Quectel SC200L Supplement

SC200L Series (Dual-band Wi-Fi)
Hardware Design
Smart Module Series
Version: 1.0
Date: 2021-09-17
Status: Released

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 1 / 111
At Quectel, our aim is to provide timely and comprehensive services to our customers. If you
require any assistance, please contact our headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai
200233, China
Tel: [phone]
Email: [e-mail]
Or our local offices. For more information, please visit:
http://www.quectel.com/support/sales.htm.
For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm.
Or email us at: [email protected]om.
Legal Notices
We offer information as a service to you. The provided information is based on your requirements and we
make every effort to ensure its quality. You agree that you are responsible for using independent analysis
and evaluation in designing intended products, and we provide reference designs for illustrative purposes
only. Before using any hardware, software or service guided by this document, please read this notice
carefully. Even though we employ commercially reasonable efforts to provide the best possible
experience, you hereby acknowledge and agree that this document and related services hereunder are
provided to you on an “as available” basis. We may revise or restate this document from time to time at
our sole discretion without any prior notice to you.
Use and Disclosure Restrictions
License Agreements
Documents and information provided by us shall be kept confidential, unless specific permission is
granted. They shall not be accessed or used for any purpose except as expressly provided herein.
Copyright
Our and third-party products hereunder may contain copyrighted material. Such copyrighted material
shall not be copied, reproduced, distributed, merged, published, translated, or modified without prior
written consent. We and the third party have exclusive rights over copyrighted material. No license shall
be granted or conveyed under any patents, copyrights, trademarks, or service mark rights. To avoid
ambiguities, purchasing in any form cannot be deemed as granting a license other than the normal
non-exclusive, royalty-free license to use the material. We reserve the right to take legal action for
noncompliance with abovementioned requirements, unauthorized use, or other illegal or malicious use of
the material.

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 2 / 111
Trademarks
Except as otherwise set forth herein, nothing in this document shall be construed as conferring any rights
to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel
or any third party in advertising, publicity, or other aspects.
Third-Party Rights
This document may refer to hardware, software and/or documentation owned by one or more third parties
(“third-party materials”). Use of such third-party materials shall be governed by all restrictions and
obligations applicable thereto.
We make no warranty or representation, either express or implied, regarding the third-party materials,
including but not limited to any implied or statutory, warranties of merchantability or fitness for a particular
purpose, quiet enjoyment, system integration, information accuracy, and non-infringement of any
third-party intellectual property rights with regard to the licensed technology or use thereof. Nothing herein
constitutes a representation or warranty by us to either develop, enhance, modify, distribute, market, sell,
offer for sale, or otherwise maintain production of any our products or any other hardware, software,
device, tool, information, or product. We moreover disclaim any and all warranties arising from the course
of dealing or usage of trade.
Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein.
c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless
otherwise provided by valid agreement, we make no warranties of any kind, either implied or express,
and exclude all liability for any loss or damage suffered in connection with the use of features and
functions under development, to the maximum extent permitted by law, regardless of whether such
loss or damage may have been foreseeable.
d) We are not responsible for the accessibility, safety, accuracy, availability, legality, or completeness of
information, advertising, commercial offers, products, services, and materials on third-party websites
and third-party resources.
Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 3 / 111
Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 4 / 111
About the Document
Revision History
Version
Date
Author
Description
-
2021-05-26
Shihao HUANG/
Shawn HU
Creation of the document
1.0
2021-09-17
Shihao HUANG/
Shawn HU
First official release

