Martindale ET4000 / ET4500 Table of contents
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5.2 Insulation resistance........................................................................................29
5.3 Resistance of earth connection and equipotential bonding .............................31
5.3.1 Continuous resistance measurement .......................................................33
5.3.2 R LOWΩ, 200 mA resistance measurement ............................................34
5.3.3 Continuous low current resistance measurement ....................................35
5.3.4 Nulling of test lead resistance ..................................................................37
5.4 Testing RCDs ..................................................................................................38
5.4.1 Contact voltage (RCD Uc)........................................................................39
5.4.2 Trip-out time (RCDt) .................................................................................40
5.4.3 Trip-out current (RCD I)............................................................................40
5.4.4 RCD Autotest ...........................................................................................42
5.5 Fault loop impedance and prospective fault current ........................................44
5.6 Line impedance and prospective short-circuit current / Voltage drop ..............47
5.6.1 Line impedance and prospective short circuit current ..............................48
5.6.2 Voltage drop.............................................................................................49
5.7 Earth resistance (ET4500 only) .......................................................................52
5.7.1 Standard earth resistance measurement .................................................53
5.8 PE test touch terminal .....................................................................................55
6Data handling (ET4500 only)................................................................................57
6.1 Memory organization.......................................................................................57
6.2 Data structure..................................................................................................57
6.3 Saving test results ...........................................................................................59
6.4 Recalling test results .......................................................................................60
6.5 Clearing stored data ........................................................................................61
6.5.1 Completely clearing all memory content...................................................61
6.5.2 Clearing measurement(s) in selected locations........................................61
6.5.3 Clearing individual measurements ...........................................................62
6.5.4 Renaming installation structure elements (upload from PC) ....................63
6.6 Communication ...............................................................................................64
6.6.1 USB and RS232 communication..............................................................64
7Upgrading the instrument firmware....................................................................65
8Maintenance..........................................................................................................66
8.1 Battery replacement ........................................................................................66
8.2 Fuse replacement............................................................................................66
8.3 Test lead replacement.....................................................................................67
8.4 Cleaning ..........................................................................................................67
8.5 Periodic calibration ..........................................................................................67
8.6 Service ............................................................................................................67
9Technical specifications ......................................................................................68
9.1 Insulation resistance........................................................................................68
9.2 Continuity ........................................................................................................69
9.2.1 Resistance R LOW, R2, R1+R2 ...............................................................69
9.2.2 Resistance CONTINUITY.........................................................................69
9.2.3 RING Continuity .......................................................................................69
9.3 RCD testing .....................................................................................................70
9.3.1 General data ............................................................................................70
9.3.2 Contact voltage RCD Uc ..........................................................................70