Mitsubishi Electric MELSEC-A/QnA Series User manual

Transition from MELSEC-A/QnA
(Large Type) Series to Q Series Handbook
(Intelligent Function Modules)
Dec. 2018 Edition

A- 1
SAFETY PRECAUTIONS
(Read these precautions before using this product.)
Before using this product, please read this manual and the relevant manuals carefully and pay full attention
to safety to handle the product correctly.
In this manual, the safety precautions are classified into two levels: " WARNING" and " CAUTION".
Under some circumstances, failure to observe the precautions given under " CAUTION" may lead to
serious consequences.
Observe the precautions of both levels because they are important for personal and system safety.
Make sure that the end users read this manual and then keep the manual in a safe place for future
reference.
[Design Precautions]
WARNING
●Configure safety circuits external to the programmable controller to ensure that the entire system
operates safely even when a fault occurs in the external power supply or the programmable
controller. Failure to do so may result in an accident due to an incorrect output or malfunction.
(1) Configure external safety circuits, such as an emergency stop circuit, protection circuit, and
protective interlock circuit for forward/reverse operation or upper/lower limit positioning.
(2) When the programmable controller detects the following problems,
it will stop calculation and turn off all output in the case of (a).
In the case of (b), it will hold or turn off all output according to the parameter setting.
Note that the AnS series module will turn off the output in either of cases (a) and (b).
Also, all outputs may be turned on if an error occurs in a part, such as an I/O control part, where
the CPU module cannot detect any error. To ensure safety operation in such a case, provide a
safety mechanism or a fail-safe circuit external to the programmable controller.
For a fail-safe circuit example, refer to LOADING AND INSTALLATION in the QCPU User's
Manual (Hardware Design, Maintenance and Inspection).
(3) Outputs may remain on or off due to a failure of an output module relay or transistor.
Configure an external circuit for monitoring output signals that could cause a serious accident.
WARNING
CAUTION
Indicates that incorrect handling may cause hazardous conditions,
resulting in death or severe injury.
Indicates that incorrect handling may cause hazardous conditions,
resulting in minor or moderate injury or property damage.
Q series module A series module
Output OFF Output OFF
Hold or turn off all output
according to the parameter
setting.
The power supply module has over current
protection equipment and over voltage
protection equipment.
The CPU module self-diagnosis functions, such
as the watchdog timer error, detect problems.
(a)
(b)
Output OFF

A- 2
[Design Precautions]
WARNING
●In an output module, when a load current exceeding the rated current or an overcurrent caused by a
load short-circuit flows for a long time, it may cause smoke and fire. To prevent this, configure an
external safety circuit, such as a fuse.
●Configure a circuit so that the programmable controller is turned on first and then the external power
supply.
If the external power supply is turned on first, an accident may occur due to an incorrect output or
malfunction.
●For the operating status of each station after a communication failure, refer to relevant manuals for
each network.
Failure to do so may result in an accident due to an incorrect output or malfunction.
●When changing data of the running programmable controller from a peripheral connected to the
CPU module or from a personal computer connected to an intelligent function module or special
function module, configure an interlock circuit in the sequence program to ensure that the entire
system will always operate safely.
For program modification and operating status change, read relevant manuals carefully and ensure
the safety before operation.
Especially, when a remote programmable controller is controlled by an external device, immediate
action cannot be taken if a problem occurs in the programmable controller due to a communication
failure.
To prevent this, configure an interlock circuit in the sequence program, and determine corrective
actions to be taken between the external device and CPU module in case of a communication
failure.
CAUTION
●Do not install the control lines or communication cables together with the main circuit lines or power
cables.
Keep a distance of 100mm or more between them.
Failure to do so may result in malfunction due to noise.
●When a device such as a lamp, heater, or solenoid valve is controlled through an output module, a
large current (approximately ten times greater than normal) may flow when the output is turned from
off to on.
Take measures such as replacing the module with one having a sufficient current rating.
●After the CPU module is powered on or is reset, the time taken to enter the RUN status varies
depending on the system configuration, parameter settings, and/or program size. Design circuits so
that the entire system will always operate safely, regardless of the time.