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 5 / 111
Contents
Safety Information.......................................................................................................................................3
About the Document...................................................................................................................................4
Contents.......................................................................................................................................................5
Table Index...................................................................................................................................................8
Figure Index...............................................................................................................................................10
1Introduction........................................................................................................................................12
1.1. Special Mark .............................................................................................................................12
2Product Overview ..............................................................................................................................13
2.1. Frequency Bands and Functions..............................................................................................13
2.2. Key Features.............................................................................................................................15
2.3. Functional Diagram...................................................................................................................17
2.4. EVB...........................................................................................................................................18
3Application Interfaces .......................................................................................................................19
3.1. General Description..................................................................................................................19
3.2. Pin Assignment .........................................................................................................................20
3.3. Pin Description..........................................................................................................................21
3.4. Power Supply............................................................................................................................32
3.4.1. Power Supply Pins.........................................................................................................32
3.4.2. Voltage Stability Requirements......................................................................................33
3.4.3. Reference Design for Power Supply..............................................................................34
3.5. Turn On and Off the Module.....................................................................................................35
3.5.1. Turn On the Module with PWRKEY...............................................................................35
3.5.2. Turn Off/Restart the Module...........................................................................................37
3.6. Power Output............................................................................................................................37
3.7. Battery Charging and Management..........................................................................................38
3.8. USB Interfaces..........................................................................................................................39
3.9. UART Interfaces........................................................................................................................43
3.10. (U)SIM Interfaces......................................................................................................................44
3.11. SD Card Interface .....................................................................................................................46
3.12. GPIO Interfaces ........................................................................................................................48
3.13. I2C Interfaces............................................................................................................................50
3.14. SPI Interface .............................................................................................................................50
3.15. ADC Interface............................................................................................................................51
3.16. LCM Interface............................................................................................................................51
3.17. Touch Panel Interface...............................................................................................................53
3.18. Camera Interfaces.....................................................................................................................54
3.18.1. MIPI Design considerations...........................................................................................57
3.19. Sensor Interfaces......................................................................................................................58
3.20. Audio Interfaces........................................................................................................................59
3.20.1. Reference Circuit Design for Microphone Interfaces.....................................................60

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 6 / 111
3.20.2. Reference Circuit Design for Earpiece Interface...........................................................61
3.20.3. Reference Circuit Design for Headset Interface............................................................61
3.20.4. Reference Circuit Design for Loudspeaker Interface.....................................................62
3.20.5. Audio Signal Design Considerations .............................................................................62
3.21. Emergency Download Interface................................................................................................63
4Wi-Fi and Bluetooth...........................................................................................................................64
4.1. Wi-Fi Overview..........................................................................................................................64
4.1.1. Wi-Fi Performance.........................................................................................................64
4.2. Bluetooth Overview...................................................................................................................66
4.2.1. Bluetooth Performance ..................................................................................................67
5GNSS...................................................................................................................................................68
5.1. GNSS Performance..................................................................................................................68
5.2. GNSS RF Design Guidelines....................................................................................................69
6Antenna Interfaces.............................................................................................................................70
6.1. Main/Rx-diversity Antenna Interfaces.......................................................................................70
6.1.1. Module Operating Frequencies......................................................................................70
6.1.2. Reference Circuit Design for Main and Rx-diversity Antenna Interfaces......................72
6.2. Wi-Fi/Bluetooth Antenna Interface............................................................................................73
6.3. GNSS Antenna Interface...........................................................................................................74
6.3.1. Reference Circuit Design for PassiveAntenna..............................................................75
6.3.2. Reference Circuit Design for Active Antenna.................................................................75
6.5. Reference Design of RF Layout ...............................................................................................76
6.6. Antenna Installation ..................................................................................................................78
6.6.1. Antenna Requirements..................................................................................................78
6.6.2. Recommended RF Connector for Antenna Installation.................................................79
7Reliability, Radio and Electrical Characteristics............................................................................81
7.1. Absolute Maximum Ratings......................................................................................................81
7.2. Power Supply Ratings...............................................................................................................81
7.3. Operating and Storage Temperatures ......................................................................................82
7.4. Power Consumption..................................................................................................................82
7.5. Tx Power...................................................................................................................................90
7.6. Rx Sensitivity.............................................................................................................................93
7.7. ESD...........................................................................................................................................95
8Mechanical Information.....................................................................................................................96
8.1. Mechanical Dimensions............................................................................................................96
8.2. Recommended Footprint ..........................................................................................................98
8.3. Top and Bottom Views..............................................................................................................99
9Storage, Manufacturing and Packaging........................................................................................100
9.1. Storage Conditions..................................................................................................................100
9.2. Manufacturing and Soldering..................................................................................................101
9.3. Packaging Specifications........................................................................................................103

