NEC FD1165 User manual

FDl165
Flexible
Disk
Drive
Maintenance
Manual
NEe
NEe
Info,mation
Systems,lnc.
819-000090-2001
10-82

LIABILITY
DISCLAIMER
NEe
Information
Systems,
Inc.
products
are
warranted
in
accordance
with
the
terms
of
the
applicable
NEC
Information
Systems,
Inc.
product
specification.
Product
performance
is
affected
by
system
configuration,
software,
the
applica-
tion,
customer
data
and
operator
control
of
the
system
among
other
factors.
While
NECIS
products
are
considered
to
be
compatible
with
most
systems,
the
specific
functional
imple-
mentation
by
customers
of
the
product
may
vary.
Therefore,
the
suitability
of
a
product
for
a
specific
application
must
be
determined
by
the
customer
and
is
not
warranted
by
NECIS.
This
manual
is
as
complete
and
factual
as
possible
at
the
time
of
pr
inting,
however,
the
information
in
this
manual
may
have
been
updated
since
that
time.
NEC
Information
Systems,
Inc.
reserves
the
right
to
change
the
functions,
features,
or
specifications
of
its
products
at
any
time,
without
notice.
NEC
Information
Systems,
Inc.
has
prepared
this
document
for
use
by
NECIS
employees
and
customers.
The
information
con-
tained
herein
is
the
property
of
NECIS
and
shall
not
be
re-
produced
in
whole
or
in
part
without
prior
written
approval
from
NECIS.
First
Printing
-
October
1982
Copyright
1982©
NEe
Information
Systems,
Inc.
5
Militia
Drive
Lexington,
MA
02173
Printed
in
U.S.A.

FEDERAL
COMMUNICATIONS
COMMISSION
RADIO
FREQUENCY
INTERFERENCE
STATEMENT
Although
disk
drives
as
subsystem
type
components
do
not
require
FCC
rating,
the
following
statement
applies
to
the
Model
FDl165.
This
unit
has
been
type
tested
ond
found
to
comply
with
the
limits
for
a
Class
B
computing
device
in
accordance
with
the
specifications
for
Subpart
J
of
Part
15
of
FCC
Rules,
which
are
designed
to
provide
reasonable
protection
against
such
interference
in
a
residential
installation.
Manufacturer's
Instructions
and
User's
Responsibilities
to
Prevent
Radio
Freguency
Interference
Manufacturer's
Instructions
The
user
must
observe
the
following
precautions
in
install-
ing
and
operating
this
device:
1.
Operate
the
equipment
in
strict
accordance
with
the
manufacturer's
instructions
for
the
model.
2.
Ensure
that
the
unit
:is
plugged
into
a
properly
grounded
wall
outlet
and
that
the
power
cord
sup-
plied
with
the
unit
is
used
and
not
modified.
3.
Ensure
that
the
unit
is
always
operated
with
the
factory
installed
cover
set
on
the
unit.
4.
Make
no
modification
to
the
equipment
which
would
affect
its
meeting
the
specified
limits
of
the
Rules.
5.
Properly
maintain
the
equipment
in
a
satisfactory
state
of
repair.
ii
i.

User's
Responsibility
The
user
has
the
ultimate
responsibility
to
correct
problems
ar
ising
from
harmful
radio-frequency
emissions
from
equip-
ment
under
his
contiol.
If
this
equipment
does
cause
inter-
ference
to
radio
or
television
reception,
which
can
be
determined
by
turning
the
equipment
off
and
on,
the
user
is
encouraged
to
try
to
correct
the
interference
by
one
of
the
following
measures.
All
of
these
responsibili
ties
and
any
others
not
mentioned
are
exclusively
at
the
expense
of
the
user.
1.
Change
in
orientation
of
the
receiving
device
antenna.
2.
Change
in
orientation
of
the
equipment.
3.
Change
in
location
of
equipment.
4.
Change
in
equipment
power
source.
If
these
a
ttempts
are
unsuccessful,
install
one
or
all
of
the
following
devices:
1.
Line
isolation
transformers
2.
Line
filters
3.
Electro-magnetic
shielding
If
necessary,
the
user
should
consult
the
dealer,
NEC
or
an
experienced
radio/television
technician
for
additional
sug-
gestions.
The
user
may
find
the
following
booklet
prepared
by
the
Federal
Communications
Commission
to
be
helpful~
"How
to
Identify
and
Resolve
Radio-TV
Interference
Problems."
This
booklet
is
available
from
the
u.s.
Government
Printing
Office,
Washi'ngton,
D.C.
20402,
Stock
No.
004-000-00345-5.
"Note:
The
operator
of
a
computing
device
may
be
required
to
stop
operating
his
device
upon
finding
that
the
device
is
causing
harmful
interference
and
it
is
in
the
public
interest
to
stop
opera
tion
until
the
interference
problem
has
been
corrected."
iv

