Panasonic P4S User manual

ACCTF24E-1
2017.10 industrial.panasonic.com/ac/e/
P
4S Shield type
Narrow
-pitch Connectors
Operation manual

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
1
Contents
01.Introduction.............................................................................................2
02.Precautions for equipment design ..........................................................3
03.Precautions for mounting and reflow soldering.....................................15
04.Precautions for mating..........................................................................23
Parts that require special confirmation are bold and underlined.

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
2
01. Introduction
The P4S Shield type narrow pitch connector has a terminal pitch of 0.4 mm, stacking
height of 1.5 mm, and width of 3.8 mm. Being both slim and equipped with a shield
plate, the P4S Shield type connector is designed for use in the connections between PC
boards and PC boards, and PC boards and flexible PC boards, compared to our P4S
series, noise immunity are required.
The molded part has been downsized and made thinner.
Select models best suited to the situation and conditions of use. Read this document
before designing the equipment and starting production.
●Difference between P4S and P4S Shield type
P4S P4S Shield type
Space-saving
◎
Width: 3.6 mm
◎
Width: 3.8 mm
Contact
reliability
◎
◎
Drop
resistance
○
Bellows contact:
Adopted
○
Bellows contact:
Adopted
Mountability
○
Requires dedicated
nozzle
○
Requires dedicated
nozzle
Noise
immunity
―
○
Multi-point ground +
Shield construction
Pin layout
○
Unlimited
△
Ground dedicated
terminal: available
3.6mm
3.8mm
Pickup space:
Narrow
Pickup space:
Narrow
Adopted Adopted
‘‘ that has a
strong resistance to adverse
environments
Bellows contact: Resistant to
drop impacts
V-notch: Resistant to the
entry of foreign materials and
flux.
Ni barrier: Resistant to solder
creep
Porosity treatment: Resistant
to gases
‘‘ that has a
strong resistance to adverse
environments
Bellows contact: Resistant to
drop impacts
V-notch: Resistant to the
entry of foreign materials and
flux.
Ni barrier: Resistant to solder
creep
Porosity treatment: Resistant
to gases

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
3
02. Precautions for equipment design
02-1. Precautions for mechanical design
1) Position of connectors on a board
(1)When using board to board connectors, a pair of board shall NOT be connected
with multiple connectors. Otherwise, misaligned connector positions may cause
mating failure or product breakage.
Panasonic corporation does not guarantee the failures caused by using the multiple
connectors.
(2)Solid board is tend to warp to vertical direction against mill direction of
production process. Some warp directions can cause poor soldering. Therefore,
arrange the board in a direction that can minimize warp.
This gap causes poor
soldering.
Tendency to warp easily to
production direction (horizontal direction)
It is possible to prevent poor soldering
by the arrangement of mounting
connector on the horizontal direction.
×

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
4
2) Position of connectors during mounting
When using a multiple-pin connector, it is preferable that the connector be placed
in a position that does not require swing motion of the mounter during pickup and
mounting. The inertial force of the swing motion of mounter often displaces the
connectors so that connector arrangement without swing operation is required.
●Connector arrangement with swing motion (rotation) during picking up and mounting
Pickup positions
Connector
Embossed tape
Main board
No inertial force
during mounting
Connector
Inertial force during
mounting

