LG L1100 User manual

Service Manual Model : L1100
Service Manual
L1100
P/N : MMBD0032801 Date: June, 2004 / Issue 1.0

REVISED HISTORY
DATE ISSUE CONTENTS OF CHANGES S/W VERSION
31/MAR/2004 ISSUE 0.1 Initial Release
The information in this manual is subject to change without notice and should not be construed as
a commitment by LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make
changes to equipment design as advances in engineering and manufacturing methods warrant.
This manual provides the information necessary to install, program, operate and maintain the
L1100
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-2-
Table of Contents
1. INTRODUCTION.................................. 4
1.1 Purpose ............................................….
1.2 Regulatory Information ..........................
1.3 Abbreviations .........................................
2. General Performance .....................… 7
2.1 Product Name ................................…….
2.2 Supporting Standard ……………………..
2.3 Main Parts …………………………………
2.4 H/W Features …………………………….
2.5 S/W Features …………………………….
3. H/W Circuit Description ....................12
3.1 RF Transceiver General Description ……
3.2 Receiver Part …………………………….
3.3 Transmitter Part …………………………….
3.4 Power Amplifier …………………………….
3.5 26MHz Clock ……………………………….
3.6 Power Supplies and Control Signals ……
3.7 Digital Baseband (DBB) Processor ………
3.8 Analog Baseband (ABB) Processor …...…
3.9 Camera Circuit ……..……………….………
4
4
6
7
7
7
8
10
12
12
15
17
17
18
19
24
42
5. ASSEMBLY INSTRUCTION ………....97
5.1 Disassembly ..........................................97
6. DOWNLOAD ……………………...……103
6.1 Download Setup .....................................
6.2 Download Procedure ………...….……….
103
104
7. SERVICE AND CALIBRATION …….. 111
4.10 Vibrator Trouble ………………………….
4.11 Keypad Backlight Trouble ……………….
4.12 Folder Open/Close Trouble ………….….
4.13 SIM Detect Trouble ………………………
4.14 Earphone Trouble ………………………..
4.15 Infrared Data Association Trouble ………
4.16 Camera Trouble …………………………..
64
66
68
70
72
77
80
7.1 Service S/W ……....................................
7.2 Calibration ……………….…...….……….
111
114
4. TROUBLESHOOTING .................… 49
4.1 Main Components Placement …………..
4.2 FPCB Components Placement ………….
4.3 Baseband Components ..……………..….
4.4 Main Components …………………………
4.5 Power On Trouble …..........…………..….
4.6 Charging Trouble ........................…..…..
4.7 LCD Display Trouble ………....................
4.8 Receiver Trouble ………………………….
4.9 Microphone Trouble ……………………….
49
50
50
51
52
53
55
57
61
8. CIRCUIT DIAGRAM .............………... 119
8.1 BB_MAIN ………..……………..................
8.2 AUDIO …………………….……………….
8.3 MEMORY ………….…………………..….
8.4 MMI ……….…………….………………….
8.5 Peripheral ………………………..…..…….
8.6 CAMERA ………………………………...
8.7 LCD ………………………………….…….
8.8 RF ………………………………………….
119
120
121
122
123
124
125
126

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Table of Contents
10. ENGINEERING MODE ................... 129
11.1 Setting Method .................................….
130
11. STANDALONE TEST ..................... 130
12.1 Exploded View .................................….
12.2 Replacement Parts
<Mechanic components> ………………..
Replacement Parts
<Main components>………………………
12.3 Accessory ………………………………..
131
133
136
148
12. EXPLODED VIEW &
REPLACEMENT PART LIST.......... 131
9. PCB LAYOUT .............……………... 127

1. Introduction
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the L1100
1.2 Regulatory Information
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges you’re your telecommunications
services. System users are responsible for the security of own system. There are may be risks of toll
fraud associated with your telecommunications system. System users are responsible for
programming and configuring the equipment to prevent unauthorized use. LGE does not warrant that
this product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it. LGE will not be
responsible for any charges that result from such unauthorized use.
A. Security
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
B. Incidence of Harm
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the L1100 or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to
take appropriate steps to maintain telephone service.
C. Changes in Service
Maintenance limitations on the L1100 must be performed only by the LGE or its authorized agent. The
user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may
void any remaining warranty.
D. Maintenance Limitations
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The L1100 complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
E. Notice of Radiated Emissions
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
F. Pictures
An L1100 may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
G. Interference and Attenuation
H. Electrostatic Sensitive Devices
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange
system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
ATTENTION
-5-

