Panasonic KX-TEA308NE User manual

© 2005 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
KX-TEA308NE
KX-TE82460NE
KX-TE82492NE
KX-TE82493NE
KX-A227X
(for Europe)
Advanced Hybrid System
IMPORTANT INFORMATION ABOUT LEAD FREE, (PbF), SOLDERING
If lead free solder was used in the manufacture of this product the printed circuit boards will be marked PbF.
Standard leaded, (Pb), solder can be used as usual on boards without the PbF mark.
When this mark does appear, please read and follow the special instructions described in this manual on the use of PbF and how
it might be permissible to use Pb solder during service and repair work.
ORDER NO. KMS0507104CE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free) 4
1.1. SUGGESTED PbF SOLDER 4
1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED 5
2 FOR SERVICE TECHNICIANS 7
3 CAUTION 8
3.1. SAFETY PRECAUTIONS 8
3.2. INSULATION RESISTANCE TEST 8
3.3. BATTERY CAUTION 8
3.4. CAUTION 8
4 SPECIFICATIONS 9
4.1. GENERAL DESCRIPTION 9
4.2. CHARACTERISTICS 9
4.3. SYSTEM CAPACITY 9
5 SYSTEM OVERVIEW 10
5.1. SYSTEM COMPONENTS 10
5.2. SYSTEM CONNECTION DIAGRAM 11
6 NAMES AND LOCATIONS 12
7 CONNECTION 12
7.1. SERIAL INTERFACE CONNECTION 12
8 DISASSEMBLY INSTRUCTIONS 13
8.1. DISASSEMBLY INSTRUCTION 13
9 BLOCK DIAGRAM 15
9.1. SYSTEM BLOCK DIAGRAM 15
9.2. POWER BLOCK DIAGRAM 16
9.3. KX-TEA308NE MAIN BLOCK DIAGRAM 16
9.4. KX-TEA308NE CO BLOCK DIAGRAM 17
9.5. KX-TEA308NE POWER SUPPLY UNIT BLOCK
DIAGRAM 17
10 EXPLANATION OF BLOCK DIAGRAM 18
10.1. MAIN UNIT (KX-TEA308NE) 18
11 CIRCUIT OPERATION 20
11.1. POWER SUPPY CIRCUIT 20
11.2. CO INTERFACE CIRCUIT 21
11.3. CROSS POINT SWITCH CIRCUIT 26
11.4. INTERCOM CIRCUIT 28
11.5. POWER FAILURE THROUGH CALL SWITCHING
CIRCUIT 29
11.6. DATA COMMUNICATION CIRCUIT 29
11.7. CONTROL CIRCUIT 31
11.8. TONE GENERATOR CIRCUIT 31
11.9. DTMF GENERATOR CIRCUIT 32
11.10. DTMF RECEIVER CIRCUIT 32
11.11. INT CALLID INTERFACE CIRCUIT 33
11.12. MODEM INTERFACE CIRCUIT 33
11.13. USB INTERFACE CIRCUIT 34
11.14. OGM INTERFACE CIRCUIT 34
11.15. RINGING SIGNAL GENERATOR CIRCUIT 35
11.16. SMDR INTERFACE CIRCUIT 35
11.17. DOORPHONE CARD INTERFACE (KX-TE82460NE) 36
11.18. BUILT IN VOICE MESSAGE CARD INTERFACE (KX-
TE82492NE) 36
11.19. CALL ID CARD INTERFACE (KX-TE82493NE) 37
12 TROUBLESHOOTING GUIDE 38
12.1. NO OPERATION (Check POWER SUPPLY BOARD,
MAIN BOARD and 2AP BOARD) 38
12.2. NO DIAL TONE 39
12.3. CANNOT DIAL 40
12.4. CANNOT CALL EXTENSION 41
12.5. CANNOT USE PROPRIETARY TELEPHONE 41
12.6. CANNOT RECEIVE INCOMING CALL 41
12.7. CANNOT SEND DTMF DIALING 42
12.8. CANNOT RECEIVE CALL DIAL TONE 42
12.9. CANNOT SEND A HOLD ON MUSIC 43
13 IC DATA 44
13.1. IC700 44
13.2. IC7 46
13.3. IC8 46
14 TERMINAL GUIDE OF ICS, TRANSISTORS AND DIODES 47
15 HOW TO REPLACE A FLAT PACKAGE IC 48
15.1. PREPARATION 48
15.2. REMOVAL PROCEDURE 48
15.3. INSTALLATION PROCEDURE 48
15.4. REMOVING SOLDER FROM BETWEEN PINS 48
16 FIXTURES AND TOOLS 49
17 CABINET AND ELECTRICAL PARTS LOCATION 50
18 ACCESSORIES AND PACKING MATERIALS 51
19 REPLACEMENT PARTS LIST (KX-TEA308NE) 52
19.1. CABINET AND ELECTRICAL PARTS 52
19.2. ACCESSORIES AND PACKING MATERIALS 52
19.3. MAIN BOARD PARTS 52
19.4. CO BOARD PARTS 59
19.5. POWER SUPPLY BOARD PARTS 62
19.6. FIXTURES AND TOOLS 63
20 FOR THE SCHEMATIC DIAGRAM 64
21 SCHEMATIC DIAGRAM (KX-TEA308NE) 66
21.1. MAIN No.1 (Extention A-D Block) 66
21.2. MAIN No.2 (Extention E-H Block) 70
21.3. MAIN No.3 (Cross-Point Block) 74
21.4. MAIN No.4 (ASIC, Memory Block) 78
21.5. MAIN No.5 (CO Block) 82
21.6. POWER SUPPLY 86
22 PRINTED CIRCUIT BOARD (KX-TEA308NE) 87
22.1. MAIN BOARD 87
22.2. CO BOARD 89
22.3. POWER SUPPLY 91
23 KX-TE82460NE (2-PORT DOORPHONE CARD) 92
23.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED 93
23.2. LOCATION OF OPTIONAL CARDS 94
CONTENTS
Page Page
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KX-TEA308NE

