Panasonic HL-D3 Series User manual

High Speed, Multi-Point Laser
Displacement Sensor
HL-D3 Series
User's Manual
ME-HLD3-12
2017.5 panasonic.net/id/pidsx/global

Preface
Thank you for purchasing High-Speed, Multi-Point Laser Displacement Sensor
“HL-D3 Series”.
To fully use this product safely and properly, please read this manual carefully.
Please check our website（http://panasonic.net/id/pidsx/global）about new info
of the product and new version of the user’s manual.
■Note
1. Please notice that illustrations in this USER’S MANUAL might be little different
from the actual product.
2. Contents of this USER’S MANUAL will be changed without notice due to
improvements.
3. This USER’S MANUAL and software must not be partially or totally copied or
reprinted.
4. If there are any questions, mistakes, paging disorder, or missing pages in this
USER’S MANUAL, please contact our sales office nearest you.
5. We have no responsibility of any results of operations regardless of the above.
■Symbol Indications
This USER’S MANUAL uses symbols to indicate safety precautions, instructions,
and reference.
Before reading this USER’S MANUAL, fully understand the meanings of these
indications.
“WARNING”indicates the possibility that death or
serious injury could result if a handling error occurs.
“CAUTION”indicates the possibility that the user could
be injured or property could be damaged if a handling
error occurs.
“CHECK”indicates any instructions or precautions for
using the system.
“REFERENCE”indicates any hints for operation, detail
explanations, or references.
“TECHNIQUE”indicates useful conditions or techniques
(know-how) for operation of the system.

Preface
1
Manual Construction
小型
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
Preface
Troubleshooting
Specification
Maintenance
and Service
External
com
munication
control
Explanation of
Functions
Description of
operation with
HL-D3SMI
I/O Terminal
Block
Before Use
This chapter provides cautions for safe and correct
operation of the product. Be sure to read this
chapter.
This chapter describes the timing chart for each
controller terminal and terminal behavior in hold
measurement.
This chapter explains control method of the system by
RS
-232C communication.
This chapter provides information on the
troubleshooting of the system.
Read this Chapter if
something seems to be wrong with the system.
This chapter describes the specifications of system
components
(controller and sensor head).
This chapter describes basic operation procedures of
the HL
-D3 series.
This chapter describes basic operation procedures of
the HL
-D3 series.
This chapter explains the maintenance and service of
the system.
This chapter explains the configuration, installation,
and connection of the system
(Controller, Sensor
Head, Setting Monitoring Tool
HL-D3SMI).
Apx
Appendix
This chapter provides index and revision history of this
manual.
Appendix

Preface
2
Contents
Manual Construction·······················1
Contents······································2
Safety Precautions························ 7
WARNING····································7
CAUTION ···································· 7
Correct Handling··························· 8
Installation Environment ··················8

Do not install the product in the following
conditions.
······································· 8
Use Environment ···························8

Ambient Temperature, Humidity and
Illuminance
····································· 8

Power Supply Voltage ······················ 9

Environment··································· 9
Protection Enclosure ······················9
Warming Up Time ························ 10
Measures to Noise······················· 10
Insulation Resistance and Voltage
Resistance································· 10
Power Supply ······························11

Power Supply ································11

Power Supply Sequence for
Controller ·····································11
Instantaneous Power Failure ···········11
Grounding·································· 12

Ground the device when noise
influence is large
····························12

Use an exclusive ground ·················12

Precautions for positive ground
environment··································12
Installation ································· 13

Controller ·····································13

Wire Connections and Connectors····13

Cable Extension·····························13
Cautions on Handling Laser Light····14
JIS/IEC/GB/KS···························· 14

Semiconductor laser is used as the light source
ofsensor··········································14
Cautions ········································14

Warning Label································15
CE ··········································· 16

CE Compliant Condition ··················16

Contact for CE ·······························17
FDA·········································· 18
■Export to US··································18
■Classification·································18
■Labeling ·······································19
■FDA Standard ································20
External Control of Laser Radiation·· 22
Export Control·····························23
1Before Use ······················· 1-1
1-1 Measurement Principle and
Precautions································1-2
1-1-1 Measurement Principle ·········· 1-2
1-1-2 Measurement Axis and Laser
Specification······························ 1-2
1-1-3 Measurement Range············· 1-3

