Quectel BG96 Supplement

BG96 Hardware Design
LTE Module Series
Rev. BG96_Hardware_Design_V1.2
Date: 2017-12-22
Status: Released
www.quectel.com

LTE Module Series
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About the Document
History
Revision
Date
Author
Description
1.0
2017-08-04
Lyndon LIU/
Daryl DU
Initial
1.1
2017-08-31
Daryl DU
1. Modified GSM features in Table 2.
2. Added a note for e-I-DRX in Chapter 3.3.
3. Elaborated the description of e-I-DRX in Chapter
3.4.3.
4. Updated RF receiving sensitivity in Chapter 6.6.
1.2
2017-12-22
Lyndon LIU/
Daryl DU
1. Added the storage temperature of the module in
Table 2 and Chapter 6.3.
2. Updated transmitting power values in Table 2.
3. Added the description of sleep mode in Table 5 and
Chapter 3.4.4.
4. Added the description of ADC interfaces in Chapter
3.16.
5. Updated the GNSS performance in Table 21.
6. Updated the peak supply current values in Table 28.
7. Updated the current consumption values in Chapter
6.4.
8. Updated RF output power values in Table 34.
9. Updated LTE Cat NB1 RF receiving sensitivity values
(without repetitions) in Table 35.
10. Updated the recommended footprint in Chapter 7.2.

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Contents
About the Document...................................................................................................................................2
Contents.......................................................................................................................................................3
Table Index...................................................................................................................................................5
Figure Index.................................................................................................................................................7
1Introduction..........................................................................................................................................8
1.1. Safety Information......................................................................................................................9
2Product Concept................................................................................................................................10
2.1. General Description.................................................................................................................10
2.2. Key Features ........................................................................................................................... 11
2.3. Functional Diagram .................................................................................................................13
2.4. Evaluation Board .....................................................................................................................14
3Application Interfaces .......................................................................................................................15
3.1. Pin Assignment........................................................................................................................16
3.2. Pin Description.........................................................................................................................17
3.3. Operating Modes.....................................................................................................................23
3.4. Power Saving...........................................................................................................................24
3.4.1. Airplane Mode................................................................................................................24
3.4.2. Power Saving Mode (PSM)............................................................................................25
3.4.3. Extended Idle Mode DRX (e-I-DRX)..............................................................................25
3.4.4. Sleep Mode....................................................................................................................26
3.4.4.1. UARTApplication.................................................................................................26
3.5. Power Supply...........................................................................................................................27
3.5.1. Power Supply Pins.........................................................................................................27
3.5.2. Decrease Voltage Drop..................................................................................................27
3.5.3. Monitor the Power Supply..............................................................................................28
3.6. Turn on and off Scenarios .......................................................................................................28
3.6.1. Turn on Module Using the PWRKEY Pin.......................................................................28
3.6.2. Turn off Module..............................................................................................................30
3.6.2.1. Turn off Module Using the PWRKEY Pin.............................................................30
3.6.2.2. Turn off Module UsingAT Command...................................................................31
3.7. Reset the Module.....................................................................................................................31
3.8. (U)SIM Interface ......................................................................................................................33
3.9. USB Interface ..........................................................................................................................35
3.10. UART Interfaces......................................................................................................................36
3.11. PCM* and I2C* Interfaces .......................................................................................................39
3.12. Network Status Indication........................................................................................................40
3.13. STATUS...................................................................................................................................41
3.14. Behaviors of RI........................................................................................................................42
3.15. USB_BOOT Interface..............................................................................................................43
3.16. ADC Interfaces*.......................................................................................................................43

