LG KS660 User manual

Service Manual Model : KS660
Internal Use Only
Service Manual
KS660
Date: December, 2008 / Issue 1.0

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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
REVISED HISTORY
Editor Date Issue Contents of Changes S/W Version
H.J.YANG 21/10/2008 A
* The information in this manual is subject to change without notice and should not be
construed as a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without
notice, to make changes to equipment design as advances in engineering and manufacturing
methods warrant.
zThis manual provides the information necessary to install, program, operate and
maintain the KS660.

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LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes

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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION ............................................... 8
1.1 Purpose......................................................................8
1.2 Regulatory Information.................................................8
2. PERFORMANCE............................................. 10
2.1 H/W Feature..............................................................10
2.2 Technical specification ...............................................11
3. TECHNICAL BRIEF......................................... 17
3.1 KS660 Functional Block diagram ...............................17
3.2 Baseband Processor (BBP) Introduction ......................18
3.3 Power management IC...............................................28
3.4 Power ON/OFF ..........................................................33
3.5 Dual SIM & u-SD Interface .........................................35
3.6 Memory ....................................................................37
3.7 LCD Display ..............................................................39
3.8 Keypad .....................................................................40
3.9 Keypad Backlight.......................................................41
3.10 LCD Backlight .........................................................42
3.11 JTAG & ETM interface connector ..............................43
3.12 Charging Circuit ......................................................43
3.13 18pin Multi Media Interface connector......................44
3.14 Acceleration sensor .................................................45
3.15 Touch Operation ......................................................46
3.16 Camera & Flash LED................................................47
3.17 KS660 RF Block Diagram.........................................51
3.18 RF Block General Description ...................................51
3.19 Receiver part...........................................................55
3.20 Transmitter part.......................................................57
3.21 RF synthesizer.........................................................59
3.22 DCXO .....................................................................59
3.23 Front End Module control.........................................61
3.24 Power Amplifier Module ...........................................63
3.25 Mode Selection .......................................................64
4. TROUBLE SHOOTING..................................... 65
4.1 Trouble shooting test setup ........................................65
4.2 Power on Trouble.......................................................66
4.3 Charging trouble........................................................69
4.4 LCD display trouble ...................................................72
4.5 Camera Trouble.........................................................75
4.6 Vibrator trouble..........................................................77
4.7 Keypad back light trouble...........................................79
4.8 Touch trouble ............................................................81
4.9 Trouble shooting of RF Block 1 (SG3) Receiver part......82
4.10 Trouble shooting of RF Block 1 (SG3) Transmitter part 82
4.11 Trouble shooting of RF Block 2 (SGR) Receiver part 97
4.12 Trouble shooting of RF Block 2 (SGR)
Transmitter part.....................................................103
5. DOWNLOAD & S/W UPGRADE..................... 112
6. BLOCK DIAGRAM........................................ 123
7. CIRCUIT DIAGRAM...................................... 125
8. BGA PIN MAP.............................................. 135
9. PCB LAYOUT ............................................... 145
10. RF CALIBRATION ...................................... 151
10.1 RF Block 1 (SG3) RF Calibration..............................151
10.2 RF Block 2 (SGR) RF Calibration .............................156
11. STAND-ALONE TEST ................................. 162
11.1 RF Block 1 (SG3) Stand-alone Test .........................162
11.2 RF Block 2 (SGR) Stand-alone Test .........................167
12. ENGINEERING MODE................................. 172
13. EXPLODED VIEW & REPLACEMENT
PART LIST ................................................. 173
13.1 EXPLODED VIEW ...................................................173
13.2 Replacement Parts ................................................175
13.3 Accessory .............................................................206

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LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
ABBREVIATION
For the purposes of this manual, following abbreviations apply:

