Quectel SG865W Series Supplement

SG865W Series
Hardware Design
Smart Module Series
Version: 1.0
Date: 2022-05-20
Status: Released

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to use any trademark, trade name or name, abbreviation, or counterfeit product thereof owned by Quectel
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To implement module functionality, certain device data are uploaded to Quectel’s or third-party’s servers,
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Disclaimer
a) We acknowledge no liability for any injury or damage arising from the reliance upon the information.
b) We shall bear no liability resulting from any inaccuracies or omissions, or from the use of the
information contained herein.
c) While we have made every effort to ensure that the functions and features under development are
free from errors, it is possible that they could contain errors, inaccuracies, and omissions. Unless
otherwise provided by valid agreement, we make no warranties of any kind, either implied or express,
and exclude all liability for any loss or damage suffered in connection with the use of features and
functions under development, to the maximum extent permitted by law, regardless of whether such
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Copyright © Quectel Wireless Solutions Co., Ltd. 2022. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

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About the Document
Revision History
Version
Date
Author
Description
-
2022-04-30
Glenn GE/
Joshua PAN
Creation of the document
1.0
2022-05-20
Glenn GE/
Joshua PAN
First official release

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Contents
Safety Information.......................................................................................................................................3
About the Document...................................................................................................................................4
Contents.......................................................................................................................................................5
Table Index...................................................................................................................................................7
Figure Index.................................................................................................................................................9
1Introduction........................................................................................................................................11
1.1. Special Marks..........................................................................................................................15
2Product Overview ..............................................................................................................................16
2.1. Frequency Bands and Functions............................................................................................17
2.2. Key Features...........................................................................................................................17
2.3. Functional Diagram.................................................................................................................19
2.4. Pin Assignment........................................................................................................................21
2.5. Pin Description........................................................................................................................22
2.6. EVB Kit....................................................................................................................................42
3Operating Characteristics.................................................................................................................43
3.1. Power Supply..........................................................................................................................43
3.1.1. Power Supply Pins.........................................................................................................43
3.1.2. Battery Charge and Management..................................................................................43
3.1.3. Reference Design for Power Supply..............................................................................45
3.1.4. Voltage Stability Requirements......................................................................................45
3.2. Turn On ...................................................................................................................................47
3.2.1. Turn On with PWRKEY..................................................................................................47
3.2.2. Turn On Automatically with CBL_PWR_N.....................................................................48
3.3. Turn Off/Restart.......................................................................................................................49
3.4. VRTC Interface........................................................................................................................50
3.5. Power Supply Output..............................................................................................................51
4Application Interfaces .......................................................................................................................53
4.1. USB Interfaces........................................................................................................................53
4.1.1. USB0 Type-C .................................................................................................................55
4.1.2. DisplayPort.....................................................................................................................56
4.2. UART Interfaces......................................................................................................................58
4.3. SD Card Interface....................................................................................................................60
4.4. GPIOs......................................................................................................................................62
4.5. I2C Interfaces..........................................................................................................................63
4.6. ADC Interfaces........................................................................................................................64
4.7. PCIe Interfaces........................................................................................................................65
4.8. Vibrator Drive Interface...........................................................................................................68
4.9. Wireless Charging Interface....................................................................................................69
4.10. RGB Interfaces........................................................................................................................70
4.11. Keypad Interfaces ...................................................................................................................70