A- 3
[Installation Precautions]
CAUTION
●Use the programmable controller in an environment that meets the general specifications in the
QCPU User's Manual (Hardware Design, Maintenance and Inspection).
Failure to do so may result in electric shock, fire, malfunction, or damage to or deterioration of the
product.
●To mount the module, while pressing the module mounting lever located in the lower part of the
module, fully insert the module fixing projection(s) into the hole(s) in the base unit and press the
module until it snaps into place.
Incorrect mounting may cause malfunction, failure or drop of the module.
When using the programmable controller in an environment of frequent vibrations, fix the module
with a screw.
Tighten the screws within the specified torque range.
Undertightening can cause drop of the screw, short circuit, or malfunction.
Overtightening can damage the screw and/or module, resulting in drop, short circuit, or malfunction.
●When using an extension cable, connect it to the extension cable connector of the base unit
securely.
Check the connection for looseness.
Poor contact may cause incorrect input or output.
●When using a memory card, fully insert it into the memory card slot.
Check that it is inserted completely.
Poor contact may cause malfunction.
●Shut off the external power supply (all phases) used in the system before mounting or removing a
module. Failure to do so may result in damage to the product. A module can be replaced online
(while power is on) on any MELSECNET/H remote I/O station or in the system where a CPU module
supporting the online module change function is used.
Note that there are restrictions on the modules that can be replaced online, and each module has its
predetermined replacement procedure.
For details, refer to the relevant sections in the QCPU User's Manual (Hardware Design,
Maintenance and Inspection) and in the manual for the corresponding module.
●Do not directly touch any conductive part of the module.
Doing so can cause malfunction or failure of the module.

A- 4
[Wiring Precautions]
WARNING
●Shut off the external power supply (all phases) used in the system before wiring.
Failure to do so may result in electric shock or damage to the product.
●After wiring, attach the included terminal cover to the module before turning it on for operation.
Failure to do so may result in electric shock.
CAUTION
●Individually ground the FG and LG terminals of the programmable controller with a ground
resistance of 100or less.
Failure to do so may result in electric shock or malfunction.
●Use applicable solderless terminals and tighten them within the specified torque range.
If any spade solderless terminal is used, it may be disconnected when the terminal screw comes
loose, resulting in failure.
●Check the rated voltage and terminal layout before wiring to the module, and connect the cables
correctly.
Connecting a power supply with a different voltage rating or incorrect wiring may cause a fire or
failure.
●Connectors for external devices must be crimped or pressed with the tool specified by the
manufacturer, or must be correctly soldered.
Incomplete connections may cause short circuit, fire, or malfunction.
●Tighten the terminal screws within the specified torque range.
Undertightening can cause short circuit, fire, or malfunction.
Overtightening can damage the screw and/or module, resulting in drop, short circuit, or malfunction.
●Prevent foreign matter such as dust or wire chips from entering the module.
Such foreign matter can cause a fire, failure, or malfunction.
●A protective film is attached to the top of the module to prevent foreign matter, such as wire chips,
from entering the module during wiring.
Do not remove the film during wiring.
Remove it for heat dissipation before system operation.
●Mitsubishi programmable controllers must be installed in control panels.
Connect the main power supply to the power supply module in the control panel through a relay
terminal block.
Wiring and replacement of a power supply module must be performed by qualified maintenance
personnel with knowledge of protection against electric shock.
For wiring methods, refer to the QCPU User's Manual (Hardware Design, Maintenance and
Inspection).

A- 5
[Startup and Maintenance Precautions]
WARNING
●Do not touch any terminal while power is on. Doing so will cause electric shock.
●Correctly connect the battery connector.
Do not charge, disassemble, heat, short-circuit, or solder the battery, or throw it into the fire.
Doing so will cause the battery to produce heat, explode, or ignite, resulting in injury and fire.
●Shut off the external power supply (all phases) used in the system before cleaning the module or
retightening the terminal screws or module fixing screws.
Failure to do so may result in electric shock.
Undertightening the terminal screws can cause short circuit or malfunction.
Overtightening can damage the screw and/or module, resulting in drop, short circuit, or malfunction.
CAUTION
●Before performing online operations (especially, program modification, forced output, and operating
status change) for the running CPU module from the peripheral device connected, read relevant
manuals carefully and ensure the safety.
Improper operation may damage machines or cause accidents.
●Do not disassemble or modify the modules. Doing so may cause failure, malfunction, injury, or a fire.
●Use any radio communication device such as a cellular phone or PHS (Personal Handy-phone
System) more than 25cm away in all directions from the programmable controller.
Failure to do so may cause malfunction.
●Shut off the external power supply (all phases) used in the system before mounting or removing a
module. Failure to do so may cause the module to fail or malfunction.
A module can be replaced online (while power is on) on any MELSECNET/H remote I/O station or in
the system where a CPU module supporting the online module change function is used.
Note that there are restrictions on the modules that can be replaced online, and each module has its
predetermined replacement procedure.
For details, refer to this manual and the online module change section in the manual of the module
compatible with online module change.
●After the first use of the product, do not mount/remove the module to/from the base unit, and the
terminal block to/from the module more than 50 times (IEC 61131-2 compliant) respectively.
Exceeding the limit of 50 times may cause malfunction.
●Do not drop or apply shock to the battery to be installed in the module.
Doing so may damage the battery, causing the battery fluid to leak inside the battery.
If the battery is dropped or any shock is applied to it, dispose of it without using.
●Before handling the module, touch a conducting object such as a grounded metal to discharge the
static electricity from the human body. Failure to do so may cause the module to fail or malfunction.