1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control
BB Baseband
BER Bit Error Ratio
CC-CV Constant Current – Constant Voltage
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milliwatt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
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2. General Performance
2.1 Product Name
Item Feature Comment
Supporting Standard
E-GSM/ DCS/ PCS Tril Band
with seamless handover
Phase 2+
SIM Toolkit : Class 1,2,3
Frequency Range
E-GSM TX : 880 – 915 MHz
E-GSM RX : 925 – 960 MHz
DCS 1800 TX : 1710 – 1785 MHz
DCS 1800 RX : 1805 – 1880 MHz
PCS 1900 TX : 1850 – 1909 MHz
PCS 1900 RX : 1930 – 1990 MHz
-7-
L1100: Support GPRS (Class 10)
2.2 Supporting Standard
Application
Standard
WAP 2.0 : Yes
MMS : Yes
JAVA : MIDP v1.0
IrDA 1.3
L1100
2.3 Main Parts: GSM Solution
Digital Baseband CALYPSO @39MHz (D751992GHH)
Analog Baseband IOTA (TWL3014CGGM)
RF Chip Aero-1 (SI4205)

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2.4 H/W Features
Item Feature Comment
Form Factor Clam shell LCD (TFT 65K Color)
Battery
Capacity
Standard: Li-Ion, 820mAh(Min)
Packing Type: Hard Pack
Cell Size: Standard
4.5(L)×33.8(W)×49.7(H)mm
Size Standard: 89×50×24mm L×W×H
Weight 90.5g With Battery
PCB Main PCB : 8Layers, 1t
FPCB : 5Layers, 0.5t
AVG TCVR
current (mA)
270 mA (GSM, Power Level 5)
120 mA (GSM, Power Level 12)
Standby Current 2.6mA @ Paging Period 9
Standby time Up to 200 hours @ Paging Period 9
Charging time Below 3 hr. @ Power Off / 820mAh
Talk time Min : 3hr @Power Level 5
Min : 6hr @Power Level 12 @ 820mAh
RX sensitivity
GSM 900 : -105 dBm
DCS 1800 : -105 dBm
PCS 1900 : -105 dBm
TX output power
GSM 900 : 32 dBm
DCS 1800 : 29 dBm
PCS 1900 : 29 dBm
Class4 (GSM)
Class1 (DCS)
Class1 (PCS)
GPRS compatibility GPRS Class 10
SIM card type Plug-In SIM 3V
Display
-MAIN LCD : 65K Color-TFT (128 X160)
-SUB LCD : 4Gray (96X 64)
- Pixels : 0.231 x 0.231 mm
- View Area : 30.57 x 7.96 mm
-Active Area : 29.568 x 36.96 mm
-Backlight : White LED
(Sub : 0.197 x 0.21)
(Sub : 20.9 x 15.4)
(Sub : 18.902 x 13.43)
Status Indicator Yes (Red, Green)
Keypad
Alphanumeric Key : 12
Function Key : 12
Side Key : 2
Total Number of Keys : 26
Function Key:
4 Key Navigation & OK,
F1, F2, SND, END/PWR,
Clear, Camera, Calendar

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Item Feature Comment
Antenna Fixed Type
System connector 24 Pin
Ear Phone Jack 3 Pole (φ2.5mm)
PC synchronization Yes CDROM
Memory Flash : 128Mbit / SRAM : 64Mbit AMD
Speech coding FR, EFR, HR
Data & Fax Built in Data & Fax support
Vibrator Built in Vibrator
IrDA Built in IrDA PC sync support
MIDI (for Buzzer
Function) 40 Poly Buzzer Function By Using
MIDI IC
Voice Recording up to 90 sec 30sec x 3
Travel Adapter Yes
Camera Sensor VGA / CIS
Options
Travel Adapter
Ear-Microphone
Hand Strap
Cigarette Lighter Adapter
Data Cable
Handsfree Car Kit
Simple Hands Free kit

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2.5 S/W Features
Item Feature Comment
RSSI 0~5 level Antenna
Quick Access Mode Schedule/Ring Tone/Phonebook
Camera/GPRS
Battery Charging 0~4 level
Key Volume 0~5 level
Keypad Volume 0~5 level
Effect sound volume 0~5 level
Ring Volume 0~5 level
Time/Date Display Yes
Text Input T9
Multi-language Yes
PC Sync Schedule/Phonebook/SMS MS Scheduler & Outlook
Speed Dial Yes (2~9) Voice mail center →1 key
Profile Yes
CLIP/CLR Yes
Phonebook 3 Number + 1 Memo + 1 e-mail Phone (Up to 255 entries)
Last Dial Number Yes (20)
Last Received
Number Yes (20)
Last Missed Number Yes (10)
Search Number/Name Yes
Group 7 / User Editor
Fixed Dial Number Yes
Voice Memo 30 secs * 3
Call Remainder Yes
Network Selection Automatic / Manual

