NXP Semiconductors UM11620 User manual

UM11620
FRDMGD3160XM3EVM half-bridge evaluation board
Rev. 1 — 10 June 2021 User guide
Document information
Information Content
Keywords gate driver, half-bridge, evaluation board, XM3, GD3160
Abstract The FRDMGD3160XM3EVM is a functional power module half-bridge kit.
This kit can be used as a foundation on which to develop and analyze the
GD3160 gate driver for ASIL D compliant high voltage, high-power traction
motor inverter for electric vehicle applications. This manual is a guide for
describing the various features in using the kit.

NXP Semiconductors UM11620
FRDMGD3160XM3EVM half-bridge evaluation board
Revision Date Description
1 20210610 initial version
Revision history
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1 Important notice
NXP provides the enclosed product(s) under the following conditions:
This evaluation kit is intended for use of ENGINEERING DEVELOPMENT OR
EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a printed
circuit board to make it easier to access inputs, outputs, and supply terminals. This
evaluation board may be used with any development system or other source of I/O
signals by simply connecting it to the host MCU or computer board via off-the-shelf
cables. This evaluation board is not a Reference Design and is not intended to represent
a final design recommendation for any particular application. Final device in an
application will be heavily dependent on proper printed circuit board layout and heat
sinking design as well as attention to supply filtering, transient suppression, and I/O
signal quality.
The goods provided may not be complete in terms of required design, marketing, and
or manufacturing related protective considerations, including product safety measures
typically found in the end product incorporating the goods. Due to the open construction
of the product, it is the user's responsibility to take any and all appropriate precautions
with regard to electrostatic discharge. In order to minimize risks associated with the
customers applications, adequate design and operating safeguards must be provided
by the customer to minimize inherent or procedural hazards. For any safety concerns,
contact NXP sales and technical support services.
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2 FRDMGD3160XM3EVM
Figure 1. FRDMGD3160XM3EVM
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3 Getting started
The NXP analog product development boards provide an easy-to-use platform for
evaluating NXP products. The boards support a range of analog, mixed-signal, and
power solutions. They incorporate monolithic integrated circuits and system-in-package
devices that use proven high-volume technology. NXP products offer longer battery life, a
smaller form factor, reduced component counts, lower cost, and improved performance in
powering state-of-the-art systems.
The tool summary page for FRDMGD3160XM3EVM is at http://www.nxp.com/
FRDMGD3160XM3EVM. The overview tab provides an overview of the device, product
features, a description of the kit contents, a list of (and links to) supported devices, a list
of (and links to) any related products, and a Get Started section.
The Get Started section provides links to everything needed to start using the
device and contains the most relevant, current information applicable to the
FRDMGD3160XM3EVM.
1. Go to http://www.nxp.com/FRDMGD3160XM3EVM.
2. On the Overview tab, locate the Jump To navigation feature on the left side of the
window.
3. Select the Get Started link, review each entry, and download an entry by clicking the
title.
4. After reviewing the Overview tab, visit the other product-related tabs for additional
information:
• Documentation: download current documentation
• Software & Tools: download current hardware and software tools
• Buy/Parametrics: purchase the product and view the product parametrics
After downloading files, review each file, including the user guide, which includes setup
instructions. If applicable, the bill of materials (BOM) and supporting schematics are also
available for download in the Get Started section of the Overview tab.
3.1 Kit contents/packing list
The FRDMGD3160XM3EVM kit contents include:
•Assembled and tested FRDMGD3160XM3EVM board in an anti-static bag
•3.3 V to 5.0 V translator board (KITGD3160TREVB) connected to FRDM-KL25Z
•USB cable, type A male/type mini B male, 3 ft
•Quick start guide
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3.2 Required equipment
To use this kit, you need:
•Compatible XM3 SiC MOSFET module (CAB450M12XM3)
•DC link capacitor compatible with the XM3 module
•30 µH to 50 µH, high current air core inductor for double pulse testing
•HV power supply with protection shield and hearing protection
•25 V, 1.0 A DC power supply
•500 MHz 2.5 GS/s 4-channel oscilloscope
•Rogowski current probe or shunt resistor for measuring source current
•Isolated high-voltage and low-voltage differential probes
•Digital voltmeter
3.3 System requirements
The kit requires the following to function properly with the software:
•Windows 8 or higher operating system
4 Getting to know the hardware
4.1 Overview
The FRDMGD3160XM3EVM is a half-bridge evaluation kit populated with two GD3160
single channel gate drive devices. The kit includes the Freedom KL25Z microcontroller
hardware for interfacing a PC installed with FlexGUI software for communication to the
serial peripheral interface (SPI) registers on the GD3160 gate drive devices in either
daisy chain or standalone configuration.