A- 6
[Disposal Precautions]
[Transportation Precautions]
CAUTION
●When disposing of this product, treat it as industrial waste.
When disposing of batteries, separate them from other wastes according to the local regulations.
For details on battery regulations in EU member states, refer to the MELSEC-L CPU Module User's
Manual (Hardware Design, Maintenance and Inspection).
CAUTION
●When transporting lithium batteries, follow the transportation regulations.
(Refer to QCPU User’s Manual (Hardware Design, Maintenance and Inspection) for details of the
controlled models.)

A- 7
CONDITIONS OF USE FOR THE PRODUCT
(1) Mitsubishi programmable controller ("the PRODUCT") shall be used in conditions;
i) where any problem, fault or failure occurring in the PRODUCT, if any, shall not lead to any major
or serious accident; and
ii) where the backup and fail-safe function are systematically or automatically provided outside of
the PRODUCT for the case of any problem, fault or failure occurring in the PRODUCT.
(2) The PRODUCT has been designed and manufactured for the purpose of being used in general
industries.
MITSUBISHI SHALL HAVE NO RESPONSIBILITY OR LIABILITY (INCLUDING, BUT NOT
LIMITED TO ANY AND ALL RESPONSIBILITY OR LIABILITY BASED ON CONTRACT,
WARRANTY, TORT, PRODUCT LIABILITY) FOR ANY INJURY OR DEATH TO PERSONS OR
LOSS OR DAMAGE TO PROPERTY CAUSED BY the PRODUCT THAT ARE OPERATED OR
USED IN APPLICATION NOT INTENDED OR EXCLUDED BY INSTRUCTIONS, PRECAUTIONS,
OR WARNING CONTAINED IN MITSUBISHI'S USER, INSTRUCTION AND/OR SAFETY
MANUALS, TECHNICAL BULLETINS AND GUIDELINES FOR the PRODUCT.
("Prohibited Application")
Prohibited Applications include, but not limited to, the use of the PRODUCT in;
• Nuclear Power Plants and any other power plants operated by Power companies, and/or any
other cases in which the public could be affected if any problem or fault occurs in the PRODUCT.
• Railway companies or Public service purposes, and/or any other cases in which establishment of
a special quality assurance system is required by the Purchaser or End User.
• Aircraft or Aerospace, Medical applications, Train equipment, transport equipment such as
Elevator and Escalator, Incineration and Fuel devices, Vehicles, Manned transportation,
Equipment for Recreation and Amusement, and Safety devices, handling of Nuclear or
Hazardous Materials or Chemicals, Mining and Drilling, and/or other applications where there is a
significant risk of injury to the public or property.
Notwithstanding the above, restrictions Mitsubishi may in its sole discretion, authorize use of the
PRODUCT in one or more of the Prohibited Applications, provided that the usage of the PRODUCT
is limited only for the specific applications agreed to by Mitsubishi and provided further that no
special quality assurance or fail-safe, redundant or other safety features which exceed the general
specifications of the PRODUCTs are required. For details, please contact the Mitsubishi
representative in your region.