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4GNSS Receiver...................................................................................................................................45
4.1. General Description.................................................................................................................45
4.2. GNSS Performance.................................................................................................................45
4.3. Layout Guidelines....................................................................................................................46
5Antenna Interfaces.............................................................................................................................47
5.1. Main Antenna Interface ...........................................................................................................47
5.1.1. Pin Definition..................................................................................................................47
5.1.2. Operating Frequency .....................................................................................................47
5.1.3. Reference Design of RF Antenna Interface...................................................................48
5.1.4. Reference Design of RF Layout.....................................................................................48
5.2. GNSS Antenna Interface.........................................................................................................50
5.3. Antenna Installation.................................................................................................................52
5.3.1. Antenna Requirements..................................................................................................52
5.3.2. Recommended RF Connector forAntenna Installation.................................................52
6Electrical, Reliability and Radio Characteristics............................................................................55
6.1. Absolute Maximum Ratings.....................................................................................................55
6.2. Power Supply Ratings.............................................................................................................55
6.3. Operation and Storage Temperatures.....................................................................................56
6.4. Current Consumption ..............................................................................................................56
6.5. RF Output Power.....................................................................................................................60
6.6. RF Receiving Sensitivity..........................................................................................................61
6.7. Electrostatic Discharge............................................................................................................62
7Mechanical Dimensions....................................................................................................................63
7.1. Mechanical Dimensions of the Module....................................................................................63
7.2. Recommended Footprint and Stencil Design..........................................................................65
7.3. Design Effect Drawings of the Module....................................................................................67
8Storage, Manufacturing and Packaging..........................................................................................68
8.1. Storage ....................................................................................................................................68
8.2. Manufacturing and Soldering ..................................................................................................69
8.3. Packaging................................................................................................................................69
9Appendix A References.....................................................................................................................72
10 Appendix B GPRS Coding Schemes...............................................................................................75
11 Appendix C GPRS Multi-slot Classes..............................................................................................76
12 Appendix D EDGE Modulation and Coding Schemes ...................................................................78

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Table Index
TABLE 1: FREQUENCY BANDS OF BG96 MODULE...................................................................................... 10
TABLE 2: KEY FEATURES OF BG96 MODULE................................................................................................11
TABLE 3: DEFINITION OF I/O PARAMETERS................................................................................................. 17
TABLE 4: PIN DESCRIPTION........................................................................................................................... 17
TABLE 5: OVERVIEW OF OPERATING MODES............................................................................................. 23
TABLE 6: VBAT AND GND PINS....................................................................................................................... 27
TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 29
TABLE 8: RESET_N PIN DESCRIPTION ......................................................................................................... 31
TABLE 9: PIN DEFINITION OF (U)SIM INTERFACE....................................................................................... 33
TABLE 10: PIN DEFINITION OF USB INTERFACE ......................................................................................... 35
TABLE 11: PIN DEFINITION OF UART1 INTERFACE..................................................................................... 37
TABLE 12: PIN DEFINITION OF UART2 INTERFACE..................................................................................... 37
TABLE 13: PIN DEFINITION OF UART3 INTERFACE..................................................................................... 37
TABLE 14: LOGIC LEVELS OF DIGITAL I/O.................................................................................................... 38
TABLE 15: PIN DEFINITION OF PCM* AND I2C* INTERFACES .................................................................... 39
TABLE 16: PIN DEFINITION OF NETLIGHT.................................................................................................... 40
TABLE 17: WORKING STATE OF NETLIGHT.................................................................................................. 41
TABLE 18: PIN DEFINITION OF STATUS ........................................................................................................ 41
TABLE 19: DEFAULT BEHAVIORS OF RI ........................................................................................................ 42
TABLE 20: PIN DEFINITION OF USB_BOOT INTERFACE............................................................................. 43
TABLE 21: PIN DEFINITION OF ADC INTERFACES....................................................................................... 44
TABLE 22: CHARACTERISTICS OF ADC INTERFACES ................................................................................ 44
TABLE 23: GNSS PERFORMANCE ................................................................................................................. 45
TABLE 24: PIN DEFINITION OF MAIN ANTENNA INTERFACE...................................................................... 47
TABLE 25: MODULE OPERATING FREQUENCIES........................................................................................ 47
TABLE 26: PIN DEFINITION OF GNSS ANTENNA INTERFACE..................................................................... 50
TABLE 27: GNSS FREQUENCY....................................................................................................................... 51
TABLE 28: ANTENNA REQUIREMENTS.......................................................................................................... 52
TABLE 29: ABSOLUTE MAXIMUM RATINGS .................................................................................................. 55
TABLE 30: POWER SUPPLY RATINGS........................................................................................................... 55
TABLE 31: OPERATION AND STORAGE TEMPERATURES.......................................................................... 56
TABLE 32: BG96 CURRENT CONSUMPTION................................................................................................. 57
TABLE 33: GNSS CURRENT CONSUMPTION................................................................................................ 60
TABLE 34: RF OUTPUT POWER ..................................................................................................................... 60
TABLE 35: BG96 CONDUCTED RF RECEIVING SENSITIVITY ..................................................................... 61
TABLE 36: ELECTROSTATIC DISCHARGE CHARACTERISTICS ................................................................. 62
TABLE 37: REEL PACKAGING......................................................................................................................... 71
TABLE 38: RELATED DOCUMENTS................................................................................................................ 72
TABLE 39: TERMS AND ABBREVIATIONS...................................................................................................... 72
TABLE 40: DESCRIPTION OF DIFFERENT CODING SCHEMES.................................................................. 75
TABLE 41: GPRS MULTI-SLOT CLASSES ...................................................................................................... 76