CONTENTS
CHAPTER
1
GENERAL
INFORMATION
1.1
1.2
DESC.RI
PTION
••
•••••••••••••••••••••••••••••••••
CONSTRUCTION
AND
FEATURES
••••
~
••••••••••••••••
1-1
1-2
1.2.1
1.2.2
1.2.3
1.2.4
1.2.5
1.2.6
1.2.7
1.2.8
1.2.9
1.2.10
1.2.11
1.2.12
1.2.13
1.2.14
1.2.15
1.2.16
1.2.17
1.2.18
Base
Frame
•••••••••••••••••••••••••••
Spindle
Assembly
•••••••••••••••••••••
Dc
Direct
Drive
Spindle
Motor
••••••••
Carriage
Read/Write
Assembly
Heads
•••
Stepping
Motor
•••••••••••••••••••••••
Head
Load
Cam
Assembly
•••••••••••••••
Pop-Up
Feature
•••••••••••••••••••••••
Index
Sensor
•••••••••••••••••••••••••
00
Track
Sensor
••••••••••••••••••••••
Write
Protect
Sensor
•••••••••••••••••
Media-In
Sensor
••••••••••••••••••••••
Collet
Assembly
••••••••••••••••••••••
Printed
Circuit
Board
(PCB)
••••••••••
Variable
Frequency
Oscillator
,(Optional)
.
Display
Lamps
••••••••••••••••••••••••
Front
Panel
••••
"
•••
·
••••••••••••••••••
Movable
Door
Handle
••••••••••••••••••
Door
Lock
Solenoid
•••••••••••••••••••
1-2
1-2
1-3
1-3
1-3
1-3
1-4
1-4
1-4
1-4
1-4
1-4
1-4
1-4
1-5
1-5
1-5
1-5
1.3
SPECIFICATIONS
••••••••••••••••••••••••••••••••
1-5
CHAPTER
2INSTALLATION
AND
OPERATION
2.1
2.2
PRELIMINARY INSPECTION .
UNPACKING
AND
REPACKING
•••••••••••••••••••••••
2-1
2-1
ENVIRONMENTAL
REQUIREMENTS
••••••••••••••••••••
2.3
2.2.1
2.2.2
2.2.3
2.3.1
2.3.2
2.3.3
Unpacking
Procedure
••••••••••••••••••
Repacking
Procedure
••••••••••••••••••
Preinsta11ation
Inspection
•••••••••••
Operating
Environment
••••••••••••••••
Space
and
Weight
Data
••••••••••••••••
Mounting
•••••••••••••••••••••••••••••
v
2-1
2-1
2-3
2-3
2-3
2-3
2-3

CONTENTS (cont'd)
2.4
POWER
SUPPLy
••••••••••••••••••••••••••••••••••
Page
2-6
INTERFACE
CONNECTION
••••••••••••••••••••••••••
TERMINATOR
RESISTORS
••••••••••••••••••••••••••
OPTION
SELECTION
••••••••••••••••••••••••••••••
DRIVE
IDENTIFICATION
(DX)
SELECTION
•••••••••••
2-9
2-12
2-6
2-6
2-7
2-8
2-12
2-12
2-12
2-12
2-13
2-13
2-13
Power
Supply
Specifications
••••••••••
Power
Connec
tor
••••••••••••••••••••••
Power
Connector
Pin
Assignments
••••••
Head Load
Jumper
(HL)
••••••••••••••••
Radial
Ready
Jumper
(RX)
•••••••••••••
Side
Select
Jumper
(SS)
••••••••••••••
Wr
i
te
Protect
Jumper
(PR)
••••••••••••
File
Unsafe
Jumper
(FR)
••••••••••••••
Door
Lock
Jumpers
(DL, DR,
DH)
•••••••
2.4.1
2.4.2
2.4.3
2.8.1
2.8.2
2.8.3
2.8.4
2.8.5
2.8.6
2.5
2.6
2.7
2.8
OPERATING
THE
FDl165
••••••••••••••••••••••••••
DIS
PLAY
LAMPS
•••••••••••••••••••••••••••••••••
2.9
2.10
2.8.6.1
2.8.6.2
2.8.6.3
2.8.7
2.8.8
2.8.9
2.8.9.1
2.8.9.2
2.8.9.3
2.9.1
2.9.2
2.10.1
2.10.2
DR
Jumper
••••••••••••••••••••••••••••
DL
Jumper
••••••••••••••••••••••••••••
DH
Jumper
••••••••••••••••••••••••••••
In
Use
Pins
(US)
•••••••••••••••••••••
Rea
d Da
taP
ins
(
RD)
••••••••••••••••••
Busy
Lamp
Jumpers
(BU,
BS)
•••••••••••
Busy
Lamp
On
During
Head Load
••••••••
Busy
Lamp
On
During
Drive
Select
•••••
Busy
Lamp
On
During
In
Use
•••••••••••
Inserting
a
Flexible
Disk
••••••••••••
Removing
a
Flexible
Disk
•••••••••••••
Ready
Lamp
•••••••••••••••••••••••••••
Busy
Lamp
••••••••••••••••••••••••••••
2-13
2-13
2-13
2-14
2-14
2-14
2-14
2-15
2-15
2-15
2-15
2-16
2-16
2-16
2-17
vi