A- 8
REVISIONS
* The handbook number is given on the bottom left of the back cover.
Print Date * Handbook Number Revision
Apr. 2005 L(NA)08046ENG-A First edition
Oct. 2005 L(NA)08046ENG-B
Appendix 1
Contents, Appendix 1 Appendix 2
Oct. 2008 L(NA)08046ENG-C
Q64DAN, Q64RD-G, Q68RD3-G, Q68TD-G-H01
QD62 QD62-H01, QD62-H02, Q62DA Q62DAN,
Q68DAV Q68DAVN, Q68DAI Q68DAIN
Term revision (whole), SAFETY PRECAUTIONS, Chapter 3 (whole),
Chapter 4 (whole), Section 6.1 to Section 6.3, Section 7.1, Section 9.1.2,
Section 9.1.4, Appendix 2.1 to Appendix 2.3
Jul. 2011 L(NA)08046ENG-D
Q68AD-G, Q68TD-G-H02
CONDITIONS OF USE FOR THE PRODUCT, Section 2.4, Section 2.6,
Section 2.8
Term revision (whole), SAFETY PRECAUTIONS, Chapter 3 (whole),
Chapter 4 (whole), Section 5.1.1, Section 5.2.1, Section 6.1, Section 6.2.1,
Section 7.1, Section 7.4.1, Section 7.4.4, Section 7.5.1, Section 7.5.4,
Chapter 9, Appendix 2.1, Appendix 2.3
Chapter 9 (External dimensions)
Mar. 2013 L(NA)08046ENG-E
QD73A1
QD75PQD75PN, QD75DQD75DN
Section 7.6
Section 2.4.4, Section 2.6.1, Section 2.8.1, Section 3.1, Section 4.6.1,
Section 6.1, Section 6.3.4, Section 7.1, Section 7.2, Section 7.4
Addition
Partial correction
Model addition
Model change
Partial correction
Model addition
Partial addition
Partial correction
Partial deletion
Model addition
Model change
Addition
Partial correction

A- 9
* The handbook number is given on the bottom left of the back cover.
Japanese Handbook Version L-08045-K
© 2005 MITSUBISHI ELECTRIC CORPORATION
Print Date * Handbook Number Revision
Jun. 2013 L(NA)08046ENG-F
Section 4.1, Section 6.2.1, Section 6.3.1, Section 7.1, Section 7.4.4,
Section 7.5.4, Section 7.6.4, Section 7.6.6
Sep. 2014 L(NA)08046ENG-G
Section 2.1, Section 3.1, Section 4.1, Section 5.1, Section 6.1, Section 7.1,
Section 7.2, Section 7.3, Section 7.5.5, Appendix 2.1
May 2015 L(NA)08046ENG-H
Appendix 4
Change
Chapter 9 to Appendix 1, Appendix1 to Appendix 2, Appendix2 to Appendix 3
Section3.1, Section7.1, Section7.6.1, Section7.6.2
Feb. 2016 L(NA)08046ENG-I
Cover, WARRANTY
Dec. 2018 L(NA)08046ENG-J
Cover
This handbook confers no industrial property rights or any rights of any other kind, nor does it confer any patent licenses.
Mitsubishi Electric Corporation cannot be held responsible for any problems involving industrial property rights which may
occur as a result of using the contents noted in this handbook.
Partial correction
Partial correction
Addition
Partial correction
Partial correction
Partial correction