The KITGD3160TREVB translator board is used to translate 3.3 V signals to 5.0 V
signals between the MCU and GD3160 gate drivers. The evaluation kit can be connected
to a compatible insulated gate bipolar transistor (IGBT) or SiC module for half-bridge
evaluations and applications development.
4.2 Board features
•Capability to connect to CAB450M12XM3 form factor module for half-bridge
evaluations
•Negative VEE gate low drive level (−3.7 V DC)
•VCCREG regulated high gate drive level (+15 V to +21 V DC programmable)
•Jumper configurable for disabling dead time fault protection when short-circuit testing
•Easy access power, ground, and signal test points
•Easy to install and use FlexGUI for interfacing via SPI through PC; software includes
double pulse and short-circuit testing capability
•DC link bus voltage monitor on low-side driver via AMUXIN and AOUT
•Negative temperature coefficient (NTC) connection and configurable for monitoring
module temperature
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4.3 Device features
Device Description Features
GD3160 The GD3160 is an
advanced single
channel gate driver for
IGBT and SiC.
•Compatible with current sense and temp sense
IGBTs
•DESAT detection capability for detecting VCE
desaturation condition
•Fast short-circuit protection for IGBTs with current
sense feedback
•Compliant with automotive safety integrity level
(ASIL) C/D ISO 26262 functional safety requirements
•SPI interface for safety monitoring, programmability,
and flexibility
•Integrated galvanic signal isolation
•Integrated gate drive power stage capable of 15 A
peak source and sink
•Interrupt pin for fast response to faults
•Compatible with negative gate supply
•Compatible with 200 V to 1700 V IGBT and SiC
MOSFET, power range > 125 kW
Table 1. Device features
4.4 Board description
The FRDMGD3160XM3EVM is a half-bridge evaluation board populated with two
GD3160 single channel IGBT or SiC gate drive devices. The board supports connection
to an FRDM-KL25Z microcontroller for SPI communication configuration programming
and monitoring. The board includes DESAT circuitry for short-circuit detection and
implementation of GD3160 shutdown protection capabilities.
The evaluation board is designed to connect to an XM3 module for evaluation of the
GD3160 performance and capabilities.
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Figure 2. Connecting FRDM-KL25Z, GD31xx half-bridge EVB and translator board
4.4.1 Low-voltage logic and control connector
Low-voltage domain is 15 V VSUP domain that interfaces with the MCU and GD3160
control registers through the 24-pin connector interface.
Low-side driver and high-side driver domains are driver control interfaces to XM3 SiC
module single phase connections and test points.
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Figure 3. Evaluation board voltage and interface domains
Pin Name Function
1 AOUTL analog output duty cycle encoded signal (low side) for reading temperature via
TSENSEA or voltage via AMUXIN
2 n.c. not connected
3 CSBL chip select bar (low side)
4 n.c. not connected
5 PWML pulse width modulation (PWM) input (low side)
6 INTBL interrupt bar (low side)
7 MOSIL master out slave in (low side)
8 SCLK serial clock input
9 MISOL master in slave out (low side)
10 EN_PS MCU control of flyback power supply
11 FSSTATEL fail-safe state (low side)
12 GND ground
13 FSENB fail-safe enable (high side and low side)
14 MISOH master in slave out (high side)
Table 2. Low-voltage domain 24-pin connector definitions
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Pin Name Function
15 INTAL fault reporting and real time VCE and VGE monitoring (low side)
16 MOSIH master out slave in (high side)
17 INTAH fault reporting and real time VCE and VGE monitoring (high side)
18 CSBH chip select bar (high side)
19 LED_PWR USB 3.3 V power for INTB LEDs (high side and low side)
20 AOUTH duty cycle encoded signal (high side)
21 PWMH PWM input (high side)
22 FSSTATEH fail-safe state (high side)
23 GND ground
24 INTBH interrupt bar (high side)
Table 2. Low-voltage domain 24-pin connector definitions...continued
4.4.2 Test point definitions
All test points are clearly marked on the evaluation board. Figure 4 shows the location of
various test points.
