA RAID ada ters
– ThinkSystem RAID 5350-8i PCIe 12Gb Ada ter
– ThinkSystem RAID 5350-8i PCIe 12Gb Internal Ada ter*
– ThinkSystem RAID 9350-8i 2GB Flash PCIe 12Gb Ada ter
– ThinkSystem RAID 9350-8i 2GB Flash PCIe 12Gb Internal Ada ter*
– ThinkSystem RAID 9350-16i 4GB Flash PCIe 12Gb Ada ter
– ThinkSystem RAID 9350-16i 4GB Flash PCIe 12Gb Internal Ada ter*
– ThinkSystem RAID 540-8i PCIe Gen4 12Gb Ada ter
– ThinkSystem RAID 540-16i PCIe Gen4 12Gb Ada ter
– ThinkSystem RAID 940-8i 4GB Flash PCIe Gen4 12Gb Ada ter
– ThinkSystem RAID 940-16i 4GB Flash PCIe Gen4 12Gb Ada ter
– ThinkSystem RAID 940-16i 8GB Flash PCIe Gen4 12Gb Ada ter
– ThinkSystem RAID 940-16i 8GB Flash PCIe Gen4 12Gb Internal Ada ter*
– ThinkSystem RAID 940-32i 8GB Flash PCIe Gen4 12Gb Ada ter
– ThinkSystem RAID 940-8e 4GB Flash PCIe Gen4 12Gb Ada ter
• Ex ander: ThinkSystem 48 ort 12Gb Internal Ex ander*
Notes:
• *Custom form factor (CFF) ada ters that are su orted only for server models with 2.5-inch front drive bays.
• For more information about the RAID/HBA ada ters, see Lenovo ThinkSystem RAID Ada ter and HBA Reference.
Graphics processing unit (GPU)
Your server su orts the following GPUs:
• Double-wide: NVIDIA® A16, A30, A40, A100, H100, L40, RTX A2000, RTX A4500, RTX A6000, AMD® Instinct MI210
• Single-wide: NVIDIA A2, T1000, T400, L4
For GPU su orting rules, see “Thermal rules” in User Guide or Hardware Maintenan e Guide.
Cha ter 1.Introduction 5

Integrated functions and I/O connectors
• Lenovo XClarity Controller (XCC), which rovides service rocessor control and monitoring functions, video
controller, and remote keyboard, video, mouse, and remote drive ca abilities.
– The server su orts Lenovo XClarity Controller 2 (XCC2). For additional information about Lenovo XClarity
Controller 2 (XCC2), refer to htt s://sysmgt.lenovofiles.com/hel /to ic/lxcc_frontend/lxcc_overview.html.
• Front connectors:
– One VGA connector (o tional)
– One USB 3.2 Gen1 (5 Gb s) connector
– One USB 2.0 connector with XCC system management function
– One external diagnostics connector
– One integrated diagnostics anel (o tional)
• Rear connectors:
– One VGA connector
– Three USB 3.2 Gen1 (5 Gb s) connectors
– One XCC system management ort
– Two or four Ethernet connectors on the OCP module (o tional)
– One serial ort (o tional)
Network
• OCP module, which rovides two or four Ethernet connectors for network su ort
Note: If the ThinkSystem V3 Management NIC Ada ter Kit (management NIC ada ter) is installed on the server, it
will not be dis layed on the PCIe card list of system management software, such as XCC, LXPM, and so on.
System fan
• Su orted fan ty es:
– Standard fan (60 x 60 x 36 mm, single-rotor, 17000 RPM)
– Performance fan (60 x 60 x 56 mm, dual-rotor, 21000 RPM)
• Fan redundancy: N+1 redundancy, one redundant fan rotor
– One rocessor: five hot-swa system fans (one redundant fan rotor)
– One rocessor with middle/rear bay or Riser 3, or two rocessors: six hot-swa system fans (one redundant fan
rotor)
Notes:
• Single-rotor hot-swa fans cannot be mixed with dual-rotor hot-swa fans.
• The redundant cooling by the fans in the server enables continued o eration if one rotor of a fan fails.
• When the system is owered off but still lugged in to AC ower, fans 1 and 2 may continue to s in at a much lower
s eed. This is the system design to rovide ro er cooling.
Power supplies
The server su orts u to two hot-swa ower su lies for redundancy.
Power supply 100–127 V ac 200–240 V ac 240 V dc -48 V dc
750W Platinum √ √ √
6ThinkSystem SR650 V3 System Configuration Guide