CHAPTER
3
CONTENTS (cont'd)
INTERFACE
INFORMATION
3.1
BASIC
OPE:RATIONAL
DESCRIPTION
•••
3-1
3.2
ELECTRICAL
INTERFACE
•••••
.....................
3-2
3.2.1
3.2.2
3.2.3
Signal
Levels
••.•••••••••••••••••••••
Driver/Receiver
Circuits
•••••••••••••
Interface
Lines
••••••••••••••••••••••
3-2
3-2
3-3
3.3
INPUT
SIGNALS
••••••••••••••••••••••••••••.••••
3-3
3.3.1
3.3.2
3.3.3
3.3.4
3.3.5
3.3.6
3.3.7
3.3.8
3.3.9
3.3.10
Drive
Select
1
Through
4(DSXl
to
4).
Head Load
(HDL)
••••••••••••••••••••••
Step
(STP)
•••••••••••••••••••••••••••
Direction
Select
(DIR)
•••••••••••••••
Side
Select
(SSL)
••••••••••••••••••••
Write
Gate
(WGT)
•••••••••••••••••••••
Write
Data
(WDT)
•••••••••••••••••••••
Low
Wr
i
te
Current
(LWC)
••••••••••••••
File
Unsafe
Reset
(FUR)
••••••••••••••
In
Use
(USE)
•••
It
•••••••••••••••••••••
3-3
3-4
3-4
3-4
3-4
3-5
3-5
3-5
3-6
3-6
3.4
OUTPUT
SIGNALS
.................
3-6
3.4.1
3.4.2
3.4.3
3.4.4
3.4.5
3.4.6
3.4.7
3.4.8
Index
(IDX) .
Tr
ack
00
(TKO)
.
Dual-Sided
(TSD)
•••••••••••••••••••••
Ready
(ROY)
••••.
~
•••••••••••••••••••••
File
Unsafe
(FUS)
••••••••••••••••••••
Read
Data
(ROT)
.
Write
Protect
(PRT)
••••••••••••••••••
Dis
k
Chan
ge
(DCG)
••••••••••••••••••••
3-6
3-7
3-7
3-7
3-7
3-8
3-8
3-8
3.5
VFO
INTERFACE
SIGNALS
•••••••••••••••••••••••••
3-9
3.5.1
3.5.2
3.5.3
3.5.4
Modified
Frequency
Modulation
Mode
(MFM)
••••••••••••••••••••••••••••••
VFO
Synchroni
zation
(SYC)
••••••••••••
Standardized
Read
Data
(SRD)
•••••••••
Wi
ndow
(WID)
•••••••••••••••••••••••••
3-9
3-9
3-9
3-9
3.6
INTERFACE
TIMING
••••••••••••••••••••••••
3-10
3.6.1
3.6.2
3.6.3
3.6.4
3.6.5
3.6.6
Power
On
Sequenc
e
••••••••••••••••••••
Drive
Select
•••••••••••••••••••••••••
Step
and
Track
00
••••••••••••••••••••
Access
•••••••••••••••.•••••••••••••••
Wr
i
te
.
Read
.••••••••••••••••••••••••••••••••
vii
3-10
3-10
3-10
3-11
3-11
3-12