-11-
Item Feature Comment
Mute Yes
Call Divert Yes
Call Barring Yes
Call Charge Yes
Call Duration Yes
SMS (EMS) 100
EMS
Send/Receive/Save Yes Melody/Picture/Animation
MMS Yes
WAP Browser WAP 2.0
Java CLDC v1.0.3 / MIDP v1.0.3
Wall Paper Yes Max. 10 preset
Download Melody/
Wallpaper (MMS) Over the WAP
Long Message Max. 918 Character(6page*153)
Cell Broadcast Yes
Calendar Yes
Memo 20
World Clock Yes
Unit Convert Length/Surface/Volume/Weight
Fax & Data Yes
SIM Lock Yes Operator Dependent
SIM Toolkit Class 1,2,3
Camera
Image resolutio(640 x 480, 320*240, 160*120, 128*160, 48*80)
400 KB dynamic memory for
images : Max 200 photos (128 x 96)
Max 4x zoom
Phone lock Yes
Security DRM (Forward-lock only)
CPHS Yes
IM Yes

3. H/W Circuit Description
3.1 RF Transceiver General Description
The RF parts consist of a transceiver part, a power amplifier part, a front-end module part, a voltage
supply part, and a VC-TCXO part.
The AeroTM Itransceiver is composed of single RF chipset, Si4205-BM[U803] which is a triple and
quad-band GSM/GPRS wireless communications.
This device integrated a receiver based on a low IF (100KHz) architecture and a transmitter based on
modulation loop architecture. The transceiver employed a 3 wire serial interface to allow an external
system controller to write the control registers for dividers, receive path gain, power down setting, and
other controls.
3.2 Receiver Part
The receiver part uses a low-IF receiver architecture that allows for the on-chip integration of the
channel selection filters, eliminating the external RF image reject filters and the IF SAW filter required
in conventional super-heterodyne architecture. The Si4205-BM[U803] integrates three differential
input LNAs that are matched to the 150 Ohm balanced-output SAW filters through external LC
matching networks.
A quadrature image-rejection mixer downconverts the RF signal to a 100kHz intermediate frequency
(IF) with the RFLO from the frequency synthesizer. The mixer output is amplified with an analog
programmable gain amplifier (PGA) and quadrature IF signal is digitized with high resolution A/D
converters (ADCs).
The Si4205-BM[U803] downconverts the ADC output to baseband with a digital 100kHz quadrature
LO signal. Digital decimation and IIR filters perform channel selection to remove blocking and
reference interference signals. After channel selection, the digital output is scaled with digital PGA,
which is controlled with the DGAIN[5:0] bits in register 05h. The amplified digital output signal go
through with DACs that drive a differential analog signal onto the RXIP,RXIN,RXQP and RXQN pins
to interface to standard analog ADC
input baseband ICs.
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Antenna Bar Number Rx Power (dBm)
Antenna Display
5 →4-85dBm±2dBm
4 →3-90dBm±2dBm
3 →2-95dBm±2dBm
2 →1-100dBm±2dBm
1 →0-105dBm±2dBm

RF front end consists of Antenna Switch(FL801), triple band LNAs integrated in transceiver(U803).
The Received RF signals (EGSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz, PCS 1930MHz ~
1990MHz) are fed into the antenna or mobile switch. An antenna matching circuit is between the
antenna and the mobile switch. The Antenna Switch(FL801) is used for control the Rx and TX paths.
And the input signals VC1,VC2 and VC3 of a FL801 pass through triple-buffer(U801) are directly
connected to baseband controller to switch either TX or RX path on. Ant S/W (FL801) is an antenna
switch module for triple band phone. The logic and current is given below Table 3-1.
-13-
Table 3-1. The Logic and Current
3.2.1. RF Front End
Figure 1. RF Receiver Block
ADC
ADC
ADC
ADC
RF
PLL
RF
PLL
Channel Filter
Channel Filter
DAC
DAC
DAC
DAC
100KHz
100KHz
D
I
P
D
I
P
EGSM
DCS
FL801
Antenna Switch
26MHz
I
Q
U803/Si4205
÷2:GSM
÷2:GSM
÷1:DCS
÷1:DCS
0˚/
90˚
0˚/
90˚
RF1
RF2
PGA PGA
X801
VC-TCXO
GSM
DCS
PCS
LNA
Baseband
(TI)
U102
(Calypso)
+
U101
(IOTA)
Baseband
(TI)
U102
(Calypso)
+
U101
(IOTA)
PCS
VC1
EGSM RX 0 V
DCS RX 0 V
PCS RX 2.5~3.0 V
VC3
0 V
0 V
0 V
Current
< 0.1 mA
< 0.1 mA
10.0 mA max
VC2
0 V
0 V
0 V
EGSM TX 0 V 2.5~3.0 V 10.0 mA max0 V
DCS/PCS TX 0 V 0 V 10.0 mA max2.5~3.0 V

