Neousys Technology POC-300 User manual

Neousys Technology Inc.
POC-300 Series
User Manual
Revision 1.0

Table of Contents
Table of Contents
Table of Contents...................................................................................................................2
Legal Information...................................................................................................................5
Contact Information...............................................................................................................6
Declaration of Conformity.....................................................................................................6
Copyright Notice....................................................................................................................7
Safety Precautions.................................................................................................................8
Service and Maintenance ......................................................................................................9
ESD Precautions....................................................................................................................9
About This Manual...............................................................................................................10
1Introduction
1.1 Specification of POC-300.........................................................................................12
1.2 Specification of POC-310.........................................................................................14
1.3 Specification of POC-320.........................................................................................16
1.4 Specification of POC-330.........................................................................................18
1.5 Dimension.................................................................................................................20
1.5.1 Superior View....................................................................................................20
1.5.2 Front Panel View...............................................................................................21
1.5.3 Bottom View......................................................................................................22
1.6 POC-300 Series Mounting Options.........................................................................23
1.6.1 DIN-Rail Mount Clip..........................................................................................23
1.6.2 Wall Mount Bracket (WM-300V)........................................................................24
1.6.3 Wall Mount Bracket (WM-300H) .......................................................................25
2System Overview
2.1 Unpacking the System.............................................................................................26
2.2 POC-300 Series Front Panel....................................................................................27
2.2.1 USB 2.0 Port.....................................................................................................28
2.2.2 Power Button ....................................................................................................29
2.2.3 Reset Button.....................................................................................................30
2.2.4 Gigabit Ethernet................................................................................................31
2.2.5 System Status LED...........................................................................................32
2.2.6 DVI-I Port..........................................................................................................33
2.2.7 USB 3.0 Port.....................................................................................................34
2.2.8 IEEE 802.3at Power over Ethernet Port #1 & #2 (POC-300/ POC-320 Only)...35
2.2.9 3-Pin Terminal Block for DC Input/ Ignition Input...............................................36
2.3 POC-300 Series Top Panel.......................................................................................37
2.3.1 COM Port (COM1) ............................................................................................38
2.3.2 COM Ports (COM2/ COM3/ COM4)..................................................................39
2.3.3 3.5mm Microphone-in/ Speaker-out Jack..........................................................40
2.3.4 SMAAntennae Opening....................................................................................41
2.4 POC-300 Series Internal I/O.....................................................................................42
2.4.1 DDR3L SO-DIMM Socket .................................................................................42
2.4.2 Full-size mini-PCIe Socket................................................................................43
2.4.3 Half-size mSATA Socket ...................................................................................45
2.5 MezIOTM Interface .....................................................................................................47
2.5.1 MezIOTM Interface Pin Definition.......................................................................48
2.5.2 MezIOTM Modules for POC-300 Series .............................................................49
3System Installation
3.1 Disassembling the System Enclosure....................................................................51
3.2 Installing Internal Components...............................................................................52
3.2.1 DDR3L SO-DIMM Installation ...........................................................................52
3.2.2 mini-PCIe Module, SIM Card and Antennae Installation...................................53