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4.12. LCM Interfaces........................................................................................................................71
4.13. Touch Panel Interfaces............................................................................................................74
4.14. Camera Interfaces...................................................................................................................75
4.14.1. Design Considerations...................................................................................................81
4.14.2. Flashlight Interfaces.......................................................................................................86
4.15. Sensor Interfaces....................................................................................................................86
4.16. Audio Interfaces ......................................................................................................................87
4.17. I2S Interfaces..........................................................................................................................88
4.18. SPI Interfaces..........................................................................................................................89
4.19. USB_BOOT.............................................................................................................................90
5RF Specifications...............................................................................................................................91
5.1. RFAntenna Interface..............................................................................................................91
5.1.1. Antenna Interface and Frequency Bands......................................................................91
5.1.2. Reference Design ..........................................................................................................91
5.2. RF Performance......................................................................................................................92
5.2.1. Wi-Fi Overview...............................................................................................................93
5.2.2. Bluetooth Overview........................................................................................................96
5.3. Reference Design of RF Routing............................................................................................97
5.4. Antenna Design Requirements...............................................................................................98
5.5. RF Connector Recommendation ............................................................................................99
6Electrical Characteristics & Reliability..........................................................................................101
6.1. Absolute Maximum Ratings ..................................................................................................101
6.2. Power Supply Ratings...........................................................................................................101
6.3. Power Consumption..............................................................................................................102
6.4. Digital I/O Characteristic .......................................................................................................102
6.5. ESD Protection......................................................................................................................103
6.6. Operating and Storage Temperatures...................................................................................103
7Mechanical Information...................................................................................................................104
7.1. Mechanical Dimensions........................................................................................................104
7.2. Recommended Footprint.......................................................................................................106
7.3. Top and Bottom Views...........................................................................................................107
8Storage, Manufacturing & Packaging............................................................................................108
8.1. Storage Conditions................................................................................................................108
8.2. Manufacturing and Soldering................................................................................................109
8.3. Packaging Specifications.......................................................................................................111
8.3.1. Carrier Tape...................................................................................................................111
8.3.2. Plastic Reel ...................................................................................................................111
8.3.3. Packaging Process ......................................................................................................112
9Appendix References......................................................................................................................113

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Table Index
Table 1: Special Marks...............................................................................................................................15
Table 2: Brief Introduction of the Module...................................................................................................16
Table 3: Wireless Network Type of the Module.......................................................................................... 17
Table 4: Key Features................................................................................................................................ 17
Table 5: I/O Parameters Definition.............................................................................................................22
Table 6: Pin Description ............................................................................................................................. 22
Table 7: Pin Definition of Charging Interface ............................................................................................. 43
Table 8: Pin Definition of PWRKEY............................................................................................................47
Table 9: Pin Definition of CBL_PWR_N.....................................................................................................48
Table 10: Power Supply Description..........................................................................................................51
Table 11: Pin Definition of USB0 and USB1 Interfaces .............................................................................53
Table 12: USB Trace Length Inside the Module........................................................................................ 55
Table 13: Pin Definition of USB Type-C/DisplayPort Mode ....................................................................... 56
Table 14: Pin Definition of UART Interfaces...............................................................................................58
Table 15: Pin Definition of SD Card Interface............................................................................................60
Table 16: SD Card Signal Trace Length Inside the Module.......................................................................61
Table 17: Pin Definition of GPIO Interfaces............................................................................................... 62
Table 18: Pin Definition of I2C Interfaces................................................................................................... 63
Table 19: Pin Definition ofADC Interface................................................................................................... 64
Table 20: Characteristics of ADC Interface................................................................................................ 64
Table 21: Pin Definition of PCIe Interfaces................................................................................................ 65
Table 22: PCIe Trace Length Inside the Module........................................................................................67
Table 23: Pin Definition of Vibrator Drive Interface.................................................................................... 68
Table 24: Pin Definition of Wireless Charging Interface ............................................................................69
Table 25: Pin Definition of RGB Interfaces ................................................................................................ 70
Table 26: Pin Definition of Keypad Interfaces............................................................................................70
Table 27: Pin Definition of LCM Interfaces.................................................................................................71
Table 28: Pin Definition of Touch Panel Interfaces ....................................................................................74
Table 29: Pin Definition of Camera Interfaces ........................................................................................... 75
Table 30: MIPI Trace Length Inside the Module ........................................................................................82
Table 31: CSI and DSI Data Rate and Max. Trace Length (D-PHY).....................................................85
Table 32: Pin Definition of Flashlight Interfaces......................................................................................... 86
Table 33: Pin Definition of Sensor Interfaces.............................................................................................87
Table 34: Pin Definition ofAudio Interfaces............................................................................................... 87
Table 35: Pin Definition of I2S Interfaces...................................................................................................88
Table 36: Pin Definition of SPI Interfaces ..................................................................................................89
Table 37: Pin Definition of Wi-Fi/BluetoothApplication Interfaces.............................................................91
Table 38: Pin Definition of Wi-Fi/BluetoothApplication Interfaces.............................................................92
Table 39: Wi-Fi/Bluetooth Frequency.........................................................................................................93
Table 40: Wi-Fi Transmitting Performance.................................................................................................93
Table 41: Wi-Fi Receiving Performance.....................................................................................................94

