Quick QUICK7610 User manual

QUICK7610
BGA/SMD Rework System
Operation Manual
Thank you for purchasing our IR Rework System. The system is exclusively designed
for reworking and soldering SMD component. Please carefully read this manual before
operating the system. Store this manual in a safe, easily accessible place for future
reference.

QUICK7610 Operation Manual
Table of Contents
1. Summary......................................................................................................................1
2. Specification and Technical Parameter........................................................................1
2.1 Specification ........................................................................................................1
2.2 Technical Data .....................................................................................................2
3. Product Picture.............................................................................................................2
4. Safety instructions………………………………………………………………………3
5. Install the Unit and Adjust Parts……………………………………………………………3
5.1 Place the Unit ......................................................................................................3
5.2 Check the Unit.....................................................................................................3
5.3 Connect the Unit..................................................................................................4
5.4 PCB Fixture .........................................................................................................4
6. Keyboard and Parameter Setting.................................................................................5
6.1 Keyboard .............................................................................................................5
6.2 parameter setting.................................................................................................5
7. Technology Instruction................................................................................................13
7.1 Soldering Technology.........................................................................................14
7.2 De-soldering Technology ...................................................................................15
8. Turn off the System....................................................................................................15
9. System Maintenance..................................................................................................15
10.toxic and harmful substance or element form............................................................16

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1. Summary
Thank you for using QUICK 7610 Rework System. This system adopts micro-processor control
and infrared sensor technology to do soldering and de-soldering to surface mount components
safely and accurately and it can also control the whole technological process and record all
information by means of the IR Software, thus meeting the higher technological demands of modern
electronic industry. It becomes one of the most valued electronic equipments in this field.
This QUICK 7610 Rework System adopts micro-processor control and infrared sensor technology.
It has the precision non-contact infrared temperature sensor for de-soldering parts and the middle
wavelength infrared heater. The soldering process is under the monitoring of non-contact infrared
sensor and optimum control of process can be achieved at any time. In order to get the best
technological control and the nondestructive and reproductive PCB temperature, QUICK 7610
supplies 2400W heating power, suitable for all application, such as large or small PCB as well as
lead-free process. The technology of re-flow soldering controlled by closed-loop ensures the precise
and smaller technological window, even heat distribution and appropriate peak value of temperature
for lead-free soldering.
The middle-wavelength infrared heater of QUICK7610 has a well-proportioned and safe heating and
power and flexibleness necessary for the system, so it can also deal with some PCBs with big
thermal capacity and other high temperature situation (lead-free soldering) easily. The adjustable
aperture under the infrared heater can protect the adjacent components (which are sensitive to the
temperature) on PCB from being heated. No need for nozzles.
QUICK7610 has 10 types of working modes and programmable temperature controlling can
modify the parameter of every work modes. IR system and setting of parameters are operated by
outside Keyboard as well as by IR soft.
The use of RPC (reflow process camera) provides the critical visual information to accurately
judge the melting of solder during the whole soldering and desoldering process.
2. Specification and Technical Parameter
2.1 Specification
1. Max Power:2400W（max）
2. Power of Bottom preheating:1600W（Infrared ceramic heating plate）
3. Power of Top heating: 720W（Infrared heating tube, 2~8µmApprox,
Size: 60m×60 mm）
4. Preheating area of Bottom Heater：260*260mm
5. Max PCB size: 420mm*500mm
6. Max BGA size: 60*60mm
7. Communication: standard RS-232C （Connect with PC）
8. Infrared Temperature sensor: 0~300℃（Testing range）
9. USB connect: output 5V DC, 1A,connect USB lighting equipment
10. Dimension : 80*58*52 (cm)
11. Weight: 14.3Kg