Restrictions in Principle ················1-3
1-2 System Configuration··············1-4
1-2-1 System Configuration ············ 1-4
1-2-2 System Components & Accessories
List·········································· 1-5

Controller Accessories ··················1-5

Sensor Head Accessories ··············1-6

Extension Cable for Sensor Head
(Optional) ····································1-6
1-3 Part Names and Functions ·······1-7
1-3-1 Controller ··························· 1-7
1-3-2 Sensor Head ······················· 1-8
1-4 Installation Method ·················1-9
1-4-1 Controller ··························· 1-9

Installation by Using DIN Rail ·········1-9
1-4-2 Sensor Head ······················1-10

Installation Direction of Sensor
Head········································· 1-10
1-5 Connection ······················· 1-12
1-5-1 Connection Method of Power
Supply·····································1-12
1-5-2 Connection Method of Terminal
Block ······································1-12

Model Number of Terminal Blocks · 1-13

Wiring Method···························· 1-13
1-5-3 Sensor Head Connection·······1-14
1-5-4 Connection of HL-D3SMI (PC) 1-14

Connections ······························ 1-14
1-5-5 Installation of HL-D3SMI ·······1-15
2I/O Terminal Block·············· 2-1
2-1 Functions and Arrangements of I/O
Terminal Block ····························2-2

Operation of Indicators··················2-3
2-2 I/O Circuit·····························2-4

Preface
3
2-3 Timing Chart··························2-5
2-3-1 Normal Measurement ············ 2-5
2-3-2 Peak/bottom Hold Measurement2-5
2-3-3 Peak-to-peak Hold Measurement
·············································· 2-6
2-3-4 Operation by External Input During
Measurement······························ 2-6
2-3-5 HL-D3SMI Operation During
Measurement····························2-12
3Description of operation with
HL-D3SMI··························· 3-1
3-1 Use Condition························3-2
3-2 HL-D3SMI·····························3-5
3-2-1 Overview···························· 3-5
3-2-2 Instruction for Installation ······· 3-5
3-2-3 Operating Environment·········· 3-6
3-2-4 HL-D3SMI Screen Configuration3-7
3-2-5 Basic Operation of HL-D3SMI·3-10

Connection with sensor for
communication ·························· 3-10

Start/stop of continuous
measurement ····························· 3-10

Loading value (LOAD) from sensor 3-11

Set value transmission/condition
change (SEND) for sensor·············3-11

Saving of set value in the sensor ·· 3-12

Initialization of set value in the
sensor ······································ 3-13
Acquisition of detected light intensity
image········································ 3-14
Enlargement display, movement and
overall view display in the detected
light intensity image and displacement
shape waveform plot chart ············· 3-15

Data display in the displacement
waveform plot chart ···················· 3-16

Calculation area designation in
OUT setting tab ·························· 3-17

Position designation in multi-select
displacement sensing mode········· 3-18
3-3 Basic Operation Procedure of
Sensor ···································3-19
3-3-1 First Measurement···············3-19
STEP1
Installation of HL-D3SMI······· 3-19
STEP2
First power supply··············· 3-19
STEP3
Position adjustment of sensor
head········································· 3-20
STEP4
Basic settings····················· 3-20
STEP5
Start measurement ·············· 3-21
STEP6
Initialize····························· 3-21
STEP7
Save settings······················ 3-21
STEP8
Measuring multi-select
displacement sensing ··················3-22
3-3-2 Setting Change and Measurement for
Workpiece and Application ··············3-23

If a workpiece does not have
sufficient light intensity in default
settings ·····································3-23

Frequent alarms occur due to
variation of light intensity in the
default settings···························3-23

When the measurement and
judgment cycle is long (When
faster overall measurement and
judgment than the default value are
desired) ·····································3-24