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Table 42: Bluetooth Transmitting and Receiving Performance..................................................................96
Table 43:Antenna Design Requirements ..................................................................................................98
Table 44:Absolute Maximum Ratings......................................................................................................101
Table 45: The Module’s Power Supply Ratings .......................................................................................101
Table 46: SG865W-WF Power Consumption ..........................................................................................102
Table 47: SG865W-AP Power Consumption ...........................................................................................102
Table 48: 1.8 V I/O Requirements............................................................................................................102
Table 49: Electrostatics Discharge Characteristics (25 °C, 45 % Relative Humidity) .............................103
Table 50: Operating and Storage Temperatures......................................................................................103
Table 51: Recommended Thermal Profile Parameters............................................................................ 110
Table 52: Carrier Tape Dimension Table (Unit: mm).................................................................................111
Table 53: Plastic Reel Dimension Table (Unit: mm)................................................................................. 112
Table 54: Related Documents.................................................................................................................. 113
Table 55: Terms and Abbreviations.......................................................................................................... 113

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Figure Index
Figure 1: Functional Diagram.....................................................................................................................20
Figure 2: PinAssignment (Top View)......................................................................................................... 21
Figure 3: Reference Design for Battery Charging Circuit..........................................................................44
Figure 4: Reference Circuit of Power Supply............................................................................................. 45
Figure 5: Voltage Drop Sample..................................................................................................................46
Figure 6: Structure of Power Supply..........................................................................................................46
Figure 7: Turn On the Module Using Driving Circuit.................................................................................. 47
Figure 8: Turn On the Module Using a Button...........................................................................................48
Figure 9: Reference Circuit of Automatic Turn-on......................................................................................48
Figure 10: Power-up Timing.......................................................................................................................49
Figure 11: Forced Power-down Timing......................................................................................................50
Figure 12: RTC Powered by a Coin Cell....................................................................................................50
Figure 13: RTC Powered by Capacitor......................................................................................................50
Figure 14: USB Type-C Interface Reference Design................................................................................. 55
Figure 15: Reference Design for DisplayPort Mode..................................................................................57
Figure 16: Reference Circuit with Voltage-level Translator Chip (for UART 5)..........................................59
Figure 17: RS-232 Level Matching Circuit (for UART 5)............................................................................ 59
Figure 18: Reference Circuit for SD Card Interface................................................................................... 61
Figure 19: Reference Design of PCIe1 Interfaces.....................................................................................66
Figure 20: Reference Design for Vibrator Connection...............................................................................69
Figure 21: Reference Design for RGB Interfaces...................................................................................... 70
Figure 22: Reference Design for LCM0 Interface...................................................................................... 73
Figure 23: Reference Design for TP0 Interface.........................................................................................75
Figure 24: Reference Design for Camera0Application.............................................................................80
Figure 25: Reference Design of Camera Power Supply............................................................................ 81
Figure 26: Reference Design for Flashlight Interfaces..............................................................................86
Figure 27: Reference Design for USB_BOOT...........................................................................................90
Figure 28: Reference Design for Wi-Fi/BluetoothAntenna Interface ........................................................92
Figure 29: Microstrip Design on a 2-layer PCB.........................................................................................97
Figure 30: Coplanar Waveguide Design on a 2-layer PCB....................................................................... 97
Figure 31: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground).................... 97
Figure 32: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground).................... 98
Figure 33: Dimensions of the Receptacle (Unit: mm)................................................................................ 99
Figure 34: Specifications of Mated Plugs ................................................................................................100
Figure 35: Space Factor of Mated Connectors (Unit: mm)......................................................................100
Figure 36: Module Top and Side Dimensions..........................................................................................104
Figure 37: Module Bottom Dimensions (Bottom View)............................................................................105
Figure 38: Recommended Footprint (Top View)......................................................................................106
Figure 39: Top and Bottom Views of the Module.....................................................................................107
Figure 40: Recommended Reflow Soldering Thermal Profile .................................................................109
Figure 41: Carrier Tape Dimension Drawing........................................................................................111