APC Automatic Power Control

BB Baseband

BER Bit Error Ratio

CC-CV Constant Current – Constant Voltage

CLA Cigar Lighter Adapter

DAC Digital to Analog Converter

DCS Digital Communication System

dBm dB relative to 1 milli-watt

DSP Digital Signal Processing

EEPROM Electrical Erasable Programmable Read-Only Memory

EGPRS Enhanced General Packet Radio Service

EL Electroluminescence

ESD Electrostatic Discharge

FPCB Flexible Printed Circuit Board

GMSK Gaussian Minimum Shift Keying

GPIB General Purpose Interface Bus

GPRS General Packet Radio Service

GSM Global System for Mobile Communications

IPUI International Portable User Identity

IF Intermediate Frequency

LCD Liquid Crystal Display

LDO Low Drop Output

LED Light Emitting Diode

LGE LG Electronics

OPLL Offset Phase Locked Loop

PAM Power Amplifier Module

PCB Printed Circuit Board

PGA Programmable Gain Amplifier

PLL Phase Locked Loop

PSTN Public Switched Telephone Network

RF Radio Frequency

RLR Receiving Loudness Rating

RMS Root Mean Square

RTC Real Time Clock

SAW Surface Acoustic Wave

SIM Subscriber Identity Module

SLR Sending Loudness Rating

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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION

SRAM Static Random Access Memory

STMR Side Tone Masking Rating

TA Travel Adapter

TDD Time Division Duplex

TDMA Time Division Multiple Access

UART Universal Asynchronous Receiver/Transmitter

VCO Voltage Controlled Oscillator

DCXO Digitally Controled Crystal Oscillator

WAP Wireless Application Protocol
◆8PSK 8 Phase Shift Keying

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LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
1. INTRODUCTION
1.1. Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the KS660.
1.2. Regulatory Information
1.2.1. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. LGE does not warrant that this product is
immune from the above case but will prevent unauthorized use of common-carrier telecommunication
service of facilities accessed through or connected to it. LGE will not be responsible for any charges that
result from such unauthorized use.
1.2.2. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is
not done.
1.2.3. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the KS660 or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
1.2.4. Maintenance Limitations
Maintenance limitations on the KS660 must be performed only at the LGE or its authorized agents. The
user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.
1.2.5. Notice of Radiated Emissions
The KS660 complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
1.2.6. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
1.2.7. Interference and Attenuation
An KS660 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.

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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1.2.8. Electrostatic Sensitive Devices
ATTENTION
Boards, which contains Electrostatic Sensitive Device(ESD), are indicated by the sign.
Following information is ESD handling: Service personnel should ground themselves by using
a wrist strap when exchange system boards.
When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these
protective packages until these are used. When returning system boards or parts such as
EEPROM to the factory, use the protective package as described.

2.1. H/W Feature
Item Feature Comment
Standard Battery Lithium-Ion Polymer, 950mAh
AVG TCVR Current 270mA typ @PL5
Standby Current 3.5 mA typ @PP5
Talk time 3 hours (GSM TX Level 7)
Standby time Over 250 hours (Paging Period:9, RSSI: -85dBm)
Charging time Under 3 hours
RX Sensitivity EGSM/GSM900:-105dBm,DCS/PCS:-105dBm
TX output power EGSM/GSM900 : 33dBm (@PL 5)
DCS/PCS: 30dBm (@PL 0)
GPRS compatibility Class 10
SIM card type 3V Small
Display Main 240 u400 pixels, 3” WQVGA, 262K color
Status Indicator Send Key, Shortcut Key, Volume Up/Down Key, PWR
Key, Camera Key, Lock Key
ANT Built in antenna
EAR Phone Jack 18pin multi port Headset jack
PC Synchronization Yes
Speech coding HR/EFR/FR/AMR
Data and Fax Yes
Vibrator Yes
Buzzer No
Voice Recoding Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Bluetooth hands-free kit, Data Kit
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2. PERFORMANCE
2. PERFORMANCE

