RadiSys CE915GM User manual

www.radisys.com
PROCELERANT™
CE915GM COM EXPRESS MODULE
QUICK START GUIDE
007-02531-0000 • April 2007
CE760A-0
CE738A-0
CE373A-0
CE370A-0
CE738A-E-512

Release history
Release Date Description
-0000 April 2007 First release, introducing CE760A, CE738A, CE373A, and CE370A modules.
Copyright © 2007 by RadiSys Technology (Ireland) Ltd. All rights reserved.
Portions of this manual are copyrighted by the PCI Industrial Computer Manufacturers Group, and are reprinted with permission.
RadiSys is a registered trademark and Procelerant is a trademark of RadiSys Corporation. PICMG is a registered trademark and COM
Express is a trademark of the PCI Industrial Computer Manufacturers Group. Intel and Celeron are registered trademarks and Intel Core
is a trademark of Intel Corporation. Micro Memory is a trademark of Micro Memory LLC. Microsoft, Windows, and Windows XP are
registered trademarks of Microsoft Corporation. Red Hat and Red Hat Linux are registered trademarks of Red Hat, Inc. Linux is a
registered trademark of Linus Torvalds. Phoenix is a registered trademark and FirstBIOS is a trademark of Phoenix Technologies.
All other trademarks, registered trademarks, service marks, and trade names are the property of their respective owners.

3
Preface ............................................................................................................................ 5
About this guide................................................................................................................................. 5
Where to get more information..................................................................................................... 5
Safety notices...................................................................................................................................... 5
Lithium cell battery ................................................................................................................................ 5
Electrostatic discharge ........................................................................................................................... 6
Chapter 1: Checking your order................................................................................... 7
COM Express module product codes........................................................................................... 7
CR100 carrier board product codes...............................................................................................7
Optional components....................................................................................................................... 8
Memory modules................................................................................................................................... 8
Fansinks .................................................................................................................................................... 8
Video adapter.......................................................................................................................................... 10
Chapter 2: Preparing Components and Accessories................................................. 11
Preparing COM Express components........................................................................................... 11
Power supply...................................................................................................................................... 12
CD-ROM.............................................................................................................................................. 12
Hard disk ............................................................................................................................................. 12
Keyboard and mouse....................................................................................................................... 12
Video devices...................................................................................................................................... 13
DVI and VGA Monitors.......................................................................................................................... 13
LVDS panel............................................................................................................................................... 13
TV or other S-Video devices................................................................................................................. 13
Ethernet ............................................................................................................................................... 13
Miscellaneous attachments ............................................................................................................. 13
TABLE OF CONTENTS

4
Chapter 3: Identifying Key Components..................................................................... 15
COM Express module layout.......................................................................................................... 15
CR100 carrier board layout.............................................................................................................. 16
Chapter 4: Assembling the Module and Carrier Board ............................................ 17
Install the memory module............................................................................................................. 17
Install the fansink............................................................................................................................... 18
Install the module assembly on the carrier board..................................................................... 24
Install the CR100 carrier board in the chassis ............................................................................. 26
Connect internal devices and set jumpers................................................................................... 26
Connect external I/O devices and chassis components........................................................... 28
Power on the system........................................................................................................................ 29
Check the BIOS settings................................................................................................................... 29
Chapter 5: Installing Operating System and Drivers ................................................. 31
Install the operating system ............................................................................................................ 31
Install drivers....................................................................................................................................... 31

5
PREFACE
About this guide
Procelerant™ COM Express™ family products are designed to provide a wide range of processor
options enabling high reuse and interchangeability of COM Express modules and carrier boards.
Additionally, all CE915GM COM Express modules, their heatsink assemblies, and the CR100
carrier boards are RoHS compliant.
This guide is for the technician or engineer who will physically install the Procelerant COM
Express embedded computing module on an application-specific carrier board. The Procelerant
CR100 FlexATX carrier board was designed for this purpose, and is used as the sample carrier
board in this guide.
For detailed information and technical specifications, refer to the Procelerant CE915GM COM
Express Module Product Manual available on the RadiSys Web site, www.radisys.com.
For information about the CR100 carrier board, refer to the Procelerant CR100 FlexATX Carrier
Board Product Manual.
Where to get more information
Please visit the RadiSys®Web site at www.radisys.com for product information and other
resources. Downloads (manuals, release notes, software, etc.) are available via the Technical
Support Library product links at www.radisys.com/support or the product pages at
www.radisys.com/products.
Safety notices
Lithium cell battery
WARNING
The CR100 carrier board contains a lithium cell battery.
DANGER OF EXPLOSION IF BATTERY IS INCORRECTLY REPLACED. Replace only with the same or equivalent
type recommended by the manufacturer. Dispose of batteries according to the manufacturer's instructions.
When removing or replacing the lithium cell, do not use a conductive instrument, as a short-circuit may cause
the cell to explode. Always replace the cell with one of the same type. This product uses a CR2032 cell. Dispose
of a spent cell promptly—do not recharge, disassemble, or incinerate a cell. Keep cells away from children.