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 7 / 111
9.3.1. Carrier Tape..................................................................................................................103
9.3.2. Plastic Reel ..................................................................................................................104
9.3.3. Packaging Process ......................................................................................................104
10 Appendix References......................................................................................................................106

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 8 / 111
Table Index
Table 1: Special Mark.................................................................................................................................12
Table 2: SC200L-CE* Frequency Bands....................................................................................................13
Table 3: SC200L-EU Frequency Bands..................................................................................................... 14
Table 4: SC200L-AU* Frequency Bands....................................................................................................14
Table 5: Key Features................................................................................................................................15
Table 6: I/O Parameters Definition.............................................................................................................21
Table 7: Pin Description ............................................................................................................................. 21
Table 8: Power Description ........................................................................................................................37
Table 9: Pin Definition of Charging Interface .............................................................................................38
Table 10: Pin Definition of USB1 Interface.................................................................................................40
Table 11: Pin Definition of USB2 Interface................................................................................................. 41
Table 12: USB Trace Length Inside the Module........................................................................................ 42
Table 13: Pin Definition of UART Interfaces...............................................................................................43
Table 14: Pin Definition of (U)SIM Interfaces............................................................................................. 44
Table 15: Pin Definition of SD Card Interface............................................................................................ 46
Table 16: SD Card Signal Trace Length Inside the Module....................................................................... 47
Table 17: Pin Definition of GPIO Interfaces............................................................................................... 48
Table 18: Pin Definition of I2C Interfaces................................................................................................... 50
Table 19: Pin Definition of SPI Interface....................................................................................................50
Table 20: Pin Definition of ADC Interface...................................................................................................51
Table 21: Pin Definition of LCM Interface .................................................................................................. 51
Table 22: Pin Definition of Touch Panel Interface...................................................................................... 53
Table 23: Pin Definition of Camera Interfaces ...........................................................................................55
Table 24: MIPI Trace Length Inside the Module ........................................................................................ 57
Table 25: Pin Definition of Sensor Interfaces............................................................................................. 58
Table 26: Pin Definition ofAudio Interfaces............................................................................................... 59
Table 27: Wi-Fi Transmitting Performance.................................................................................................64
Table 28: Wi-Fi Receiving Performance..................................................................................................... 65
Table 29: Bluetooth Data Rate and Versions.............................................................................................67
Table 30: Bluetooth Transmitting and Receiving Performance.................................................................. 67
Table 31: GNSS Performance.................................................................................................................... 68
Table 32: Pin Definition of Main/Rx-diversityAntenna Interfaces.............................................................. 70
Table 33: SC200L-CE* Module Operating Frequencies............................................................................ 70
Table 34: SC200L-EU Module Operating Frequencies .............................................................................71
Table 35: SC200L-AU* Module Operating Frequencies............................................................................72
Table 36: Pin Definition of Wi-Fi/Bluetooth Antenna Interface................................................................... 73
Table 37: Wi-Fi/Bluetooth Frequency......................................................................................................... 73
Table 38: Pin Definition of GNSS Antenna.................................................................................................74
Table 39: GNSS Frequencies.....................................................................................................................74
Table 40:Antenna Requirements............................................................................................................... 78
Table 41: Absolute Maximum Ratings........................................................................................................ 81

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 9 / 111
Table 42: Power Supply Ratings................................................................................................................ 81
Table 43: Operating and Storage Temperatures........................................................................................82
Table 44: SC200L-CE* Power Consumption.............................................................................................82
Table 45: SC200L-EU Power Consumption...............................................................................................84
Table 46: SC200L-AU* Power Consumption.............................................................................................87
Table 47: SC200L-CE* RF Output Power..................................................................................................90
Table 48: SC200L-EU RF Output Power................................................................................................... 91
Table 49: SC200L-AU* RF Output Power..................................................................................................92
Table 50: SC200L-CE* RF Receiving Sensitivity.......................................................................................93
Table 51: SC200L-EU RF Receiving Sensitivity........................................................................................ 94
Table 52: SC200L-AU* RF Receiving Sensitivity.......................................................................................94
Table 53: ESD Characteristics (Temperature: 25 °C , Humidity: 45 %)...................................................... 95
Table 54: Recommended Thermal Profile Parameters............................................................................102
Table 55: Carrier Tape Dimension Table (Unit: mm)................................................................................103
Table 56: Plastic Reel Dimension Table (Unit: mm).................................................................................104
Table 57: Related Documents..................................................................................................................106
Table 58: Terms and Abbreviations.......................................................................................................... 106