When faster measurement and
judgment for displacement at the
limited area are desired················3-24
4Description of Functions·······4-1
4-1 Features of HL-D3 Series ········4-2
4-1-1 Multi-zone Beam Control (MZBC)
··············································· 4-2
4-1-2 Various Types of Measurement
Mode ······································· 4-4
Multi-zone beam control (MZBC)
measurement mode························ 4-4
Whole-synchronizing measurement
mode (MZBC not allowed)················ 4-5
Constant pitch measurement mode
(MZBC allowed)····························· 4-5
Multi-Select Displacement Sensing
(MSDS) mode (MZBC allowed)·········· 4-6
4-1-3 Various Types of Acquisition Data
··············································· 4-8
Detected light intensity image··········· 4-8
Displacement shape waveform·········· 4-8
Shape waveform measurement value 4-11
4-2 Setting Items and Data Flow··· 4-12
4-2-1 Relation Between Setting Condition
and Sampling Cycle····················4-13
Relation between major measuring
conditions and sampling cycle··········4-16
4-3 Function List and Default Value
············································ 4-18
4-3-1 Function Classification··········4-18
4-3-2 Function List and Default Value
··············································4-19
4-3-3 Additional Function in Upgrading
··············································4-27
Ver1.0x→Ver1.1x (sensor head,
controller, SMI)·····························4-27

Preface
4
Ver1.1x→Ver1.2x (Controller, SMI) ··· 4-28
■Ver1.2x→Ver2.0x (Sensor head,
Controller , HL-D3SMI) ··················4-28
Ver2.01→Ver2.0x (Controller,
HL-D3SMI)··································4-29
■Ver2.02→Ver2.10 (Controller)··········4-29
Ver2.03→Ver2.10 (HL-D3SMI) ········ 4-29
4-4 Description of Each Function ··4-30
4-4-1 Main Screen and Function at
Start-up···································4-30
(1) Display on separate window··········· 4-31
(2) Controller operation ·····················4-31
(3) Controller connection status ··········4-32
(4) Sensor information ······················4-33
(5) Memory change ··························4-34
(6) Setting zone·······························4-35
(7) Menu········································ 4-36
4-4-2 Head Setting······················4-37
Head setting tab screen ·················4-37
Measurement mode selection··········4-37
Width (X) meas. rng. ·····················4-38
Height (Z) meas. rng. ····················4-38
Unit detection time························ 4-39
Sens. adjust. ······························· 4-39
Sensitivity ratio ···························· 4-39
Beam pwr ctrl cnt.························· 4-40
Measurement value extraction········· 4-41
X position correct. ························ 4-41
Height correct.·····························4-42
Slope correct.······························4-43
Moving average ···························4-47
Width smoothing ·························· 4-47
Point alarm delays························4-48
Mirror reflection coefficient ············· 4-48
Mask function······························4-49
Light intensity peak width limit·········4-53
4-4-3 Setting for Measurement Mode4-55
Setting tab screen for each mode····· 4-55
Items for multi-zone beam control
measurement mode ······················ 4-56
Items for constant pitch measurement
mode·········································4-57
Items for multi-select displacement
sensing mode ······························4-58
Item for X position correction settings4-59
Slope correction area (used in
non-multi-select displacement
sensing mode) ·····························4-61
Sending set value to sensor············4-61
4-4-4 OUT Setting·······················4-62
OUT setting tab screen (OUT1, OUT2,
OUT3)········································ 4-62
Target head selection ····················4-62
Hold measurement························ 4-63
Waveform calculation selection········ 4-64
Specification of calculation target area
················································ 4-67
Selection of calculation target area··· 4-68
Offset val.··································· 4-77
Hi judg. val. ································ 4-78
Low judg. val.······························ 4-78
Judgement hysteresis width············ 4-78
Filter ········································· 4-79
Sending set value to sensor············ 4-79
4-4-5 OUT-OUT calculation setting··4-80
OUT-OUT calculation setting tab
screen ······································· 4-80
OUT-OUT calculation setting tab
screen ······································· 4-80
4-4-6 Total judgment and Shape judgment
setting·····································4-82
Total judgment and Shape judgment
setting tab screen························· 4-82
Total judgment measurement ·········· 4-83
■Shape judgment measurement········· 4-85
■Setting of reference Z value ············ 4-88
■Setting of reference X position········· 4-89
■Setting of measurement position ······ 4-90
4-4-7 Common Setting ·················4-92
Common setting tab screen ············ 4-92
Continuous measurement trigger signal
source········································ 4-92
■Z-axis coordinate direction·············· 4-93
■Input terminal layout settings··········· 4-96
■Output terminal layout settings········· 4-97
Err. value rmvl lvl. ························ 4-98
Defect processing ························ 4-98
Judgement operation at measurement
value alram································· 4-99
Meas. alarm output delay cnt.················· 4-99
Output mode ······························4-100
Output OFF delay························4-100
4-4-8 HL-D3SMI System Settings·· 4-101
System setting window and function 4-101
Interpolation method ····················4-103
Graph display method ··················4-104
Set value list screen ····················4-104
4-4-9 Acquisition of Detected Light
Intensity Image and Shape Waveform
··········································· 4-105
How to use ································4-105
Detected light intensity image
acquisition windowand function·······4-105
Acquisition of detected light intensity
image ·······································4-107
Operation for acquisition of detected
light intensity image ·····················4-108
Display of acquisition image in each
measurement mode ·····················4-108
Display of shape waveform············4-110