CONTENTS (cont'd)
CHAPTER
4
MAINTENANCE
4.1
4.2
4.3
4.4
PREVENTI
VE
MAINTENANCE
••••••••••••••••••••••••
MAINTENANCE
TOOLS
•••••••••••••••••••••••••••••
MAINTENANCE
PARTS
•••••••••••••••••••••••••••••
REMOVAL
AND
REPLACEMENT
PROCEDURES
••••••••••••
4-1
4-1
4-1
4-2
4.4.1
4.4.2
4.4.3
4.4.4
4.4.5
4.4.6
4.4.7
4,,4.8
4.4.9
.4
.4.10
4.4.11
4.4.12
4.4.13
4.4.14
4.4.15
PCB
Removal
••••••••••••••••••••
"
•••••
Collet
Assembly
Removal,
Replacement,
and
Adj
ustmen
t
••••••••••••••
"
••••••••
Carriage
Assembly
Removal
and
Replac
ement
••••••••••••••••••••••••••
Head Load
Cam
Assembly
and
Head
Load
C~m
Removal
and
Replacement
••••••••••
Write
Protect
Sensor
and
Media-In
Sensor
Removal
and
Replacement
•••••••
Optical
Tachometer
Sensor
Removal
and
Replacement
•.••••••••••••••••••••
Sensor
Cable
Assembly
(LED
Assembly
and
Index
Sensor
Removal
and
Replacement
••••••••••••••••••••••••••
Removing
and
Replacing
the
Carbon
Brushes
••••••••••••••••••••••••••••••
Armature
Removal
•••••••••••••••••••••
Spindle
Assembly
Removal
•••••••••••••
Front
Panel
Removal
••••••••••••
,
•••••
"
Picker
Rod
Removal
and
Replacement
•••
Pop-Up
Assembly
Removal
and
Replacement
••••••••••••••••••••••••••
Guide
Rail
Removal
•••••••••••••••••••
Checking
the
Operation
of
the
Pop-Up
4-2
4-3
4-6
4-8
4-9
4-10
4-11
4-14
4-15
4-16
4-17
4-17
4-18
4-19
4.4.16
Feature..............................
4-19
Door Lock
Solenoid
Removal
and
Replacement..........................
4-20
CHAPTER
5
ADJUSTMENTS
DIAGNOSTIC
TESTS
••••••••••••••••••••••••••••••
5.1
5.1.1
5.1.2
5.1.3
Auto
Tap
Test
••••••••••••••••••••.•••
Auto
Seek
Test
•••••••••••••••••••••••
Auto
Seek
and
Auto
Tap
Test
.•••••••••
5-1
5-2
5-2
5-2
5.2
5.3
HEAD
UNLOAD
DELAy
••••••••••
"""""""
II
" " " " " • " • "
••
TEST
PO
INTS
•••••••••••••••••••••••••••••••••••
viii
5-2
5-3

5.4
CONTENTS (cQnt'd)
ADJUSTMENTS
AND
CHECKS
USING
THE
ALIGNMENT
FLEXIBLE DISK
•••••••••••••••••••••••••••••••••
5-3
O'l"HER
ADJUSTMENTS
••••••••••••••••
~
••••••••••••
TRIM
POTS
••••
.-
•••••••••••
~
••••••••••••••••••••
5.5
5.6
5.4.1
5.4.2
5.4.3
5.5.1
5.5.2
5.5.3
5.5.4
Head
Radial
Alignment
Check
or
Ad
j'
ustmen
t
•••••••••••••••••••••••••••
Azimuth
Check
••••••••••••••••••••••••
Index
Alignment
Check
or
Adjustment
••
LED
Assembly/Index
Assembly
Check
and
Adjustment
•••••••••••••••••••••••
00
Track
Sensor
Check
or
Adjustment
••
Write
Protect
Sensor
Check
or
Ad
j
us
tmen
t
•••••••••••••••••••••••••••
Head
Load
Check
••••••••••••••••••••••
5-4
5-6
5-7
5"'8
5-8
5-9
5-10
5
.....
10
5-11
CHAPTER
6
ILLUSTRATED
PARTS
BREAKDOWN
CHAPTER
7
SCHEMATIC
ix