6
Electrostatic discharge
Electrostatic discharge (ESD) damage can result in partial or complete device failure,
performance degradation, or reduced operating life. To avoid ESD damage, the following
precautions are strongly recommended.
Keep each module/PCB in its ESD shielding bag until you are ready to install it.
Before touching a module, attach an ESD wrist strap to your wrist and connect its other end
to a known ground.
Handle the module only in an area that has its working surfaces, floor coverings, and chairs
connected to a known ground.
Hold modules only by their edges and mounting hardware. Avoid touching PCB
components and connector pins.
For further information on ESD, visit www.esda.org.
WARNING
This product contains static-sensitive components and should be handled with care. Failure to employ adequate
anti-static measures can cause irreparable damage to components.

7
CHECKING YOUR ORDER 1
Check the RadiSys product codes on the Procelerant COM Express module, CR100 carrier
board, and accessories to make sure you received the correct products for your application.
COM Express module product codes
The following table lists the CE915GM modules available at the time of publication. Check the
CE915GM product page on the RadiSys Web site or contact your sales representative for the
latest information about product offerings. Note that memory modules are not necessarily
included and must be purchased separately.
CR100 carrier board product codes
This guide assumes that you will use the CR100 carrier board with the COM Express module.
Two CR100 carrier board options are available to accommodate your graphics requirements.
Product code Description
CE760A-0 CE915GM with Intel®2GHz Pentium®M 760 BGA processor, no memory module,
RoHS
CE738A-0 CE915GM with Intel 1.4GHz LV Pentium M 738 BGA processor, no memory
module, RoHS
CE373A-0 CE915GM with Intel 1.0GHz ULV Celeron M 373 BGA processor, no memory
module, RoHS
CE370A-0 CE915GM with Intel 1.5GHz Celeron®M 370 BGA processor, no memory module,
RoHS
CE738A-E-512 CE915GM with Intel 1.4GHz LV Pentium M 738 BGA processor, 512MB memory
module, with extended temperature to -25ºC to 70ºC, RoHS
Product code Description
CR100-2DVI Flex ATX Carrier, Dual DVI
CR100-PCIE16 Flex ATX Carrier, PCIE x16, SVGA

Checking your order
1
8
Optional components
Memory modules
The COM Express module requires one memory module to operate. For supported memory
module options that have been validated for use with these COM Express modules, refer to the
Procelerant CE915GM Memory Validation List documentation on the RadiSys Web site.
Fansinks
The table below lists the product codes of fansinks offered by RadiSys. A complete list of all the
components in each fansink kit is provided in the tables that follow.
Product code Description
CE-AHSA Active heatsink assembly (a fan is built into the heatsink) for any COM Express
module in a 2U chassis.
The power connector for the CE-AHSA fansink is ATX-compliant.
Heatsink dimensions: 125 x 95 x 26.90mm
Fansink dimensions: 80 x 80 x 15mm
Fansink power supply: +5V to +13.8V (+12V recommended)
CE-PHSA A passive heatsink for any COM Express module in a 1U chassis. A chassis fan is
required with this option.
Dimensions: 125 x 95 x 26.90mm
CE-PHS17A A 17mm low-profile passive heatsink for COM Express modules CE373A or CE738A
in a 6HP (ATCA) blade. An air velocity of 400 lfm [2 m/sec] is required. Use with
CE738A requires a chassis fan.
Dimensions: 125 x 95 x 14.94mm
CE-HSPA Heat spreader for CE760A, solid aluminum, compliant with PICMG COM.0 COM
Express specification Revision 1.0
Dimensions: 125 x 95 x 11mm
CE-TIM Thermal compound application bar, phase change at 58ºC (136ºF)