Preface
5
File format································· 4-110
4-4-10 Display of Measurement Value
············································4-111
Measurement value window and
function ···································· 4-111
Display of shape waveform ···········4-113
Operation during measurement ······4-115
Calculation value display window···· 4-118
Multi-select position measurement value
window······································4-120
4-5 Buffering··························· 4-121
4-5-1 Description of Data Buffering 4-121
4-5-2 Data Buffering ·················· 4-122
Data buffering procedures················4-122
Buffering···································4-123
4-5-3 Buffering Display Window and
Function ································ 4-130
■ Buffering data save file format········4-133
4-5-4 Buffering Setting Screen and
Function ································ 4-134
Number of buffering measurements (Number
of accumulated data points) ·················4-135
Accumulation time of buffering data·4-136
Number of accumulatied data points
and data acquisition time from sensor4-136
4-6 Supplementary Explanation ·· 4-137
4-6-1 Unfixed Operation (Occurrence of
Alarm, etc.)······························ 4-137
4-6-2 When Alarm Continues ······· 4-138
4-6-3 Condition for Unfixed Output Data
··········································· 4-139
5External communication control 5-1
5-1 Communication Control by RS-232C
···············································5-2
5-1-1 Specifications······················ 5-2
Communication Specifications··········· 5-2
Pin Arrangement···························· 5-2
5-1-2 Connecting Example with External
Device······································ 5-3
5-1-3 Change Method of Communication
·············································· 5-4
5-1-4 Communication Procedure······ 5-4
Configure communication
specifications································ 5-4
5-1-5 Type and Format of Commands 5-5
Transmission/reception sequence ······ 5-5
Command Classification ·················· 5-6
Command Format ·························· 5-7
FORMAT
1
General······························ 5-7
FORMAT
2
For value setting ·················· 5-9
FORMAT
3
Slope correction··················5-11
FORMAT
4
Measurement of measuring
cycle··········································5-12
FORMAT
5
Measurement of multi-select
displacement ·······························5-12
FORMAT
6
Waveform calculation
(general)·····································5-13
FORMAT
7
Waveform calculation
(Multi-select displacement sensing)···5-15
FORMAT
8
Calculation target area (area
range) ········································5-16
FORMAT
9
Output check······················5-18
FORMAT
10
Load of multi-select
displacement measurement data ······5-19
FORMAT
11
Load of shape waveform data 5-20
FORMAT
12
Buffering Setting ·················5-21
FORMAT
13
Load of buffering data
(normal)······································5-22
FORMAT
14
Load of buffering data (high
speed)········································5-23
FORMAT
15
For value setting 2···············5-24
FORMAT
16
For real number coefficients···5-25
FORMAT
17
OUT-OUT calculation (OUT4
and 5) ········································5-26
FORMAT
18
For shape judgment threshold
setting········································5-27
FORMAT
19
For shapejudgmentmeasurementposition
range setting
······································5-29
FORMAT
20
All output load ····················5-30
FORMAT
21
All output load ····················5-31
FORMAT
22
Buffering setting 2 ···············5-32
FORMAT
23
Load of buffering data 2
(normal)······································5-33
FORMAT
24
Load of buffering data 2 (high
speed)········································5-34
FORMAT
25
For total judgment (OUT6
setting)·······································5-35
Format of abnormal response ··········5-37
BCC ··········································5-37
5-1-6 Command List ····················5-38
5-1-7 Error Code List ···················5-55
6Maintenance and Inspection··6-1
6-1 Inspection·····························6-2

Major Inspection Items ·················· 6-2
6-2 Maintenance ·························6-2