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Figure 42: Plastic Reel Dimension Drawing.........................................................................................111
Figure 43: Packaging Process................................................................................................................. 112

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1Introduction
This document defines SG865W series module and describes its air interfaces and hardware interfaces
which are connected with your applications.
It can help you quickly understand interface specifications, electrical and mechanical details as well as
other related information of the module. Associated with application notes and user guides, you can use
this module to design and to set up mobile applications easily.
changes or modifications not expressly approved by the party responsible for compliance could void the
user’s authority to operate the equipment.
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to
Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference to
radio communications. However, there is no guarantee that interference will not occur in a particular
installation.
If this equipment does cause harmful interference to radio or television reception, which can be determined
by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
-- Reorient or relocate the receiving antenna.
-- Increase the separation between the equipment and receiver.
-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
-- Consult the dealer or an experienced radio/TV technician for help.
This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to
avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna
shall not be less than 20cm (8 inches) during normal operation.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Any changes ormodifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment. This transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter.
Important Notice to OEM integrators
1. This module is limited to OEM installation ONLY.
2. This module is limited to installation in fixed applications, according to Part 2.1091(b).
3. The separate approval is required for all other operating configurations, including portable
configurations with respect to Part 2.1093 and different antenna configurations

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4. For FCC Part 15.31 (h) and (k): The host manufacturer is responsible for additional testing to verify
compliance as a composite system. When testing the host device for compliance with Part
15 Subpart B, the host manufacturer is required to show compliance with Part 15 Subpart B while the
transmitter module(s) are installed and operating. The modules should be transmitting and the evaluation
should confirm that the module's intentional emissions are compliant (i.e. fundamental and out of band
emissions).The host manufacturermust verify that there are no additional unintentional emissions other than
what is permitted in Part 15 Subpart B or emissions are complaint with the transmitter(s) rule(s).
The Grantee will provide guidance to the host manufacturer for Part 15 B requirements if needed.
Important Note notice that any deviation(s) from the defined parameters of the antenna trace, as
described by the instructions, require that the host product manufacturer must notify to Quectel Wireless
Solutions Co., Ltd that they wish to change the antenna trace design. In this case, a Class II permissive
change application is required to be filed by the USI, or the host manufacturercan take responsibility through
the change in FCC ID (new application) procedure followed by a Class II permissive change application.
End Product Labeling
When the module is installed in the host device, the FCC/IC ID label must be visible through a window
on the final device or it must be visible when an access panel, door or cover is easily re-moved. If not, a
second label must be placed on the outside of the final device that contains the following text: “Contains FCC
ID: XMR2022SG865WWF”
The FCC ID can be used only when all FCC compliance requirements are met.
Antenna Installation
(1) The antenna mustbe installed such that 20 cm is maintained between the antenna and users,
(2) The transmitter module may not be co-located with any other transmitter or antenna.
(3) Only antennas of the same type and with equal or less gains as shown below may be used with this
module. Other types of antennas and/or higher gain antennas may require additional authorization for
operation.
(4) The max allowed antenna gain is 0dBi for external antenna.
In the event that these conditions cannot be met (forexample certain laptop configurations orco-location
with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID/IC ID
cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for
re-evaluating the end product (including the transmitter) and obtaining a separate FCC/IC authorization.
Manual Information to the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install
or remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
This device complies with ISED’s licence-exempt RSSs. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must acceptany interference
received, including interference that may cause undesired operation.