Power supplies
750W Titanium √ √
1100W Platinum √ √ √
1100W Titanium √ √
1800W Platinum √ √
1800W Titanium √ √
2400W Platinum √ √
2600W Titanium √ √
1100W -48V DC √
CAUTION:
• 240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland ONLY.
• Power supply with 240 V dc input cannot support hot plugging power cord function. Before remo ing the
power supply with dc input, please turn off ser er or disconnect dc power sources at the breaker panel or by
turning off the power source. Then, remo e the power cord.
Operating systems
Su orted and certified o erating systems:
• Microsoft Windows Server
• Microsoft Windows
• Red Hat Enter rise Linux
• SUSE Linux Enter rise Server
• VMware ESXi
• Canonical Ubuntu
References:
• Com lete list of available o erating systems: htt s://lenovo ress.com/osig.
• OS de loyment instructions, see “De loy the o erating system” on age 85.
Minimal configuration for debugging
• One rocessor in socket 1
• One DIMM in slot 7
• One ower su ly
• One HDD/SSD drive, one M.2 drive, or one 7mm drive (if OS is needed for debugging)
• Five system fans
Mechanical specifications
Summary of the mechanical s ecifications of server. De ending on the model, some features might not be
available, or some s ecifications might not a ly.
Cha ter 1.Introduction 7

Dimension
• Form factor: 2U
• Height: 86.5 mm (3.4 inches)
• Width:
– With rack latches: 482.0 mm (19.0 inches)
– Without rack latches: 444.6 mm (17.5 inches)
• De th: 763.7 mm (30.1 inches)
Note: The de th is measured with rack latches installed, but without the security bezel installed.
Weight
U to 39 kg (86 lb), de ending on the server configuration
8ThinkSystem SR650 V3 System Configuration Guide

En ironmental specifications
Summary of the environmental s ecifications of server. De ending on the model, some features might not be
available, or some s ecifications might not a ly.
Acoustical noise emissions
The server has the following acoustic noise emissions declaration.
Configuration Ty ical Storage GPU
Sound power
le els (LWAd)
• Idling: 5.6 Bel
• O erating: 5.6 Bel
• Idling: 7.3 Bel
• O erating: 7.3 Bel
• Idling: 7.3 Bel
• O erating: 8.9 Bel
Sound pressure
le el (LpAm)
• Idling: 41.5 dBA
• O erating: 41.5 dBA
• Idling: 60.2 dBA
• O erating: 60.2 dBA
• Idling: 60.2 dBA
• O erating: 74.1 dBA
The declared sound levels are based on the following configurations, which may change de ending on configurations
or conditions.
Component Typical configuration Storage configuration GPU configuration
Chassis (2U) 8 x 2.5-inch front drive bays 12 x 3.5-inch front drive
bays
16 x 2.5-inch front drive
bays
Fan 6 x standard fans 6 x high erformance fans 6 x high erformance fans
Processor 2 x 205 W CPUs 2 x 205 W CPUs 2 x 205 W CPUs
Memory 8 x 64 GB RDIMMs 16 x 64 GB RDIMMs 32 x 64 GB RDIMMs
Dri e 8 x 2.4 TB SAS HDDs 20 x 14 TB SAS HDDs 16 x 2.4 TB SAS HDDs
RAID adapter 1 x RAID 940-8i 1 x RAID 940-32i 1 x RAID 940-16i
OCP adapter 1 x Intel X710-T2L 10GBASE-T 2- ort OCP
Power supply 2 x 750 W PSUs 2 x 1100 W PSUs 2 x 1800 W PSUs
GPU adapter None None 3 x A100
Notes:
• These sound levels were measured in controlled acoustical environments according to rocedures s ecified by
ISO7779 and are re orted in accordance with ISO 9296.
• Government regulations (such as those rescribed by OSHA or Euro ean Community Directives) may govern noise
level ex osure in the work lace and may a ly to you and your server installation. The actual sound ressure levels
in your installation de end u on a variety of factors, including the number of racks in the installation; the size,
materials, and configuration of the room; the noise levels from other equi ment; the room ambient tem erature, and
em loyee's location in relation to the equi ment. Further, com liance with such government regulations de ends
on a variety of additional factors, including the duration of em loyees' ex osure and whether em loyees wear
hearing rotection. Lenovo recommends that you consult with qualified ex erts in this field to determine whether
you are in com liance with the a licable regulations.
Cha ter 1.Introduction 9