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 10 / 111
Figure Index
Figure 1: Functional Diagram.....................................................................................................................18
Figure 2: PinAssignment (Perspective View)............................................................................................ 20
Figure 3: Voltage Drop Sample..................................................................................................................33
Figure 4: Star Structure of Power Supply.................................................................................................. 34
Figure 5: Reference Circuit of Power Supply............................................................................................. 34
Figure 6: Turn On the Module Using Driving Circuit..................................................................................35
Figure 7: Turn On the Module Using Keystroke.........................................................................................35
Figure 8: Power-Up Timing ........................................................................................................................36
Figure 9: Restart Timing............................................................................................................................. 37
Figure 10: Reference Design for Battery Charging Circuit........................................................................39
Figure 11: Reference Design for USB1 Interface ...................................................................................... 40
Figure 12: Reference Design for USB1 Power Supply..............................................................................41
Figure 13: Reference Design for USB2 Interface...................................................................................... 41
Figure 14: Reference Design for USB2 Power Supply..............................................................................42
Figure 15: Reference Circuit with Level Translator Chip (for UART0)....................................................... 43
Figure 16: RS-232 Level Match Circuit (for UART0) .................................................................................44
Figure 17: Reference Circuit for (U)SIM Interface with an 8-pin (U)SIM Card Connector........................ 45
Figure 18: Reference Circuit for (U)SIM Interface with a 6-pin (U)SIM Card Connector..........................45
Figure 19: Reference Circuit for SD Card Interface...................................................................................47
Figure 20: Reference Circuit Design for LCM Interface............................................................................. 52
Figure 21: Reference Design of LCM External Backlight Driving Circuit ..................................................53
Figure 22: Reference Circuit Design for Touch Panel Interface ................................................................54
Figure 23: Reference Circuit Design for Two-CameraApplications.......................................................... 56
Figure 24: Reference Design for ECM Microphone................................................................................... 60
Figure 25: Reference Design for MEMS Microphone................................................................................ 60
Figure 26: Reference Circuit Design for Earpiece Interface...................................................................... 61
Figure 27: Reference Circuit Design for Headset Interface....................................................................... 61
Figure 28: Reference Circuit Design for Loudspeaker Interface............................................................... 62
Figure 29: Reference Circuit Design for Emergency Download Interface.................................................63
Figure 30: Reference Circuit Design for Main and Rx-diversityAntenna Interfaces.................................73
Figure 31: Reference Circuit Design for Wi-Fi/Bluetooth Antenna Interface.............................................74
Figure 32: Reference Circuit Design for GNSS PassiveAntenna.............................................................75
Figure 33: Reference Circuit Design for GNSS Active Antenna................................................................ 75
Figure 34: Microstrip Line Design on a 2-layer PCB .................................................................................76
Figure 35: Coplanar Waveguide Line Design on a 2-layer PCB ...............................................................76
Figure 36: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 3 as Reference Ground)............ 77
Figure 37: Coplanar Waveguide Line Design on a 4-layer PCB (Layer 4 as Reference Ground)............ 77
Figure 38: Dimensions of the U.FL-R-SMT Connector (Unit: mm)............................................................79
Figure 39: Mechanicals of U.FL-LP Connectors........................................................................................ 79
Figure 40: Space Factor of Mated Connector (Unit: mm)..........................................................................80
Figure 41: Module Top and Side Dimensions............................................................................................96