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2.2 Technical Data
TL: Melting temperature of solder
T1: Heat preservation starting temperature of reflow soldering
T2: Heat preservation ending temperature of reflow soldering
T3: Peak value temperature of soldering and de-soldering
T0: Valve temperature: The lowest temperature of bottom heater when top heater heats up. T0<TB
TB: The set temperature of bottom heater
Tb: The real time temperature value of bottom heater
TC: The real time temperature value of top heater
S1: Heating time rising from T1 to T2
S2: Heating time rising from T2 to T3
S3: Heat preservation time of T3
3. Product Picture
4. Safety Instructions
Caution：
For safety of system and operator, please read this manual carefully before operating the unit.
Please note that the unit is suitable for soldering and de-soldering of electronic components.
Top heating
Exterior cooling
PCB fixing pole
PCB fixed knob
Bottom
heating
LCD
USB connector

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Caution:
Top and bottom infrared heater and sirocco nozzle will be very hot during working, so
explosive and combustible objector gas and solvent is strictly prohibited in working areas, also
please don’touch the hot surface parts.
Caution:
The laser alignment device includes a secondary laser device, so don’t see the laser bean
directly.
Caution:
When the system in trouble and needs maintenance, it should be maintained by an
experienced and authorized technician or expert, or contact with service agent and factory.
The unit with dangerous voltage! The inexperienced maintenance is dangerous for the
operators.
5. Install the Unit and Adjust Parts
5.1 Place the Unit
* Unwrap the packing of the unit, then take it out and put it on the solid level worktable. Put the I760E
main unit on the IR base plate.
5.2 Check the Unit
Please check whether the following parts are in good condition and they aren’t missed.
* Main unit
* Operation Manual
* IRsoft Disc
* RS232 connect line
* Power cord
* Outer cooling fan
*monitor （optional）
Note: The parts will be packed according to the packing list, if you don’t purchase the optional part
and it isn’t in the package. If any above part is missed out, please contact with our company or
agents immediately.

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5.3 Connect the Unit
Please check whether the power voltage accords with the rated voltage on the equipment
nameplate.
Please check whether switches are turned off before connection.
Connect Power cord to the power socket behind equipment.
If use IR Soft, please connect RS232 to behind RS232.
COOLFAN: connect cooling fan power line.
USB: output 5V DC, connect floodlight.
After finishing above steps, insert power plug into power socket, and switch on power.
5.4 PCB Fixture
1. Movable PCB fixture is able to fix PCB with different size. The Lock Knobs lock PCB Fixed Bar
to fix PCB.
2. The movable distance from forward to back is 125mm, and the maximal movable distance from
left to right is 280mm.
3. The usable height is 125mm, the outer dimensions of fixture is: 690（L）* 480(W) * 135(H)mm.
4. Unscrew PCB Lock Knobs and push Sliding Blocks by hand to open PCB Fixed Bars, make the
distance between PCB Fixed Bars accord with PCB size. Fix PCB between them and screw
down PCB Lock Knobs after adjusting position.
Bottom avoid collapse
holder
Power
RS232
Outer cooling fan
PCB
Lock Knob
PCB
Fixed Bar
Sliding Block
Special
PCB holder

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6. Keyboard and Parameter Setting
6.1 Keyboard
A．When select workflow,“+”、“-”key control cursor up down movement or the digital increase and
decrease.
B．When waiting state, press“+”、“-”key, top heating movement up and down.
C．The function of “SET” key is BGA-IR enter parameter setting state, and cursor enter next menu
(when change digital, cursor select next digital).
D．The function of “OK” key is: In setting state, BGA-IR cursor return to the last menu, until return
to operation interface, and save, change result.
E．The function of “Delay” key is: in the process of solder and de-solder, when temperature rise to
T3, click once, the keep temperature of setting time delay 5S, can delay arbitrarily times.
F．The function of “FAN” key is: outer cooling fan working or suspend.
G．The function of “START” key is: in the state of standby, BGA-IR enters into the process of
de-solder or solder.
H．The function of “STOP” key is: exit the process of de-solder or solder.
6.2 Parameter setting
System parameter setting successively order:
A．_password: *** （Password settings）
B．_select: 0 （Flow settings, it can modify parameter inside.）
C．_type: solder （Working mode settings）