23.3. DOORPHONE/DOOROPENER CARD BLOCK DIAGRAM
95
23.4. EXPLANATION OF BLOCK DIAGRAM/CIRCUIT
OPERATIONS 95
23.5. TROUBLESHOOTING GUIDE 96
23.6. IC DATA 97
23.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES 98
23.8. ACCESSORIES AND PACKING MATERIALS 98
23.9. REPLACEMENT PARTS LIST (KX-TE82460NE) 99
23.10. FOR THE SCHEMATIC DIAGRAM 101
23.11. SCHEMATIC DIAGRAM (KX-TE82460NE) 102
23.12. PRINTED CIRCUIT BOARD (KX-TE82460NE) 104
24 KX-TE82492NE (2-CHANNEL VOICE MESSAGE CARD) 105
24.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED 106
24.2. LOCATION OF OPTIONAL CARDS 107
24.3. BLOCK DIAGRAM 108
24.4. CIRCUIT OPERATIONS 109
24.5. TROUBLESHOOTING GUIDE 110
24.6. IC DATA 112
24.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES 113
24.8. ACCESSORIES AND PACKING MATERIALS 113
24.9. REPLACEMENT PARTS LIST (KX-TE82492NE) 114
24.10. FOR THE SCHEMATIC DIAGRAM 115
24.11. SCHEMATIC DIAGRAM (KX-TE82492NE) 116
24.12. PRINTED CIRCUIT BOARD (KX-TE82492NE) 118
25 KX-TE82493NE (3-PORT CALLER ID CARD) 119
25.1. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS
USED 120
25.2. LOCATION OF OPTIONAL CARDS 121
25.3. BLOCK DIAGRAM 122
25.4. CIRCUIT OPERATIONS 122
25.5. TROUBLESHOOTING GUIDE 123
25.6. IC DATA 124
25.7. TERMINAL GUIDE OF ICS, TRANSISTORS AND
DIODES 126
25.8. ACCESSORIES AND PACKING MATERIALS 126
25.9. REPLACEMENT PARTS LIST (KX-TE82493NE) 127
25.10. FOR THE SCHEMATIC DIAGRAM 129
25.11. SCHEMATIC DIAGRAM (KX-TE82493NE) 130
25.12. PRINTED CIRCUIT BOARD (KX-TE82493NE) 132
26 KX-A227X (BACK-UP BATTERY CABLE) 133
26.1. ACCESSORIES AND PACKING MATERIALS 134
26.2. REPLACEMENT PARTS LIST (KX-A227X) 135
3
KX-TEA308NE

1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that
contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
• • •
• PbF solder has a melting point that is 50° ~ 70° F, (30° ~ 40°C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700° ± 20° F, (370° ± 10°C). In case of using high temperature soldering iron, please
be careful not to heat too long.
• • •
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, (600°C).
• • •
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible
and be sure that any remaining is melted prior to applying the Pb solder.
• • •
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
1.1. SUGGESTED PbF SOLDER
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the
manufacturer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.
4
KX-TEA308NE