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Le présent appareil est conforme aux CNR d’ ISED applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes : (1) le dispositif ne doit pas produire de brouillage
préjudiciable, et (2) ce dispositif doit accepter tout brouillage reçu, y compris un brouillage susceptible de
provoquer un fonctionnement indésirable.
Radiation Exposure Statement:
This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
Déclaration d'exposition aux radiations:
Cet équipement est conforme aux limites d'exposition aux rayonnements ISED établies pour un
environnement non contrôlé. Cet équipement doit être installéet utiliséavec un minimum de 20 cm de
distance entre la source de rayonnement et votre corps.
This device is intended only for OEM integrators under the following conditions: (For module device use)
1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and
2) The transmitter module may not be co-located with any other transmitter or antenna.
As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM
integrator is still responsible for testing theirend-product forany additional compliance requirements required
with this module installed.
Cet appareil est conçu uniquement pour les intégrateurs OEM dans lesconditions suivantes: (Pour utilisation
de dispositif module)
1) L'antenne doit être installée de telle sorte qu'une distance de 20 cm est respectée entre l'antenne et les
utilisateurs, et
2) Le module émetteur peut ne pas être coïmplantéavec un autre émetteur ou antenne.
Tant que les 2 conditions ci-dessus sont remplies, des essais supplémentaires sur l'émetteur ne seront pas
nécessaires. Toutefois, l'intégrateur OEM est toujours responsable des essais sur son produit final pour
toutes exigences de conformitésupplémentaires requis pour ce module installé.
IMPORTANT NOTE:
In the event that these conditions can not be met (for example certain laptop configurations or co- location
with another transmitter), then the Canada authorization is no longer considered valid and the IC ID can not
be used on the final product. In these circumstances,the OEM integratorwill be responsible for re-evaluating
the end product (including the transmitter) and obtaining a separate Canada authorization.
NOTE IMPORTANTE:
Dans le cas où ces conditions ne peuvent être satisfaites (par exemple pour certaines configurations
d'ordinateur portable ou de certaines co-localisation avec un autre émetteur), l'autorisation du Canada n'est
plus considérécomme valide et l'ID IC ne peut pas être utilisésur le produit final. Dans ces circonstances,

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l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'une
autorisation distincte au Canada.
End Product Labeling
This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be
maintained between the antenna and users. The final end product must be labeled in a visible area with the following:
“Contains IC: 10224A-2022SG865W”.
Plaque signalétique du produit final
Ce module émetteur est autoriséuniquement pour une utilisation dans un dispositif oùl'antenne peut être installée de telle
sorte qu'une distance de 20cm peut être maintenue entre l'antenne et les utilisateurs. Le produit final doit être étiquetédans
un endroit visible avec l'inscription suivante: "Contient des IC: 10224A-2022SG865W ".
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF
module in the user’s manual of the end product which integrates this module. The end user manual shall include all
required regulatory information/warning as show in this manual.
Manuel d'information àl'utilisateur final
L'intégrateur OEM doit être conscient de ne pas fournir des informations àl'utilisateur final quant àla façon d'installer ou de
supprimer ce module RF dans le manuel de l'utilisateur du produit final qui intègre ce module.
Le manuel de l'utilisateur final doit inclure toutes les informations réglementaires requises et avertissements comme
indiquédans ce manuel.
RSS-247 Section 6.4 (5) (6) (for local area network devices, 5GHz)
The device could automatically discontinue transmission in case of absence of information to transmit, or operational failure.
Note that this is not intended to prohibit transmission of control or signaling information or the use of repetitive codes where
required by the technology.
Caution:
i) The device for operation in the band 5150–5250 MHz is only for indoor use to reduce the potential for harmful
interference to co-channel mobile satellite systems;
ii) where applicable, antenna type(s), antenna models(s), and worst-case tilt angle(s) necessary to remain compliant with
the e.i.r.p. elevation mask requirement set forth in section 6.2.2.3 shall be clearly indicated.
L'appareil peut interrompre automatiquement la transmission en cas d'absence d'informations àtransmettre ou de panne
opérationnelle. Notez que ceci n'est pas destinéàinterdire la transmission d'informations de contrôle ou de signalisation ou
l'utilisation de codes répétitifs lorsque cela est requis par la technologie.
Avertissement:
i) Le dispositif utilisédans la bande 5150-5250 MHz est réservéàune utilisation en intérieur afin de réduire le risque de
brouillage préjudiciable aux systèmes mobiles par satellite dans le même canal;
ii) lorsqu’il y a lieu, les types d’antennes (s’il y en a plusieurs), les numéros de modèle de l’antenne et les pires angles