A- 10
SAFETY PRECAUTIONS ................................................................................................................................A - 1
CONDITIONS OF USE FOR THE PRODUCT .................................................................................................A - 7
REVISIONS ......................................................................................................................................................A - 8
CHAPTER 1 INTRODUCTION 1 - 1 to 1 - 2
1.1 Advantages of Transition to Q Series .............................................................................................. 1 - 1
1.2 Precautions for Transition from Large-sized A/QnA Series to Q Series .......................................... 1 - 2
CHAPTER 2 ANALOG INPUT MODULE REPLACEMENT 2 - 1 to 2 - 58
2.1 List of Analog Input Module Alternative Models for Replacement ................................................... 2 - 1
2.2 A616AD ........................................................................................................................................... 2 - 3
2.2.1 Performance comparison .......................................................................................................... 2 - 3
2.2.2 Function comparison ................................................................................................................ 2 - 7
2.2.3 I/O signal comparison to programmable controller CPU .......................................................... 2 - 8
2.2.4 Buffer memory address comparison ......................................................................................... 2 - 9
2.3 A68AD (Upgrade to Q68ADV, Q68ADI) ........................................................................................ 2 - 11
2.3.1 Performance comparison ........................................................................................................ 2 - 11
2.3.2 Function comparison .............................................................................................................. 2 - 15
2.3.3 I/O signal comparison to programmable controller CPU ........................................................ 2 - 16
2.3.4 Buffer memory address comparison ....................................................................................... 2 - 17
2.4 A68AD (Upgrade to Q68AD-G) ..................................................................................................... 2 - 19
2.4.1 Performance comparison ........................................................................................................ 2 - 19
2.4.2 Function comparison .............................................................................................................. 2 - 23
2.4.3 I/O signal comparison to programmable controller CPU ........................................................ 2 - 24
2.4.4 Buffer memory address comparison ....................................................................................... 2 - 25
2.5 A68AD-S2 (Upgrade to Q68ADV, Q68ADI) ................................................................................... 2 - 27
2.5.1 Performance comparison ........................................................................................................ 2 - 27
2.5.2 Function comparison .............................................................................................................. 2 - 31
2.5.3 I/O signal comparison to programmable controller CPU ........................................................ 2 - 32
2.5.4 Buffer memory address comparison ....................................................................................... 2 - 33
2.6 A68AD-S2 (Upgrade to Q68AD-G) ................................................................................................ 2 - 35
2.6.1 Performance comparison ........................................................................................................ 2 - 35
2.6.2 Function comparison .............................................................................................................. 2 - 39
2.6.3 I/O signal comparison to programmable controller CPU ........................................................ 2 - 40
2.6.4 Buffer memory address comparison ....................................................................................... 2 - 41
2.7 A68ADN (Upgrade to Q68ADV, Q68ADI) ...................................................................................... 2 - 43
2.7.1 Performance comparison ........................................................................................................ 2 - 43
2.7.2 Function comparison .............................................................................................................. 2 - 47
2.7.3 I/O signal comparison to programmable controller CPU ........................................................ 2 - 48
2.7.4 Buffer memory address comparison ....................................................................................... 2 - 49
2.8 A68AD (Upgrade to Q68AD-G) ..................................................................................................... 2 - 51
2.8.1 Performance comparison ........................................................................................................ 2 - 51
2.8.2 Function comparison .............................................................................................................. 2 - 55
CONTENTS

A- 11
2.8.3 I/O signal comparison to programmable controller CPU ........................................................ 2 - 56
2.8.4 Buffer memory address comparison ....................................................................................... 2 - 57
CHAPTER 3 ANALOG OUTPUT MODULE REPLACEMENT 3 - 1 to 3 - 66
3.1 List of Analog Output Module Alternative Models for Replacement ................................................ 3 - 1
3.2 A616DAI .......................................................................................................................................... 3 - 3
3.2.1 Performance comparison ......................................................................................................... 3 - 3
3.2.2 Functional comparison ............................................................................................................. 3 - 7
3.2.3 I/O signal comparison to programmable controller CPU .......................................................... 3 - 8
3.2.4 Buffer memory address comparison ......................................................................................... 3 - 9
3.3 A616DAV ....................................................................................................................................... 3 - 11
3.3.1 Performance comparison ....................................................................................................... 3 - 11
3.3.2 Functional comparison ........................................................................................................... 3 - 15
3.3.3 I/O signal comparison to programmable controller CPU ........................................................ 3 - 16
3.3.4 Buffer memory address comparison ....................................................................................... 3 - 17
3.4 A62DA (Replacement to the Q62DAN) ......................................................................................... 3 - 19
3.4.1 Performance comparison ....................................................................................................... 3 - 19
3.4.2 Functional comparison ........................................................................................................... 3 - 23
3.4.3 I/O signal comparison to programmable controller CPU ........................................................ 3 - 24
3.4.4 Buffer memory address comparison ....................................................................................... 3 - 25
3.5 A62DA (Replacement to the Q64DAN) ......................................................................................... 3 - 27
3.5.1 Performance comparison ....................................................................................................... 3 - 27
3.5.2 Functional comparison ........................................................................................................... 3 - 31
3.5.3 I/O signal comparison to programmable controller CPU ........................................................ 3 - 32
3.5.4 Buffer memory address comparison ....................................................................................... 3 - 33
3.6 A62DA-S1 (Replacement to the Q62DAN) .................................................................................... 3 - 35
3.6.1 Performance comparison ....................................................................................................... 3 - 35
3.6.2 Functional comparison ........................................................................................................... 3 - 39
3.6.3 I/O signal comparison to programmable controller CPU ........................................................ 3 - 40
3.6.4 Buffer memory address comparison ....................................................................................... 3 - 41
3.7 A62DA-S1 (Replacement to the Q64DAN) .................................................................................... 3 - 43
3.7.1 Performance comparison ....................................................................................................... 3 - 43
3.7.2 Functional comparison ........................................................................................................... 3 - 47
3.7.3 I/O signal comparison to programmable controller CPU ........................................................ 3 - 48
3.7.4 Buffer memory address comparison ....................................................................................... 3 - 49
3.8 A68DAI(-S1) .................................................................................................................................. 3 - 51
3.8.1 Performance comparison ....................................................................................................... 3 - 51
3.8.2 Functional comparison ........................................................................................................... 3 - 55
3.8.3 I/O signal comparison to programmable controller CPU ........................................................ 3 - 56
3.8.4 Buffer memory address comparison ....................................................................................... 3 - 57
3.9 A68DAV ......................................................................................................................................... 3 - 59
3.9.1 Performance comparison ....................................................................................................... 3 - 59
3.9.2 Functional comparison ........................................................................................................... 3 - 63
3.9.3 I/O signal comparison to programmable controller CPU ........................................................ 3 - 64
3.9.4 Buffer memory address comparison ....................................................................................... 3 - 65

