Quectel LCC Series User manual

Module Secondary SMT
User Guide
LCC/LGA Module Series
Rev. Module_Secondary_SMT_User_Guide_V2.5
Date: 2019-03-11
Status: Released
www.quectel.com

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Quectel Wireless Solutions Co., Ltd.
7th Floor, Hongye Building, No.1801 Hongmei Road, Xuhui District, Shanghai 200233, China
Tel: [phone]
Email: [email protected]om
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QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
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Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.

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About the Document
History
Revision
Date
Author
Description
1.0
2012-08-28
Gavin HOU
Initial
2.0
2013-08-26
Gavin HOU
Added the description of stencil-making in Chapter 4.2
2.1
2013-12-19
Gavin HOU
Modified Figure 3: Inward Shrinking and Outward Moving
2.2
2015-11-23
Meisy MEI
Added the description of stencil-making on UC/EC/GC
series in Chapter 4.2
2.3
2017-03-08
Alain HUANG
1. Added the description of stencil design requirements
for M66/M66-DS/MC60/L70-R/
L70-RL/L76-L/L76B/L80-R/L86/L96/EC20 R2.0/
EC21/EC25/EG91/EG95/BG96/FC10/FC20/SC10/
SC20/SG30/AG35 modules in Chapter 4.2.
2. Added desoldering and repair instructions in Chapter
5 and 6.
2.4
2018-06-02
Rowan WANG/
Alain HUANG
1. Updated the MSL rating of Quectel modules into 3.
2. Updated stencil design requirements in Chapter 4.2.
3. Optimized the recommended reflow soldering
requirements and thermal profile in Chapter 4.4.
2.5
2019-03-11
Alain HUANG
1. Deleted the tray packing in the packing methods
(Figure 2) in Chapter 2.2.
2. Updated the soldering requirements in Chapter 3.2.
3. Updated stencil design requirements in Chapter 4.2.
4. Updated the max temperature of reflow zone in
Chapter 4.4.

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Content
About the Document...................................................................................................................................2
Content.........................................................................................................................................................3
Table Index...................................................................................................................................................4
Figure Index.................................................................................................................................................5
1Introduction..........................................................................................................................................6
2Information about Modules.................................................................................................................7
2.1. Surface-Mount Packaging Type...................................................................................................7
2.2. Packing Methods..........................................................................................................................7
3Requirements on Chip Mounter.........................................................................................................8
3.1. Chip Mounter................................................................................................................................8
3.2. Soldering Requirements ..............................................................................................................8
4Attentions for Manufacturing .............................................................................................................9
4.1. MSL and Moisture-proof Requirement.........................................................................................9
4.2. Stencil Design Requirements.....................................................................................................10
4.3. Mounting Process ......................................................................................................................18
4.3.1. Load Materials..................................................................................................................18
4.3.2. Automatic Placement.......................................................................................................19
4.4. Reflow Soldering........................................................................................................................20
5Desoldering ........................................................................................................................................22
6Repair Instructions............................................................................................................................24
7Appendix Reference..........................................................................................................................25

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Table Index
TABLE 1: STENCIL DESIGN REQUIREMENTS .............................................................................................. 10
TABLE 2: RECOMMENDED THERMAL PROFILE PARAMETERS ................................................................. 20
TABLE 3: HEAT GUN DESOLDERING REQUIREMENTS............................................................................... 22
TABLE 4: TERMS AND ABBREVIATIONS........................................................................................................ 25

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Figure Index
FIGURE 1: TAPE & REEL PACKING .................................................................................................................. 7
FIGURE 2: HUMIDITY INDICATOR CARD......................................................................................................... 9
FIGURE 3: STEP-UP STENCILAREA.............................................................................................................. 18
FIGURE 4: AUTOMATIC PLACEMENT ............................................................................................................ 19
FIGURE 5: FIRST PIN AND MOUNTED PICTURE.......................................................................................... 19
FIGURE 6: RAMP-SOAK-SPIKE REFLOW PROFILE...................................................................................... 20
FIGURE 7: REMOVE MODULE........................................................................................................................ 23
FIGURE 8: MODULE SOLDERING QUALITY INSPECTION........................................................................... 23

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1Introduction
This document describes the process of Quectel modules’ secondary SMT and desoldering. It is
applicable to all Quectel modules in LCC or LGA form factor.

