Quectel FC80A User manual

FC80A User Manual
Wi-Fi&Bluetooth Module Series
Version: 1.0.3
Date: 2021-12-31
Status: Preliminary

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Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causesdistraction
and can lead to an accident. Please comply with laws and regulationsrestricting the
use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in hospitals,
clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergent help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives and
transmits radio frequency signals. RF interference can occur if it is used close to TV
sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular terminals.
Areas with explosive or potentially explosive atmospheres include fuelling areas,
below decks on boats, fuel or chemical transfer or storage facilities, and areas
where the air contains chemicals or particles such as grain, dust or metal powders.

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About the Document
Revision History
Version
Date
Author
Description
-
2021-04-15
Elinor WANG/
Lucas HUANG
Creation of the document
1.0.0
2021-04-15
Elinor WANG/
Lucas HUANG
Preliminary
1.0.1
2021-08-13
Elinor WANG/
Lucas HUANG
Preliminary:
1. Updated the data in Chapter 4.
2. Updated the packaging information in Chapter 6.3.
1.0.2
2021-11-25
Elinor WANG
Preliminary:
1. Updated the data in Chapter 4.5 -4.7
2. Updated the packaging information in Chapter 6.3.
1.0.3
2021-12-31
Macky Xu
Preliminary:
1. Updated the data in Chapter 4.6

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Contents
Safety Information...................................................................................................................................... 3
About the Document.................................................................................................................................. 4
Contents...................................................................................................................................................... 5
Table Index.................................................................................................................................................. 7
Figure Index................................................................................................................................................ 8
1Introduction......................................................................................................................................... 9
1.1. Special Mark .............................................................................................................................. 9
2Product Overview ............................................................................................................................. 10
2.1. General Description................................................................................................................. 10
2.2. Key Features............................................................................................................................ 10
2.3. Functional Diagram.................................................................................................................. 12
2.4. Evaluation Board...................................................................................................................... 12
3Application Interfaces ...................................................................................................................... 13
3.1. Pin Assignment........................................................................................................................ 13
3.2. Pin Description......................................................................................................................... 14
3.3. Power Supply........................................................................................................................... 17
3.4. WLAN Application Interface..................................................................................................... 18
3.4.1. WLAN_EN..................................................................................................................... 18
3.4.2. WLAN_WAKE............................................................................................................... 18
3.4.3. SDIO Interface.............................................................................................................. 19
3.5. Bluetooth Application Interface................................................................................................ 20
3.5.1. BT_EN .......................................................................................................................... 21
3.5.2. UART Interface............................................................................................................. 21
3.5.3. BT_WAKE_HOST* and HOST_WAKE_BT*................................................................ 22
3.5.4. PCM Interface*.............................................................................................................. 22
3.6. Other Interfaces ....................................................................................................................... 23
3.6.1. WLAN_SLP_CLK.......................................................................................................... 23
3.6.2. SDIO_VSEL.................................................................................................................. 23
3.7. RF Antenna Interfaces............................................................................................................. 24
4Reliability, Radio and Electrical Characteristics........................................................................... 25
4.1. Electrical Characteristics.......................................................................................................... 25
4.2. I/O Interface Characteristics .................................................................................................... 25
4.3. Operating and Storage Temperatures..................................................................................... 26
4.4. Power Consumption................................................................................................................. 27
4.4.1. Power Consumption in Low Power Modes*................................................................. 27
4.4.2. Power Consumption ..................................................................................................... 27
4.5. RF Performances..................................................................................................................... 29

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4.5.1. Conducted RF Output Power ....................................................................................... 30
4.5.2. Conducted RF Receiving Sensitivity............................................................................ 31
4.6. Bluetooth Performance............................................................................................................ 32
4.7. ESD Protection......................................................................................................................... 32
5Mechanical Information.................................................................................................................... 33
5.1. Mechanical Dimensions........................................................................................................... 33
5.2. Recommended Footprint ......................................................................................................... 34
5.3. Top and Bottom Views............................................................................................................. 35
6Storage, Manufacturing and Packaging......................................................................................... 36
6.1. Storage Conditions................................................................................................................... 36
6.2. Manufacturing and Soldering................................................................................................... 37
6.3. Packaging Specifications......................................................................................................... 39
6.3.1. Carrier Tape.................................................................................................................. 39
6.3.2. Plastic Reel................................................................................................................... 40
6.3.3. Packaging Process....................................................................................................... 41
7Appendix Reference......................................................................................................................... 42
8Compliance Information................................................................................................................... 44

