NXP Semiconductors UM10569 User manual

UM10569
Store and transport requirements
Rev. 3.00 — 9 March 2015 User manual
Document information
Info Content
Keywords Storage, transport, shelf life, dry-baking, drying, dry-packing
Abstract This document describes the store and transport requirements of final
commercial and semi-finished products of NXP Semiconductors

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Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
NXP Semiconductors UM10569
Store and transport requirements
Revision history
Rev Date Description
v.3 20150309 third, enhanced revision
v.2 20140124 second revision
v.1 20120625 new user manual, first revision

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Store and transport requirements
1. Introduction
This specification describes the technical conditions of shelf life and transport of final
commercial and semi-finished products of NXP Semiconductors. Other aspects like sales,
warranty, legal and commercial issues are regulated by NXP’s “Terms and Conditions of
commercial Sale“, see Ref. 7 on page 13.
2. Objectives
It is essential that the quality of products entering store areas is maintained and that the
products are easily identified. The quality of stored products must not deteriorate by
additional handling while in store.
Transport conditions must be such that the quality and reliability of the product and its
packing shall not be harmed in any way.
3. Definitions
Bake to seal time — The maximum time after bake that components may be exposed to
ambient conditions prior to being sealed in MBBs.
Desiccant — An absorbent material used to maintain a low relative humidity.
ESD — ElectroStatic Discharge
FFC — Film Frame Carrier
Floor life — The permissible time period between removing the MBB and soldering.
HIC — Humidity Indicator Card.
IC — Integrated Circuit
MBB — Moisture Barrier Bag.
MSL — Moisture Sensitivity Level
PQ-box — The box for containing and protecting the prescribed Packing Quantity of final
product (also called Inner Box).
RH — Relative Humidity
Shelf life — The possible storage life before the product is used.
SMD — Surface-Mount Device
Transport — In this standard, transport includes the whole path and temporary storage
from the sending warehouse to the receiving point, which can be a warehouse or the
customer.
4. General conditions
Products have to be packed in a way that ensures protection against mechanical,
environmental and electrical influences during transport and storage.
Store and transport conditions should be such that the integrity of the product and its
packing are not harmed in any way.

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NXP Semiconductors UM10569
Store and transport requirements
5. Receiving inspection
Dry-packed packages should be inspected for a bag seal date on the caution or bar code
label to determine remaining shelf life. The bags should be inspected to verify that there
are no holes, gouges, tears, punctures, or openings of any kind that would expose either
the contents or an inner layer of a multilayer bag. If openings are found and the humidity
indicator card (HIC) indicates that the maximum humidity has been exceeded, then the
parts should be baked using the bake times of Table 3 or Table 4. This resets the floor life
if the parts to be used and shelf life if the parts are to be dry-packed.
6. Store conditions
Secure and clean store areas shall be provided to isolate and protect the products.
Conditions in the store areas shall be such that the quality of the products does not
deteriorate due to, among others, harmful gasses or electrical fields.
The following conditions have to be taken into account:
•Temperature
–Min. +8 C
–Max. +45 C
•Humidity
–Min. 25 %
–Max 75 %
–No condensation under any condition is allowed.
•Light intensity
–No direct sun light
7. Transport conditions
In the case of transporting, the following conditions have to be observed.
7.1 General transport conditions
During transport the packing and the products should be protected against extreme
temperatures, humidity and mechanical forces.
The following conditions have to be taken into account:
•Temperature
–Min. +8 C
–Max. +60 C
(Higher temperature causes a serious risk of deformation of the packing material
and lower temperature the risk of condensation within the package).
–In tropical conditions, the packing shall not be placed in direct sunlight.
•Humidity

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Store and transport requirements
–Direct contact of packing boxes with water is prohibited.
•Mechanical forces
–Transport must be done in such a way that the PQ-boxes are not deformed and
forces are not directly passed on to PQ-boxes.
•Time
–The total transport time should be as short as possible. When transport time
exceeds 5 days the transport conditions shall be the same as store conditions, or
the products have to be sealed with inclusion of a dry-agent.
7.2 Conditioned air transport
Air transport is possible with conditioned cargo rooms. This conditional air transport is
advised for all products, but mandatory for air transport of products in sealed bags, like dry
pack.
•Temperature
–Min. +8 C
–Max. +45 C
•Humidity
–Avg. 16 %
•Air pressure
–Min. 700 mbar
–Max. 1060 mbar
8. Shelf life conditions
8.1 Packed end products
The shelf life for packed end products is 4 years after the date code. This includes
encapsulated products in standard packing, encapsulated products in dry pack.
For products in dry pack, the dry conditions are guaranteed for one year (this is not shelf
life, see above). When the HIC shows a relative humidity of higher than 10 %, the
products have to be baked before use (see Section 10).
8.2 Wafers and bare die
Wafers and bare die have to be packed in dry pack, or stored under the following
conditions:
•Inert gas
•Dry air or dry nitrogen
•No sources of corrosive material such as halogenic contamination
•Temperature 18 C to 24 C
The shelf life for wafers or bare die is 3 years (excluding wafers with Au/Ge backside and
assuming condition of <60 % relative humidity) after diffusion process end (Fab. date
code).