A- 12
CHAPTER 4 TEMPERATURE INPUT MODULE REPLACEMENT 4 - 1 to 4 - 70
4.1 List of Temperature Input Module Alternative Models for Replacement .......................................... 4 - 1
4.2 A616TD (Replacement to the Q64TD) ............................................................................................ 4 - 3
4.2.1 Performance comparison .......................................................................................................... 4 - 3
4.2.2 Functional comparison .............................................................................................................. 4 - 7
4.2.3 I/O signal comparison to programmable controller CPU .......................................................... 4 - 8
4.2.4 Buffer memory address comparison ......................................................................................... 4 - 9
4.3 A616TD (Replacement to the Q68TD-G-H02, Q68TD-G-H01) ..................................................... 4 - 13
4.3.1 Performance comparison ........................................................................................................ 4 - 13
4.3.2 Functional comparison ............................................................................................................ 4 - 18
4.3.3 I/O signal comparison to programmable controller CPU ........................................................ 4 - 19
4.3.4 Buffer memory address comparison ....................................................................................... 4 - 20
4.4 A68RD3N (Replacement to the Q64RD) ....................................................................................... 4 - 23
4.4.1 Performance comparison ........................................................................................................ 4 - 23
4.4.2 Functional comparison ............................................................................................................ 4 - 27
4.4.3 I/O signal comparison to programmable controller CPU ........................................................ 4 - 28
4.4.4 Buffer memory address comparison ....................................................................................... 4 - 29
4.5 A68RD3N (Replacement to the Q64RD-G) ................................................................................... 4 - 33
4.5.1 Performance comparison ........................................................................................................ 4 - 33
4.5.2 Functional comparison ............................................................................................................ 4 - 37
4.5.3 I/O signal comparison to programmable controller CPU ........................................................ 4 - 38
4.5.4 Buffer memory address comparison ....................................................................................... 4 - 39
4.6 A68RD3N (Replacement to the Q68RD3-G) ................................................................................. 4 - 43
4.6.1 Performance comparison ........................................................................................................ 4 - 43
4.6.2 Functional comparison ............................................................................................................ 4 - 47
4.6.3 I/O signal comparison to programmable controller CPU ........................................................ 4 - 48
4.6.4 Buffer memory address comparison ....................................................................................... 4 - 49
4.7 A68RD4N (Replacement to the Q64RD) ....................................................................................... 4 - 51
4.7.1 Performance comparison ........................................................................................................ 4 - 51
4.7.2 Functional comparison ............................................................................................................ 4 - 55
4.7.3 I/O signal comparison to programmable controller CPU ........................................................ 4 - 56
4.7.4 Buffer memory address comparison ....................................................................................... 4 - 57
4.8 A68RD4N (Replacement to the Q64RD-G) ................................................................................... 4 - 61
4.8.1 Performance comparison ........................................................................................................ 4 - 61
4.8.2 Functional comparison ............................................................................................................ 4 - 65
4.8.3 I/O signal comparison to programmable controller CPU ........................................................ 4 - 66
4.8.4 Buffer memory address comparison ....................................................................................... 4 - 67
CHAPTER 5 MULTIPLEXER REPLACEMENT 5 - 1 to 5 - 11
5.1 A60MX ............................................................................................................................................. 5 - 1
5.1.1 Performance comparison .......................................................................................................... 5 - 1
5.2 A60MXRN ........................................................................................................................................ 5 - 5
5.2.1 Performance comparison .......................................................................................................... 5 - 5
5.3 A60MXR .......................................................................................................................................... 5 - 9