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Table Index
Table 1: Special Mark...................................................................................................................................9
Table 2: Key Features................................................................................................................................10
Table 3: I/O Parameters Definition............................................................................................................. 14
Table 4: Pin Description............................................................................................................................. 14
Table 5: Definition of Power Supply and GND Pins...................................................................................17
Table 6: Pin Definition of WLAN_EN .........................................................................................................18
Table 7: Pin Definition of WLAN_WAKE.................................................................................................... 18
Table 8: Pin Definition of SDIO Interface...................................................................................................19
Table 9: Pin Definition of BT_EN............................................................................................................... 21
Table 10: Pin Definition of UART Interface................................................................................................21
Table 11: Pin Definition of BT_WAKEUP_HOST and HOST_WAKEUP_BT............................................ 22
Table 12: Pin Definition of PCM Interface.................................................................................................. 22
Table 13: Pin Definition of WLAN_SLP_CLK Interface............................................................................. 23
Table 14: Pin Definition of SDIO_VSEL..................................................................................................... 23
Table 15: Pin Definition of RF Antenna Interfaces.....................................................................................24
Table 16: Absolute Maximum Ratings.......................................................................................................25
Table 17: Recommended Operating Conditions........................................................................................25
Table 18: General DC Electrical Characteristics for 1.8 V Domain...........................................................26
Table 19: General DC Electrical Characteristics for 3.3 V Domain........................................................... 26
Table 20: Operating and Storage Temperatures....................................................................................... 26
Table 21: Power Consumption in OFF State and Idle...............................................................................27
Table 22: Power Consumption in ANT_WIFI0/BT (SISO Mode, Unit: mA) .............................................27
Table 23: Power consumption in ANT_WIFI1 (SISO Mode, Unit: mA).................................................. 28
Table 24: Power consumption in MIMO Mode (Unit: mA).........................................................................29
Table 25: Conducted RF Output Power at 2.4 GHz.................................................................................. 30
Table 26: Conducted RF Output Power at 5 GHz..................................................................................... 30
Table 27: Conducted RF Receiving Sensitivity at 2.4 GHz....................................................................... 31
Table 28: Conducted RF Receiving Sensitivity at 5 GHz..........................................................................31
Table 29: Bluetooth Transmitting and Receiving Performance.................................................................32
Table 30: Electrostatic Discharge Characteristics (25 ºC, 45 % Relative Humidity).................................32
Table 31: Recommended Thermal Profile Parameters............................................................................. 38
Table 32: Carrier Tape Dimension Table (Unit: mm)................................................................................. 39
Table 33: Plastic Reel Dimension Table (Unit: mm)..................................................................................40
Table 34: Related Documents....................................................................................................................42
Table 35: Terms and Abbreviations...........................................................................................................42

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Figure Index
Figure 1: Functional Diagram of FC80A.................................................................................................... 12
Figure 2: Pin Assignment (Top View) ........................................................................................................13
Figure 3: Turn Up Timing...........................................................................................................................17
Figure 4: WLAN Application Interface Connection.................................................................................... 18
Figure 5: SDIO Interface Connection......................................................................................................... 19
Figure 6: Block Diagram of Bluetooth Application Interface Connection...................................................20
Figure 7: Reference Design for UART Interface Connection .................................................................... 22
Figure 8: PCM Interface Connection..........................................................................................................23
Figure 9: Top and Side Dimensions (Top and Side View)......................................................................... 33
Figure 10: Recommended Footprint (Top View)........................................................................................34
Figure 11: Top and Bottom Views of the Module.......................................................................................35
Figure 12: Recommended Reflow Soldering Thermal Profile ................................................................... 37
Figure 13: Carrier Tape Dimension Drawing.............................................................................................39
Figure 14: Package Sketch Map................................................................................................................39
Figure 15: Plastic Reel Dimension Drawing ..............................................................................................40
Figure 16: Packaging Process...................................................................................................................41

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1Introduction
This document defines the FC80A and describes its air interfaces and hardware interfaces which are
connected with your application.
This document can help you quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of the module. Associated with application notes
and user guides, you can use FC80A to design and set up applications easily.
1.1. Special Mark
Table 1: Special Mark
Mark
Definition
*
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface,
pin name, AT command, or argument, it indicates that the function, feature, interface, pin,
AT command, or argument is under development and currently not supported; and the
asterisk (*) after a model indicates that the sample of such model is currently unavailable.