Maintenance Instructions··············· 6-2

Cleaning of light emitter/receiver on
the front surface of sensor head····· 6-2

Cleaning of other components········ 6-2

Preface
6
7Troubleshooting··················7-1
7-1 Corrective Actions ··················7-2
7-2 Error Types ···························7-7
7-3 Initialization·························7-10
8Specifications·····················8-1
8-1 Controller Specifications ··········8-2
8-2 Sensor Head Specifications ······8-4
8-3 Dimension Diagram·················8-6
Controller (HL-D3C)························8-6
Sensor Head ·································8-7
8-4 Characteristics·······················8-8
Beam Diameter······························8-8
Mutual Interference Area··················8-9
Measurement Range Indicator·········8-10
Appendix······························· 1
1Index ······································· 2

Preface
7

Preface
7
Safety Precautions
WARNING
●This product is intended to detect the objects and does not have the
control function to ensure safety such as accident prevention.
●Do not use the product as a sensing device to protect human body.
●Please use the products that comply with local laws and standards for
human body protection specified by e.g., OSHA, ANSI and IEC.
●Install a fail-safe device when the product is used for the purpose that
has a possibility of physical injury or serious extended damage.
●Do not use the product in the atmosphere of flammable gas, to prevent
explosion.
CAUTION
●The product was developed and manufactured for industrial use.
●Use the product within specifications.
Abnormal heat or smoke generation may occur.
●Do not disassemble or remodel the product. Electrical shock or smoke
generation may occur.
●Connect the electric wire securely with the terminal screws.
Imperfect connection may cause abnormal heat or smoke generation.
●Do not touch the terminal during energization of the product, to prevent
electrical shock.
Cautions for handling CD-ROM
●Store the product away from direct sunlight, high temperature and high
humidity.
●Keep the both surfaces of CD-ROM free from fingerprints, dirt and
scratches.
●Protect the CD-ROM from liquids such as record cleaner, solvent, water
and oil.
●Do not use cracked, deformed or bonded disk.
●Keep the surfaces of CD-ROM free from writing letters, painting pictures
or putting stickers.
●Store the CD-ROM in the cover.
●Avoid putting something heavy onto the plastic cover. Do not drop it.
The cover may be damaged and injury may result.
●Do not play the CD-ROM in ordinary audio CD players, to prevent injury
of your ears or damage of the speaker.

Preface
8
Correct Handling
Note the following points when installing and using HL-D3 Series.
Installation Environment

Do not install the product in the following conditions.
• Where the ambient temperature, ambient humidity or ambient extraneous
light immunity at the light receiving face is beyond the range of
specifications
(Refer to “Use Environment”.)
• Where dew condensation occurs due to rapid temperature change
• In an atmosphere of corrosive gas or flammable gas
• Where covered or filled with dust, iron powder and salt
• In an atmosphere which is likely to be exposed to organic solvent such as
benzene, thinner or alcohol, or to strong alkaline materials such as ammonia
or sodium hydroxide
• Where heavy vibration or impact is applied
• Where direct sunlight is received
• Where water, oil or chemicals splashes
• Where load is applied to the product
Use Environment

Ambient Temperature, Humidity and Illuminance
Ambient temperature
・Use the product with the temperature specification ranges (Chapter 8
“Specifications”).
Sensor head : 0 to 45°C
Controller : 0 to 50°C
Store the product with the following specification ranges.
Sensor head : -20 to 70°C
Controller : -20 to 70°C
・The life of the semiconductor laser depends on the ambient temperature
during use. When using the product near a heat source, take measures to
keep the ambient temperature of the sensor head as lower as possible. Mount
the sensor on a device having good heat radiation because the sensor itself
also generates heat.

Preface
9
Ambient humidity
Use the sensor within a range of 35 to 85% RH.
Avoid using it in places that may be exposed to dew condensation due to rapid
temperature change.
Extraneous light immunity at the light receiving surface
Use the sensor in locations where extraneous light immunity from
incandescent lamps is 3,000 lx or less.

Power Supply Voltage
The power supply voltage should be within the rated voltage range of 21.6 to
26.4VDC.