Figure
1-1
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
2-9
2-10
2-11
2-12
2-13
2-14
3-1
3-2
3-3
3-4
3-5
3-6
3-7
3-8
3-9
3-10
3-11
3-12
3-13
4-1
4-2
4-3
4-4
4-5
4-6
4-7
4-8
ILLUSTRATIONS
Title
FDl165
Flexible
Disk
Drive
••••••••••••••••••
Unpack
ing
••••••••••••••••••••••••••••.••••••
Model
FDl165
Physical
Dimensions
••••••••••••
Vertical
Installation
.••••••••••••••••••.•••
Horizontal
Installation
•••••••••••••••••••••
On-End
Installation
•••••••••••••••••••••••••
Air
Flow
Requirements
for
Natural
Air
Cool
ing
•••••••••••••••••••
'
••••••••••••••••••
Power
Connector
Location
••••••••••••••••••.•
Pin
and
Line
Assignments
for
the
Power
Connec
tor
•••••••••••••••••••••••••••••••••••
Contact
Arrangement
for
Edge
Connector
••••••
In
terf
ace
Connector
•••••••••••••••••••••••••
Terminator
Resistors
and
Jumper
Locations
on
the
PCB
•••••••••••••••.•••••••••••••.••••
Parallel
and
Series
Configurations
••••••••••
Closing
the
Door
of
the
FDl165
••••••••••••••
Unlocking
the
Door
and
Removing
the
Fle'xible
Disk
•••••••••••••••••••••••••••••••
Dr i ver
/R
ec
e i ver Ci r
cui
ts••••••••••••••••••••
Interface
Lines
•••••••••••••••••••.••••••••.
Step
Signal
Timing
••••••••••••••••••••••••••
WGT
Timing
••••••••••••••••••••••••••••••••••
Write
Data
Signal
Ximing
••••••••••••••••••••
Index
Signal
Timing
•••••
~
•••••••••••••••••.•
Read
Data
Signal
Timing
••••••••••••••••.•.••
Disk
Change
Signal
Timing
•.•••••••.•••••••••
Read
Data
and
Window
Signal
Timing
••••••••••
Step
and
Track
00
Timing
••••••••••••••••••••
Acce
ss
T
imi
ng
•••••••••••••••••••••••••••••••
Write
Timing
••••••••.••••••••••••••••••••.••
Read
T
imi
ng
••••••••••••••.••••••••••••••••••
Removing
the
Collet
Assembly
••••••••••••••••
Replacing
the
Collet
Assembly
•••••••••••••••
Head
Unload
Spring
in
Relation
to
Spring
Plate
.
Position
of
the
Spring
Plate
••••••••••••••••
Carriage
Assembly
position
on
the
Base
Frame
Removing
the
Head Load
Cam
••••••••••••••••••
Installing
the
Head Load
Cam
Assembly
•••••••
Write
Protect
or
Media-In
Sensor
Page
1-2
2-2
2-4
2-4
2-4
2-5
2-5
2-7
2-7
2-8
2-8
2-10
2-11
2-15
2-16
3-2
3-3
3-4
3-5
3-6
3-6
3-8
3-9
3-10
3-10
3-11
3-11
3-12
4-3
4-4
4-5
4-5
4-7
4-8
4-9
Connections.................................
4-10
4-9
Installing
the
Write
Protect
or
Media-In
Sensor......................................
4-10
4-10
Removing
the
Replacing
the
Optical
Tachometer
Sensor
•••••••••••••••••••••••••••
x
4-11