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 11 / 111
Figure 42: Module Bottom Dimensions (Bottom View)..............................................................................97
Figure 43: Recommended Footprint (Top View)........................................................................................ 98
Figure 44: Top and Bottom Views..............................................................................................................99
Figure 45: Recommended Reflow Soldering Thermal Profile .................................................................101
Figure 46: Carrier Tape Dimension Drawing............................................................................................103
Figure 47: Plastic Reel Dimension Drawing ............................................................................................104
Figure 48: Packaging Process.................................................................................................................105

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 12 / 111
1Introduction
This document, describing SC200L series (Dual-band Wi-Fi) module and its air and hardware interfaces
connected to your applications, informs you of the interface specifications, electrical and mechanical
details, as well as other related information of the module.
With the application notes and user guides provided separately, you can easily use the module to design
and set up mobile applications.
1.1. Special Mark
Table 1: Special Mark
Mark
Definition
*
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface, pin
name, AT command, or argument, it indicates that the function, feature, interface, pin, AT
command, or argument is under development and currently not supported; and the asterisk (*)
after a model indicates that the sample of such model is currently unavailable.

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 13 / 111
2Product Overview
2.1. Frequency Bands and Functions
SC200L series (Dual-band Wi-Fi) is a series of smart LTE module based on Android operating system,
and provides industrial grade performance. Its general features are listed below:
⚫Supports LTE-FDD, LTE-TDD, HSDPA, HSUPA, WCDMA, EDGE, GSM and GPRS coverage.
⚫Supports short-range wireless communication through Wi-Fi 802.11a/b/g/n/ac and Bluetooth 5.0.
⚫Integrates GPS/GLONASS/BeiDou satellite positioning systems.
⚫Supports multiple audio and video codecs.
⚫Built-in high-performance Mail-T820 graphics processing unit.
⚫Provides multiple audio and video input/output interfaces as well as abundant GPIO interfaces.
SC200L series (Dual-band Wi-Fi) is available in three variants: SC200L-CE*, SC200L-EU, and
SC200L-AU*.
The module supports multiple standards and multiple frequency bands. The corresponding standards and
frequency bands are as follows:
Table 2: SC200L-CE*Frequency Bands
Mode
Frequency bands
LTE-FDD
B1/B3/B5/B8
LTE-TDD
B34/B38/B39/B40/B41(140 MHz)
WCDMA
B1/B8
GSM
900/1800 MHz
Wi-Fi 802.11a/b/g/n/ac
2402–2482 MHz
5180–5825 MHz
Bluetooth 5.0
2402–2480 MHz

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 14 / 111
Table 3: SC200L-EU Frequency Bands
Table 4: SC200L-AU*Frequency Bands
GNSS
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz
Mode
Frequency bands
LTE-FDD
B1/B3/B5/B7/B8/B20/B28
LTE-TDD
B38/B40/B41(200 MHz)
WCDMA
B1/B5/B8
GSM
900/1800 MHz
Wi-Fi 802.11a/b/g/n/ac
2402–2482 MHz
5180–5825 MHz
Bluetooth 5.0
2402–2480 MHz
GNSS
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz
Mode
Frequency bands
LTE-FDD
B1/B2/B3/B4/B5/B7/B8/B28
LTE-TDD
B38
WCDMA
B1/B2/B4/B5/B8
GSM
850/900/1800/1900 MHz
Wi-Fi 802.11a/b/g/n/ac
2402–2482 MHz
5180–5825 MHz
Bluetooth 5.0
2402–2480 MHz
GNSS
GPS: 1575.42 ±1.023 MHz
GLONASS: 1597.5–1605.8 MHz
BeiDou: 1561.098 ±2.046 MHz