Environment
• The internal circuit may be broken when the external surge voltage exceeds
±500V (1.2/50 µs) unipolar full wave voltage]. If there is danger of external
surge voltages exceeding 500V, install a surge absorber between the power
supply and input terminal.
• Keep the emitter surface and the receiver surface clean, not to attach light
refractors such as water, oil and fingerprints, or light blockers such as dust
and dirt. When cleaning these parts, wipe them off using a soft lint-free
cloth or lens cleaning paper.
• Install the sensor head at where extraneous light (such as sunlight or light
which has the same wavelength as laser beam) do not enter the receiver. If
high accuracy is required, install a light shield plate or the like on the sensor
head.
• Do not use the product in dusty places or that exposed to flammable or
corrosive gases, droplet, direct sunlight, severe vibration or impact.
Protection Enclosure
• The sensor head has protection against immersion, while the controller and
connectors are not structurally dustproof, waterproof, or corrosion-resistant.
Do not use the product underwater or in the rain.

Preface
10
Warming Up Time
Allow at least 30 minutes of warming up after turning on the power to ensure
the performance of the product.
Measures to Noise
• Install the product as far away as possible from noise source such as
high-voltage lines, high-voltage device, power lines, power device,
machines which generate a large starting and stopping surge, welding
machines and inverter motor.
• Install the product as far away as possible from wireless device that has a
transmitter such as amateur radio device.
• Do not roll up the sensor cable (bundle in parallel) with other wirings. Keep
it at least 100mm away from other wires. Cables should be separated from
high voltage and power circuit lines. If it is unavoidable, shield it by
running through a conductive material such as grounded electrical conduit.
• For input signal lines and output signal lines, run them separately, not rolled
up with the power line and power supply line. Keep them at least 100 mm
apart. All signal lines should be connected as short as possible.
• For signal lines for RS-232C or for I/O terminals, use shielded cables and
connect the shielding wire to the frame ground (F.G.) to reduce electric
noise.
• Use an exclusive class D frame ground and avoid sharing the ground with
other devices. This may produce an opposite effect.
Insulation Resistance and Voltage Resistance
Do not conduct insulation resistance tests and voltage resistance tests among
the power supply, I/O signals, metal parts of the controller and sensor head.

Preface
11
Power Supply

Power Supply
• Select a power supply with a ripple 0.5V or less (P-P) and a current capacity 2A
or more.
• When using a commercial switching regulator, be sure to ground the frame
ground (F.G.) terminal to avoid the influence of high frequency noise.
• When using a transformer in the power supply, be sure to use an insulated
transformer. The product or the power supply may be damaged if an auto
transformer is used.
• Use an insulated power supply that incorporates a protective circuit to protect
against abnormal voltages from the power line.
• When using a power supply that does not incorporate a protective circuit, be
sure to supply power through a protective element such as a fuse.

Power Supply Sequence for Controller
• Arrange the power supply sequence so the controller turns off prior to the I/O
power.
• If the I/O power turns off prior to the controller, the controller detects the change
in level of input signals and this may cause wrong operation.
• Leave an interval for at least 10 seconds between turning off the controller and
turning on the power again.
• It takes approximately 40 to 50 seconds to be active for operation
(completion of startup) from power supply, depending on the saved settings
(including the number of average movements). Since all outputs are not
determined during startup, do not use the output.
• Do not turn off the power while saving the settings. In the worst case, the system
of controller is destroyed and may fail to restart.
• When the power is supplied, be careful that the laser lights only for a short
time from the sensor head. (This occurs when the laser control input is
open.)
Instantaneous Power Failure
If an instantaneous power failure occurs, the system operates continuously, or
goes to the same state as power-on state, depending on the duration of power
failure. Do not use the system in the environment where an instantaneous power
failure occurs.

Preface
12
Grounding

Ground the device when noise influence is large
• Under normal use, the product has sufficient noise resistance. In an
environment with particularly high noise levels, however, ground it securely.

Use an exclusive ground
• Use wires of 1.5 mm2or more and establish a class D ground with a ground
resistance of 100Ω or less.
• Make the grounding point as close to the controller as possible, keeping the
ground wire distance short.
• Use an exclusive ground. Sharing the ground with other devices may
produce an opposite effect.
• The connector housing for the sensor head case and sensor cable is
connected electrically to the frame ground (F.G.) terminal of the controller
terminal through the sensor cable.