Table of Contents
3
3.2.3 mSATA Module Installation ...............................................................................57
3.2.4 2.5” HDD/ SSD Installation (for MezIO-R11/ R12) ............................................59
3.2.5 MezIOTM Module Installation.............................................................................60
3.3 Installing the System Enclosure .............................................................................62
3.4 DIN Rail Installation..................................................................................................63
3.5 Wall Mount Bracket Installation (with WM-300V)...................................................65
3.6 Wall Mount Bracket Installation (with WM-300H)...................................................67
3.7 Powering On the System .........................................................................................70
3.7.1 Powering On Using the Power Button...............................................................70
3.7.2 Powering On Using An External Non-Latched Switch.......................................71
3.7.3 Powering On Using An External Latched Switch...............................................72
3.7.4 Powering On Using Wake-on-LAN....................................................................73
3.8 Ignition Power Control (For MezIO-V20 Only)........................................................76
3.8.1 Principles of Ignition Power Control..................................................................76
3.8.2 Additional Features of Ignition Power Control...................................................77
3.8.3 Wiring Ignition Signal........................................................................................78
3.8.4 Configure your Windows system.......................................................................79
3.8.5 Operation Modes of Ignition Power Control ......................................................80
4BIOS Settings
4.1 COM1 Port Configuration ........................................................................................83
4.2 COM2/ 3/ 4 Port Configuration ................................................................................84
4.3 SATA Interface Speed...............................................................................................85
4.4 C-States.....................................................................................................................86
4.5 Wake-on-LAN............................................................................................................87
4.6 Power On after Power Failure..................................................................................88
4.7 Position New Boot Device .......................................................................................89
4.8 Watchdog Timer........................................................................................................90
4.9 Select a Boot Device................................................................................................91
5OS Support and Driver Installation
5.1 Operating System Compatibility.............................................................................92
5.2 Driver Installation.....................................................................................................93
5.2.1 Install Drivers Automatically..............................................................................93
5.2.2 Install Drivers Manually.....................................................................................94
5.3 Driver for Watchdog Timer and DIO........................................................................95
Appendix A Using WDT & DIO
WDT and DIO Library Installation .......................................................................................97
WDT Function Reference ....................................................................................................99
InitWDT..............................................................................................................99
SetWDT..............................................................................................................99
StartWDT..........................................................................................................100
ResetWDT........................................................................................................100
StopWDT..........................................................................................................100
Using DIO Function (With MezIO-R12 Installed)..............................................................101
Wiring for DIO...................................................................................................101
DIO Pin Definition.............................................................................................102
DIO Function Reference ....................................................................................................103
InitDIO..............................................................................................................103
DIReadLine ......................................................................................................103
DIReadPort ......................................................................................................103
DOWriteLine.....................................................................................................104
DOWritePort.....................................................................................................104
DOWriteLineChecked.......................................................................................105
DOWritePortChecked.......................................................................................105
COS Function Reference...................................................................................................106
SetupDICOS ....................................................................................................106
RegisterCallbackDICOS...................................................................................107
StartDICOS.......................................................................................................107

Table of Contents
4
StopDICOS.......................................................................................................108
DI COS Example..............................................................................................108

Legal Information
Legal Information
All Neousys Technology Inc. products shall be subject to the latest Standard
Warranty Policy
Neousys Technology Inc. may modify, update or upgrade the software, firmware or
any accompanying user documentation without any prior notice. Neousys
Technology Inc. will provide access to these new software, firmware or
documentation releases from download sections of our website or through our
service partners.
Before installing any software, applications or components provided by a third party,
customer should ensure that they are compatible and interoperable with Neousys
Technology Inc. product by checking in advance with Neousys Technology Inc.
Customer is solely responsible for ensuring the compatibility and interoperability of
the third party’s products. Customer is further solely responsible for ensuring its
systems, software, and data are adequately backed up as a precaution against
possible failures, alternation, or loss.
For questions in regards to hardware/ software compatibility, customers should
contact Neousys Technology Inc. sales representative or technical support.
To the extent permitted by applicable laws, Neousys Technology Inc. shall NOT be
responsible for any interoperability or compatibility issues that may arise when (1)
products, software, or options not certified and supported; (2) configurations not
certified and supported are used; (3) parts intended for one system is installed in
another system of different make or model.

Contact Information/ Declaration of Conformity
Contact Information
Headquarters
(Taipei, Taiwan)
Neousys Technology Inc.
15F, No.868-3, Zhongzheng Rd., Zhonghe Dist., New Taipei City, 23586, Taiwan
Tel: [phone] Fax: [phone] Email, Website
Americas
(Illinois, USA)
Neousys Technology America Inc.
3384 CommercialAvenue, Northbrook, IL 60062, USA
Tel: [phone] Email, Website
China
Neousys Technology (China) Ltd.
Room 612, Building 32, Guiping Road 680, Shanghai
Tel: [phone] Email, Website
Declaration of Conformity
FCC
This equipment has been tested and found to comply with the limits for a Class
Adigital device, pursuant to part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful interference when the
equipment is operated in a commercial environment. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instruction manual, may cause harmful interference to
radio communications. Operation of this equipment in a residential area is likely
to cause harmful interference in which case the user will be required to correct
the interference at own expense.
CE
The product(s) described in this manual complies with all applicable European
Union (CE) directives if it has a CE marking. For computer systems to remain
CE compliant, only CE-compliant parts may be used. Maintaining CE
compliance also requires proper cable and cabling techniques.