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TABLE 42: EDGE MODULATION AND CODING SCHEMES........................................................................... 78

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Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 13
FIGURE 2: PIN ASSIGNMENT (TOP VIEW)..................................................................................................... 16
FIGURE 3: SLEEP MODE APPLICATION VIA UART....................................................................................... 26
FIGURE 4: STAR STRUCTURE OF THE POWER SUPPLY............................................................................ 28
FIGURE 5: TURN ON THE MODULE USING DRIVING CIRCUIT................................................................... 29
FIGURE 6: TURN ON THE MODULE USING KEYSTROKE ........................................................................... 29
FIGURE 7: TIMING OF TURNING ON MODULE ............................................................................................. 30
FIGURE 8: TIMING OF TURNING OFF MODULE ........................................................................................... 31
FIGURE 9: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ........................................ 32
FIGURE 10: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 32
FIGURE 11: TIMING OF RESETTING MODULE.............................................................................................. 32
FIGURE 12: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
........................................................................................................................................................................... 34
FIGURE 13: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR. 34
FIGURE 14: REFERENCE CIRCUIT OF USB APPLICATION ......................................................................... 36
FIGURE 15: REFERENCE CIRCUIT WITH TRANSLATOR CHIP ................................................................... 38
FIGURE 16: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT.............................................................. 39
FIGURE 17: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC.................................... 40
FIGURE 18: REFERENCE CIRCUIT OF THE NETWORK STATUS INDICATOR........................................... 41
FIGURE 19: REFERENCE CIRCUIT OF STATUS ........................................................................................... 42
FIGURE 20: REFERENCE CIRCUIT OF USB_BOOT INTERFACE................................................................ 43
FIGURE 21: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE............................................................. 48
FIGURE 22: MICROSTRIP LINE DESIGN ON A 2-LAYER PCB...................................................................... 49
FIGURE 23: COPLANAR WAVEGUIDE LINE DESIGN ON A 2-LAYER PCB.................................................. 49
FIGURE 24: COPLANAR WAVEGUIDE LINE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE
GROUND).......................................................................................................................................................... 49
FIGURE 25: COPLANAR WAVEGUIDE LINE DESIGN ON A4-LAYER PCB (LAYER 4 AS REFERENCE
GROUND).......................................................................................................................................................... 50
FIGURE 26: REFERENCE CIRCUIT OF GNSS ANTENNA INTERFACE........................................................ 51
FIGURE 27: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM)................................................ 53
FIGURE 28: MECHANICALS OF U.FL-LP CONNECTORS............................................................................. 53
FIGURE 29: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) ........................................................... 54
FIGURE 30: MODULE TOP AND SIDE DIMENSIONS..................................................................................... 63
FIGURE 31: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW)................................................................. 64
FIGURE 32: RECOMMENDED FOOTPRINT (TOP VIEW).............................................................................. 65
FIGURE 33: RECOMMENDED STENCIL DESIGN (TOP VIEW)..................................................................... 66
FIGURE 34: TOP VIEW OF THE MODULE...................................................................................................... 67
FIGURE 35: BOTTOM VIEW OF THE MODULE.............................................................................................. 67
FIGURE 36: REFLOW SOLDERING THERMAL PROFILE.............................................................................. 69
FIGURE 37: TAPE DIMENSIONS..................................................................................................................... 70
FIGURE 38: REEL DIMENSIONS..................................................................................................................... 70

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1Introduction
This document defines BG96 module and describes its air interface and hardware interfaces which are
connected with customers’applications.
This document can help customers quickly understand the interface specifications, electrical and
mechanical details, as well as other related information of BG96. To facilitate its application in different
fields, reference design is also provided for customers’ reference. Associated with application note and
user guide, customers can use the module to design and set up mobile applications easily.