En ironment
ThinkSystem SR650 V3 com lies with ASHRAE Class A2 s ecifications with most configurations, and de ending on
the hardware configuration, also com lies with ASHRAE Class A3 and Class A4 s ecifications. System erformance
may be im acted when the o erating tem erature is outside ASHRAE A2 s ecification.
De ending on the hardware configuration, SR650 V3 server also com lies with ASHRAE Class H1 s ecification.
System erformance may be im acted when the o erating tem erature is outside ASHRAE H1 s ecification.
The restrictions to ASHRAE su ort are as follows:
• The ambient tem erature must be limited to 35°C or lower if the server has any of the following com onents:
– Broadcom 57416 10GBASE-T 2- ort OCP
– Broadcom 57454 10GBASE-T 4- ort OCP
– PCIe network interface card (NIC) at a rate greater than or equal to 100 GB
– Part with AOC and at the rate of 40 GB
• The ambient tem erature must be limited to 30°C or lower if the server has any of the following com onents:
– 24 x 2.5" or 12 x 3.5" front bay, middle bay, or rear bay
– GPU ada ter
– 256 GB 3DS RDIMM
– 350 W rocessor
– art with AOC and at a rate greater than 40 GB
• The ambient tem erature must be limited to 25°C or lower if the server has any of the following com onents:
– 350 W rocessor installed in the chassis with 24 x 2.5" or 12 x 3.5" front drives
– 270 W rocessor installed in the chassis with middle or rear drives
– GPU ada ter installed in the chassis with 24 x 2.5" front drives
– 36 NVMe configuration
– GPU ada ter and rocessor with TDP rating greater than 300 W installed in the chassis with 16 x 2.5" or 8 x 3.5"
front drives
For detailed thermal information, see “Thermal rules” in User Guide or Hardware Maintenan e Guide.
Note: When the ambient tem erature is greater than the su orted max tem erature (ASHARE A4 45°C), the server
will shut down. The server will not ower on again until the ambient tem erature falls within the su orted tem erature
range.
• Air temperature:
– O erating:
– ASHRAE class H1: 5°C to 25°C (41°F to 77°F)
The maximum ambient tem erature decreases by 1°C for every 500 m (1640 ft) increase in altitude above 900
m (2,953 ft)
– ASHRAE class A2: 10°C to 35°C (50°F to 95°F)
The maximum ambient tem erature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900
m (2,953 ft)
– ASHRAE class A3: 5°C to 40°C (41°F to 104°F)
The maximum ambient tem erature decreases by 1°C for every 175 m (574 ft) increase in altitude above 900
m (2,953 ft)
– ASHRAE class A4: 5°C to 45°C (41°F to 113°F)
The maximum ambient tem erature decreases by 1°C for every 125 m (410 ft) increase in altitude above 900
m (2,953 ft)
– Server off: -10°C to 60°C (14°F to 140°F)
– Shi ment/storage: -40°C to 70°C (-40°F to 158°F)
• Maximum altitude: 3,050 m (10,000 ft)
• Relati e Humidity (non-condensing):
– O erating
– ASHRAE class H1: 8%–80%; maximum dew oint: 17°C (62.6°F)
– ASHRAE class A2: 20%–80%; maximum dew oint: 21°C (70°F)
– ASHRAE class A3: 8%–85%; maximum dew oint: 24°C (75°F)
10 ThinkSystem SR650 V3 System Configuration Guide