Optional components
1
9
CE-AHSA package contents
CE-PHSA package contents
Product code Description QTY Part number
Backer plate 41x36mm, sheet metal (supplied with four M2 flat head
screws)
1 010-02709-00xx
CE-AHSA Aluminum active fansink, 125x94x42mm, 12V input 1 019-00352-00xx
Carrier screws M2.5x0.45x4mm, pan head (used to tighten the carrier
board and module)
5 09-0293-00xx
Heatsink screws M2.5x0.45x16mm, pan head (used to tighten the heatsink
and module)
5 009-01707-00xx
Heatsink spacer M2.5 clear, 4.5mm outside diameter, 6mm long 1 009-01587-00xx
Module screw M2.5x0.45x12mm, pan head (used with the heatsink
spacer)
1 09-0344-00xx
Standoffs M2.5x0.45x5mm, hex jam, 4.5mm outside diameter 5 009-01190-00xx
Washers 2.5mm inside diameter, spring lock (used with heatsink
screws)
5 009-01208-00xx
Product code Description QTY Part number
Backer plate 41x36mm, sheet metal (supplied with four M2 flat head
screws)
1 010-02709-00xx
CE-PHSA Aluminum active fansink, 125x94x27mm, 12V input 1 019-00352-00xx
Carrier screws M2.5x0.45x4mm, pan head (used to tighten the carrier
board and module)
5 09-0293-00xx
Heatsink screws M2.5x0.45x16mm, pan head (used to tighten the heatsink
and module)
5 009-01707-00xx
Heatsink spacer M2.5 clear, 4.5mm outside diameter, 6mm long 1 009-01587-00xx
Module screw M2.5x0.45x12mm, pan head (used with the heatsink
spacer)
1 09-0344-00xx
Standoffs M2.5x0.45x5mm, hex jam, 4.5mm outside diameter 5 009-01190-00xx
Washers 2.5mm inside diameter, spring lock (used with heatsink
screws)
5 009-01208-00xx

Checking your order
1
10
CE-PHS17A package contents
Video adapter
If you are using the CR100 carrier board and need to attach a VGA monitor to a DVI-I port, a
DVI-to-SVGA adapter is required. Refer to DVI and VGA Monitors on page 13 for further
information on VGA support on DVI-I ports.
Product code Description QTY Part number
Backer plate 41x36mm, sheet metal (supplied with four M2 flat head
screws)
1 010-02709-00xx
CE-AHSA Aluminum active fansink, 125x95x17mm, 12V input 1 019-00352-00xx
Carrier screws M2.5x0.45x4mm, pan head (used to tighten the carrier
board and module)
5 09-0293-00xx
Heatsink screws M2.5x0.45x16mm, pan head (used to tighten the heatsink
and module)
5 009-01707-00xx
Heatsink spacer M2.5 clear, 4.5mm outside diameter, 6mm long 1 009-01587-00xx
Module screw M2.5x0.45x12mm, pan head (used with the heatsink
spacer)
1 09-0344-00xx
Standoffs M2.5x0.45x5mm, hex jam, 4.5mm outside diameter 5 009-01190-00xx
Washers 2.5mm inside diameter, spring lock (used with heatsink
screws)
5 009-01208-00xx
Product Code Description
CE-DVI-VGA DVI-to-SVGA adapter

11
PREPARING COMPONENTS AND ACCESSORIES 2
Preparing COM Express components
Lay out all the components on a grounded work surface as shown in Figure 1, “Basic
component preparation,” on page 11 to prepare for assembly. Note that you may have
different parts depending on what you ordered.
Figure 1. Basic component preparation
1
2
9
3
8
11
10
47 56
Item Component description Item Component description
1 COM Express module 7 Heatsink spacer and module screw
2 DDR2 memory module 8 Heatsink screws
3 Active fansink assembly 9 Washers (use with item 8)
4 Fansink backer plate (supplied with four M2 flat
head screws)
10 Carrier screws
5 Phase-change thermal interface material,
Thermstrate®TC
11 CR100 FlexATX carrier board
6 Standoffs (use with items 8 and 9)

Preparing Components and Accessories
2
12
Power supply
The COM Express module will work with an ATX-compliant power supply or a power supply that
is compliant with PICMG COM.0 COM Express Specification Revision 1.0. When selecting a
power supply, be sure to consider the maximum power, AC input, frequency, input current, and
DC out specifications of the power supply.
Theoretically, COM Express modules require at least 8A on the +12V power rail. Considering
the power consumption of the carrier board, though, it is best to allow a certain amount of
leeway on the two power rails. For this reason, the power supply should be rated above 200
Watts with at least 12A output on the +12V power rail.
A typical power supply for the CR100 Flex ATX carrier board may have these specifications:
Type: ATX
Max Power: 350W
AC input: 100–120V AC, 200–240V AC
Frequency: 50/60Hz
Input current: 10 A @ 115 V, 6 A @ 230 V
DC output:
CD-ROM
A USB CD-ROM or IDE CD-ROM drive is usually required for you to install the operating system
and other software.
Hard disk
Standard computer IDE and SATA hard disks (60GB, 80GB, 120GB, etc.) can be attached to the
CR100 carrier board. The CR100 carrier board contains one IDE header and two SATA headers.
Keyboard and mouse
The CR100 carrier board supports a standard USB keyboard and USB mouse. The CR100 does
not support the use of a PS/2 keyboard or mouse.
Voltage +3.3V +5V +12V -5V -12V +5V Standby with 12V power supply
Current 14A 30A 15A 0.5A 0.8A 3.0A
Note
It is recommended that you use an ATX P4 power supply with a 24-pin cable, which is typically
labeled “BTX.” A 20-pin cable can also be used, in which case you would plug the 20-pin cable in on
the pin #1 end of the carrier board’s ATX power supply connector and leave the two pairs of pins on
the other end exposed. No adapter is required.
When multiple fans are used, additional amperage is required. For example, if a 4U chassis with two
fans has 2A surge current for each fan, 16A is required (12A + 2A + 2A).