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d’inclinaison nécessaires pour rester conforme à l’exigence de la
p.i.r.e. applicable au masque d’élévation, énoncée àla section 6.2.2.3, doivent être clairement indiqués.
1.1. Special Marks
Table 1: Special Marks
Mark
Definition
*
Unless otherwise specified, when an asterisk (*) is used after a function, feature, interface,
pin name, AT command, or argument, it indicates that the function, feature, interface, pin,
AT command, or argument is under development and currently not supported; and the
asterisk (*) after a model indicates that the sample of the model is currently unavailable.
[…]
Brackets ([…]) used after a pin enclosing a range of numbers indicate all pins of the same
type. For example, SD_DATA[0:3] refers to all four SDIO pins: SD_DATA0, SD_DATA1,
SD_DATA2, and SD_DATA3.

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2Product Overview
SG865W series is a series of smart modules based on Android operating system, and provides industrial
grade performance. Its general features are listed below:
⚫Supports built-in high performance KryoTM 585 CPU, AdrenoTM 650 GPU, Adreno 995 DPU, Adreno
665 VPU, HexagonTM DSP, and SpectraTM 480 ISP
⚫Provides multiple audio and video input/output interfaces as well as abundant GPIO interfaces.
⚫Supports multiple video codecs
The module is engineered to meet the demanding requirements in high computing power, AI and
multimedia functions. Its general features are listed below:
Table 2: Brief Introduction of the Module
1
Compared to SG865W-WF, SG865W-AP does not support Wi-Fi and Bluetooth function.
Categories
Packaging and pins number
LGA; 571
Dimensions
46.0 ×42.0 ×2.95 mm
Weight
14 g
Wi-Fi & Bluetooth functions
⚫2.4 GHz, 5 GHz
⚫BLE 5.1 (BR/EDR + BLE)
Variants
SG865W-WF, SG865W-AP 1

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2.1. Frequency Bands and Functions
Table 3: Wireless Network Type of the Module
2.2. Key Features
Table 4: Key Features
Mode
Frequency Bands
Wi-Fi 802.11a/b/g/n/ac/ax
2402–2482 MHz
5170–5835 MHz
BLE 5.1(BR/EDR + BLE)
2402–2480 MHz
Features
Details
Application Processors
⚫64-bit applications processor (Kryo 585) with 4 MB L3 cache
⚫1 × Kryo 585 Gold prime core with a 512 KB L2 cache, Fmax at
2.842 GHz
⚫3 × Kryo 585 Gold cores with 256 KB L2 cache per core, Fmax at
2.419 GHz
⚫4 × low-power Kryo 585 Silver cores with 128 KB L2 cache per core,
Fmax at 1.805 GHz
DSP
Hexagon™ DSP with 4 Hexagon Vector eXtensions (HVX) processor
GPU
⚫AdrenoTM 650
Memory
⚫64 GB UFS + 8 GB LPDDR5 (default)
⚫256 GB UFS + 12GB LPDDR5 (optional)
Operating System
⚫Android 10
Power Supply
⚫Supply voltage: 3.55–4.4 V
⚫Typical supply voltage: 3.8 V
LCM Interfaces
⚫Supports 2 groups of 4-lane MIPI DSI, up to 2.5 Gbps/lane
Camera Interfaces
⚫Support 6 groups of 4-lane MIPI CSI, up to 2.5 Gbps/lane
⚫Support 7 concurrent camera usages
⚫Max. 64 MP @ 30 fps ZSL @ 2 × ISP
Video Codec
⚫Adreno 665 VPU
⚫Video decode up to 4K @ 240 fps; 8K @ 60 fps
⚫Video encode up to 4K @ 120 fps; 8K @ 30 fps

