Micron T 1287 User manual

T 1287 Hot Air SMD Rework Station
Operating Instructions
• Low vibration air pump • Suits leaded & lead free solder (RoHS)
• Quality heating element • Rapid heat up • Long service life
• Includes 4 nozzles, SMD tweezer set, chip removal tool & spare heating
element • Individual temperature & air flow adjustments
• Auto fan cooling extends tip life • ESD safe • Energy authority approved

MICRON
OVERVIEW
Thank you for choosing the T 1287 SMD Rework Station – a great solution for your soldering equipment needs!
This tool is specifically designed for soldering and desoldering Surface Mount Devices (SMDs) with
temperature controlled hot air. The T 1287 will achieve marked improvements in the quality and efficiency of
your rework tasks.
Please carefully read the operating manual prior to operation in order to maximize the advantages of using
your new T 1287 SMD rework station, and keep this manual readily accessible for future reference.
WARNING: This appliance is not intended for use by children or infirm persons without assistance or
supervision if their physical, sensory or mental capabilities prevent them from using it safely. Children should
be supervised to ensure that they do not play with the appliance. Failure to observe this safety regulation could
result in a risk to life and limb. The manufacturer or supplier shall not be liable for damage resulting from
misuse of the unit or unauthorised alterations.
CAUTION
DO NOT WORK ON LIVE CIRCUITS
• Before working on any mains powered equipment, make sure that it is turned off, and the mains plug is
removed from the power point. You must not undertake work on live parts.
DO NOT USE IF DAMAGED
• If the power lead becomes damaged or the soldering station becomes faulty, discontinue use immediately.
SAFETY PRECAUTIONS RECOMMENDED FOR OPERATION:
1. Ensure the voltage rating of the unit and your power supply is identical prior to use.
2. Check carefully for any damage that may have occurred during transportation.
3. Put the product on a safe and stable working table. The surface should be made of fire and heat
resistant material, because the unit can reach very high temperatures and is potentially dangerous.
4. During the operation, the heater is extremely hot, and will cause serious burns if it makes contact with
exposed skin. Use gloves and/or any other heat resistant tools to pick up the PCB assembly to eliminate
the possibility of accidental burns.
5. Do not touch the unit or allow it to touch anything when in operation. Keep the hot air from the nozzle
away from the eyes and face.
6. Do not use the product near combustible gases or flammable materials. Be sure the work area is well
ventilated.
7. Turn the power switch OFF and allow the heater to cool before checking or replacing the heater and
other parts, or prior to storing the unit. Do not modify the unit.
8. Do not block the air outlet of the nozzle, as this may damage the heating element.
9. Keep the appliance clean. This may be achieved with a damp cloth using a small amount of liquid
detergent. NEVER submerse the unit in liquid or allow any liquid to enter the station. Never use any
solvent to clean the case. Initially, the iron may emit white smoke, but this will soon dissipate.
10. This unit is designed for SMD rework and should not be used for any other purpose without first
consulting the manufacturer or its authorized agent. Suitable for SOIC, CHIP, QFP, PLCC, BGA etc.
11. To improve the operating life of the heating element, it is recommended that the unit not be used
continuously at high temperature with a low air flow level. Let the heating element cool for up to 20
minutes after using. Ensure that it is placed back on its cooling stand to cool down between rework
operations. Also, do not switch the hand tool on while it is in the cooling stand. Failure to comply with
these instructions may result in damage to the hand tool.
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12. When the power is switched off, the unit will briefly continue to blow cooling air through the pipe. Do not
disconnect the plug during this cooling process.
13. Do not leave the machine unattended while switched on and operating. Turn off the machine and unplug
the power cord when you are leaving and put the hot air nozzle in the holder on one side of the machine.
Always replace the hand tool in its holder when not being used. The nozzle and the heating element
remain hot after being switched off.
14. Do not use if damaged: If the pump stops working or the rework station becomes faulty, immediately
discontinue using the unit. Only authorized technicians are able to safely repair the unit or replace
parts. Do not disassemble the pump.
TO PREVENT ELECTRICAL SHOCK, TAKE THESE PRECAUTIONS:
1. Death or serious injury may result from electric shock. It is therefore essential to isolate the equipment
from the mains before commencing maintenance or repairs. Remember to unplug in the power cord.
2. Always connect the unit to a grounded power socket.
3. Do not pour water/liquids or subject the heating surface to physical shock. This may damage the heater.
Avoid contact with moisture.
4. The station must be switched off and the power cord must be unplugged before replacing the fuse in the
AC socket at the rear side of the machine.
5. Turn the power switch off and remove the AC power cord by pulling the plug (not the cable) when the
unit will remain unused for a long period of time.
PRODUCT FEATURES:
?Specially-designed intelligent chip microcomputer control system
?Easy to read digital LED displays with simple to use operating buttons to control temperature and air flow.
?The temperature can be locked by a “password” code that is convenient for production line management.
?Quick heating high-power heating element, with a maximum of 600W.
?Ideally suited to desoldering ICs such as: QFP, SOP, PLCC or SOJ chips etc.
?The built in static-free circuit design is safe for the sensitive circuit components elements like CMOS ICs.
?Auto shutoff handpiece cradle (Air power is shut off when handpiece is placed in cradle)
?Auto-cooling design: When the power is switched off, the cooling system begins automatically, and the
temperature will drop gradually down to 100 degrees Celsius (212°F) to protect the heating element from
burning out.
?Sensor / Pump Failed Detection - If the sensor circuit fails, the display reads ‘S-E’ and the power to the
heating nozzle is cut. If the pump circuit fails, the display reads ‘P-E’ and the power is cut to the heating
nozzle.
?Heating element auto-protecting function: When the heating element reaches a high temperature, this
function automatically protects the element, and thereby preventing the element from premature failure.
INSIDE THE BOX:
?T 1287 Workstation and air pump handle / pencil.
?Nozzles: 10mm x 10mm; 14mm x 14mm; 4mm dia; 7mm dia.
?Pliers (Tweezer) – 4 different sets, non-magnetic stainless steel.
?Heating elements.
?IC removing wire tool.
PRODUCT DESCRIPTION
The temperature-controlled LF-852DII Hot-Air SMD rework station has been built around an intelligent
microcomputer chip, which is specially designed to work with lead free SMD chips such as SOIC, CHIP, QFP,
PLCC, BGA etc. It also meets RoHS standards requirement. This appliance is equipped with a high-power
heating element that heats up quickly. High-quality sensors and consistent heat-transfer technology ensure
precise temperature regulation. The aluminum housing is strong and acts as a reliable heat sink and is
resistant to electro-magnetic interference.
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FIGURE 1. FRONT PANEL:
1. Main power switch
2. Hot air pencil input
3. Temperature increase (UP)
4. Temperature decrease (DOWN)
5. Temperature display
6. SET function key
7. Hot air flow increase (UP)
8. Air flow level display
9. Hot air flow decrease (DOWN)
INSTALLATION
1. Select the Nozzle that matches the size of the IC. Attach the nozzle when both the heating element and
the nozzle are cool and the unit is turned off and unplugged.
2. Loosen the screw on the nozzle. Attach nozzle.
IMPORTANT: Do not force the nozzle or pull on the edge of the nozzle with pliers. Also, do not tighten the set-
screw too tightly.
3. In order to protect the pump during transportation, the pump in the machine is tightened by the 4
screws under the bottom enclosure. Please unscrew the 4 screws before the machine is first used.
(See Figure 2 above)
4. Ensure that the base unit power switch is in the off position. Check carefully for any damage that may
have occured during transportation and ensure that the working voltage matches your power supply
before plugging in the station.
5. Plug in the AC power cord and turn the main power switch to on. The temperature LED and airflow
LED displays will be on and show the value.
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FIGURE 2.
View showing base of solder station