Figure
4-11
4-12
4-13
4-14
4-15
4-16
4-17
4-18
4-19
4-20
5-1
5-2
5-3
5-4
5-5
5-6
5-7
5-8
6-1
6-2
Table
1-1
2-1
2-2
2-3
2-4
4-1
4-2
5-1
5-2
5-3
5-4
5-5
6-1
ILLUSTRATIONS (cont'd)
Title
Removing
the
Sensor
Cable
Assembly
••••••••••
Installing
the
Index
Sensor
•••••••••••••••••
Removing
a
Carbon
Brush
•••••••••••.•••••••••
Removing
the
Armature
•••••••••••••••••••••••
Removing
the
Spindle
Assembly
•••••••••••••••
Removing
the
Front
Panel
••••••••••••••••••••
Adjusting
the
Picker
Rod
••••••••••••••••••••
Removing
the
Pop-Up
Assembly
and
Guide
Rail.
Removing
the
Door
Lock
Solenoid
•••••••••••••
Adjusting
the
Door
Lock
Solenoid
••••••••••••
Location
of
Diagnostic
Test
Pins
and
Test
Po
in
ts
.
Head
Radial
Alignment
Waveform
••••••••••••••
Adjusting
Head
Radial
Alignment
•.••••••••••.
Azimuth
Waveform
••
~
•••••••••••••••••••••••••
Index
Alignment
Waveform
••••••••••••••••••••
Waveforms
at
TP7
and
TP10
•••••••••••••••••••
Track
00
Signal
•••••••••••••••••••••••••••••
Head
Load
Waveform
••••••••••••••••••••••••••
FDl165
Flexible
Disk
Drive
••••••••••••••••••
G9NYF
PCB
Assembly
••••••••••••••••••••••••••
TABLES
Title
FDl165
Specifications
•••••••••••••••••••••••
Power
Supply
Specifications
••••••••••.••••••
Power
Connector
Part
Number
••••••••••••.••••
Data
and
Control
Interface
Contact
Ass
ignmen
ts
•••••••••••••••••••••••••••••••••
Door
Lock
Jumper
Combinations
•••••••••••••••
Maintenance
Tools
••••••••••••••••••••••.••••
Maintenance
Parts
••••••.••••••••••••••••••••
Test
Points
and
Signals
•••••••••••••••••••••
Adj
ust.ments
•••••••••••••••••••••••••••••••••
Head
Radial
Alignment
Oscilloscope
Settings.
Head
Azimuth
Oscilloscope
Settings
••••••••••
Index
Alignment
Oscilloscope
Settings
•••..••
List
of
Illustrations
•••••••••••••••••••••••
xi
Page
4-12
4-13
4-14
4-15
4-16
4-17
4-18
4-19
4-20
4-21
5-1
5-5
5-6
5-7
5-8
5-9
5-9
5-11
6-5
6-7
1-5
2-6
2-6
2-9
2-14
4-1
4-2
5-3
5-3
5-4
5-6
5-7
6-3

LIST OF ABBREVIATIONS
A
Ampere
DIR
Direction
Select
DCG
Disk
Change
DLH
Door
Lock
Hold
DSX
Drive
Select
FDD
Flexible
Disk
Drive
FM
Frequency
Modulation
FUR
File
Unsafe
Reset
FUS
File
Unsafe
HLD
Head
Load
IC
Integrated
Circuit
IDX
Index
I/O
Input/Output
k
1000
kg
Kilogram
LED
Light
Emitting
Diode
LSI
Large-Scale
Integration
LWC
Low
Write
Current
rnA
Milliampere
MB
Megabyte
MFM
Modified
Frequency
Modulation
ms
Millisecond
mV
Millivolt
PCB
Printed
Circuit
Board
POH
Power-On-Hours
pp
Peak-To-Peak
PRT
Write
Protect
ROT
Read
Data
ROY
Ready
rpm
revolutions
per
minute
SRO
Standardized
Read
Data
SSL
Side
Select
STP
Step
SYC
Synchronization
TKO
Track
00
TSD
Two-Sided
Disk
TTL
Transistor
Transistor
Logic
USE
In
Use
Vdc
Volts
direct
current
VFO
Variable
Frequency
Oscillator
WDT
Write
Data
WGT
Write
Gate
WID
Window
~s
Microsecond



CHAPTER 1
GENERAL INFORMATION
This
chapter
gives
an
overall
description
of
the
Model
FDl165
8-Inch
Flexible
Disk
Drive,
describes
the
features
and
parts
of
the
disk
drive
in
detail,
and
lists
the
speci-
fications.
1.1
DESCRIPTION
The
Model
FDl165
Flexible
Disk
Drive
is
a
compact
magnetic
disk
storage
device
that
uses
single-
or
dual-sided,
single-
or
double-density
flexible
disks.
The
storage
capacity
of
the
disk
drive
depends
on
the
type
and
format
of
the
disk-
ette
that
is
used.
wi
th
a
dual-sided
flexible
disk
and
a
double-density
format,
the
maximum-storage
capacity
is
1.6
million
bytes
(MB).
The
most
apparent
features
of
the
Model
FDl165
are
its
small
size
and
light
weight.
The
disk
drive
measures
8.55
inches
(2l7.2
rom)
high,
by
2.28
inches
(58.0
rom)
wide
by
13.20
inches
(335.0
rom)
deep
and
weighs
only
7.7
pounds
(3.5
kg).
The
disk
drive
has
all
the
features
and
performance
of
larger,
conventional
units,
and
is
media-compatible
and
interface-compatible
with
~hem.
Because
the
Model
FDl165
measures
one-half
the
height
of
'conventional
disk
drives,
two
disk
dr
i
ves
can
be
mounted
in
the
same
space
as
one
conventional
drive.
The
Model
FDl165
is
operated
by
an
external
controller
(NEC
~PD765
is
recommended)
through
a
Transistor
Transistor
Logic
(TTL)
interface.
The
disk
drive
requires
an
external
power
supply
that
must
supply
and
control
two
vol
tages,
+5 Vdc
(for
the
TTL)
and
+24
Vdc
(for
the
dc
direct
drive
spindle
motor)
(see
Section
1.2.3).
The
disk
drive
features
a
microprocessor-controlled
head
loading
mechanism
that
mini-
mizes
head
and
media
wear.
The
head
position
mechanism
(stepping
motor)
is
also
microprocessor-controlled
to
ensure
extremely
accurate
head
positioning.
1-1