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1.1. Safety Information
The following safety precautions must be observed during all phases of the operation, such as usage,
service or repair of any cellular terminal or mobile incorporating BG96. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for
customers’failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. You must comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden, so as
to prevent interference with communication systems. Consult the airline staff about
the use of wireless devices on boarding the aircraft, if your device offers an
Airplane Mode which must be enabled prior to boarding an aircraft.
Switch off your wireless device when in hospitals, clinics or other health care
facilities. These requests are designed to prevent possible interference with
sensitive medical equipment.
Cellular terminals or mobiles operating over radio frequency signal and cellular
network cannot be guaranteed to connect in all conditions, for example no mobile
fee or with an invalid (U)SIM card. While you are in this condition and need
emergent help, please remember using emergency call. In order to make or
receive a call, the cellular terminal or mobile must be switched on and in a service
area with adequate cellular signal strength.
Your cellular terminal or mobile contains a transmitter and receiver. When it is ON,
it receives and transmits radio frequency energy. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

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2Product Concept
2.1. General Description
BG96 is an embedded IoT (LTE Cat M1, LTE Cat NB1 and EGPRS) wireless communication module. It
provides data connectivity on LTE-TDD/LTE-FDD/GPRS/EDGE networks, and supports half-duplex
operation in LTE networks. It also provides GNSS1) and voice functionality2) to meet customers’specific
application demands. The following table shows the frequency bands of BG96 module.
Table 1: Frequency Bands of BG96 Module
1. 1) GNSS function is optional.
2. 2) BG96 supports VoLTE (Voice over LTE) under LTE Cat M1 network.
3. 3) BG96 GSM only supports Packet Switch.
With a compact profile of 22.5mm ×26.5mm ×2.3mm, BG96 can meet almost all requirements for M2M
applications such as smart metering, tracking system, security, wireless POS, etc.
BG96 is an SMD type module which can be embedded into applications through its 102 LGApads. BG96
supports internet service protocols like TCP, UDP and PPP. Extended AT commands have been
developed for customers to use these internet service protocols easily.
Module
LTE Bands
GSM 3)
Rx-diversity
GNSS 1)
BG96
Cat M1 & NB1:
LTE-FDD:
B1/B2/B3/B4/B5/B8/B12/
B13/B18/B19/B20/B26/B28
LTE-TDD: B39 (for Cat M1 only)
GSM850/GSM900/
DCS1800/PCS1900
Not
Supported
GPS,
GLONASS,
BeiDou/Compass,
Galileo, QZSS
NOTES

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2.2. Key Features
The following table describes the detailed features of BG96 module.
Table 2: Key Features of BG96 Module
Features
Details
Power Supply
Supply voltage: 3.3V~4.3V
Typical supply voltage: 3.8V
Transmitting Power
Class 3 (23dBm±2dB) for LTE-FDD bands
Class 3 (23dBm±2dB) for LTE-TDD bands
Class 4 (33dBm±2dB) for GSM850
Class 4 (33dBm±2dB) for GSM900
Class 1 (30dBm±2dB) for DCS1800
Class 1 (30dBm±2dB) for PCS1900
Class E2 (27dBm±3dB) for GSM850 8-PSK
Class E2 (27dBm±3dB) for GSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 8-PSK
Class E2 (26dBm±3dB) for PCS1900 8-PSK
LTE Features
Support LTE Cat M1 and LTE Cat NB1
Support 1.4MHz RF bandwidth for LTE Cat M1
Support 200KHz RF bandwidth for LTE Cat NB1
Support SISO in DL direction
Cat M1: Max. 300Kbps (DL)/375Kbps (UL)
Cat NB1: Max. 32Kbps (DL)/70Kbps (UL)
GSM Features
GPRS:
Support GPRS multi-slot class 33 (33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max. 107Kbps (DL), Max. 85.6Kbps (UL)
EDGE:
Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Max. 296Kbps (DL), Max. 236.8Kbps (UL)
Internet Protocol
Features
Support PPP/TCP/UDP/SSL/TLS/FTP(S)/HTTP(S) protocols
Support PAP (Password Authentication Protocol) and CHAP (Challenge
Handshake Authentication Protocol) protocols which are usually used for
PPP connections
SMS
Text and PDU mode