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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2.2. Technical specification
Item Description Specification
1Frequency Band
GSM900
TX: 890 + 0.2 x n MHz
RX: 935 + 0.2 x n MHz ( n = 1 ~ 124 )
EGSM
TX: 890 + 0.2 x (n-1024) MHz
RX: 935 + 0.2 x (n-1024) MHz ( n = 975 ~ 1023 )
DCS1800
TX: 1710 + ( n-511 ) u0.2 MHz (n = 512 a885)
RX: TX + 95 MHz
PCS1900
TX: 1850.2 + ( n-512 ) u0.2 MHz (n = 512 a810)
RX: TX + 80MHz
2Phase Error RMS < 5 degrees
Peak < 20 degrees
3Frequency Error < 0.1ppm
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 33 dBm ±2dB 13 17 dBm ±3dB
6 31 dBm ±3dB 14 15 dBm ±3dB
7 29 dBm ±3dB 15 13 dBm ±3dB
8 27 dBm ±3dB 16 11 dBm ±5dB
9 25 dBm ±3dB 17 9 dBm ±5dB
10 23 dBm ±3dB 18 7 dBm ±5dB
11 21 dBm ±3dB 19 5 dBm ±5dB
12 19 dBm ±3dB
DCS1800/PCS1900
Level Power Toler. Level Power Toler.
0 30 dBm ±2dB 8 14 dBm ±3dB
1 28 dBm ±3dB 9 12 dBm ±4dB
2 26 dBm ±3dB 10 10 dBm ±4dB
3 24 dBm ±3dB 11 8 dBm ±4dB
4 22 dBm ±3dB 12 6 dBm ±4dB
5 20 dBm ±3dB 13 4 dBm ±4dB
6 18 dBm ±3dB 14 2 dBm ±5dB
4Power Level
7 16 dBm ±3dB 15 0 dBm ±5dB

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LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
GSM900/EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
6,000 -71
DCS1800/PCS1900
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
5Output RF Spectrum
(due to modulation)
6,000 -73
GSM900/EGSM
Offset from Carrier (kHz) Max. (dBm)
400 -19
600 -21
1,200 -21
1,800 -24
DCS1800/PCS1900
Offset from Carrier (kHz) Max. (dBm)
400 -22
600 -24
1,200 -24
6Output RF Spectrum
(due to switching transient)
1,800 -27

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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
7 Spurious Emissions Conduction, Emission Status
Conduction, Emission Status
8Bit Error Ratio
EGSM/GSM900
BER (Class II) < 2.439% @-102dBm
DCS1800/PCS1900
BER (Class II) < 2.439% @-100dBm
9Rx Level Report accuracy r3 dB
10 SLR 8r3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 /
200 0 /
300 0 -12
1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
11 Sending Response
4,000 0 /
12 RLR 2r3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 /
200 0 /
300 2 -7
500 * -5
1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
13 Receiving Response
* Mean that Adopt a straight line in between
300 Hz and 1,000 Hz to be Max. level in the
range.
14 STMR 13 r5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
-10 33.3
0 33.7
7 31.7
16 Distortion
10 25.5

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2. PERFORMANCE
17 Side tone Distortion Three stage distortion < 10%
18 <Change> System frequency (26 MHz)
tolerance d2.5 ppm
19 <Change>32.768KHz tolerance d30ppm
20 Power consumption Standby
- Normald3 mA(@PP9)
21 Ta l k T i m e EGSM/Lvl 7 (Battery Capacity 950mA):180 min
EGSM/Lvl12(Battery Capacity 950 mA):320min
22 Standby Time
Under conditions, at least 300 hours:
1. Brand new and full 950mAh battery
2. Full charge, no receive/send and keep GSM
in idle mode.
3. Broadcast set off.
4. Signal strength display set at 3 level above.
5. Backlight of phone set off.
23 Ringer Volume
At least 65 dB under below conditions:
1. Ringer set as ringer.
2. Test distance set as 50 cm
24 Charge Current Fast Charge : < 400 mA
Slow Charge: < 120 mA
Antenna Bar Number Power
7>-92 dBm a
5-97dBm a–93dBm
4-100dBm a–98dBm
2-103dBm a–101dBm
1-105dBm a–104dBm
0 < –106 dBm
25 Antenna Display
Off No Service
Battery Bar Number Voltage (±0.05V)
3 3.69V~4.2V
2 3.53V~3.69V
1 3.43V~3.53V
26 Battery Indicator
0 3.35V~3.43V
3.53V↓±0.05V (Call)
27 Low Voltage Warning 3.43V↓±0.05V (Standby)
28 Forced shut down Voltage 3.3 r0.05 V