Copyright Notice
Copyright Notice
All rights reserved. This publication may not be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, electronic, mechanical,
magnetic, optical, chemical, manual or otherwise, without the prior written
consent of Neousys Technology, Inc.
Disclaimer
This manual is intended to be used as an informative guide only and is subject
to change without prior notice. It does not represent commitment from Neousys
Technology Inc. Neousys Technology Inc. shall not be liable for any direct,
indirect, special, incidental, or consequential damages arising from the use of
the product or documentation, nor for any infringement on third party rights.
Patents and
Trademarks
Neousys, the Neousys logo, Expansion Cassette, MezIOTM are registered
patents and trademarks of Neousys Technology, Inc.
Windows is a registered trademark of Microsoft Corporation.
Intel®, Core™ are registered trademarks of Intel Corporation
NVIDIA®, GeForce®are registered trademarks of NVIDIA Corporation
All other names, brands, products or services are trademarks or registered
trademarks of their respective owners.

Safety Precautions
Safety Precautions
Read these instructions carefully before you install, operate, or transport the
system.
Install the system or DIN rail associated with, at a sturdy location
Install the power socket outlet near the system where it is easily accessible
Secure each system module(s) using its retaining screws
Place power cords and other connection cables away from foot traffic. Do not
place items over power cords and make sure they do not rest against data
cables
Shutdown, disconnect all cables from the system and ground yourself before
touching internal modules
Ensure that the correct power range is being used before powering the device
Should a module fail, arrange for a replacement as soon as possible to minimize
down-time
If the system is not going to be used for a long time, disconnect it from mains
(power socket) to avoid transient over-voltage

Service and Maintenance/ ESD Precautions
Service and Maintenance
ONLY qualified personnel should service the system
Shutdown the system, disconnect the power cord and all other connections
before servicing the system
When replacing/ installing additional components (expansion card, memory
module, etc.), insert them as gently as possible while assuring proper
connector engagement
ESD Precautions
Handle add-on module, motherboard by their retention screws or the module’s
frame/ heat sink. Avoid touching the PCB circuit board or add-on module
connector pins
Use a grounded wrist strap and an anti-static work pad to discharge static
electricity when installing or maintaining the system
Avoid dust, debris, carpets, plastic, vinyl and styrofoam in your work area.
Do not remove any module or component from its anti-static bag before
installation

About This Manual
About This Manual
This manual introduces and demonstrates installation procedures of Neousys
POC-300 seriessystems.
Revision History
Version
Date
Description
1.0
Nov. 2017
Initial release

POC-300 Series
11
1 Introduction
Neousys Technology POC-300 series are ultra-compact fanless embedded
computers featuring Intel® Apollo-Lake Atom™ x7-E3950 or Pentium® N4200
processor. The latest member of Neousys’ ultra-compact POC series (POC-300) has
a compact and rugged chassis with dimensions measuring just 56 (W) x 153 (H) x
108 (D) mm. Designed for DIN rail mounting with front panel I/O port access,
POC-300 is easy to setup and ideal for industrial applications where space is limited.
POC-300 series system utilizes Intel Atom™ x7-E3950 quad-core processor that
features an updated 14nm
microarchitecture with integrated
HD graphics and faster memory
speeds (DDR3L-1866) for
efficient computing. It delivers
more than 150% CPU
performance and 300% GPU
performance over previous
E3800 series platform. For
applications such as industrial
automation, machine vision and
real-time surveillance can all
benefit from its higher throughput
performance.
Neousys POC-300 series provides rich I/O ports, it has one Gigabit Ethernet port,
two 802.3at Gigabit PoE+ ports, two USB3.0 ports, two USB2.0 ports, one DVI-I
connector for VGA + DVI dual video output, four COM ports and is compatible with
Neousys’ MezIO™ interface.
Neousys MezIO interface allows for the installation of an I/O expansion module that
is application-oriented. The expansion module is a flexible and cost-effective way to
customize an embedded system for dedicated applications.
As an industrial embedded computer, POC-300 series systems can function under
100% CPU load under wide temperature ranging from -25°C to 70°C. It also accepts
a wider range of power inputs from 8 to 35V DC and is fully tested for 24/7 operation
in harsh environments.