1.2. HOW TO RECOGNIZE THAT Pb FREE SOLDER IS USED
5
KX-TEA308NE

6
KX-TEA308NE

2 FOR SERVICE TECHNICIANS
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
7
KX-TEA308NE

3 CAUTION
3.1. SAFETY PRECAUTIONS
1. Before servicing, unplug the power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer´s recommended components for safety.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent
the customer from being exposed to shock hazards.
3.2. INSULATION RESISTANCE TEST
1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with ohmmeter between the jumpers AC plug and each exposed metal cabinet part, such as
screw threads, control shafts, handle brackets, etc.
Note:
Some exposed parts may be isolated from the chassis by design. These will read infinity.
4. If the measurement is outside the specified limits, there is a possibility of shock hazard. The equipment should be repaired and
rechecked before it is returned to the customer.
3.3. BATTERY CAUTION
1. Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the
manufacturer. Dispose of used batteries according to the manufacturer’s Instructions.
2. The lithium battery is a critical component (type No.CR23541). Please observe for the proper polarity and the exact location
when replacing it and soldering the replacement lithium battery in.
3.4. CAUTION
The power socket wall outlet should be located near this equipment and be easily accessible.
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KX-TEA308NE

4 SPECIFICATIONS
4.1. GENERAL DESCRIPTION
Control Bus Original bus (16-bit, 24 MHz)
Switching Space Division CMOS Crosspoint Switch
Power Input 100 V AC to 240 V AC, 0.8A to 0.4A, 50 Hz/60Hz
External Battery +24 V DC (+12 V DC x 2)
Maximum Power Failure Tolerance 300 ms (without using backup batteries)
Memory Backup Duration 7 years
Dialling Outside (CO) Line Pulse (10 pps, 20 pps) or Tone (DTMF)
Extension Pulse (10 pps, 20 pps) or Tone (DTMF)
Intercom Path 3
Mode Conversion Pulse-DTMF
Ring Frequency 20 Hz/25 Hz (selectable)
Operating Environment Temperature 0°Cto40°C
Humidity 10 % to 90 % (non-condensing)
Conference Call Outside (CO) Line 2
Music on Hold (MOH) 1 port
Selectable MOH: Internal/External/Tone
Paging Internal 1
Extension 1 port
Serial Interface Port RS-232C 1
USB 1.1 1
Extension Connection Cable SLT 1 pair wire (T, R)
PT 2-pair wire (T, R, H, L)
DSS Console 1-pair wire (H, L)
Dimension 249 mm (W) x 316 mm (H) x 73 mm (D)
Weight (when fully expanded) Approx. 1.8 kg
4.2. CHARACTERISTICS
Terminal Equipment Loop Limit PT 40 Ω
SLT 600 Ωincluding set
Doorphone 20 Ω
Minimum Leakage Resistance 15000 Ωminimum
Maximum Number of Extension
Instruments per Line
1 PT or SLT in standard connection
1 PT and 1 SLT in parallel connection
Ring Voltage 65 Vrms at 20 Hz/25 Hz depending on the ringing load
Outside (CO) Line Loop Limit 1600 Ωmaximum
Hookswitch Flash/Recall Timing Range 24 ms-2032 ms
Door Opener Current Limit 30 V DC/30 V AC, 3 A maximum
Paging Terminal Impedance 600 Ω
MOH Terminal Impedance 10000 Ω
4.3. SYSTEM CAPACITY
4.3.1. System Capacity
KX-TEA308
Basic System Outside (CO) line 3
Extensions for PT/SLT 8
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KX-TEA308NE

4.3.2. Maximum Cards Terminal Equipment
ltem KX-TEA308
PT 8
SLT 8
2-Port Doorphone Card 1
3-Port Caller ID Card 1
2-Channel Voice Message Card 1
Doorphone 2
Door Opener 2
Pager 1
Music on Hold (MOH) 1
DSS Console 2
4.3.3. System Data
ltem Max. Quantity
Operator 1
System Speed Dialling 100
One-touch Dialling 24 per extension (PT)
Personal Speed Dialling 10 per extension
Call Park Area 10
Absent Message 6
Toll Restriction (TRS) COS 5
Extension Group 8
Message Waiting 8 per extension
Message for Built-in Voice Message 125 messages (total 60 minutes)
5 SYSTEM OVERVIEW
5.1. SYSTEM COMPONENTS
Model Description
Main Unit KX-TEA308NE Advances Hybrid System: 3 Outside (CO) Line, 8 Hybrid Extentions
Optional Service Cards KX-TE82460NE
KX-TE82492NE
KX-TE82493NE
2-Port Doorphone Card
2-Channel Voice Message Card
3-Port Caller ID Card
Proprietary Equipment KX-T30865
KX-A227X
Doorphone
Backup Battery Cable
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KX-TEA308NE