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 15 / 111
The module is an SMD module with a total of 274 pins, including 146 LCC pins and 128 LGA pins. The
size is only 40.5 mm ×40.5 mm ×2.85 mm, which can be embedded in various M2M product applications
through pads. It is very suitable for the development of mobile devices such as POS machines, in-vehicle
computers, multimedia terminals, smart homes, and IoT terminals.
2.2. Key Features
Table 5: Key Features
Features
Details
CPU
Quad-core ARM Cortex-A53 CPU @ 1.4 GHz
32 KB L1 I-cache, 32 KB L1 D-cache, 256 KB L2 cache
GPU
Mali-T820 MP1 GPU, working at 680 MHz
Memory
⚫8 GB eMMC + 1 GB LPDDR3 (default)
⚫16 GB eMMC + 2 GB LPDDR3 (optional)
System
Android 10.0
Power
VBAT power supply rang: 3.50–4.20 V
Typical supply voltage: 3.80 V
Transmitting Power
Class 4 (33 dBm ±2 dB) for GSM850
Class 4 (33 dBm ±2 dB) for EGSM900
Class 1 (30 dBm ±2 dB) for DCS1800
Class 1 (30 dBm ±2 dB) for PCS1900
Class E2 (27 dBm ±3 dB) for GSM850 8-PSK
Class E2 (27 dBm ±3 dB) for EGSM900 8-PSK
Class E2 (26 dBm ±3 dB) for DCS1800 8-PSK
Class E2 (26 dBm ±3 dB) for PCS1900 8-PSK
Class 3 (23 dBm ±2 dB) for WCDMA bands
Class 3 (23 dBm ±2 dB) for LTE-FDD bands
Class 3 (23 dBm ±2 dB) for LTE-TDD bands
LTE Features
Supports 3GPP Rel-10 Cat 4 FDD and TDD
Supports 1.4/3/5/10/15/20 MHz RF bandwidth
⚫FDD: Max. 150 Mbps (DL)/ Max. 50 Mbps (UL)
⚫TDD: Max. 130 Mbps (DL)/ Max. 30 Mbps (UL)
UMTS Features
Supports 3GPP Rel-9 HSDPA/HSUPA/WCDMA
Supports QPSK, 16QAM and 64QAM modulation
⚫HSDPA: Max. 21 Mbps
⚫HSUPA: Max. 11 Mbps
⚫WCDMA: Max. 384 kbps (DL)/ Max. 384 kbps (UL)

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 16 / 111
GSM Features
R99
GPRS
Supports GPRS multi-slot level 33 (default 33)
Coding format: CS-1, CS-2, CS-3 and CS-4
Max. 107 kbps (DL)/ Max. 85.6 kbps (UL)
EDGE
Supports EDGE multi-slot level 33 (default 33)
Supports GMSK and 8-PSK modulation and coding methods
Downlink coding format: MCS 1–9
Uplink coding format: MCS 1–9
Max. 296 kbps (DL)/ Max. 236.8 kbps (UL)
WLAN Features
SupportsAP mode and STAmode
⚫2.4 GHz, supports 802.11b/g/n, up to 150 Mbps
⚫5 GHz, supports 802.11a/n/ac, up to 433 Mbps
Bluetooth Features
Supports Bluetooth 5.0
Supports Bluetooth Classic and BLE
GNSS
GPS + GLONASS or GPS + BeiDou
SMS
Text and PDU mode
Point-to-point MO and MT SMS
SMS cell broadcast
LCM Interface
Supports 1 group of 4-lane MIPI_DSI, up to 1.5 Gbps/lane
Supports up to HD+ (1440 ×720 ) @ 60 fps
Camera Interfaces
Supports 2 groups of MIPI_CSI, up to 1.5 Gbps/lane
⚫Front camera: 1-lane MIPI, which can support up to 2 MP camera
⚫Rear camera: 2-lane MIPI, which can support up to 8 MP camera
Video codec
Video codec: encoding + decoding: 1080P @ 30 fps + 1080P @ 30 fps
Wi-Fi video: encoding up to 720P @ 30 fps, decoding up to 1080P @ 30 fps
Audio Interfaces
Audio input
3 analog microphone inputs, external bias voltage circuit is needed
Audio output
⚫Class AB stereo headphone output
⚫Class AB differential earpiece output
⚫Class D differential speaker amplifier output
Audio codec
GSM-FR, GSM-EFR, GSM-HR, AMR, AMR-NB, AMR-WB, EVS-NB,
EVS-WB, EVS-SWB, MP3, AAC, AAC+, PCM
USB Interfaces
Supports 2 USB interfaces which comply with USB 2.0 specification
⚫USB1:
-Supports USB OTG, but does not support USB hub, up to 480 Mbps
-Used for AT command transmission, data transmission, software
debugging and firmware upgrade
⚫USB2
-Supports USB host mode only, supports USB hub, up to 100 Mbps