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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
29 Battery Type
Li-ion Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 950mAh
30 Travel Charger
Switching-mode charger
Input: 150 a240 V, 50/60Hz
Out put: 5.6, 0.4A
* EDGE RF Specification (Option: is not serviced for ”EDGE mode”)
Item Description Specification
1 RMS EVM ≤9%
2 Peak EVM ≤30%
3 95th Percentile EVM ≤15%
4 Origin Offset Suppression ≥30dB
GSM900/EGSM
Level Power Toler. Level Power Toler.
5 27dBm ±3dB 13 17dBm ±3dB
6 27dBm ±3dB 14 15dBm ±3dB
7 27dBm ±3dB 15 13dBm ±3dB
8 27dBm ±3dB 16 11dBm ±5dB
9 25dBm ±3dB 17 9dBm ±5dB
10 23dBm ±3dB 18 7dBm ±5dB
11 21dBm ±3dB 19 5dBm ±5dB
12 19dBm ±3dB
DCS1800, PCS1900
Level Power Toler. Level Power Toler.
0 26/25dBm ±3dB 8 14dBm ±3dB
1 26/25dBm ±3dB 9 12dBm ±4dB
2 26/25dBm ±3dB 10 10dBm ±4dB
3 24dBm ±3dB 11 8dBm ±4dB
4 22dBm ±3dB 12 6dBm ±4dB
5 20dBm ±3dB 13 4dBm ±4dB
6 18dBm ±3dB 14 2dBm ±5dB
5 Power Level
7 16dBm ±3dB 15 0dBm ±5dB
GSM900/EGSM
Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
400 -54
600~<1,200 -60
1,200~<1,800 -60
1,800~<3,000 -63
3,000~<6,000 -65
6,000 -71
DCS1800, PCS1900
Offset from carrier(kHz) Max. dBc
100 +0.5
200 -30
250 -33
6 Output RF Spectrum
(due to modulation)
400 -54

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LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
600~<1,200 -60
1,200~<1,800 -60
1,800~<3,000 -63
3,000~<6,000 -65
6,000 -71
GSM900/EGSM
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
1,800 -30
DCS1800, PCS1900
Offset from carrier(kHz) Max. dBm
400 -23
600 -26
1,200 -27
7Output RF Spectrum
(due to switching transient)
1,800 -30


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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1. KS660 Functional Block diagram.
The functional component arrangement is mentioned below diagram.
< Fig 1. KS660 Functional Block diagram >
LGE Internal Use Only Challenge 123
KS660
Block
Diagram
3” TFT LCD
(WQVGA,
240x400

Touch Pad
MIC
Receiver
Speaker



TA
Headset
BAT
Li-Ion
950mAh
BAT
Li-Ion
950mAh
SIM Card 2
SIM Card 1
Memory 2
(1G NAND +
512M SDRAM)
BaseBand 1
(SG3+SMPower)
Memory 1
(2G NAND +
1G SDRAM) ANT 1
PAM 2
FEM 2
ANT 2
DPRAM (128M)
SIM
Switch
Touch
IC
Accel.
Sensor
Camera
(5M, AF)
Flash LED
Multimedia
IC
(M180)
MIPI
Charge
Pump
LCD
Interface
DAC
& AMP
(WM8990)
LDO
(1.2V/1.8V/
2.8V/2.6V)
I2S
μSD Card
PCM
Switch
RF
Transceiver
PAM 1 FEM 1
UART
& USB
Switch
Mic
Switch
RCV
Switch
Vibrator
Charging
IC
LCD
Backlight
Charge Pump
BaseBand 2
(SGRadio)
I2C
MMCI
I2C
Touch Signal
LCD
Backlight
Headset
RCV
Switch
Headset
Mic
Switch
SPK
Switch
Bluetooth
& FM Radio
BT ANT
FM Radio
MM Interface