1.2
CONSTRUCTION
AND
FEATURES
This
section
describes
the
construction
of
the
Model
FDl165
and
explains
the
features
of
the
various
assemblies.
See
Figure
1-1
to
identify
the
assemblies
that
are
described
in
this
section.
HEAD LOAD
SOLENOID
Figure
1-1
FDl165
Flexible
Disk
Drive
1.2.1
Base
Frame
The
base
frame
is
the
metal
form
that
supports
the
sub-
assemblies
of
the
disk
drive.
1.2
b2
Spindle
Assembly
The
spindle
assembly
supports
the
flexible
disk
in
the
disk
drive
and
rotates
the
flexible
disk
at
360
revolutions
per
minu
te
(rpm).
1-2

1.2.3
Dc
Direct
Dtive
Spindle
Motor
The
dc
direct
drive
motor
(not
shown)
rotates
the
spindle
assembly.
This
dc
motor
eliminates
the
problems
that
are
associated
with
conventional
ac
motor
drives.
•
The
motor
does
not
use
drive
pulleys
or
belts,
elim-
inating
the
problems
associated
with
these
parts.
•
The
motor
consumes
less
power
than
conventional
ac
motor
s.
Low-power,
inexpensi
ve
power
suppli
es
can
be
used.
•
The
motor
uses
direct
current,
so
that
there
are
no
concerns
about
voltages
and
frequencies.
•
The
motor
generates
less
heat
than
conventional
un
its.
The
spindle
motor
has
an
up-to-speed
time
of
700
ms.
1.2.4
Carr!
age
Read/Wr
i
te
Assembly
Heads
The
read/write
heads
touch
each
side
of
the
flexible
disk,
allowing
data
to
be
written
to
the
flexible
disk
and
to
be
read
from
it.
The
read/write
heads
are
part
of
a
precision
carriage
assembly
that
shifts
the
heads
from
track
to
track.
During
the
loading
of
a
flexible
disk,
the
read/write
heads
are
held
away
from
the
surface
of
the
flexible
disk.
1.2.5
Stepping
Motor
The
stepping
motor,
under
microprocessor
control,
positions
the
carriage
assembly
with
a
tensioned
steel
belt.
This
arrangement
provides
fast
and
accura
te
data
access.
For
each
pulse
the
stepping
motor
receives,
the
stepping
motor
shaft
rotates
1.8
degrees.
This
action,
in
turn,
moves
the
carriage
1/2
track
on
the
flexible
disk.
1.2.6
Head
Load
Cam
Assembly
The
head
load
cam
assembly
(rotary
solenoid)
lowers
the
heads
onto
the
flexible
disk
with
a
force
that
is
controlled
by
a
microprocessor.
This
action
prevents
damage
to
the
flexible
disk
and
reduces
wear
of
the
read/write
heads.
1-3

1.2.7
Pop-Up
Feature
For
easy
removal
of
the
flexible
disk
from
the
disk
drive,
the
pop-up
feature
ejects
the
flexible
disk
from
the
disk
drive
when
the
door
is
opened.
After
ejection,
the
edge
of
the
flexible
disk
protrudes
approximately
1/2
inch
(13
mm)
from
the
disk
drive.
1.2.8
Index
Sensor
The
index
sensor
is
a
combination
LED
and
phototransistor
that
senses
the
index
position
of
the
flexible
disk.
The
Model
FDl165
has
a
dual
index
sensor
to
detect
both
single-
sided
and
dual-sided
flexible
disks.
1.2.9
00
Track
Sensor
The
00
Track
sensor
detects
when
the
read/write
head
is
at
the
00
track
(track
0,
side
0).
1.2.10
Write
Protect
Sensor
The
write
protect
sensor
detects
the
presence
or
absence
of
a
write
protect
notch
on
the
flexible
disk.
If
there
is
a
notch,
the
write
function
is
disabled.
If
no
notch
exists,
the
write
function
operation
is
enabled.
1.2~11
Media-In
Sensor
The
media-in
sensor
detects
the
presence
of
a
flexible
disk
in
the
disk
drive.
1.2
0
12
Collet
Assembly
The
collet
assembly
holds
the
flexible
disk
in
position
on
the
spindle
when
the
door
is
closed.
1.2.13
Printed
Circuit
Board
(PCB)
The
PCB
(not
shown)
supports
the
electronic
drive
and
logic
circuits
of
the
disk
drive.
1.2.14
Variable
Frequency
Oscillator
(Optional)
The
optional
Variable
Frequency
Oscillator
(VFO)
PCB
makes
the
interface
signals
to
the
controller
more
stable,
in-
creasing
the
overall
reliability
of
the
disk
drive.
1-4