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D．_laser: off (Working mode settings)
E．_baud: 19200 （Working mode settings）
A. Input password
The initial password of system is “000”.At the same time, system also has the omnipotent password
“159”. If you forget the setting password, you can input “159” to make the password of system come
back to initial password “000”.
Note: If want to modify parameter of system, you must input correct password, otherwise, you can
only browse them.
For instance: Input the initial password “000” of system.
Press “SET” Press
“SET”
Press “-” Press “SET”
Press “-” Press “SET”
Press “-” Press “OK”
TC:022
℃
Tb:019
℃
ready for flow
_password: ***
select: 0
password: *
**
select: 0
password: 0**
select: 0
password: 0**
select: 0
password: 00*
select: 0
password: 00*
select: 0
password: 000
select: 0
Saving Password!
Any key return

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Finish password inputting:
1. If you want to modify the password, return to above mode to input the new password. If
password is modified successfully, it will show:
2．If you want to modify the next working flow, operate as the following B item. If you don’t want to
modify, please press “DOWN” key to browse the following parameter settings.
B. Modify working flow
For instance: Modify the working flow and make it become 1 flow.
Press “-” Press “SET”
Step①
Step②
Press “+” Press “OK”
Step③
Step④
1. When carry on the forth step (Step④), if press “SET” key, you can browse and modify
parameter of this flow, shown as C-1 item.
2. After finishing modifying of working flow 1, if you want to modify the next working mode, operate
as C item shows. If you don’t want to modify it, you can press “DOWN” key to browse the next
parameter settings.
Saving Password!
Any key return
password: ***
select: 0
password: ***
select: 0
password: ***
select: 0
password: ***
select: 1
password: ***
select: 1

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C. Modify working mode
For instance: Modify the working mode and make it in “desolder” mode.
Press “-” Press “SET”
Press “-” or “+” Press “OK”
After finishing modifying working mode, if you want to modify laser alignment mode, operate as D
item shows; if no need to modify it, please press “DOWN” key to browse the next parameter
settings.
C-1. Modify Parameter of working flow
1. If it is necessary to modify parameter of a working flow, first you must select the working flow
and then modify its parameter.
2. The modification of parameter must accord with the following technics graph.
TB
表示 TC
表示 Tb
T3
TL
S1
T2
T1
℃
Tb=T0
S2 S3
Tb
TC
The soldering technics is decided by T0, TB, T1, T2, T3, S1, S2 and S3. It describes the
temperature graph during the system working. TL denotes Melting temperature of solder and the
password: ***
select: 1
select: 1
type: solder
select: 1
type: solder
select: 1
type: desolder
select: 1
type: desolder

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range between T2 and T3.
T0
T0 is the valve temperature for bottom heater required by top heater when it heats up. Also it is the
first temperature of this technics process. When the work flow STARTs, the bottom heater starts to
heat up. After reaching the T0, the top heater STARTs to heat up.
TB、Tb、TC
TB: The setting temperature of bottom preheating Tb: Real-time temperature of bottom heating TC:
Real-time temperature of top heating
T1
It is the heat preservation starting temperature of reflow soldering. It is the second temperature of
this technics process. The temperature rises to T1 with a proper speed the component permits. Use
the “UP” and “DOWN” key to set the value of T1 in parameter setting interface.
T2
It is the temperature when finish the heat preservation of reflow soldering. The pre-heating
temperature rises to T2, after the time of S1 finishes. Within this time, PCB and component
pre-heating is finished and the solder is activated. Use the “UP” or “DOWN” key to set the value of
T2 in parameter setting interface.
T3
It is the peak value temperature of reflow soldering. When the temperature reaches T2, the
temperature equably rises to T3 with a definite raising speed. The soldering or de-soldering will be
finished when the temperature reaches to the peak value and performs the next step. Use the “UP”
or “DOWN” key to set the value of T3 in parameter setting interface.
TL
Meltingtemperature of solder. At this temperature, the solder starts to melt down and turn into liquid.
S1
Heating time rises from T1 to T2. User can set the value in the range of 0~300s.
S2
Heating time rises from T2 to T3. User can set the value in the range of 0~300s.
S3
Prolonged heating time (Heat preservation time) after the temperature reach T3, and user can also
set the value in the range of 0~300s.
Unit
It’s able to set the unit of display temperature during work flow. In parameter modifying, use “UP”
and “DOWN” keys to set the value of it.