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3. TECHNICAL BRIEF
3.2. Dual Baseband Processor (BBP) Introduction
KS660 is composed of dual Baseband Processor. (S-Gold3 & S-Gold Radio)
3.2.1. S-Gold3 Part
< Fig 2. Top level block diagram of the S-GOLD3TM (PMB8877) >
3.2.1.1. General Description
S-GOLD3TM is a GSM/EDGE single chip mixed signal Baseband IC containing all analog and digital
functionality of a cellular radio. Additionally S-GOLD3TM Provides multimedia extensions such as camera,
software MIDI, MP3 sound. It is designed as a single chip solution, integrating the digital and mixed
signal portions of the base band in 0.09um, 1.2V technology.
The chip will fully support the FR, EFR, HR and AMR-NB vocoding.
S-GOLD3TM support multi-slot operation modes HSCSD (up to class 10), GPRS for high speed data
application (up to class 12) and EGPRS (up to class 12) without additional external hardware.
3.2.1.2. Block Description
zProcessing core
ARM926EJ-S 32 bit processor core for controller functions. The ARM926EJ-S includes an MMU, and
the Jazelle Java extension for Java acceleration.
- TEAKLite DSP core

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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
zARM-Memory
- 32k Byte Boot ROM on the AHB
- 96k Byte SRAM on the AHB, flexibly usable as program or data RAM
- 16k Byte Cache for Program (internal)
- 8k Byte tightly coupled memory for Program(internal)
- 8k Byte Cache for Data(internal)
- 8k Byte tightly coupled memory for Data(internal)
zDSP-Memory
- 104K x 16bit Program ROM
- 8k x 16bit Program RAM
- 60k x 16bit Data ROM
- 37k x 16bit Data RAM
- Incremental Redundancy(IR) Memory of 35904 words of 16bit
zShared Memory Block
1.5K x 32bit Shared RAM(dual ported) between controller system and TEAKLite.
zController Bus system
The processor cores and their peripherals are connected by powerful buses.
Multi-layer AHB for connecting the ARM and the other master capable building blocks with the internal
and external memories and with the peripheral buses.
zClock system
The clock system allows widely independent selection of frequencies for the essential parts of the
S-GOLD3. Thus power consumption and performance can be optimized for each application.
zFunctional Hardware block
- CPU and DSP Timers
- MOVE coprocessor performing motion estimation for video encoding algorithms
(H.263, MPEG-4)
- Programmable PLL with additional phase shifters for system clock generation
- GSM Timer Module that off-loads the CPU from radio channel timing
- GMSK / 8-PSK Modulator according to GSM-standard 05.04 (5/2000)
- GMSK Modulator: gauss-filter with B*T=0.3
- EDGE Modulator: 8PSK-modulation with linearized GMSK-Pulse-Filter
- Hardware accelerators for equalizer and channel decoding.
- Incremental Redundancy memory for EDGE class 12 support
- A5/1, A5/2, A5/3 Cipher unit
- GEA1, GEA2, GEA3 Cipher Unit to support GPRS data transmission
- Advanced static and dynamic power management features including TDMA-Frame
synchronous low power mode and enhanced CPU modes(idle and sleep modes)
- Pulse Number Modulation output for Automatic Frequency Correction(AFC)
- Serial RF Control interface: support of direct conversion RF
- A Universal Serial Interface(USIF) enabling asynchronous (UART) of synchronous (SPI)
serial data transmission
- 3 USIF with autobaud detection, hardware flow control and integrated
- A dedicated Fas IfDA Controller supporting IrDA’s SIR,MIR and FIR standards
(up to 4Mbps)
- I2C-bus interface (e.g. connection to S/M power)
- A fast display interface supporting serial and parallel interconnection
- An ITU-R BT.656 compatible Camera interface.
- Programmable clock output for a camera
- An multimedia/Secure Digital Card Interface (MMCI/SD:SDIO capable)