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Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interface
Support USIM/SIM card: 1.8V, 3.0V
Audio Feature*
Support one digital audio interface: PCM interface
USB Interface
Compliant with USB 2.0 specification (slave only) and the data transfer rate
can reach up to 480Mbps
Used for AT command communication, data transmission, GNSS NEMA
output, software debugging and firmware upgrade
Support USB drivers for Windows XP, Windows Vista, Windows 7,
Windows 8/8.1, Windows 10, Windows CE 5.0/6.0/7.0, Linux 2.6/3.x/4.1,
Android 4.x/5.x/6.x/7.x
UART Interfaces
UART1:
Used for data transmission and AT command communication
115200bps by default
The default frame format is 8N1 (8 data bits, no parity, 1 stop bit)
Support RTS and CTS hardware flow control
UART2:
Used for module debugging and log output
115200bps baud rate
UART3:
Used for outputting GNSS data or NEMA sentences
115200bps baud rate
AT Commands
3GPP TS 27.007 and 3GPP TS 27.005 AT commands, as well as
Quectel enhanced AT commands
Network Indication
One NETLIGHT pin for network connectivity status indication
Antenna Interfaces
Including main antenna (ANT_MAIN) and GNSS antenna (ANT_GNSS)
interfaces
Physical Characteristics
Size: (22.5±0.15)mm ×(26.5±0.15)mm ×(2.3±0.2)mm
Weight: approx. 3.1g
Temperature Range
Operation temperature range: -35°C ~ +75°C 1)
Extended temperature range: -40°C ~ +85°C 2)
Storage temperature range: -40°C ~ +90°C
Firmware Upgrade
USB interface, DFOTA
RoHS
All hardware components are fully compliant with EU RoHS directive
1. “*”means under development.
2. 1) Within operation temperature range, the module is 3GPP compliant.
NOTES

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3. 2) Within extended temperature range, the module remains the ability to establish and maintain a
voice, SMS, data transmission, emergency call, etc. There is no unrecoverable malfunction. There
are also no effects on radio spectrum and no harm to radio network. Only one or more parameters like
Pout might reduce in their value and exceed the specified tolerances. When the temperature returns to
the normal operating temperature levels, the module will meet 3GPP specifications again.
2.3. Functional Diagram
The following figure shows a block diagram of BG96 and illustrates the major functional parts.
Power management
Baseband
DDR+NAND flash
Radio frequency
Peripheral interfaces
Baseband
PMIC
Transceiver
NAND
DDR2
SDRAM
PA
(2G+ASM)
Filter
ANT_MAIN ANT_GNSS
VBAT_BB
VBAT_RF
PWRKEY
VDD_EXT USB (U)SIM PCM* I2C*
RESET_N
19.2M
XO
STATUS
GPIOs
Control
IQ Control
LNA
Tx Rx GNSS
UARTs
NETLIGHT
PA
(4G)
ADCs
Figure 1: Functional Diagram

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“*” means under development.
2.4. Evaluation Board
In order to help customers develop applications conveniently with BG96, Quectel supplies the evaluation
board (EVB), USB to RS-232 converter cable, USB data cable, earphone, antenna and other peripherals
to control or test the module. For more details, please refer to document [1].
NOTE

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3Application Interfaces
BG96 is equipped with 102 LGA pads that can be connected to customers’cellular application platforms.
The following sub-chapters will provide detailed description of interfaces listed below:
Power supply
(U)SIM interface
USB interface
UART interfaces
PCM* and I2C* interfaces
Status indication
USB_BOOT interface
ADC interfaces*
“*”means under development.
NOTE

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3.1. Pin Assignment
The following figure shows the pin assignment of BG96.
PSM_IND*
PCM_SYNC*
PCM_CLK*
PCM_IN*
PCM_OUT*
RESERVED
RESERVED
PWRKEY1)
RESERVED
RESET_N
W_DISABLE#
1
2
3
4
5
6
7
11
12
13
14
15
16
17
50 51 52 53 54
55
58 59 60 61 62
USB_DM
AP_READY*
STATUS
NETLIGHT
DBG_RXD
DBG_TXD
ADC0*
RESERVED
GPIO26
UART3_TXD
UART3_RXD
VDD_EXT
DTR
GND
USIM_CLK
USIM_DATA
USIM_RST
USIM_VDD
RI
DCD
CTS
TXD
RXD
VBAT_BB
VBAT_BB
USIM_GND
GND
RESERVED
31 30 29 28 27 26 23 22 21 20 19
10
9
USB_DP
USB_VBUS
ADC1*
GND
RESERVED
RESERVED
RTS
I2C_SCL*
I2C_SDA*
8
49
48
47
46
45
44
43
40
41
42
39
38
37
36
35
34
33
32
24
57
56
GND GND
ANT_MAIN
GND GND
VBAT_RF
VBAT_RF
GND
GND
ANT_GNSS
RESERVED
GND
USIM_PRESENCE
63
64
65
66
67
68
83
84
85
86
87
88
98
97
96
95
94
93
78
77
76
75
74
73
91 92
89 90
71 72
69 70
80 79
82 81
100 99
102 101
POWER USB UART USIM OTHERS
GND RESERVED
PCM ANT
25
RESERVED
USB_BOOT
18
GPIO64
Figure 2: Pin Assignment (Top View)

