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Panasonic MANV250GE User manual

Zener Diodes
Publication date: October 2005 SKE00038AED 1
MANV250GE
Silicon planar type
For surge protect
Features
Large surge reduction power
Absolute Maximum Ratings Ta= 25°C
Parameter Symbol Rating Unit
Peak pulse power *1PPP 450 W
Peak pulse current *1IPP 9 A
Maximum peak reverse voltage VRM 18 V
Total power dissipation *2PT150 mW
Junction temperature Tj150 °C
Storage temperature Tstg –55 to +150 °C
Electrostatic discharge *3ESD ±30 kV
Note) *1: Test method: IEC61000-4-5 (tp = 8/20 ms, Unrepeated)
*2: PT= 150 mW achieved with a printed circuit board.
*3: Test method: IEC61000-4-2 (C = 150 pF, R = 330 W, Contact discharge: 10 times)
Electrical Characteristics Ta= 25°C±3°C
Parameter Symbol Conditions Min Typ Max Unit
Breakdown voltage *1VBR IR= 1 mA 20.0 25.0 30.0 V
Reverse current IRVR= 18 V 10.0 mA
Clamping voltage *2VCIPP = 9.0 A, tp = 8/20 ms 50.0 V
Terminal capacitance CtIR= 0 V, f = 1 MHz 76 pF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7031 measuring methods for diodes.
2. *1: VZguaranted 20 ms after current flow.
*2: Pulse Waveform
100
90
50
10
T2
Tt
T1
Percent of I
PP
Front time:
T1 = 1.25 ×T = 8 µs ±20%
Time to half value:
T2 = 20 µs ±20%
Package
Code
SMini2-F3
Pin Name
1: Anode
2: Cathode
Marking Symbol: RD
MANV250GE
2SKE00038AED
IFVFIRVRIZVZ
CtVR
10−4
0 0.8 1.00.4 0.60.2 1.6 1.81.2 1.4 2.0
10−2
10−1
1
10
10−3
102
Forward current IF(mA)
Ta=25°C
MANV250GE_IF-VF
Forward voltage VF(V)
10−7
10−6
0 4 62 128 10 2016 1814
10−5
10−3
10−4
Ta=25°C
Reverse current IR(µA)
MANV250GE_IR-VR
Reverse voltage VR(V)
10−6
10−5
10−3
10−4
10−1
10−2
5 10 15 25 30 3520 40
1
Zener current IZ(A)
Ta=25°C
MANV250GE_IZ-VZ
Zener voltage VZ(V)
100 5 1510 20
100
Terminal capacitance Ct(pF)
Ta=25°C
f =1 MHz
MANV250GE_Ct-VR
Reverse voltage VR(V)
MANV250GE
SKE00038AED 3
SMini2-F3 Unit: mm
1.25 ±0.10
0.13 +0.05
−0.02
0.50 ±0.05
2
1
0.35 ±0.05
0.7 ±0.1
5°
(0.15)
2.5 ±0.2
1.7 ±0.10.4 ±0.1
0 to 0.05
5°
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
 Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.

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