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
5
3) Prevention of problems during equipment operations
(1) Although this product is equipped with a simple locking mechanism, insert
cushioning material in the equipment enclosure in order to prevent the header
from being detached from the socket or damaged during operation.
- Please consider that there should be no gap between the enclosure and the board.
- It is recommended that holding force to the sub board be bigger than connector
insertion force.
- With regard to the cushioning material, select an appropriate shape, size and
material and position the center of the connector.（Unbalanced control causes
unmating.)
(2) When the board fixation is not enough as the lower chart , the connector is
affected by the load of the inertial force and might be damaged.
Please consider as follows.
Shock of fall
(1) If the both boards are not fixed sufficiently,
the connector is affected by the shock and
might be damaged.
(2)
If there is no gap between enclosure and sub
board （A＜B）
, the sub board strikes against
the enclosure. Due to the impact of its strike,
the connector is affected and might be
damaged.
<Prevention>
Please fix the both main and sub-board
sufficiently
(1) Fix the main board
(Fix the side that has the larger mass and
prevent the inertial motion of drop impact.)
(2) Hold with object such as rubber cushion
not to move by the drop impact.
(3) Guide of the board is to be A≧B, to
prevent the damage of the gap made by drop
impact.
×
A<B
○
A
≧
B
Sub-board
(FPC)
Connector
Enclosure
Main board
(not fixed)
Connector
Enclosure
Main board
(fixed)
Object to hold
Sub-board
(FPC
)
<Prevention>
Support plate
Main board
Enclosure
Flexible PC
board
Connector
Cushioning material

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
6
(3) For an easier connecting operation, it is recommended that the main board
be designed as follows:
- Provide a positioning mark.
- Place the connector in a position where a connector mating operation can be
easily checked.
Flexible PC board
Support plate
Main board
Positioning mark
-silk screening printing
-pattern (copper leaf)
・Positioning mark example

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
7
02-2. Board design
1) Circuit design
(1) Since this connector has multi-point ground construction, there is a dedicated
ground terminal.
When designing the terminal foot pattern, check the latest specifications and
examine the recommended foot pattern and dimensions of the metal mask opening.
Current recommendations are indicated on pages 13, 14 and 15.
(2) This connector is provided with a soldering terminal piece for preventing solder from
peeling off the terminal.
Make sure to design a foot pattern for the soldering terminal piece.
(3) Foot pattern arrangement in consideration for mounting
On the header, an area where through-holes are prohibited is indicated on the
underside of the connector. Make sure to note this area.
Since the terminal soldering face is configured to extend to the bottom face of
the molded part, a defect that cannot be reworked occurs if a solder bridge is
created on this part.
To lead out the pattern by a through-hole using the bottom face of the connector,
design by referring to the drawing below.
Socket
Header
Soldering terminal
Because of the small gap in this
area, soldering bridge may be
occurred by much solder and its
creeping.
When considering designing the
through holes under the
connector, it is recommended that
the pattern be thin in prohibited
area and through holes not be
placed in the prohibited area. It is
general that the pattern length of
this part be approx. one third
against the width of patterns for
contact.
Cross section view
Top view
The area where
through holes
are prohibited
Soldering terminal
Ground terminal

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
8
(4) Precautions for placing a through hole in prohibited area.
Header is constructed as shown in below, the post is extended to the bottom of
body and metal part of the terminal is exposed horizontally on the area from the
post on the bottom of body to the middle of foot pattern. Therefore, take the
following precautions.
①When placing the through holes that are not isolated, it is recommended that
the through holes not be interfered in contiguous contacts.
②Ｉt is recommended that the patterns not be interfered in contiguous contacts.
(5) Precautions for placing isolated through holes in prohibited area.
Header is constructed as shown in below, the post is extended to the bottom of
body and metal part of the terminal is exposed horizontally on the arm from the
post on the bottom of body to the middle of foot pattern. If an isolated through
hole is placed in prohibited area, the gap between pattern and contacts may
become too wide so that poor soldering may be occurred.
①
interference in
contiguous contacts
②
interference in
contiguous
contacts
Pulling out straight
not to interferer
Because of the wider
gap, poor soldering
may be occurred.
●It is recommended that through hole be placed close to the center, not in prohibited area.
There is the 50 μm gap
between bottom of
body and connection.
The bump between
bottom of body and
contacts terminal
absorb the gap of
through hole plating.
Cross section
view
Top view
The area where
through holes
are prohibited
When pulling out the isolated pattern,
do not touch the contiguous contacts.
●When through hole is located in prohibited area,
Cross
section
view