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1. Keep all RESERVED pins and unused pins unconnected.
2. GND pads should be connected to ground in the design.
3. 1) PWRKEY output voltage is 0.8V because of the diode drop in the Qualcomm chipset.
4. “*” means under development.
3.2. Pin Description
The following tables show the pin definition and description of BG96.
Table 3: Definition of I/O Parameters
Type
Description
IO
Bidirectional
DI
Digital input
DO
Digital output
PI
Power input
PO
Power output
AI
Analog input
AO
Analog output
OD
Open drain
Table 4: Pin Description
Power Supply
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
VBAT_BB
32, 33
PI
Power supply
for module’s
baseband part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
VBAT_RF
52, 53
PI
Power supply
for module’s RF
part
Vmax=4.3V
Vmin=3.3V
Vnorm=3.8V
NOTES

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VDD_EXT
29
PO
Provide 1.8V for
external circuit
Vnorm=1.8V
IOmax=50mA
Power supply for external
GPIO’s pull up circuits.
GND
3, 31, 48,
50, 54, 55,
58, 59, 61,
62, 67~74,
79~82,
89~91,
100~102
Ground
Turn on/off
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
PWRKEY
15
DI
Turn on/off the
module
VIHmax=2.1V
VIHmin=1.3V
VILmax=0.5V
The output voltage is
0.8V because of the
diode drop in the
Qualcomm chipset.
RESET_N
17
DI
Reset signal of
the module
VIHmax=2.1V
VIHmin=1.3V
VILmax=0.5V
If unused, keep this pin
open.
Status Indication
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
STATUS
20
DO
Indicate the
module’s
operation status
VOHmin=1.35V
VOLmax=0.45V
1.8V power domain.
If unused, keep this pin
open.
NETLIGHT
21
DO
Indicate the
module’s
network activity
status
VOHmin=1.35V
VOLmax=0.45V
1.8V power domain.
If unused, keep this pin
open.
USB Interface
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
USB_VBUS
8
PI
USB detection
Vmax=5.25V
Vmin=3.0V
Vnorm=5.0V
USB_DP
9
IO
USB differential
data bus (+)
Compliant with
USB 2.0 standard
specification.
Require differential
impedance of 90Ω.
USB_DM
10
IO
USB differential
data bus (-)
Compliant with
USB 2.0 standard
specification.
Require differential
impedance of 90Ω.

LTE Module Series
BG96 Hardware Design
BG96_Hardware_Design 19 / 78
(U)SIM Interface
Pin Name
Pin No.
I/O
Description
DC
Characteristics
Comment
USIM_
PRESENCE
42
DI
(U)SIM card
insertion
detection
VILmin=-0.3V
VILmax=0.6V
VIHmin=1.2V
VIHmax=2.0V
1.8V power domain.
If unused, keep this pin
open.
USIM_VDD
43
PO
Power supply
for (U)SIM card
For 1.8V (U)SIM:
Vmax=1.9V
Vmin=1.7V
For 3.0V (U)SIM:
Vmax=3.05V
Vmin=2.7V
IOmax=50mA
Either 1.8V or 3.0V is
supported by the module
automatically.
USIM_RST
44
DO
Reset signal of
(U)SIM card
For 1.8V (U)SIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V (U)SIM:
VOLmax=0.45V
VOHmin=2.55V
USIM_DATA
45
IO
Data signal of
(U)SIM card
For 1.8V (U)SIM:
VILmax=0.6V
VIHmin=1.2V
VOLmax=0.45V
VOHmin=1.35V
For 3.0V (U)SIM:
VILmax=1.0V
VIHmin=1.95V
VOLmax=0.45V
VOHmin=2.55V
USIM_CLK
46
DO
Clock signal of
(U)SIM card
For 1.8V (U)SIM:
VOLmax=0.45V
VOHmin=1.35V
For 3.0V (U)SIM:
VOLmax=0.45V
VOHmin=2.55V
USIM_GND
47
Specified
ground for
(U)SIM card