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Store and transport requirements
The shelf life for products on FFC (Film Frame Carrier) is 6 months due to the FFC
material.
8.2.1 Maximum shelf life versus humidity
Parts of bare wafers and bare die products that are sensitive for aging are aluminum and
backside metal surfaces (e.g. Ti, Ni, Ag or AuGe). Shelf life of wafers and bare die with a
combination of given bond and back side material at different humidity levels are given in
Table 1.
[1] RH % should be monitored or evidence (humidity indicator card) should be available that RH % requirement was really met during the
storage period.
[2] The life time at such low humidity is limited only by the amount of desiccant added and the integrity of the MBB over time.
The shelf life time of bare wafer and bare die products is determined by the halogen (F, Cl,
Br) contamination level in the product environment and the humidity which affect the
degradation of aluminum bond pads. At low humidity, the halogen contamination has no
aging effect, but at higher humidity, the halogens become volatile.
Humidity is the most important aging factor in the aging of wafers with backside metal.
Additionally, gold contamination on Ti/Ni/Ag backside metal surface accelerates the aging
process.
Silver surfaces are very sensitive for sulphur contamination. MBB will be a barrier for
airborne sulphur contamination and therefore wafers packed in a sealed MBB are safe.
Table 1. Shelf life of wafers and bare die
The indicated humidity levels in the table should not be exceeded.
Relative humidity[1] Bond pad material Back side Technical shelf life
< 10 % all types all types > 15 years[2]
< 30 % all types all types 6 years
< 50 % Al all types (not AuGe) 4 years
< 50 % all types AuGe 1 year
< 60 % Al all types (not AuGe) 3 years
< 60 % Ag Ag 4 years
< 60 % Au AuAs > 15 years[2]
< 80 % Al all types 0.1 years

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Store and transport requirements
9. Floor life and bake to seal time
The floor life starts with opening the MBB. The floor life and the bake to seal time of IC
products are dependent on the MSL (see Table 2). If the bake to seal time is exceeded,
the products must be baked again.
[1] Products with MSL1 are not dry packed.
[2] Wafers and bare die are rated as MSL 1. They do not require baking but require dry packing to avoid
oxidation.
[3] Products that are moisture sensitive (MSL 2 through MSL 6) shall be baked prior dry-packed.
[4] Products of MSL 6 must be baked before use within 6 hours at the customer.
If partial lots are used, the remaining products must be resealed or placed in safe storage
within 1 hour of bag opening. If the bag opening time or the floor life has expired or an
excess moisture exposure happened, the products have to be backed prior dry-packing.
For information about storing in a dry atmosphere cabinet or a dry cabinet, see Ref. 4
“IPC/JEDEC J-STD-033C”.
10. Dry-baking and drying
Before sealing product devices in MBBs, the products must be dry. This can be done by
dry-baking or drying.
10.1 Dry-baking
Dry-bake conditions are:
•Bake temperature: +125 C + 0 C/5 C
•Bake time, see Table 3
–Packages, not mentioned in this table, are baked 5 times the package thickness
(in mm), see Table 4 and Ref. 4 “IPC/JEDEC J-STD-033C”
–The x’s in a package name in Table 3 cover all versions except specifically
mentioned versions
Table 2. Moisture Classification Level, floor life, and bake to seal time
Moisture Sensitivity
Level (MSL)
Ambient conditions Floor life (out of
bag time)
Bake to seal time
Temperature RH
1[1][2] 30 C90 % no limit no limit
2[3] 60 % 1 year 7 days
2a [3] 4 weeks
3[3] 168 hours 24 hours
4[3] 72 hours
5[3] 48 hours
5a [3] 24 hours
6[4] 6 hours no limit

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Store and transport requirements
Remark: Baking deteriorates the solderability; do not bake for longer and not more often
than required.
Table 3. Dry-bake time per package type
Bake temperature +125 C + 0 C/5 C.
Package family Dry-bake time in hours
SO 8
SSOP, HSOP, VSO 10
TSSOP, HTSSOP 5
HBCC 5
xxQFP packages 12
LQFP, HLQFP, TQFP, HTQFP 8
PLCC, HSSON 12
xxBGA packages, <40 40 mm210
xxBGA packages, 40 40 mm215
TFBGA, LBGA, LFBGA 5
HVQFN, HVSON 5
SOJ 24