A quadrate image-rejection mixer downconverts the RF signal to a 100kHz intermediate frequency (IF)
with the RFLO from the frequency synthesizer. The RFLO frequency is between 1737.8 and 1989.9
MHz, and is divided by two for GSM 850 and EGSM 900 modes. The mixer output is amplified with an
analog programmable gain amplifier (PGA), which is controlled with the AGAIN[2:0] bits in register 05h.
The quadrate IF signal is digitized with high resolution A/D converters (ADCs).
The Si4205-BM[U803] down-converts the ADC output to baseband with a digital 100kHz quadrate LO
signal. Digital decimation and IIR filters perform channel selection to remove blocking and reference
interference signals. The response of the IIR filter is programmable to a high selectivity
setting(CSEL=0) or a low selectivity setting (CSEL=1). After channel selection, the digital output is
scaled with digital PGA, which is controlled with the DGAIN[5:0] bits in register 05h.
3.2.2. IF
The amplified digital output signal go through with DACs that drive a differential analog signal onto the
RXIP, RXIN, RXQP and RXQN pins to interface to standard analog ADC input baseband ICs.
No special processing is required in the baseband for offset compensation or extended dynamic range.
Compared to a direct-conversion architecture, the low-IF architecture has a much greater degree of
immunity to dc offsets that can arise from RF local oscillator(RFLO) self-mixing, 2nd order distortion of
blockers, and device 1/f noise.
3.2.3. Demodulator and Baseband Processing
-14-
3.2.4. Synthesizer
The Aero I transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop
filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs.
The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode. The IF PLL is
used only during transmit mode. All VCO tuning inductors are also integrated. The IF and RF output
frequencies are set by programming the N-Divider registers, NRF1, NRF2 and NIF. Programming the
N-Divider register for either RF1 or RF2 automatically selects the proper VCO. The output frequency
of each PLL is as follows:
fout = N * fø
The DIV2 bit in register 31h controls a programmable divider at the XIN pin to allow either a 13 or 26
MHz reference frequency. For receive mode, the RF1 PLL phase detector update rate (fφ) should be
programmed fφ= 100 kHz for DCS 1800 or PCS 1900 bands, and fφ= 200 kHz for GSM 850 and E-
GSM 900 bands.

Transmit modes should always use fø = 200kHz. The IF and RF output frequencies are set by
programming he N-Divider registers and also programmed via 3-wire interface with external system
controller.
-15-
3.3 Transmitter Part
The Transmitter part contains the transmitter parts of Si4205-BM[U803], Power Amp Module[U804]
and Antenna switch[FL801]. The transmit section of Si4205-BM [U502] consists of an I/Q baseband
upconverter, an offset phase-locked loop(OPLL) and two output buffers that can drive external power
amplifiers(PA).
The RF GMSK outputs from the transmit VCO are fed directly to the RF power amplifiers.
The peak output power and the profile of the transmitted burst are controlled by means of
incorporated power control circuits inside of PA and DAC output from the Baseband Controller.
The PA outputs pass to the antenna connector via Antenna Switch.
Figure 2. Synthesizer Block
Serial
I/O
Serial
I/O
Baseband
(TI)
U101
IOTA
+
U102
Calypso
Baseband
(TI)
U101
IOTA
+
U102
Calypso
U803/Si4205
RF1
RF2
PDIB
26MHz
X801
VC-TCXO
SCLK
SDI
SDO
SEN
PDN
XIN
XOUT
XEN
Power
control
Power
control
Self
Tune
Self
Tune
1/N
1/N
1/N
1/N
Φ
DET
Φ
DET
Self
Tune
Self
Tune
Φ
DET
Φ
DET
To Rx/Tx
To Tx
RF PLL
IF PLL
PDRB
SDOSEL[4:0]
NIF[15:0]
NRF1[15:0]
NRF2[15:0]
÷1,2
÷1,2 ÷65,130 ÷65,130