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2Information about Modules
2.1. Surface-Mount Packaging Type
Quectel modules adopt LCC or LGA package.
2.2. Packing Methods
Quectel provides tape and reel pack as shown in the following figure.
Figure 1: Tape & Reel Packing

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3Requirements on Chip Mounter
3.1. Chip Mounter
⚫Feeder: Support auto tray feeder and auto reel feeder.
⚫Image processing: Optical plummet centering.
⚫Diameter of nozzle: Select the suitable nozzle according to the module size.
The recommended diameter of nozzle should be not less than 40% of the module’s shorter side. For
example, if the module size is 25mm×20mm, the nozzle diameter should be 8mm at least.
3.2. Soldering Requirements
1. It is recommended to use reflow soldering equipment with eight zones at least. For Quectel LTE,
LPWA, Automotive and Smart series modules, reflow soldering equipment with at least ten zones is
recommended.
2. In a lead-free reflow oven, the peak temperature of the actual solder joints on the component side of
an LGAmodule should be greater than 238°C , and the temperature of fixtures is recommended to be
240-245°C to avoid cold solder joints on LGAmodules.
NOTE

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4Attentions for Manufacturing
4.1. MSL and Moisture-proof Requirement
Quectel SMD module is sensitive to moisture absorption. According to IPC-JEDEC standard, the moisture
sensitive level (MSL) of Quectel SMD modules is defined as “3”. Please make sure the package is intact
before using. After opening the package, please confirm the status of humidity indicator card in the
vacuum-sealed package. To prevent the module from permanent damage, baking before reflow soldering
is required if any circumstance below occurs:
⚫Humidity indicator card: At least one circular indicator is no longer blue.
⚫The seal is open and the module is exposed to air for more than 168 hours.
Normal Not blue
Figure 2: Humidity Indicator Card

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1. If baking is required, the module should be baked for 8 hours at 120ºC ±5ºC.
2. Please take out the module from the package and put it on high-temperature resistant fixtures before
baking.All modules must be mounted within 24 hours after finishing baking, otherwise put them in the
drying oven.
4.2. Stencil Design Requirements
To ensure the solder paste is enough and soldering joints are reliable, the stencil should be partly
stepped-up on the top surface. And the stencil aperture for each single pad cannot be larger than
3.0mm×4.0mm and the exceeded part should be divided into smaller apertures with size less than
2.0mm×2.0mm by 0.3-0.5mm shelves. There is no need of opening for arc-shaped pad near regular pads;
if there is any component, a clearance of over 1mm should be left between outward end of the aperture
and the component.
The stencil design requirements for Quectel modules are shown in the table below. Diagrams in the table
are only typical examples of corresponding modules. Diagrams of different modules listed in the same
row may vary but the stencil requirements for them are identical.
Table 1: Stencil Design Requirements
Module
Diagram for Stencil Designs
Requirement Description
M10/M12/M72/
M80/M85/M95/
M66/M66-DS/
GC10
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. The innermost edge of the aperture for each
single pad should be shifted outward by
0.10mm (refer to h1) and the outermost
edge should be shifted outward by
0.30-0.50mm (refer to h2).
NOTES

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L10/L16/L20/L26/
L30/L50/L70/L76/
L80/L70-R/
L70-RL/L76-L/
L76B/L80-R/L86/
L96
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.13-0.15mm.
2. The innermost edge of the aperture for each
single pad should be shifted outward by
0.10mm (refer to h1) and the outermost
edge should be shifted outward by
0.30-0.50mm (refer to h2).
BC66/BC68
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. For pads on four sides:
The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.40-0.60mm, and the
width should be reduced in a ratio of 1:0.85.
The shape should be rectangle with round
chamfers.
3. For pads in the center:
The stencil aperture area for each single pad
should be 70% of that of the corresponding
pad and the shape should be round.
BC95/BC95-G
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. For pads on four sides:
The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.40-0.60mm, and the
width should be reduced in a ratio of 1:0.85.
The shape should be rectangle with round
chamfers.
3. For pads in the center:
The stencil aperture area for each single pad
should be 70% of that of the corresponding
pad and the shape should be round.

