RF-Star RF-BM-ND06 User manual

RF-BM-ND06
Bluetooth 5.0 Low Energy Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Sep. 22nd, 2020

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Nordic BLE Module List
➢nRF51 Series
Chipset
Core
Flash
(Byte)
RAM
(KB)
TX
Power
(dBm)
Model
Antenna
Dimension
(mm)
Range
(M)
Photo
nRF51822
M0
256K
16
4
RF-BM-ND01
PCB
15  24.8
100
RF-BM-ND02
PCB
13.5  16.2
80
RF-BM-ND02I
IPEX
13.5  16.2
150
nRF51802
M0
256K
16
4
RF-BM-ND01C
PCB
15  24.8
100
RF-BM-ND02C
PCB
13.5  16.2
80
RF-BM-ND02CI
IPEX
13.5  16.2
80
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

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➢nRF52 Series
Chipset
Core
Flash
(KB)
RAM
(KB)
TX
Power
(dBm)
Model
Antenna
Dimension
(mm)
Range
(M)
Photo
nRF52832
M4F
512
64
4
RF-BM-ND04
PCB
15  24.8
100
RF-BM-ND04I
IPEX
15  24.8
100
RF-BM-ND08
PCB
15.2  11.2
80
RF-BM-ND08I
IPEX
15.2  11.2
100
Contact me
nRF52810
M4
192
24
4
RF-BM-ND04C
PCB
15  24.8
100
RF-BM-ND04CI
IPEX
15  24.8
100
RF-BM-ND08C
PCB
15.2  11.2
80
RF-BM-ND08CI
IPEX
15.2  11.2
100
Contact me
nRF52811
M4
192
24
4
RF-BM-ND04A
PCB
15  24.8
100

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RF-BM-ND08A
PCB
15.2  11.2
80
nRF52833
M4
512
128
8
RF-BM-ND07
Chip /
IPEX
12.2  17
300
nRF52840
M4F
1024
256
8
RF-BM-ND05
PCB
15  24.8
550
RF-BM-ND05I
IPEX
15  24.8
550+
RF-BM-ND06
PCB
20.5  24
550
Note:
1. The communication distance is the longest distance obtained by testing the module's maximum transmission power
in an open and interference-free environment in sunny weather.
2. Click the picture to buy modules.

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1 Device Overview
1.1 Description
RF-BM-ND06 is an RF module based on Nordic multiprotocol SoC nRF52840-QIAA-R with best-in-class 32-bit ARM®
Cortex®-M4 processor. It integrates a 32.768 kHz and a 32 MHz crystal, a power filter, an antenna matching, and a high-
performance PCB antenna. It supports BLE stack v5.0, Bluetooth 5.0 low energy, Bluetooth mesh, Thread, ZigBee, IEEE
802.15.4-2006 and 2.4 GHz proprietary and can be preprogrammed with a serial interface communication protocol for
simple programming. It also has a range of analog and digital interfaces such as NFC-A, ADC, high-speed 32 MHz SPI,
UART, SPI, I2C, PWM, I2S, PPI and PDM. It features high-performance digital interfaces, robust connection distance,
and rigid reliability. 1.27-mm pitch stamp stick package for easy assembling and cost-effective PCB design. All pins of
RF-BM-ND06 are pulled out.
1.2 Key Features
•RF
- Bluetooth 5.0 low energy
- Bluetooth mesh
- Thread
- ZigBee
- IEEE 802.15.4-2006
- 2.4 GHz proprietary
•TX power: -20 dBm ~ +8 dBm
•On-air compatible with nRF52, nRF51, nRF24L and
nRF24AP series
•ARM® Cortex®-M4 32-bit processor with FPU, 64 MHz
•Supply voltage range: 1.8 V ~ 5.5 V
•Memory
- Flash: 1 MB
- RAM: 256 kB
•Advanced peripherals
- High-speed 32 MHz SPI
- NFC-A
- Programmable Peripheral interconnect (PPI)
- 48 GPIOs
- 12-bit, 200 ksps ADC
- 4 x 4-channel PWM
- I2S
- PDM
- 4 x SPI master / 3 x SPI slave
- 2 x I2C master / slave
- 2 x UART (CTS / RTS)
•Quadrature decoder (QDEC)
•Transmission Distance: 550+ m
•Dimension: 24.0 mm x 20.5 mm x (2.20 ± 0.1) mm
•Certificates: RoHS, FCC, CE
1.3 Applications
•Internet of Things (IoT)
•Internet Gateway
•Cloud Connectivity
•Industrial Control
•Home Automation
•Smart Plug and Metering
•Wireless Audio
•Access Control
•IP Network Sensor Nodes
•Security Systems
•Wearables
•Building automation
•Retail
•Sensor networks