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
9
(6) Please consider the following points when providing a through hole by extending
the foot pattern.
If a through-hole is created simply by extending
the foot pattern by the same width, solder is
absorbed into the through-hole during the reflow
process, which may cause defective soldering of
the terminals.
①Thin and extend the tip of the foot
pattern before creating a through-hole.
②Prevent solder from reaching the land
by using a cover lay or resist.
(7) Please consider the following point as a pattern
peeling preventive measure when removing the
connector.
- Make the foot pattern length longer than the
coverlay opening.
In general, at least 0.3 mm.
(8) Foot pattern dimensions indicated in the specification
intended to achieve the minimum area on the premise
that the reflow-soldering process is used. For manual
soldering or for ensuring solder reworkability, make
a longer pattern at the terminal tip.
In general, 1/3 the
terminal pattern
width.
- Secure space for applying the soldering
iron tip.
Terminal looseness and unwanted
solder creep are preventable by
applying the soldering iron tip here.

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
10
2) Flexible PC board design
(1) Positions of connectors on the FPC
FPC consists of polyimide, copper foil and bond layer. Each contraction rate of
those material by heat is different so that warp of FPC may occurred and may
cause poor soldering. Therefore, positioning connector on FPC minimizing
influence of warp.
■Example of Assist carrier (ShinEtsu Polymer Co., Ltd)
In case of a one-sided FPC board, warpage is
more likely to occur if a pattern is laid in a line,
or if the copper foil is applied over the entire
FPC board for noise-prevention purposes.
It is difficult to keep FPC
flat because FPC is flexible
●Example of carrier for mounting process
- Magic resin (Daisho Denshi)
- Silicon gum board
(Mitsubishi Resin)
- Assist carrier
(ShinEtsu Polymer Co., Ltd)
When mounting connector, it is
recommended that the usage of carrier with
adherent surface for mounting process to keep
FPC even.
Processed part
(FPC)
Elastomer
(adhesive layer)
Elastomer
(adhesive layer)
Board material
Processed part (FPC)
Assist carrier
Pin tool foｒlayout
STEP 1:
Temporal fixation
STEP 2:
Completion of m
ounting
process
STEP 3:
Pick up after
completion
of
mounting process
Pin tool for
removing

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
11
(2) Flexible PC board specifications
Control the thicknesses of the coverlay and adhesive to prevent poor soldering.
There is a clearance of approx. 0.05 mm between the bottom surface of the
terminal and the mold casing. Therefore, minimize the coverlay thickness,
otherwise poor soldering may be result.
If poor soldering occurs frequently, check the actual thickness of each insulation
layer. Generally, the coverlay thickness is set to about 30 μm, including the
adhesive. If the thickness exceeds 30 μm, remove the coverlay under the
connector from the design.
(3) This connector can be used for main board-to- FPC connection.
In case that the flexible board is too short, excessive load affects the connector
and may be shifted out.
Please design as the flexible board is appropriately slack.
Connector
terminal
Mold casting of the connector
Coverlay (polyimide)
Adhesive (Epoxy adhesive recommended)
Adhesive (Epoxy adhesive recommended)
Copper foil
Base material (polyimide)
Support plate + Adhesive
(Epoxy adhesive recommended)
fixation
Connector
Wrong:
too short
Positional gap
Motherboard
Part where
FPC board is fixed
Wrong:
too long