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M89
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. For pads on four sides:
The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and outermost edge should be
shifted outward by 0.40-0.60mm, and the
width should be reduced in a ratio of 1:0.85.
And the shape should be rectangle with
rectangle with round chamfer.
3. For pads in the center:
The stencil aperture for each single pad
should be centered with area reduced to
70%, and should be designed with round
chamfers.
MC60
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. For pads on four sides:
The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and outermost edge should be
shifted outward by 0.40-0.60mm, while the
width should be reduced in a ratio of 1:0.85.
And the shape should be rectangle with
round chamfers.
3. For pads in the center:
The stencil aperture for each pad should be
centered with area reduced to 70%. The
shape should be square.
UC20/UC15
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. For pads on four sides:
The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.40-0.60mm. The width
should be reduced in a ratio of 1:0.85. And
the shape should be rectangle with round
chamfers.
3. For GND pads in the center:
Design the stencil aperture for each pad into

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four 1.00mm×0.65mm smaller apertures
shaped in 0.05mm square with round
chamfers, and with clearance of 0.25mm in
between.
4. The 12 pins in the very center are used for
R&D test and recommended to be kept
intact.
EC20/EC20 R2.0/
EC21/EC25/
EC20 R2.1
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. For pads on four sides:
The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.40-0.60mm. The width
should be reduced in a ratio of 1:0.85. And
the shape should be rectangle with round
chamfers.
3. For GND pads in the center:
Design the stencil aperture for each pad into
four smaller 1.00mm×0.65mm apertures
shaped in 0.05mm square with round
chamfers, and with clearance of 0.25mm in
between.
4. Design round apertures with diameter of
0.70mm for the pads in the yellow box.
5. The 12 pins in the very center are used for
R&D test and recommended to be kept
intact.
EG25-G
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.13-0.15mm.
2. For pads on four sides:
The stencil aperture should be centered
with area reduced to 75%-85% and the
shape should be rectangle with round
chamfers.
3. For pads in the center (in the red box):
Design four square apertures centered in
each pad of which the total area is 70% of
that of the pad.
4. The apertures for pads in the yellow box
should be centered with area reduced to
70% and the shape should be round.

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5. The yellow block in the very center should
be kept intact.
UG95/UG96/
BG96/BG95
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.13-0.15mm.
2. For pads on four sides:
The aperture for each single pad should be
centered with area reduced to 75%-85%.
And the shape should be rectangle with
round chamfers.
3. For square pads in the center:
The aperture for each single pad should be
designed into round and centered with area
reduced to 70%.
EG91/EG95
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.13-0.15mm.
2. For pads on four sides:
The aperture for each single pad should be
centered with area reduced to 75%-85%.
And the shape should be rectangle with
round chamfers.
3. For square pads in the center:
The aperture for each single pad should be
designed into round and centered with area
reduced to 70%.
4. For pads at four corners:
The stencil aperture should be designed into
diagonal-patterned lines with 60% area of
the corresponding pad.
EG06/EG12
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.13-0.15mm.
2. For pads on four sides:
The aperture for each single pad should be
centered with area reduced to 75%-85%.
And the shape should be rectangle with
round chamfers.
3. For round pads in the center:
The aperture should be centered with area
reduced to 70%. And the shape should be
round.
4. For pads at four corners:

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The stencil aperture should be designed into
diagonal-patterned lines with 60% area of
the corresponding pad.
SC20
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. For pads on four sides:
The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.60-0.80mm, while width
should be reduced in a ratio of 1:0.85. And
should be shaped into rectangle with round
chamfers.
3. For square pads in the center, the stencil
aperture area should be 70% of that of the
corresponding pad.
4. There is no need to design stencil aperture
for the arc-shaped pad in blue box.
SC60/SC600T/
SC600Y
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. For pads on four sides (in blue boxes), the
innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.60-0.80mm while the
width should be reduced in a ratio of 1:0.85.
And the shape should be rectangle with
round chamfers.
3. For square pads between the two red boxes,
the stencil aperture area should be centered
with area reduced to 85% and designed with
round chamfers.
4. For round pads in the center (in the green
box), the stencil aperture should be centered
with area reduced to 70%.
5. For pads at the four corners of the module,
the stencil aperture should be designed into
diagonal-patterned lines with 60% area of
the corresponding pad.
6. There is no need to design stencil aperture
for the four arc-shaped pads.