A- 13
5.3.1 Performance comparison ......................................................................................................... 5 - 9
CHAPTER 6 HIGH-SPEED COUNTER MODULE REPLACEMENT 6 - 1 to 6 - 13
6.1 List of High-Speed Counter Module Alternative Models for Replacement ....................................... 6 - 1
6.2 AD61 ................................................................................................................................................ 6 - 4
6.2.1 Performance comparison ......................................................................................................... 6 - 4
6.2.2 Function comparison ................................................................................................................ 6 - 6
6.2.3 I/O signal comparison to programmable controller CPU .......................................................... 6 - 7
6.2.4 Buffer memory address comparison ......................................................................................... 6 - 8
6.3 AD61S1 ........................................................................................................................................... 6 - 9
6.3.1 Performance comparison ......................................................................................................... 6 - 9
6.3.2 Function comparison .............................................................................................................. 6 - 11
6.3.3 I/O signal comparison to programmable controller CPU ........................................................ 6 - 12
6.3.4 Buffer memory address comparison ....................................................................................... 6 - 13
CHAPTER 7 POSITIONING MODULE REPLACEMENT 7 - 1 to 7 - 54
7.1 List of Positioning Module Alternative Models for Replacement ...................................................... 7 - 1
7.2 AD70D ............................................................................................................................................. 7 - 2
7.3 AD72 ................................................................................................................................................ 7 - 2
7.4 AD75P1-S3/P2-S3/P3-S3 ................................................................................................................ 7 - 3
7.4.1 Performance comparison ......................................................................................................... 7 - 3
7.4.2 Function comparison ................................................................................................................ 7 - 8
7.4.3 I/O signal comparison to programmable controller CPU ........................................................ 7 - 11
7.4.4 Buffer memory address comparison ....................................................................................... 7 - 12
7.4.5 Interface specifications comparison with external devices ..................................................... 7 - 20
7.5 AD75M1/M2/M3 ............................................................................................................................. 7 - 21
7.5.1 Performance comparison ....................................................................................................... 7 - 21
7.5.2 Function comparison .............................................................................................................. 7 - 24
7.5.3 I/O signal comparison to programmable controller CPU ........................................................ 7 - 27
7.5.4 Buffer memory address comparison ....................................................................................... 7 - 28
7.5.5 Interface specifications comparison with external devices ..................................................... 7 - 40
7.6 AD70 .............................................................................................................................................. 7 - 43
7.6.1 Performance specifications comparison ................................................................................. 7 - 43
7.6.2 Function comparison .............................................................................................................. 7 - 45
7.6.3 I/O signals comparison to CPU module .................................................................................. 7 - 49
7.6.4 Buffer memory address comparison ....................................................................................... 7 - 50
7.6.5 Interface specifications comparison with external devices ..................................................... 7 - 52
7.6.6 Precautions for the replacement of the AD70 by the QD73A1 ............................................... 7 - 53
CHAPTER 8 UPGRADE OF THE POSITION 8 - 1 to 8 - 2
8.1 A61LS .............................................................................................................................................. 8 - 1
8.2 A62LS-S5 and A63LS ...................................................................................................................... 8 - 2

A- 14
APPENDICES App - 1 to App - 7
Appendix 1 External Dimensions ..........................................................................................................App - 1
Appendix 2 Spare parts storage ...........................................................................................................App - 2
Appendix 3 Related Manuals ................................................................................................................App - 3
Appendix 3.1 Replacement Handbooks ...........................................................................................App - 3
Appendix 3.2 A/QnA series ..............................................................................................................App - 4
Appendix 3.3 Q series ......................................................................................................................App - 4
Appendix 3.4 Programming tool .......................................................................................................App - 5
Appendix 4 How to Change Resolution After Analog I/O Module is Replaced .....................................App - 6

A- 15
●For the products shown in handbooks for transition, catalogues, and transition examples, refer to the
manuals for the relevant products and check the detailed specifications, precautions for use, and
restrictions before replacement.
For the products manufactured by Mitsubishi Electric Engineering Co., Ltd., Mitsubishi Electric
System & Service Co., Ltd., and other companies, refer to the catalogue for each product and check
the detailed specifications, precautions for use, and restrictions before use.
The manuals and catalogues for our products, products manufactured by Mitsubishi Electric
Engineering Co., Ltd., and Mitsubishi Electric System & Service Co., Ltd. are shown in Appendix of
each handbook for transition.
●Products shown in this handbook are subject to change without notice.