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
12
3) Support plate design
Select a support plate with an appropriate thickness and hardness to prevent solder or
the pattern from being removed during unmating of the connector.
(1) It is recommended to use stainless or glass-reinforced epoxy plates, which can
easily provide adequate hardness.
(2) When using a polyimide material to prevent lint from being generated, follow the
rules below.
- Select a plate as a thick as possible.
(Generally, plates of 0.2 mm thick or more may be used.)
- It is recommended to use a hard adhesive (epoxy-base) to bond the plate to a
flexible PC board.
- Two-ply support plates bonded with epoxy adhesive are harder than single
support plates of the same thickness.
(3) When contacts are long, the flexible PC board can bend easily. Therefore, please
make sure the support plate is sufficiently hard.
(4) As a rule, always cut the support plate materials into pieces in the same direction,
otherwise, some plates will warp during reflow soldering and cause poor
soldering.
(It is recommended to cut the material in the direction of the reinforcing fiber.)
(5) Design the support plates so that the edges are 0.5~1.0 mm or more outside the
tips of the foot pattern traces in order to protect the soldered joints of the
connector terminals from stress caused when the connector is unmated or when
the flexible PC board is bent.
(6) Foot pattern design
When using thin support plates, take the following
measures to improve the support’s effectiveness.
- Design the foot pattern traces longer than
the coverlay opening edge. Normally, the
distance is set to approx. 0.3 mm. For
greater support, it is recommended that the
distance be at least doubled.
When the connector is
unmated, the edges are
to be 0.5~1.0mm
Support plate
0.5~1.0 mm
In case that support plate is thin or flexible and too large, the support
plate tends to be bent and may not be sufficiently effective.

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
13
4) Metal Mask Design
Since this connector is designed with compact and narrow pitch,please pay
attention to the following precautions for reflow soldering.
(1) In addition to the amount of applied solder, the reflow-soldering environment and
temperature profile affect the finish quality after reflow soldering. Please make
sure to adjust the amount of solder applied after checking the finish quality in a
test run.
(2) Compared with natural air reflow soldering, N2 reflow soldering can reduce
oxidization of the melted solder surface. This significantly improves the solder
wettability. Therefore, please make sure to apply an appropriate amount of solder
(3) Do not apply an excessive amount of solder, otherwise, solder or flux may creep
near the contact section and reduce contact reliability or cause interference during
mating. Please pay careful attention.
(4) It is recommended that solder with a grain diameter of 32 μm or smaller is used
so as to print a constant amount of solder.

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
14
Recommended specifications of mounting pattern on PC board and
window size of metal masking
Please refer to the latest product specifications when designing your product.
Product: Narrow pitch connector P4S Shield type Socket
Recommended mounting pattern on PC board (Top view)
Thickness of metalmasking:120μm
(Terminal part window ratio:60%)
(Metal bracket part window ratio:100%)
Thickness of metalmasking:150μm
(Terminal part window ratio:48%)
(Metal bracket part window ratio:100%)
Connect to GND
Connect to GND
(2.40 mm pitch)

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
15
Recommended specifications of mounting pattern on PC board and
window size of metal masking
Product: Narrow pitch connector P4S Header (When using shield type socket)
Stacking height 1.5 mm type
Recommended mounting pattern on PC board (Top view)
Thickness of metalmasking:120μm
(Terminal part window ratio:60%)
(Metal bracket part window ratio:100%)
Thickness of metalmasking:150μm
(Terminal part window ratio:49%)
(Metal bracket part window ratio:100%)
Connect to GND
Insulation area
Connect to GND
(2.40 mm pitch)