POC-300 Series
12
1.1 Specification of POC-300
System Core
Processor
Intel® Atom™ E3950 1.6/ 2.0GHz quad-core processor
Graphics
Integrated Intel® HD Graphics 505
Memory
1x SODIMM socket for DDR3L-1866, up to 8GB
Panel I/O Interface
Ethernet
3x Gigabit Ethernet ports by Intel® I210 GbE controller
PoE
IEEE 802.3at PoE+ on port #1 and #2
Video Port
1x DVI-I connector for both analog RGB and DVI outputs, supporting up
to 1920 x 1200 resolution
Serial Port
1x programmable RS-232/ 422/ 485 port (COM1)
3x 3-wire RS-232 ports (COM2/ 3/ 4) or 1x RS-422/ 485 port (COM2)
USB
2x USB 3.0 ports
2x USB 2.0 ports
Audio
1x speaker-out
1x microphone-in
Internal I/O Interface
Mini-PCIe
1x full-size mini PCI Express slot with USIM socket
Storage Interface
mSATA
1x half-size mSATA port
Power Supply
DC Input
Built-in 8~35 VDC DC input
Input
Connector
3-pin pluggable terminal block for DC input
Max. Power
consumption
19.68W (0.82A@24V)*
Mechanical
Dimension
56 x 108 x 153 mm
Weight
0.96 kg
Mounting
DIN-rail mount (Standard)
Wall-mount (Optional)
Environmental
Operating
Temperature
-25°C ~ 70°C with SSD, 100% CPU loading */**
Storage
Temperature
-40°C ~85°C

POC-300 Series
13
Humidity
10%~90% , non-condensing
Vibration
Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to
IEC60068-2-64)
IEC 60068-2-64
)
Shock
Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to
IEC60068-2-27)
)
EMC
CE/FCC Class A, according to EN 55022 & EN 55024
* The 100% CPU/GPU loading for high temperature test is applied using Passmark®
BurnInTest™v8.0. For detail testing criteria, please contact Neousys Technology
** For sub-zero operating temperature, a wide temperature HDD drive or Solid State Disk
(SSD) is required.

POC-300 Series
14
1.2 Specification of POC-310
System Core
Processor
Intel® Atom™ E3950 1.6/ 2.0GHz quad-core processor
Graphics
Integrated Intel® HD Graphics 505
Memory
1x SODIMM socket for DDR3L-1866, up to 8GB
Panel I/O Interface
Ethernet
3x Gigabit Ethernet ports by Intel® I210 GbE controller
Video Port
1x DVI-I connector for both analog RGB and DVI outputs, supporting up
to 1920 x 1200 resolution
Serial Port
1x programmable RS-232/ 422/ 485 port (COM1)
3x 3-wire RS-232 ports (COM2/ 3/ 4) or 1x RS-422/ 485 port (COM2)
USB
2x USB 3.0 ports
2x USB 2.0 ports
Audio
1x speaker-out
1x microphone-in
Internal I/O Interface
Mini-PCIe
1x full-size mini PCI Express slot with USIM socket
Storage Interface
mSATA
1x half-size mSATA port
Power Supply
DC Input
Built-in 8~35 VDC DC input
Input
Connector
3-pin pluggable terminal block for DC input
Max. Power
consumption
19.68W (0.82A@24V)*
Mechanical
Dimension
56 x 108 x 153 mm
Weight
0.96 kg
Mounting
DIN-rail mount (Standard)
Wall-mount (Optional)
Environmental
Operating
Temperature
Operating temperature:
-25°C ~ 70°C with SSD, 100% CPU loading */**
-10°C ~ 50°C with HDD, 100% CPU loading */**
Storage
Temperature
-40°C ~85°C
Humidity
10%~90% , non-condensing

POC-300 Series
15
Vibration
Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to
IEC60068-2-64)
IEC 60068-2-64
)
Shock
Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to
IEC60068-2-27)
)
EMC
CE/FCC Class A, according to EN 55022 & EN 55024
* The 100% CPU/GPU loading for high temperature test is applied using Passmark®
BurnInTest™v8.0. For detail testing criteria, please contact Neousys Technology
** For sub-zero operating temperature, a wide temperature HDD drive or Solid State Disk
(SSD) is required.