1INTRODUCTION
1- 1
Advantage 1)Advanced performance of equipments
In addition to the processing performance improvement for Q series CPU, the processing
speed for Q series intelligent function module is also increased, so that the equipment capability
to improve is possible.
Advantage 2)Compact control panel and space saving
As the Q series needs only 1/4 mounting area of the A series, it is possible to create more
compact control panel.
Advantage 3)Improved operating efficiency for programming and monitor
Q series intelligent function module prepares the following utility package (GX Configurator-o)
sold separately.
(Example)
Using the utility package is not a must. However, the utility package allows not only for the
followings to do, but also reduces sequence programs.
• Initial setting is possible without a program
• The auto refresh setting allows to read/write buffer memory data of intelligent function module
automatically from/to the CPU device memory.
• Checking of the setting status or operating status of intelligent function module is simplified.
1
1 INTRODUCTION
1.1 Advantages of Transition to Q Series
• GX Configurator-AD Analog input module setting/monitoring tool
• GX Configurator-DA Analog output module setting/monitoring tool
• GX Configurator-TI Temperature input module setting/monitoring tool
• GX Configurator-CT High speed counter module setting/monitoring tool
• GX Configurator-QP Positioning module setting/monitoring tool

1INTRODUCTION
1- 2
(1) Be sure to confirm its functions, specifications and instructions by referring the manual of the
corresponding Q series module prior to use.
(2) Be sure to check the operation of whole system before the actual operation.
1.2 Precautions for Transition from Large-sized A/QnA Series to Q Series

2ANALOG INPUT MODULE REPLACEMENT
2- 1
2
2 ANALOG INPUT MODULE
REPLACEMENT
2.1 List of Analog Input Module Alternative Models for Replacement
Production discontinuation Transition to Q series
Product Model Model Remarks (Restrictions)
Analog input module
A616AD Q68ADV
Q68ADI
1) External wiring : Cable size is changed.
2) Number of slots : Changed (2 modules are required.)
3) Program : Occupied I/O points, I/O signals and buffer memory address
are changed.
4) Performance specifications change:
8CH/module, input signals (Either V or I input)
5) Function specifications: Not changed
A68AD
Q68ADV
Q68ADI
1) External wiring : Cable size is changed.
2) Number of slots : Not changed
3) Program : Occupied I/O points, I/O signals and buffer memory address
are changed.
4) Performance specifications change:
Input signals (Either V or I input) and I/O characteristics
5) Function specifications: Not changed
Q68AD-G*1
1) External wiring : Cable size is changed. (Terminal block wiring connector
wiring)
2) Number of slots : Not changed
3) Program : Occupied I/O points, I/O signals and buffer memory address
are changed.
4) Performance specifications change:
Conversion speed ((the maximum of 2.5ms/channel) 
sampling cycle (10ms/channel) + response speed (20ms))
and I/O characteristics
5) Function specifications: Changed (Non-insulation insulation between
channels)
A68AD-S2
Q68ADV
Q68ADI
1) External wiring : Cable size is changed.
2) Number of slots : Not changed
3) Program : Occupied I/O points, I/O signals and buffer memory address
are changed.
4) Performance specifications change:
Input signals (Either V or I input) and I/O characteristics
5) Function specifications: Not changed
Q68AD-G*1
1) External wiring : Cable size is changed. (Terminal block wiring connector
wiring)
2) Number of slots : Not changed
3) Program : Occupied I/O points, I/O signals and buffer memory address
are changed.
4) Performance specifications change:
Conversion speed ((the maximum of 2.5ms/channel) 
sampling cycle (10ms/channel) + response speed (20ms))
and I/O characteristics
5) Function specifications: Changed (Non-insulation insulation between
channels)