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OPERATION
TEMPERATURE SETTING:
1. Press ▲or ?key on the left side of the front panel to choose the desired temperature. When
the temperature reaches the desired setting, the heating indicator light will flash on and off to
maintain the set temperature.The temperature will change 1 degree by pressing the keys ▲or ?at
any time.
2. To increase the temperature: Press the ▲key once, and the display will increase 1 numeral. For fast
increment of the temperature setting, press and hold the ▲key for 2 seconds until you reach the
desired temperature.
3. To decrease the temperature press ?key, following the same procedure as above.
AIRFLOW SETTING:
1. Press ▲or ?key to choose the desired air flow on the right side of the front panel. The speed will
change by 5 degrees each time the keys ▲or ?are pressed, either up or down in value respectively.
2. After adjusting the air flow, wait for the temperature to stabilize before using the unit.
PARAMETER SETTING:
1. Press SET key and hold until display shows ‘— — —’
2. Release the SET key. The display ‘— — —’ will start to flash.
3. Input the factory default lock setting of ‘010’ by incrementing the ▲key.
4. Press SET key again and the display will show ‘F-0’ and flash. There are two parameters that can be set.
a. Parameter ‘F-1’ is temperature lock setting.
b. Parameter ‘F-3’ is to change between Fahrenheit and Centigrade (Celsius) temperature selection.
5. To select parameter setting, press the ▲or ?to scroll through to the parameter required.
NOTE: that the unit returns to normal operation after 15 seconds if no key is pressed.
TEMPERATURE ADJUSTMENT LOCKOUT SETTING:
When the LED displays ‘F-1’ and flashes, press SET key and the unit enters the temperature adjustment
lockout status. At this moment, the LED displays the preset value. If ‘000’ is set, this means the unit has no
temperature lock. Press ▲or ?key to change temperature adjustment lockout value. The temperature
adjustment lockout is number ‘100’. Once the number is entered, press SET key again to finish setting. The
user can now continue to set other parameters.
FAHRENHEIT AND CENTIGRADE (CELSIUS) TEMPERATURE SELECTION:
When the display shows ‘F-3’ and is flashing, press the SET button. The display will show the current setting for
Celsius °C or Fahrenheit: °F. To change the temperature selection setting, press ▲or ?key. To save the setting,
press SET key.
RECOMMENDED SOLDERING TEMPERATURES:
A low iron temperature will slow the flow of solder. A high temperature will burn the flux in the solder, which in
turn will emit a heavy white smoke, resulting in a dry joint or damage to the PCB. When the tip working
temperature is within the correct parameters suited to the particular solder being used, a good joint is assured.
The most common solder alloy used in the electronics industry is 60% tin, 40% lead (60/40). The tip working
temperature of solder is detailed below and can vary slightly from manufacturer to manufacturer.
Melting point ................................................................215°C (419°F)
Normal operation .........................................................320°C (608°F)
Production line operation..............................................380°C (716°F)
Desoldering operation for small joint ............................320°C (608°F)
Desoldering operation for larger joint............................400°C (752°F)