Precautions for positive ground environment
When the sensor is used in a positive ground environment, a short circuit may
occur via the ground of the personal computer or USB
• Please prepare a separate power supply for the sensor, and do not connect
the positive (+) terminal.
•When performing a positive ground of the DC power supply of the
equipment, do not ground the frame ground (F.G.) of the sensor or the
computer.
Controller Other devices
(e.g. inverter) Controller Other devices (e.g. inverter)

Preface
13
Installation

Controller
・Install the controller unit according to “1-4 Installation Method”, assuring
plenty of space around it. If it is installed in a manner other than specified,
failures may occur due to temperature rise.
・If the controller is mounted internally on the place where air circulation is
blocked such as in a control board, the ambient temperature will rise due to
heat generated by the controller. In such case, forced cooling is required.
・Vent holes for heat radiation are provided at the top and bottom of controller
unit. Provide adequate space for heat radiation, not to block the holes.

Wire Connections and Connectors
• Connect all wirings securely according to the explanations for I/O circuit
and description on the unit.
• Turn off the power of controller before connecting or disconnecting the
connectors.
• When connecting or disconnecting the connectors, be sure to hold the
connector area not to apply extra force to the cable.
• Be careful not to touch terminals or to let foreign objects get in the
connector after disconnecting connectors.
• Be careful not to apply force to around the connector of sensor head cable
and extension cable. Do not bend the cables near connectors, which cause
disconnection of the cable.
• When moving the sensor head during operation, install not to bend the cable
during movement. Use replaceable extensions cable where the cable needs
to be bent.

Cable Extension
• Do not pull the cable with a force
more than 29.4N when wiring the
cable when the sensor head and the
controller are fixed. At least 20 mm is
required from the cable connection to
the bend. The bending radius must be
30 mm or more.
• Use only one extension cable for
connection between one sensor head
and a controller.
20mm or more
R30mm or more

Preface
14
Cautions on Handling Laser Light
JIS/IEC/GB/KS

Semiconductor laser is used as the light source of sensor
The laser is classified based on JIS (JIS C 6802:2014) and IEC (IEC
60825-1:2014), GB (GB 7247.1:2012), KS (KS C IEC 60825-1:2013)
standards.
Model No. HL-D301B HL-D301C
Wavelength 658nm 658nm
Max. output
1mW 5mW
Class
2 3R
Cautions
1) Be careful not to directly watch the laser beam or its reflected light from a
mirror surface.
2) Install the sensor so the laser beam comes higher or lower than eye level in
order not to watch the beam directly during operation.
The safety distance (nominal ocular hazard distance: NOHD) is
approximately 0.1 m for the HL-D301B (and the HL-D301C). Terminate
the laser beam at the diffusion reflector or absorber.
3) Laser beam emission can be stopped by using the laser control input
terminal. (“2-1 Functions and Arrangementsof I/O Terminal Block”)
4) When the power is supplied, be careful that the laser lights only for a short
time from the sensor head. (This occurs when the laser control input is
open.)
5) Please contact SUNX if the system breaks down. Laser radiation is not
automatically stopped during disassembling the sensor head. The users
therefore may be exposed to laser beam in disassembling the sensor head.
6) Do not operate the device not described in this manual.
You may be exposed to hazardous laser radiation if the device
is controlled or adjusted in procedures not specified in this
manual.
7) Read the descriptions of the warning label carefully before use.
The warning label is affixed to the side of the sensor head. The label with
the same description is included. Please use it as necessary.

Preface
15

Warning Label
●HL-D301B
(Center distance: 50 mm, Measuring width: 12.5mm, Laser class 2)
<Label position>
●HL-D301C
(Center distance: 50 mm, Measuring width: 12.5 mm, Laser class:3R)
<Label position>

Preface
16
CE
Make sure to use CE compliant sensor head for making this product CE
compliant.

CE Compliant Condition
As the condition for conformance to CE, attach the ferrite cores to the power
cable, head cable and USB cable as shown below:
Recommended ferrite core
(1) Power cable and head cable: ZCAT2035-0930A by TDK Corp. or
equivalent
(2) USB cable: ZCAT3035-1330 by TDK Corp. or equivalent
Confirm the CE mark on the sensor head to be
connected.
Rotate the ferrite
core one or more
times before use.
(2)
(1)
(1)
(1)
Rotate the ferrite
core one or more
times before use.
70mm or less
30mm or less
30mm or less

Preface
17

Contact for CE
Panasonic Marketing Europe GmbH Panasonic Testing Center
Winsbergring 15, 22525 Hamburg, Germany