En ironment
– ASHRAE class A4: 8%–90%; maximum dew oint: 24°C (75°F)
– Shi ment/storage: 8% to 90%
Particulate contamination
Attention: Airborne articulates (including metal flakes or articles) and reactive gases acting alone or in
combination with other environmental factors such as humidity or tem erature might ose a risk to the
device that is described in this document.
Risks that are osed by the resence of excessive articulate levels or concentrations of harmful gases
include damage that might cause the device to malfunction or cease functioning altogether. This
s ecification sets forth limits for articulates and gases that are intended to avoid such damage. The limits
must not be viewed or used as definitive limits, because numerous other factors, such as tem erature or
moisture content of the air, can influence the im act of articulates or environmental corrosives and gaseous
contaminant transfer. In the absence of s ecific limits that are set forth in this document, you must
im lement ractices that maintain articulate and gas levels that are consistent with the rotection of human
health and safety. If Lenovo determines that the levels of articulates or gases in your environment have
caused damage to the device, Lenovo may condition rovision of re air or re lacement of devices or arts
on im lementation of a ro riate remedial measures to mitigate such environmental contamination.
Im lementation of such remedial measures is a customer res onsibility.
Cha ter 1.Introduction 11

Table 1. Limits for parti ulates and gases
Contaminant Limits
Reactive gases Severity level G1 as er ANSI/ISA 71.04-19851:
• The co er reactivity level shall be less than 200 Angstroms er month (Å/month ≈ 0.0035 μg/
cm2-hour weight gain).2
• The silver reactivity level shall be less than 200 Angstroms er month (Å/month ≈ 0.0035 μg/
cm2-hour weight gain).3
• The reactive monitoring of gaseous corrosivity must be conducted a roximately 5 cm (2 in.) in
front of the rack on the air inlet side at one-quarter and three-quarter frame height off the floor
or where the air velocity is much higher.
Airborne
articulates Data centers must meet the cleanliness level of ISO 14644-1 class 8.
For data centers without airside economizer, the ISO 14644-1 class 8 cleanliness might be met by
choosing one of the following filtration methods:
• The room air might be continuously filtered with MERV 8 filters.
• Air entering a data center might be filtered with MERV 11 or referably MERV 13 filters.
For data centers with airside economizers, the choice of filters to achieve ISO class 8 cleanliness
de ends on the s ecific conditions resent at that data center.
• The deliquescent relative humidity of the articulate contamination should be more than 60%
RH.4
• Data centers must be free of zinc whiskers.5
1 ANSI/ISA-71.04-1985. Environmental onditions for pro ess measurement and ontrol systems: Airborne
ontaminants. Instrument Society of America, Research Triangle Park, North Carolina, U.S.A.
2 The derivation of the equivalence between the rate of co er corrosion growth in the thickness of the corrosion
roduct in Å/month and the rate of weight gain assumes that Cu2S and Cu2O grow in equal ro ortions.
3 The derivation of the equivalence between the rate of silver corrosion growth in the thickness of the corrosion
roduct in Å/month and the rate of weight gain assumes that Ag2S is the only corrosion roduct.
4 The deliquescent relative humidity of articulate contamination is the relative humidity at which the dust absorbs
enough water to become wet and romote ionic conduction.
5 Surface debris is randomly collected from 10 areas of the data center on a 1.5 cm diameter disk of sticky
electrically conductive ta e on a metal stub. If examination of the sticky ta e in a scanning electron microsco e
reveals no zinc whiskers, the data center is considered free of zinc whiskers.
Management options
The XClarity ortfolio and other system management o tions described in this section are available to hel
you manage the servers more conveniently and efficiently.
12 ThinkSystem SR650 V3 System Configuration Guide