1.2.15
Displ~Lamps
Two
lamps
on
the
front
panel
provide
a
visual
display
of
the
ready
and
busy
states
of
the
disk
drive.
1.2.16
Front
Panel
The
front
panel
holds
the
display
lamps
and
provides
an
attractive
appearance
for
the
front
of
the
disk
drive.
1.2.17
Movable
Door
Handle
The
movable
door
handle
,when
closed,
engages
the
collet
assembly.
1.2.18
Door
Lock
Solenoid
The
door
lock
solenoid
(not
shown)
makes
it
impossible
to
remove
the
flexible
disk
during
certain
drive
operations,
theieby
preventing
data
loss
or
physical
damage
to
the
flexible
disk.
1.3
SPECIFICATIONS
Table
1-1
lists
the
specifications
for
the
Model
FDl165
Flexible
Disk
Drive.
Table
1-1
FDl165
Specifications
FEATURES
SPECIFICATIONS
SINGLE-SIDED
DUAL-SIDED DUAL-SIDED
SINGLE-DENSITY SINGLE-DENSITY
DUAL-DENSITY
Unformatted
Capacity
400 800 1600
(Kbytes)
Formatted
Capacity
Sectors/track
26
15 8
26
15 8
26
15 8
By
tes/
sec
tor
128 256 512 128 256 512 256 512 1024
Bytes/track
3328 3840 4096 3328 3840 4096 6656 7680
8192
I<
by
tes/D
isk
246 284 303 493 568 606 985 1137 1212
Media
IBM
Diskette
1
IBM
Diskette
2
IBM
Diskette
20
or
equivalent
or
equivalent
or
equivalent
Media
Dimensions
8 x
8/203
x203
(
inches/rom)
Tracks
Per
Disk
77 154 154
Bit
Density
3268 3408 6816
(bits
per
inch)
Transfer
Rate
31.25
31.25
62.5
(Kbytes
per
second)
Recording
Method
FM
FM
MFM
1-5

Table
1-1
FDl165
Specifications
(cont'd)
FEATURES
Track
Density
(tracks
per
inch)
Rotational
Speed
(rpm)
Access
Times (ms)
Track-to-track
Seek
settling
time
Head
load
time
Latency
time
(average)
Start
time
SINGLE-SIDED I
SINGLE-DENSITY
SPECIFICATIONS
DUAL-SIDED
I
SINGLE-DENSITY
48
360
3.0
IS
.5
30.0
83.3
700.0
DUAL-SIDED
DUAL-DENSITY
Power
Requirements
Power
Consumption
Physical
dimensions
Height
Width
Depth
Weight
Environment
requirements
Ambient
temperature
Operating
Nonoperating
Relative
humidity
Operating
Reliabili
ty
Mean Time
Between
Failures
Mean Time
to
Repair
Soft
Error
Rates
Hard
Error
Rates
Seek
Error
Rates
+24 Vdc
±10%
@
0.9
Amp
(maximum)
+5
Vdc
±5%
@
0.8
Amp
(maximum)
without
VFO/
0.9
Amp
(maximum)
with
VFO
26
Watts
(27
Watts
with
VFO)
2.28
in.
(58
rom)
8.55
in.
(217.2
mm)
13.19
in.
(335
rom)
7.7
pounds
(3.5
Kg)
50°F
to
113°F
(10°C
to
45°C)
23°F
to
158°F
(-5°C
to
70°C)
20%
to
80%
24,000
Power
On
Hours
(POH)
0.5
hours
1
bit
in
109
1
bit
in
1012
1
in
106
1-6
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