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
16
03. Precautions for mounting and reflow soldering
03-1. Mounters
When mounting, a multifunctional mounter is recommended
If using a high-speed mounter, controle the suction force by using a multifunctional
head
In case of dry condition, please note the occurrence of static electricity.
The product may be adhered to the embossed carrier tape or the cover tape in dry
condition.
Recommended humidity is from 40%RH to 60%RH and please remove static
electricity by ionizer in manufacturing process.
03-2. Precautions for selecting a pickup nozzle for
mounting connectors
Select a pickup nozzle with a pickup area that provides a theoretical lift force 10
times greater than the connector’s weight.
Theoretical lifting force (gr)
= Vacuum pressure (mmHG) /760 ×10.33×Nozzle area (mm2)
Sample vacuum pressure of machines: 480 to 520 mmHG
1) Nozzle for picking up sockets
(1) The width that can be used for pickups is 0.70mm.
The pickup face is in the bottom between the
contacts. If it is difficult to secure the positioning
accuracy, we recommend to use the nozzle which
can cover the mating inlet.
(2) In case of about 50 pins or more, or if a swinging
movement is required during mounting, we
recommend the use of an oval-shaped nozzle.
2) Nozzle for picking up headers
(1) The width that can be used for pickups is 0.54 mm.
Use a nozzle with a 1.5 mm outer diameter and
0.3 mm inner diameter.
(2) In case of about 50 pins or more, or if a swinging
movement is required during mounting, we
recommend the use of an oval-shaped nozzle.
3) Individual connector weight
(Unit: g)
14 38 50 74
Socket
0.04
0.07
0.09
0.12
Header 0.01 0.03 0.04 0.05
Note: Contact us for information on different heights.
Header
Pickup face
Socket Pickup face

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
17
Nozzle tip shape example
(1) Nozzle tip shape example for sockets side.
Note: It is possible to pick up the cover in calculation theory.
However, there is difference in socket’s speed of moving or rolling.
Conformation is needed.
(2) Nozzle tip shape example for header side
①Circular nozzle tip ②Oval shaped nozzle
Note: It is possible to pick up the cover in
calculation theory.
However, there is difference in socket’s
speed of moving or rolling. Conformation is
needed.
①
Circular nozzle tip
②
Oval shaped nozzle
Size of nozzle tip
- Picking up the pick
up face
Size of nozzle tip

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
18
03-3. Precautions for reflow soldering
(1) Check the actual temperature profile at the connector mounting position and
check that it matches the recommended temperature profile.
(2) When the resin part of the connector is melted or deformed during reflow
soldering, check whether or not the heating temperature is excessive, or there is
an electronic component with a large heat capacity near the connector-mounting
position.
(3) If the soldering is defective, carry out the following check.
If solder reaches the contact section or its periphery, it is possible that the amount
of solder applied was excessive, or that wicking has occurred. In this case, check
the amount of solder applied and the temperature at the connector-mounting
position.
Special care is required with an N2 reflow oven.
(4) Larger front fillets can be achieved by extending the screen opening outward and
shifting the solder application position outward.
(5) Take the following precautions to minimize temperature variations among
connector terminals during reflow soldering onto flexible PC boards.
- If the base on which a flexible PC board is mounted is made of metal (e.g.
aluminum), ensure that the flexible PC board and the base are kept in close
contact.
- If a metal support plate is used, ensure closer contact between the base and the
plate (e.g. double-sided adhesive tape).
(6)Do not use resin-containing solder. Otherwise, the contacts might be firmly fixed.
Temperature
Time

Operation manual for Narrow-pitch connectors P4S Shield type
Panasonic Corporation
industrial.panasonic.com/ac/e/
©Panasonic Corporation 2017 ACCTF24E-1 201710
19
03-4. Manual soldering and Solder rework
This connector has been miniaturized in order to achieve a narrow pitch and an ultra-
low profile. Therefore, take great care when carrying out manual soldering or rework.
(1) When carrying out manual soldering or rework, avoid contact between the
soldering iron tip and the resin part and do not overheat the iron, otherwise the
resin will melt.
(2) During solder rework, solder should be supplied at, and the soldering iron should
be applied to the tip of each pattern trace on the PC board in order to minimize
contact with the terminals.
(3) When carrying out manual soldering or solder rework, avoid using flux if
possible in order to prevent it from rising to the contact section. (For details,
see the next page.)
(4) When using flux, apply as little as possible to each tip of the foot pattern
trace. Since this connector has an ultra-low profile, an excessive amount of flux
may cause an unwanted rise of flux and require flux cleaning.
(5) After manual soldering or solder rework, carry out an inspection or check for
solder rise and abnormalities in the contact section using a magnifying glass.