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3. TECHNICAL BRIEF
3.2.1.3. External Devices connected to memory interface
Device Name Maker Remark
NAND FLASH H8ACS0SJ0MCP-56M Hynix
SDR H8ACS0SJ0MCP-56M Hynix
LCD
Multimedia IC AMD Multimedia processing
DPRAM
3.2.1.4. RF Interface (T_OUT)
S-Gold3 uses this interface to control RF IC and Peripherals. 13 signals are provided switch
on/off RF ICs Periodically each TDMA frame.
T_OUT
Resource Interconnection Description
T_OUT0 TXON_PA PAM Power on
T_OUT1 FE2 FEM Control
T_OUT2 PA_BAND TX RF band select
T_OUT3 FE1 FEM control
T_OUT6 PA_MODE PAM Mode select
3.2.1.5. USIF Interface
KS660 have three USIF Drivers as follow :
- USIF1 : Hardware Flow Control / SW upgrade / Calibration
- USIF2 : Not used Rx, Tx and CTS, RTS use BT Interface
- USIF3 : BT Interface
3.2.1.6. ADC channel
BBP ADC block is composed of 10 external ADC channel. This block operates charging process and
other related process by reading battery voltage and other analog values.
ADC channel
Resource Interconnection Description
M0 BAT_ID Battery temperature measure
M1 RF_TEMP RF block temperature measure
M2 Remote ADC Headset Key ADC measure
M8 VSUPPLY Battery supply voltage measure
Resource Name Remark
USIF1
USIF1_TXD SIM1_UART_TX Transmit Data
USIF1_RXD SIM1_UART_RX Receive Data
USIF1_CTS USB_SE0_VM USB
USIF1_RTS USB_DAT_VP USB
USIF2
USIF2_CTS SIM1_BT_CTS BlueTooth
USIF2_RTS SIM1_BT_RTS. BlueTooth
USIF3
USIF3_TXD SIM1_BT_TX BT Transmit tx
USIF3_RXD SIM!_BT_RX BT Receive rx

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Copyright © 2008 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL BRIEF
3.2.1.7. GPIO map
Over a hundred allowable resources, KS660 is using as follows except dedicated to SIM and Memory.
KS660 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is
shown in below table
Port function Signal Name Reset
Value Description
KP_IN0 KEY_ROW0 T/PU Key
KP_IN1 KEY_ROW1 T/PU Key
KP_IN2 KEY_ROW2 T/PU Key

GPIO_03 HSMIC_BIAS_EN T/PU Headset Mic Bias
CC0CC4IO CHG_DET T/PU Charger Detect
CC1CC0IO MMC_DET T/PU u-SD Card Detect
CC1CC4IO ACCEL_INT T/PU Accelerator Sensor
KP_OUT0 KEY_COL0 T/PU Accelerator Sensor
KP_OUT1 KEY_COL1 T/PU Key
KP_OUT2 KEY_COL2 T/PU Key
KP_OUT3 KEY_COL3 T/PU Key
USIF1_RXD_MRST SIM1_UART_RX T/PD UART
USIF1_TXD_MTSR SIM1_UART_RX T/PD UART
USIF1_RTS_N USB_DAT_VP T/PU USB
USIF1_CTS_N USB_SE0_VM T/PD USB
EINT3 TS_IRQ T/PU Touch INT
GPIO_16 EN_T T/PD Sub PMIC Enable
USIF2_RTS_N SIM1_BT_RTS T/PD Bluetooth
USIF2_CTS_N SIM1_BT_CTS T/PD Bluetooth
USIF3_RXD_MRST SIM1_BT_RX T/PD Bluetooth
USIF3_TXD_MTSR SIM1_BT_TX T/PD Bluetooth
GPIO_21 SGR_PWR_ON T/PD SGoldRadio Power On
GPIO_22 USB_SEL T/PD USB Switch
GPIO_107 VIB_EN T/PD Vibrator Enable
GPIO_108 LCD_BT_CTRL T/PD
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CIF_D0 MM_AD0 T/PD Companion IC Address
CIF_D1 MM_AD1 T/PD Companion IC Address
CIF_D2 MM_AD2 T/PD Companion IC Address
CIF_D3 MM_AD3 T/PD Companion IC Address
CIF_D4 MM_AD4 T/PD Companion IC Address
CIF_D5 MM_AD5 T/PD Companion IC Address
CIF_D6 MM_AD6 T/PD Companion IC Address
CIF_D7 MM_AD7 T/PD Companion IC Address
GPIO_86 DIF_BYPASS T/PD LCD Bypass Mode
GPIO_87 MM_WAIT T/PD Companion IC Address
GPIO_88 MM_RESETB_CORE T/PD Companion IC
CLKOUT2 26M_OUT T/PD 26MHz Output
GPIO_113 SG3_INT T/PD SGoldRadio INT
GPIO_90 MM_RESET T/PD Companion IC
DIF_D0 MM_AD8 T/PD Companion IC Address
DIF_D1 MM_AD9 T/PD Companion IC Address
DIF_D2 MM_AD10 T/PD Companion IC Address