Video devices
2
13
Video devices
DVI and VGA Monitors
The CR100-2DVI carrier board contains two DVI-I ports that comply with the Digital Video
Interface (DVI) specification. Dual independent displays can be used with the appropriate
drivers installed. Alternatively, you can attach a single analog VGA monitor to one of the DVI-I
ports. For detailed instructions, see Connect internal devices and set jumpers on page 26.
The CR100-PCIE16 carrier board is designed to use a PCI Express graphics card in the PCI
Express x16 graphics slot for high-performance graphics acceleration. The two DVI-I ports on this
carrier board do not support DVI monitors, but one of the ports can be used to attach a VGA
monitor. For detailed instructions, see Connect internal devices and set jumpers on page 26.
LVDS panel
On the CR100 carrier board, a low-voltage differential signaling (LVDS) interface allows the
connection of one LVDS flat panel. This attachment typically requires a custom cable. Use the
LVDS interface pinout chart in the Procelerant CR100 FlexATX Carrier Board Product Manual as
a guide for obtaining a suitable cable.
TV or other S-Video devices
Use a standard MiniDin4 male S-Video cable to connect video equipment or other S-Video
compatible devices.
Ethernet
Use the RJ45 Ethernet port to connect to a LAN, router, or other device via Ethernet cable. For
10/100Base-T connections, a Cat 5 cable is required. A 1000Base-T connection requires a
Cat5E cable.
Miscellaneous attachments
Additional interfaces, such as an RS-232 port, USB ports, front panel LEDs, IEEE 1394b, and
backlight control, may be added to the chassis. For connector locations on the CR100 carrier
board and cable selection for internal connections, refer to the Procelerant CR100 FlexATX
Carrier Board Product Manual, which provides connector locations, connector pinout definitions
and a list of part numbers for all carrier board connectors.
NOTE
Connection of a VGA monitor with a DB15 cable connector to the DVI port requires a VGA-to-DVI
adapter (see Video adapter on page 10).

Preparing Components and Accessories
2
14

15
IDENTIFYING KEY COMPONENTS 3
This chapter describes the key components and interfaces on the COM Express module and
CR100 carrier board.
COM Express module layout
Figure 2 and Figure 3 show the main components of COM Express modules. For features and
functionality of these components, refer to the Product Manual.
Figure 2. COM Express module top view
CPU
DDR2 SO-DIMM
memory socket
Phoenix FirstBIOS
Notebook (Pro) BIOS
Intel 82573V
Ethernet controller
Intel ICH6-M
Mobile Intel 915GM
Express chipset
BIOS operation mode
header
Reset LED (D4)
POST LED (D5)

Identifying Key Components
3
16
Figure 3. COM Express module bottom view
CR100 carrier board layout
For locations of key components on the CR100 carrier board, refer to the Procelerant CR100
FlexATX Carrier Board Product Manual.
Board-to-board
interconnector

17
ASSEMBLING THE MODULE AND CARRIER BOARD 4
Install the memory module
1. Insert one memory module into the lower DDR2 SO-DIMM memory socket. Press down on
the corners of the memory module until the latches click into place.
2. To remove a memory module, open the latches on both sides of the memory socket, lift
the free end of the memory module, and remove it from the socket.
Press firmly into place
Memory modul
e
latches

Assembling the Module and Carrier Board
4
18
Install the fansink
1. Apply the Thermstrate TC phase-change material to the processor, GMCH, and ICH6-M
chipsets. When assembled, heat from the chips will be conducted through the thermal
interfaces to the fansink.
2. Install the heatsink spacer and module screw through the module as shown below. The
screw will secure the fansink.
Heatsink spacer and module screw

Install the fansink
4
19
3. Check the bottom side of the fansink for correct alignment against the module.
Against CPU
Against mobile Intel 915GM
Express chipset
Against Intel
ICH6-M
For heatsink spacer
and module screw

Assembling the Module and Carrier Board
4
20
4. Place the fansink assembly on the module as shown, lining up the standoffs on the fansink
with the screw holes in the module.