The baseband converter(BBC) within the GSM chipset generates I and Q baseband signals for the
Transmit vector modulator. The modulator provides more than 40dBc of carrier and unwanted side-
band. Rejection and produces a GMSK modulated signal. The baseband software is able to cancel
out differential DC offsets in the I/Q baseband signals caused by imperfections in the D/A converters.
The TX-Modulator implements a quadrature modulator. A quadrature mixer upconverts the differential
I/Q signals with the IFLO to generate a SSB IF signal, which is filtered and used as the reference input
to the OPLL. The IFLO frequency is generated between 766 and 896 MHz and internally divided by 2
to generate the quadrature LO signals for the quadrature modulator, resulting in an IF between
383MHz and 448 MHz.
3.3.1. IF Modulator
-16-
3.3.2. OPLL
The OPLL consists of a feedback mixer, a phase detector, a loop filter, and a fully integrated TXVCO.
The TXVCO is centered between the DCS 1800 and PCS 1900 bands, and its output is divided by 2 for
the GSM 850 and E-GSM 900 bands. The RFLO frequency is generated between 1272 and 1483 MHz.
To allow a single VCO to be used for the RFLO, high-side injection is used for the GSM 850 and
E-GSM 900 bands, and low-side injection is used for the DCS 1800 and PCS 1900 bands. Low-pass
filters before the OPLL phase detector reduce the harmonic content of the quadrature modulator and
feedback mixer outputs. The cutoff frequency of the filters is programmable with the FIF[3:0] bits in
register 04h. The OPLL requires no external duplexer to attenuate transmitter noise and spurious signal
s in the receive band. Additionally, the output of the transmit VCO (TXVCO) is a constant-envelope
signal which reduces the problem of spectral spreading caused by non-linearity in the PA.
Figure 3. RF Transmit Block
Φ
DET
Φ
DET
÷2
÷2
÷1
÷1
÷2
÷2
IF PLL
IF PLL
I
Q
Baseband
(TI)
U101
IOTA
+
U102
Calypso
Baseband
(TI)
U101
IOTA
+
U102
Calypso
PA_BAND
VC1,VC2,VC3
RFOG RFOD
EGSM DCS/ PCS
RF PLL
RF PLL
D
I
P
D
I
P
DCS
FL801
Antenna Switch
PCS
EGSM
Si4205 (U803)
PAM RF3146 (U804)
PA PA
Triple Buffer
Triple Buffer
VC1,VC2,VC3

3.4 Power Amplifier
-17-
The RF3146 [U804] is a quad-band EGSM 900/GSM 850/DCS/PCS power amplifier module that in
corporates an indirect closed loop method of power control. The indirect closed loop is fully
self-contained and it does not require loop optimization. It can be driven directly from the DAC output
in the baseband circuit.
On-board power control provides over 37 dB of control range with an analog voltage input(Vramp).
Efficiency is 60% at GSM and 55% at DCS/PCS.
3.5 26MHz Clock
The 26 MHz clock consists of a TCXO(Temperature Compensated Crystal Oscillator) which oscillates
at a frequency of 26 MHz. It is used within the Si4205 RF Main Chip, BB Analog chip-set(IOTA),
Digital chipset (Calypso).
Figure 4. Power Amp
Fully Integrated
power control circuit
37
40
41
42
43
45
48
31
6
DCS/PCS IN
BAND SELECT
VBATT
TX ENABLE
VBATT
VRAMP
GSM IN
DCS/PCS OUT
GSM OUT

3.6 Power Supplies and Control Signals
An external regulator(U805) is used to provide DC power to RF part. Every RF component except
power amp module uses this external regulator.
Figure 6 External regulator Circuit
-18-

3.7 Digital Baseband (DBB) Processor
Figure 7. Top level block diagram of the Calypso G2(HERCROM400G2)
CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone.
This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro-
Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bit
SRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOS gates.
The chip will fully support the Full-Rate, Enhanced Full-Rate and Half-Rate speech coding.
CALYPSO implements all features for the structural test of the logic (full-SCAN, BIST, PMT, JTAG
boundary-SCAN).
3.7.1. General Description
-19-