POC-300 Series
16
1.3 Specification of POC-320
System Core
Processor
Intel® Pentium® N4200 1.1/ 2.5GHz quad-core processor
Graphics
Integrated Intel® HD Graphics 505
Memory
1x SODIMM socket for DDR3L-1866, up to 8GB
Panel I/O Interface
Ethernet
3x Gigabit Ethernet ports by Intel® I210 GbE controller
PoE
IEEE 802.3at PoE+ on port #1 and #2
Video Port
1x DVI-I connector for both analog RGB and DVI outputs, supporting up
to 1920 x 1200 resolution
Serial Port
1x programmable RS-232/ 422/ 485 port (COM1)
3x 3-wire RS-232 ports (COM2/ 3/ 4) or 1x RS-422/ 485 port (COM2)
USB
2x USB 3.0 ports
2x USB 2.0 ports
Audio
1x speaker-out
1x microphone-in
Internal I/O Interface
Mini-PCIe
1x full-size mini PCI Express slot with USIM socket
Storage Interface
mSATA
1x half-size mSATA port
Power Supply
DC Input
Built-in 8~35 VDC DC input
Input
Connector
3-pin pluggable terminal block for DC input
Max. Power
consumption
14.16W (0.59A@24V)*
Mechanical
Dimension
56 x 108 x 153 mm
Weight
0.96 kg
Mounting
DIN-rail mount (Standard)
Wall-mount (Optional)
Environmental
Operating
Temperature
-25°C ~ 70°C with SSD, 100% CPU loading */**
Storage
Temperature
-40°C ~85°C

POC-300 Series
17
Humidity
10%~90% , non-condensing
Vibration
Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to
IEC60068-2-64)
IEC 60068-2-64
)
Shock
Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to
IEC60068-2-27)
)
EMC
CE/FCC Class A, according to EN 55022 & EN 55024
* The 100% CPU/GPU loading for high temperature test is applied using Passmark®
BurnInTest™v8.0. For detail testing criteria, please contact Neousys Technology
** For sub-zero operating temperature, a wide temperature HDD drive or Solid State Disk
(SSD) is required.

POC-300 Series
18
1.4 Specification of POC-330
System Core
Processor
Intel® Pentium® N4200 1.1/ 2.5GHz quad-core processor
Graphics
Integrated Intel® HD Graphics 505
Memory
1x SODIMM socket for DDR3L-1866, up to 8GB
Panel I/O Interface
Ethernet
3x Gigabit Ethernet ports by Intel® I210 GbE controller
Video Port
1x DVI-I connector for both analog RGB and DVI outputs, supporting up
to 1920 x 1200 resolution
Serial Port
1x programmable RS-232/ 422/ 485 port (COM1)
3x 3-wire RS-232 ports (COM2/ 3/ 4) or 1x RS-422/ 485 port (COM2)
USB
2x USB 3.0 ports
2x USB 2.0 ports
Audio
1x speaker-out
1x microphone-in
Internal I/O Interface
Mini-PCIe
1x full-size mini PCI Express slot with USIM socket
Storage Interface
mSATA
1x half-size mSATA port
Power Supply
DC Input
Built-in 8~35 VDC DC input
Input
Connector
3-pin pluggable terminal block for DC input
Max. Power
consumption
14.16W (0.59A@24V)*
Mechanical
Dimension
56 x 108 x 153 mm
Weight
0.96 kg
Mounting
DIN-rail mount (Standard)
Wall-mount (Optional)
Environmental
Operating
Temperature
-25°C ~ 70°C with SSD, 100% CPU loading */**
Storage
Temperature
-40°C ~85°C
Humidity
10%~90% , non-condensing

POC-300 Series
19
Vibration
Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to
IEC60068-2-64)
IEC 60068-2-64
)
Shock
Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to
IEC60068-2-27)
)
EMC
CE/FCC Class A, according to EN 55022 & EN 55024
* The 100% CPU/GPU loading for high temperature test is applied using Passmark®
BurnInTest™v8.0. For detail testing criteria, please contact Neousys Technology
** For sub-zero operating temperature, a wide temperature HDD drive or Solid State Disk
(SSD) is required.

POC-300 Series
20
1.5 Dimension
1.5.1 Superior View
NOTE
All measurements are in millimeters (mm).