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Password
It is used for setting password. It is designed for preventing the equipment unnecessary or
non-authorized change. When it is set to “000”, the password protectingis useless. The password is
used for all flows and it can be useful and useless in each flow. The system requires inputting
correct password before any change.
Using of password refer to “A” item.
For instance: Modify parameter of flow one (Flow one has been selected) and make T1=130℃,
S1=70s, T2=160℃, S2=50s, TB=130℃.
Press “SET” Press “SET”
Press “SET” Press “+” 2 times
Press “OK” Press “-”
Press “SET” Press “SET”
Press “+” Press “OK”
Press “-” Press “SET”
password: ***
select: 1
_T1: 110
℃
S1: 060s
T1: 110
℃
S1: 060s
T1: 110
℃
S1: 060s
T1: 130
℃
S1: 060s
_T1: 130
℃
S1: 060s
T1: 130
℃
_
S1: 060s
T1: 130
℃
S1: 060s
S1: 070s
T2: 150
℃
S1: 070s
T2: 150
℃
S1: 060s
T2: 150
℃
T1: 130
℃
S1: 060s
T1: 130
℃
S1: 070s
T1: 130
℃
S1: 070s

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Press “SET” Press “+”
Press “OK” Press “-”
Press “SET” Press “SET”
Press “+” 2 times Press “OK”
Press “-” Press “-”
Press “-” Press “-”
Press “SET” Press “SET”
Press “-” Press “OK”
S1: 060s
T2: 160
℃
TL: 183
℃
TB: 140
℃
S1: 060s
T2: 160
℃
T2: 160
℃
S2: 030s
T2: 160
℃
S2: 030s
T2: 160
℃
S2: 030s
T2: 160
℃
S2: 050s
T2: 160
℃
S2: 050s
S2: 050s
T3: 200
℃
T3: 200
℃
S3: 010s
S3: 010s
TL: 183
℃
TL: 183
℃
TB: 140
℃
TL: 183
℃
TB: 140
℃
TL: 183
℃
TB: 130
℃

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Press “-” Press “-”
Press “-” Press “-”
D. Modify laser alignment mode
For instance: Modify the laser alignment mode and set it to “on”.
Press “-” Press “SET”
Press “-”or“+” Press “OK”
select: 1
type: desolder
type: desolder
laser: off
type: desolder
laser: off
type: desolder
laser: on
type: desolder
laser: on
T0: 090
℃
unit:
℃
unit:
℃
sense: IR
TL: 183
℃
TB: 130
℃
TB: 130
℃
T0: 090
℃
Senser: IR
type: desolder

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1. After finishing the modification, the next step communication speed, will not be able modified by
keyboard.
2. Press “EXIT” key to exit. Now, the system has saved all parameter settings, IR window will
display:
3. After all technological parameters have been selected, press “START” key and the system
perform the set flow.
E. System instruction
1. In initial state, if the top sensor or outer sensor is broken, it displays:
If the bottom sensor is broken, it displays:
When happening above status, user must stop operating.
2. In working process ,if the temperature TC greater than 270℃，system enter temperature protect,
exit working process, return initial state.
7. Technology Instruction
Note: Top and bottom Heater will be very hot during working, so please don’ touch the hot
housing parts.
Note: The laser alignment device includes a secondary laser device, so don’t see the laser
bean directly.
TC:022
℃
Tb:019
℃
ready for flow
TC: ***
℃
Tb: ***
℃
T sense error !
TC: ***
℃
Tb: ***
℃
B sense error !