Figure 4. Key test point locations
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Test point Definition
Low-voltage domain
VSUP DC voltage source connection point for VSUP power input of GD3160 devices. Typically supplied by vehicle
battery +15 V DC.
GND grounding points for low-voltage domain
INTAH fault monitor and VCE/VGE monitor high-side test point
INTBL interrupt bar low-side test point
INTAL fault monitor and VCE/VGE monitor low-side test point
INTBH interrupt bar high-side test point
Low-side driver domain
GNDL low-side domain ground point
VCCL positive voltage supply test point for isolated circuitry and low-side driver domain
VRFL 5.0 V reference test point for isolated analog circuitry on low-side driver
TSNSL temperature sense connection low-side test point
GL module gate test point on low-side driver domain which is the charging pin of gate; including MMCX probe
connection
FSISOL high-voltage domain fail-safe low-side test point
DSTL VCE desaturation test point connected to low-side driver DESAT pin and circuitry
VCCREGL VCC regulator low-side test point
VEEL negative voltage supply test point for low-side driver gate of IGBT or SiC module
CLMPL active clamping low-side test point
VDC DC link voltage test point at voltage divider
COLL collector test point/connection terminal on low side
High-side driver domain
VCCH positive voltage supply test point for isolated circuitry and high-side driver domain
GNDH high-side domain ground point
COLH collector test point/connection high side
TSENSEH temperature sense connection high-side test point
VCCREGH VCC regulator high-side test point
VRFH 5.0 V reference test point for isolated analog circuitry on high-side driver
FSISOH high-voltage domain fail-safe high-side test point
GH module gate test point on high-side driver domain which is the charging pin of gate; including MMCX probe
connection
CLMPH active clamping high-side test point
DSTH VCE desaturation test point connected to high-side driver DESAT pin and circuitry
VEEH negative voltage supply test point for high-side driver gate of IGBT or SiC module
AMXH analog MUX input test point for high-side driver
Table 3. Test point definitions
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4.4.3 Power supply and jumper configuration
Figure 5. Power supply and jumper configuration
Jumper Position Function
1-2 dead time fault protection enabled (low side)PWMALTL (J9)
2-3 dead time fault protection disabled (use for short-circuit testing)
1-2 dead time fault protection enabled (high side)PWMALTH (J10)
2-3 dead time fault protection disabled (use for short-circuit testing)
open VCCREG controls gate voltageVCCH and VCCL
(R25 and R46) closed VCC and VCCREG are tied together
open internally regulated supply derived from VSUPVDDH and VDDL
(R28 and R47) closed VSUP = VDD for 5 V or 3.3 V operation depending on the part number
1-2 chip select for normal operationCSB (J17)
2-3 chip select for daisy chain operation
closed normal operationMOSI (J19)
open daisy chain operation
1-2 normal operationMISO (J21)
2-3 daisy chain operation
Table 4. Jumper definitions
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4.4.4 Bottom view
Figure 6. Evaluation board power module connections
Connection socket Description
NTC NTC connection to module for monitoring temperature
V+ high-side drain connection
G1 high-side gate connection
G2 low-side gate connection
Table 5. Power module connections
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4.4.5 Gate drive resistors
•RGH - gate high resistor in series with the GH pin at the output of the GD3160 gate
high driver and XM3 module gate that controls the turn-on current for SiC MOSFET
gate.
•RGL - gate low resistor in series with the GL pin at the output of the GD3160 gate low
driver and XM3 module gate that controls the turn-off current for SiC MOSFET gate.
•RAMC - series resistor between XM3 module gate and AMC input pin of the GD3160
driver for gate sensing and active Miller clamping.
Figure 7. Gate drive resistors
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4.4.6 LED interrupt indicators
Figure 8. LED interrupt indicators
LED Description
Low-side INTB connected to the INTB output pin of low-side driver indicating reported
fault status when on (active LOW)
High-side INTB connected to the INTB interrupt output pin of high-side driver indicating
reported fault status when on (active LOW)
Low-voltage power indicator for low-voltage power supply on
Table 6. LED interrupt indicators
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4.5 Kinetis KL25Z Freedom board
The Freedom KL25Z is an ultra low-cost development platform for Kinetis L series MCU
built on Arm Cortex-M0+ processor.