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 17 / 111
2.3. Functional Diagram
The following figure shows a block diagram of the module and illustrates the major functional parts.
⚫Power management
⚫RF part
⚫Baseband part
⚫LPDDR3 + eMMC memory
⚫Peripheral interfaces
-- USB interfaces
-- (U)SIM interfaces
-- UART interfaces
1
Within the operating temperature range, the module is 3GPP compliant.
UART Interfaces
2 UART interfaces:
⚫UART0: 4-wire UART interface, supports RTS and CTS hardware flow
control, up to 3.25 Mbps
⚫Debug UART: 2-wire UART interface, used for debugging by default
SD Card Interface
Supports SD 3.0
Supports 1.8 V or 3.0 V SD card
Supports SD card hot-plug
(U)SIM Interfaces
2 (U)SIM interfaces
Supports USIM/SIM card: 1.80 V or 2.95 V
Supports Dual Card Dual Standby by default
I2C Interfaces
4 I2C interfaces
Used for peripherals such as touch screen, camera, sensor, etc.
SPI Interface
1 SPI interface multiplexed from GPIO interfaces
Used for fingerprint recognition or other peripherals
ADC Interface
1 general-purpose ADC interface
Supports up to 12-bit resolution
Antenna Interfaces
Main antenna, Rx-diversity antenna, GNSS antenna, Wi-Fi/Bluetooth antenna
interfaces
Physical Characteristics
Size: (40.5 ±0.15) mm × (40.5 ±0.15) mm × (2.85 ±0.2) mm
Package: LCC + LGA
Weight: Approx. 10.0 g
Temperature Range
⚫Operating temperature range: -30 °C to +75 °C 1
⚫Storage temperature range: -40 °C to +90 °C
Software Upgrade
Via USB interface or OTA
RoHS
All hardware components are fully compliant with EU RoHS standards

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 18 / 111
-- SD card interface
-- I2C interfaces
-- ADC interface
-- LCM (MIPI) interface
-- TP (Touch Panel) interface
-- Camera (MIPI) interfaces
-- Audio interfaces
Baseband
Transceiver
LPDDR
eMMC
ANT_GNSS ANT_WIFI/BT
GPIOs
I2C
SD 3.0
UART
2×(U)SIM
USB
2.0
2×CAM
TPLCM
EAR
SPK
MICs
ADC
32K
BBCLK
MEM
Multimedia Connectivity
Air Interface
Processors
Codec
Power
Signal
Power
Function
RF Frontend GNSS
Frontend
ANT_DRX
ANT_MAIN
26M
TSX
PMU
ADC
Headset
PWRKEY
VOL_UP VOL_DOWN
SD_VDD
USIM1_VDD
USIM2_VDD
LDO1_1V85
LDO2_1V8
LDO3_2V8
LDO4_2V8
VBAT_BB
VBAT_RF
WCN
WIFI/BT
Frontend
32K
26M
USB 20
.
Hub
Figure 1: Functional Diagram
2.4. EVB
To help you design and test applications with the module, Quectel supplies an evaluation kit, which
includes an evaluation board, a USB to RS-232 converter cable, a USB data cable, an earphone,
antennas, etc. For more details, see document [1].

Smart Module Series
SC200L_Series(Dual-band Wi-Fi)_Hardware_Design 19 / 111
3Application Interfaces
3.1. General Description
The following chapters provide the detailed description of pins/interfaces listed below.
⚫Power supply
⚫USB interfaces
⚫UART interfaces
⚫(U)SIM interfaces
⚫SD card interface
⚫GPIO interfaces
⚫I2C interfaces
⚫SPI interface
⚫ADC interface
⚫LCM interface
⚫Touch panel interface
⚫Camera interfaces
⚫Sensor interfaces
⚫Audio interfaces
⚫Emergency download interface