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7.1 Soldering Technology
1．Turn on power switch of each part.
2．Move PCB Fixture with fixed PCB to make PCB over the Bottom Heater and make the soldered
component between Top Heater and Bottom Heater. The position is easy to be measured with
laser alignment device. The right position should make the red laser point in the center of
component. The component which to solder on the PCB have been aligned before soldering.
Suggest using PLprecision placement system.
3．Select parameter with keyboard. (Refer to “Parameter setting”)
1) Input password”000”
2) Select the required flow, if need to modify, perform relevant operation.
3) Select “solder” working mode.
4) Select “IR” laser alignment mode.
5) Not to change communication speed, and press “EXIT” key to exit. IR window shows:
6) Press “START” key and the system start to work, perform content of selected flow.
4. IR window will show series of setting temperatures and the current temperature of Tb and TC
during working, and indicate when it reaches T0, T1, T2, T3 and TL. S1, S2 and S3 are counted
down and user can know about the setting value clearly.
5. IR window will show series of setting temperatures and the current temperature of Tb and TC
during working, and indicate when it reaches T0, T1, T2, T3 and TL. S1, S2 and S3 are counted
down and user can know about the setting value clearly.
6. If you see the solder has melted down (It is watched with IR camera and LCD), you can press
“CAL” Key to calibrate temperature of TL to adjust the display temperature to liquid temperature
TL.
7. When the temperature reaches TL, there will be a voice signal.
8. When the temperature reaches T3, the voice signal is change to a hurry sound and the system
prolongs heating by S3 seconds, after it, the system will not heat up anymore, and the technical
process is over.
9. The system can perform a series of function action during working.
a) After press “START” key, the top heater move downwards near to bottom.
b) After the system sounds unvaryingly, the top heater moves upwards. Open the cooling fan
to blow cooling wind.
c) After the PCB has cooled, close the cooling fan, and the soldering technics has finished.
TC: ***
℃
Tb: ***
℃
ready for flow
TC:022˙C Tb:019˙
C
ready for flow

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7.2 De-soldering Technology
1. Turn on power switch of each part.
2. Fix the PCB on the top of Bottom Heater and make the de-soldered component between Top
Heater and Bottom Heater. The position is easy to be measured with laser alignment device.
The right position should make the red laser point in the center of component and the suction
pad also in center of component.
3. Adjust aperture system to get a proper window size.
4. Select parameter with IR keyboard. (Refer to “Parameter setting”)
A. Input password ”000”
B. Select the required flow, if need to modify, perform relevant operation.
C. Select “desolder” working mode.
D. Select “IR” laser alignment mode.
E. Not to change communication speed, and press “EXIT” key to exit. IR window shows:
F. Press “START” key and the system start working, perform content of selected flow.
5. After pressing “START” key, bottom heater starts to heat up and top heater moves downwards
and reaches to bottom.
6. IR window will show a series of setting temperatures during working. Indicate when it reaches
T0, T1, T2, T3 and TL. When the bottom temperature reaches T0, the top heater STARTs to heat
up.
7. When the temperature reaches TL, it will give a sound alert automatically (Low frequency).
8. When the temperature reaches T3, it will also give a sound alert automatically. (Middle
frequency)
9. When the solder has melted down, pick up the component.
10. Open the Cooling fan until the PCB has cooled down.
11. The top heater moves upwards and stops at top.
8. Turn off the System
Please turn off power switch of each part and pull out power plug when not using it.
9. System Maintenance
Remark: For ensuring reliable function and maintenance of equipment, please use parts provided by
original factory.
Note: After cutting off the power supply, the housing is still very hot, so please
don’t use any dangerous or combustible solvent to clean it.
Clean parts:
Clean the dust on system with clean towel.
Use the towel with cleaning oil to clean PCB fixture and orbit.
Solder on the gridding of the bottom heater can be cleaned out with hard object.

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10. Toxic and harmful substance or element form
component
toxic and harmful substance or element
Pb
Hg
Cd
Cr(VI)
PBB
PBDE
transformer
×
○
○
×
○
○
wire
×
○
○
○
○
○
Welding spot
×
○
○
○
○
○
fan
×
○
○
×
○
○
dynamo
×
○
○
○
○
○
radiotube
○
○
○
×
○
○
LCD
×
○
○
○
○
○
PCB
×
○
○
○
×
○
○: show the content of this toxic and harmful substance behind the standard of SJ/T11363-2006
×: show the content of this toxic and harmful substance beyond the standard of SJ/T11363-2006