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Store and transport requirements
10.2 Drying
Products, packed in tubes or tapes cannot be baked at 125 C and therefore must be
dried at lower temperatures, see Ref. 4 “IPC/JEDEC J-STD-033C”.
Table 4. Reference conditions for drying mounted or unmounted SMD packages according to Ref. 4 “IPC/JEDEC
J-STD-033C”
Package body MSL Bake at
+125 C + 10 C/0 C +90 C + 8 C/0 C
5 % RH
+40 C + 5 C/0 C
5 % RH
Exceeding floor life by
>72 hours 72 hours >72 hours 72 hours >72 hours 72 hours
Thickness 1.4 mm 2 5 hours 3 hours 17 hours 11 hours 8 days 5 days
2a 7 hours 5 hours 23 hours 13 hours 9 days 7 days
3 9 hours 7 hours 33 hours 23 hours 13 days 9 days
4 11 hours 7 hours 37 hours 23 hours 15 days 9 days
5 12 hours 7 hours 41 hours 24 hours 17 days 10 days
5a 16 hours 10 hours 54 hours 24 hours 22 days 10 days
Thickness >1.4 mm
2.0 mm
2 18 hours 15 hours 63 hours 2 days 25 days 20 days
2a 21 hours 16 hours 3 days 2 days 29 days 22 days
3 27 hours 17 hours 4 days 2 days 37 days 23 days
4 34 hours 20 hours 5 days 3 days 47 days 28 days
5 40 hours 25 hours 6 days 4 days 57 days 35 days
5a 2 days 40 hours 8 days 6 days 79 days 56 days
Thickness >2.0 mm
4.5 mm
2 2 days 2 days 10 days 7 days 79 days 67 days
2a 2 days 2 days 10 days 7 days 79 days 67 days
3 2 days 2 days 10 days 8 days 79 days 67 days
4 2 days 2 days 10 days 10 days 79 days 67 days
5 2 days 2 days 10 days 10 days 79 days 67 days
5a 2 days 2 days 10 days 10 days 79 days 67 days
BGA package
>17 mm 17 mm
or any stacked die
package
2 to 5a 96 hours as above per
package
thickness and
moisture level
not applicable as above per
package
thickness and
moisture level
not applicable as above per
package
thickness and
moisture level

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Store and transport requirements
11. Dry-packing
11.1 Material requirements
Moisture absorbing packing materials that are used in the MBB (e.g. the cardboard guard
band for reels and the Humidity Indicator or HIC), shall be dry, before packing in the
moisture barrier bag. Moisture absorbing packing material should therefore be kept dry in
a drying box or an oven, with sufficient capacity to store (and dry) the required packing
material for at least 24 hours, before use.
Remark: Exposure of the desiccant, HIC and paper guard band to the environment shall
be for no more than 5 minutes, before packing and sealing the MBB.
11.1.1 Desiccant requirements
•The desiccant must meet Ref. 5 “MIL-D-3464E”, Type II. The desiccant shall be
dustless, noncorrosive, and absorbent to the amounts specified in the standard.
•The desiccant capacity at 10 % RH and 25 C per unit shall be ≥2.5 grams. The
desiccant capacity at 10 % RH and 25 C per unit shall be provided by desiccant
supplier.
•If desiccant capacity is <2.5 grams, then desiccant amounts shown in Table 5 and
Table 6 must be recalculated, see Ref. 4 “IPC/JEDEC J-STD-033C”.
•The desiccant type shall be bentonite clay.
•The desiccant bag shall be moisture permeable Tyvek.
•Desiccant is typically supplied in packs containing two units but this is not a
requirement and different size desiccant packs can be used.
The desiccant shall be stored in closed containers as received. After taking out the
required quantity of desiccant, the container shall be closed immediately. A humidity
indicator with a 5 % RH measuring spot shall be used in the desiccant container to check
the humidity. Once this spot is showing another color than is specified for “dry”, the
desiccant shall be reactivated (baked) first, in an oven according to suppliers
recommendation before using. Desiccants made of so-called Molecular Sieve, cannot be
reactivated.
Table 5. Desiccant requirement for wafer pack
MBB size (cm) Typical wafer size (mm) Total units of desiccant required
30 37 10 5
36 38 125 5
40 48.3 125; 150 7
50.5 77.5 200 12
76 82 300 19