Figure 9. Freedom development platform
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4.6 3.3 V to 5.0 V translator board
KITGD3160TREVB translator enables level shifting of signals from MCU 3.3 V to 5.0 V
SPI communication.
Figure 10. Translator board
Jumper Position Function
1-2 selects 5.0 V for 5.0 V compatible gate driveVCCSEL (J3)
2-3 selects 3.3 V for 3.3 V compatible gate drive
1-2 selects PWM high-side control from KL25Z MCUPWMH_SEL (J4)
2-3 selects PWM high-side control from fiber optic receiver inputs
1-2 selects PWM low-side control from KL25Z MCUPWML_SEL (J5)
2-3 selects PWM low-side control from fiber optic receiver inputs
Table 7. Translator board jumper definitions
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5 Configuring the hardware
FRDMGD3160XM3EVM is connected to compatible SiC MOSFET XM3 module; see
Figure 11. Double pulse and short-circuit testing can be conducted utilizing Windows
based PC with FlexGUI software.
Suggested equipment needed for test:
•Rogowski coil high-current probe
•High-voltage differential voltage probe
•High sample rate digital oscilloscope with probes
•DC link capacitor compatible with XM3 module
•IGBT or SiC MOSFET XM3 module
•Windows based PC
•High-voltage DC power supply for DC link voltage
•Low-voltage DC power supply for VSUP
–+15 V DC gate drive board low-voltage domain
•Voltmeter for monitoring high-voltage DC link supply
•Load coil for double pulse and short-circuit testing
DC link capacitor assembly not shown
Figure 11. Evaluation board and system setup
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Figure 12. XM3 module dimensions
6 Installation and use of software tools
Software for FRDMGD3160XM3EVM is distributed with the FlexGUI tool (available on
NXP.com). Necessary firmware comes pre-installed on the FRDM-KL25Z with the kit.
Even if the user intends to test with other software or PWM, it is recommended to install
this software as a backup or to help debugging.
6.1 Installing FlexGUI on your computer
The latest version of FlexGUI supports the GD3100 and GD3160. It is designed to run on
any Windows 10 or Windows 8 based operating system. To install the software, do the
following:
1. Go to www.nxp.com/FlexGUI and click Download.
2. When the FlexGUI software page appears, click Download and select the version
associated with your PC operating system.
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3. FlexGUI wizard creates a shortcut, an NXP FlexGUI icon appears on the desktop. By
default, the FlexGUI executable file is installed at C:\flexgui-app-des-gd31xx.exe.
Installing the device drivers overwrites any previous FlexGUI installation and replaces
it with a current version containing the GD31xx drivers. However, configuration files
(.spi) from the previous version remain intact.
6.2 Configuring the FRDM-KL25Z microcode
Figure 13. FRDM-KL25Z setup and interface
By default, the FRDM-KL25Z delivered with this kit is preprogrammed with the current
and most up-to-date firmware available for the kit.
A way to check quickly that the microcode is programmed and the board is functioning
properly, is to plug the KL25Z into the computer, open FlexGUI, and verify that the
software version at the bottom is 6.4 or later (see Figure 14).
If a loss of functionality following a board reset, reprogramming, or a corrupted data
issue, the microcode may be rewritten per the following steps:
1. To clear the memory and place the board in boot loader mode, hold down the reset
button while plugging a USB cable into the OpenSDA USB port.
2. Verify that the board appears as a BOOTLOADER device and continue with step 3. If
the board appears as KL25Z, you may go to step 6.
3. Download the Firmware Apps .zip archive from the PEmicro OpenSDA webpage
(http://www.pemicro.com/opensda/). Validate your email address to access the files.
4. Find the most recent MDS-DEBUG-FRDM-KL25Z_Pemicro_v118.SDA and
copy/drag-and-drop into the BOOTLOADER device.
5. Reboot the board by unplugging and replugging the connection to the OpenSDA port.
Verify now that the device appears as a KL25Z device to continue.
6. Locate the most recent KL25Z firmware; which is distributed as part of the FlexGUI
package.
a. From the FlexGUI install directory, which is located in the
flexgui-app-des-gd31xx\bin folder and is named in the form
“flexgui-fw-KL25Z_usb_hid_gd31xxC_vx.x.x.bin”.
b. This .bin file is a product/family-specific configuration file for FRDM-KL25Z
containing the pin definitions, SPI/PWM generation code, and pin mapping
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