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SC66
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.18-0.20mm.
2. For pads on four sides:
The innermost edge of aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.60-0.80mm, while the
width should be reduced in a ratio of 1:0.85.
And the shape should be rectangle with
round chamfers.
3. For square pads in the center:
the stencil aperture area should be centered
with area reduced to 85% and designed with
round chamfers.
4. For round pads in the very center:
The aperture should be centered with area
reduced to 70%.
5. For pads at four corners:
the stencil aperture should be designed into
diagonal-patterned lines with 60% area of
the corresponding pad.
6. For the pad marked with red arrow:
The aperture should be centered with area
reduced to 70%-80%.
AG35
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.13-0.15mm.
2. The stencil aperture area for the pads on
four sides should be centered with 75%-85%
area of corresponding pads, and should be
designed with round chamfers.
3. For pads at four corners (marked with red
boxes), the stencil aperture should be
reduced inward as marked by the white
arrows in the shape of diagonal-patterned
lines with 60% area of the corresponding
pad.
4. The stencil aperture for round GND pads in
the yellow box should be designed into 2
ovals with 60%-70% area of the pad, as
shown by the 2 grey parts in the bottom right
figure.

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AG15
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.13-0.15mm.
2. The stencil aperture area for the pads on
four sides should be centered with area
reduced to 75%-85%, and should be
designed with round chamfers.
3. For pads at four corners, the aperture should
be centered and designed into diagonal-
patterned lines with 60% area of the
corresponding pad.
4. The aperture for round GND pads in the
center should be designed into 2 ovals with
60%-70% area of the pad, as shown by the
2 grey parts in the figure at the bottom.
FC10
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.15-0.18mm.
2. The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.40mm, and the width
should be reduced in a ratio of 1:0.85, and
should be designed with round chamfers.
3. There is no need to design stencil apertures
for the arc-shaped pad in blue box.
FC20
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.15-0.18mm.
2. For pads on four sides:
The innermost edge of the aperture for each
single pad should be shifted outward by
0.20mm and the outermost edge should be
shifted outward by 0.40-0.60mm while the
width should be reduced in a ratio of 1:0.85,
and should be designed in rectangle with
round chamfers.
3. For pads in the center:
The stencil aperture should be designed into
round with area reduced to 70%.

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AF20
1. The stencil thickness of the area for the
module should be partly stepped-up to
0.13-0.15mm.
2. For pads on four sides:
The stencil aperture for each pad should
be centered with area reduced to
75%-85% and the shape should be
rectangle with round chamfers.
3. For square pads in the center:
The stencil aperture should be designed
into round with area reduced to 70%.
Figure 3: Step-up Stencil Area
1. “*” means under development.
2. Area of the stencil apertures for components within 1mm from the thickened stencil part should be
reduced by 10%-30% compared with regular apertures, since the thickening will increase the volume
of solder paste. For components with 0.5mm pitch (or smaller) or 0201 components, please keep at
least 3mm space in between, otherwise there may be a risk of solder bridging that will cause short
circuit of the component.
3. You can optimize the stencil design depending on the actual situation.
4. Inward shrinking and outward extending are relative to the host PCB footprint of the module. For
details of the recommended footprint, please refer to the hardware designs of corresponding
modules.
4.3. Mounting Process
4.3.1. Load Materials
In order to ensure mounting accuracy, for single modules that have been unpacked for baking, it is
recommended for the customers to use a dedicated tray/fixture for module loading.
NOTES

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For tape and reel packed modules, there is a need to set the feeding spacing according to actual
conditions.
4.3.2. Automatic Placement
Select a suitable nozzle according to the module size. To keep module’s stability, please ensure that the
nozzle is placed in the center of gravity, image detection and recognition are 100% passed, and keep a
medium speed when mounting the module. After the module is placed onto the motherboard, the module
pads should be in alignment with the corresponding solder paste on the motherboard’s pads. The triangle
mark on the module indicates its first pin, which should correspond to the mark on PCB.
Figure 4: Automatic Placement
Figure 5: First Pin and Mounted Picture