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To meet RoHS (European requirement for lead-free solder), the 60/40 solder alloys are not allowed in the
production process. The RoHS lead-free solder alloys require a working temperature of about 30°C (54°F)
higher than typical 60/40 lead/tin soldering. The lead free solder working temperature is detailed below and
can vary from manufacturer to manufacturer.
Melting point ................................................................220°C (428°F)
Normal operation ...........................................300-360°C (572-680°F)
Production line operation................................360-410°C (680-770°F)
IMPORTANT: The temperature above 410°C (770°F) is not recommended for normal soldering functions, but
can be used for short periods of time when high temperatures are required. Please note that the lead free
solder alloys require a higher soldering temperature which shortens tip life.
QFP (Quad Flat Package) De-soldering for ICs:
1. Melt the solder: Hold the iron so that the nozzle is located directly over but not touching the IC, and
allow the hot air to melt the solder. Be careful not to touch the leads of the IC with the nozzle.
2. Remove the IC: Once the solder has melted, remove the IC by lifting it out with the pliers (tweezers).
3. Turn the power switch off: After the power switch is off, an automatic blowing function begins sending
cool air through the pipe, in order to cool both the heating element and the handle. So do not
disconnect the plug during this cooling process.
4. In case you don’t use the unit for a long time, disconnect the plug.
NOTE: About a minute after the power is switched off, the temperature will drop to 75ºC (167º F), and
the power will automatically shut off.
5. Remove any remaining solder: After removing the IC, clean the remaining solder chips with a wick or
desoldering tool.
NOTE: For SOP, PLCC etc. it is recommended that tweezers are used to desolder.
QFP Soldering:
1. Apply the solder paste: Apply the proper quantity of solder paste and flux (preferably no-clean) and
place the SMD on the PCB.
2. Preheat SMD.
3. Soldering: Heat the lead frame evenly.
4. Washing: When soldering is completed, wash the area with a defluxer.
NOTE: While there are many advantages of hot air SMD rework, it is also possible to have defects for soldering
BGA. It is recommended that all soldering joints be closely inspected.
T 1287 SPECIFICATIONS
Voltage input: ........................................................................240V AC
Wattage: ..................................................................................1000W
Heating element: ................................................................Nichrome
Temperature range: ............................................................100-480°C
Air flow capacity: ..................................................1.5L/min - 70L/min
Weight: ......................................................................................4.9kg
Dimensions: ....................................................283W x 190D x 120Hm

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Distributed by Altronic Distributors Pty. Ltd.
Phone: [phone] Fax: [phone]
Internet: www.altronics.com.au
IMPORTANT SERVICE NOTE:
There are no user serviceable parts inside the unit. Do not open the unit.
If the iron or station should become faulty or, for some reason not operate normally, the system should be
returned to the service department of your authorised dealer or service agent, or a similarly qualified person
in order to avoid a hazard.
WARRANTY:
For repair or service please contact your place of purchase. Note: Under no circumstances should you
attempt to repair the player yourself or via a non-authorised Altronics service centre as this will invalidate the
warranty! During the warranty period, we undertake to repair or replace your product at no charge if found to
be defective due to a manufacturing fault. The warranty excludes damage by misuse, neglect, shipping
accident, incorrect installation or no fault found.
NOT FIELD SERVICEABLE.
MICRON
COMMONLY USED ACRONYMS FOR SOLDERING INTEGRATED CIRCUITS (ICs)
SMD: Surface Mounted Device.
SOIC: Small Outline Integrated Circuit
SOP: Small Outline Package
QFP: Quad Flat Package
PLCC:Plastic Lead Chip Carrier
BGA: Ball Grid Array
PCB: Printed Circuit Board
SOJ: Small Outline J-leaded