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Audio Interfaces
⚫Digital MIC
⚫SWR
⚫MI2S
⚫TDM/PCM
SPI Interfaces
⚫5 ×SPI interfaces, only supports master mode
⚫1.8 V operating voltage with clock rates up to 50 MHz
I2C Interfaces
⚫Supports up to 9 ×I2C interfaces
4 ×I2C interfaces dedicated for the camera control interface
1 ×I2C interface dedicated for communication with the sensors
2 ×I2C interfaces for TP interface
1 ×I2C interface for NFC interface
1 ×I2C interface for general purpose interface
⚫Multi-master mode is not supported
ADC Interfaces
4 ×General purpose ADC interfaces
Vibrator Drive Interface
1 ×Drive ERM/LRA vibrator
I2S Interfaces
3 ×I2S interfaces
Flashlight Interfaces
3 × High-current Flash LED drivers, which support both flash and torch
modes
⚫Up to 1.5 A for LED1 and LED2 in flash mode
⚫Up to 0.75 A for LED3 in flash mode
Wireless Charging
Interface
Used for battery voltage detection, fuel gauge, battery temperature detection
Real Time Clock
Supported
USB Interfaces
2 ×USB interfaces
⚫Compliant with USB 2.0 and 3.1 Gen 2 specifications, with transmission
rates up to 480 Mbps on USB 2.0 and 10 Gbps on USB 3.1 Gen 2
⚫USB0 is used for data transmission, software debugging, firmware
upgrade
⚫USB0 supports DisplayPort V1.4 over Type-C
⚫USB0 supports USB OTG function
⚫USB1 supports host mode only
⚫USB1 supports USB hub expansion
PCIe Interfaces
2 ×2-lane PCIe Gen 3
SDIO Interface
⚫Supports SD 3.0 protocol
⚫Supports SD card hot-plug
⚫Supports 1.8 V or 2.95 V SD card
UART Interfaces
4 ×UART interfaces: UART5, UART16, UART17 and debug UART
⚫UART5/UART16/UART17:
−Four-wire UART interface
−Supports RTS and CTS hardware flow control
⚫Debug UART:

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2.3. Functional Diagram
The following figure shows a block diagram of the module and illustrates the major functional parts.
⚫Power management
⚫Baseband
⚫LPDDR5 + UFS flash
⚫Radio frequency
⚫Peripheral interfaces
-- USB interfaces
-- UART interfaces
-- SD card interface
-- GPIOs
-- I2C interfaces
-- ADC interfaces
-- PCIe interfaces
-- Vibrator Drive interface
-- Wireless Charging interface
-- RGB interfaces
-- Keypad interfaces
2
Within operating temperature range, the module is IEEE compliant.
-Two-wire UART interface
-Used for debugging by default
-Baud rate: 115200 bps by default
Bluetooth Features
(SG865W-WF only)
⚫BLE 5.1
Antenna Interfaces
⚫ANT1
⚫ANT2
⚫ANT_BT*
50 Ωimpedance
Wi-Fi Features
(SG865W-WF only)
⚫2.4 GHz and 5 GHz
⚫Supports802.11a/b/g/n/ac/ax (20/40/80 MHz), up to 1774.5 Mbps
(2 × 2 + 2 × 2 11ax DBS)
⚫Supports MIMO and DBS
⚫Supports AP and STA modes
Temperature Range
⚫Operating temperature range 2: -35 to +75 °C
⚫Storage temperature range: -40 to +90 °C
Firmware Upgrade
⚫Use USB interface or OTA to upgrade
RoHS
⚫All hardware components are fully compliant with EU RoHS directive