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•Medical devices •Remote controls
1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-BM-ND06
1.5 Part Number Conventions
The part numbers are of the form of RF-BM-ND06 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BM-ND06
RF
BM
ND
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset Manufacturer
Nordic Semiconductor
-
-
06
Module Version
nRF52840 Second Version
nRF52840
QIAA-R
GPIO
Debug
Reset
PCB Antenna
LC Filter
Power Supply
1.7 V ~ 5.5 V
Antenna
Matching
32.0 MHz
32.768 kHz

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Table of Contents
Nordic BLE Module List ................................................................................................................................................... 1
➢nRF51 Series ....................................................................................................................................................... 1
➢nRF52 Series ....................................................................................................................................................... 2
1 Device Overview............................................................................................................................................................. 4
1.1 Description............................................................................................................................................................ 4
1.2 Key Features ....................................................................................................................................................... 4
1.3 Applications.......................................................................................................................................................... 4
1.4 Functional Block Diagram .............................................................................................................................. 5
1.5 Part Number Conventions.............................................................................................................................. 5
Table of Contents................................................................................................................................................................ 6
Table of Figures................................................................................................................................................................... 7
Table of Tables..................................................................................................................................................................... 7
2 Module Configuration and Functions ...................................................................................................................... 8
2.1 Module Parameters........................................................................................................................................... 8
2.2 Module Pin Diagram ......................................................................................................................................... 9
2.3 Pin Functions....................................................................................................................................................... 9
3 Specifications .................................................................................................................................................................12
3.1 Recommended Operating Conditions .....................................................................................................12
3.2 Handling Ratings..............................................................................................................................................12
4 Application, Implementation, and Layout.............................................................................................................13
4.1 Module Photos..................................................................................................................................................13
4.2 Recommended PCB Footprint....................................................................................................................13
4.3 Schematic Diagram.........................................................................................................................................14
4.4 Reference Design............................................................................................................................................14
4.5 Basic Operation of Hardware Design ......................................................................................................15
4.6 Trouble Shooting..............................................................................................................................................16
4.6.1 Unsatisfactory Transmission Distance........................................................................................16
4.6.2 Vulnerable Module..............................................................................................................................16
4.6.3 High Bit Error Rate .............................................................................................................................17
4.7 Electrostatics Discharge Warnings ...........................................................................................................17

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4.8 Soldering and Reflow Condition.................................................................................................................17
4.9 Optional Packaging.........................................................................................................................................18
5 Certification .....................................................................................................................................................................19
5.1 RoHS ....................................................................................................................................................................19
5.2 FCC.......................................................................................................................................................................19
5.3 CE..........................................................................................................................................................................20
6 Revision History ............................................................................................................................................................21
7 Contact Us.......................................................................................................................................................................22
Table of Figures
Figure 1. Functional Block Diagram of RF-BM-ND06................................................................................. 5
Figure 2. Part Number Conventions of RF-BM-ND06 ................................................................................ 5
Figure 3. Pin Diagram of RF-BM-ND06............................................................................................................ 9
Figure 4. Photos of RF-BM-ND06.....................................................................................................................13
Figure 5. Recommended PCB Footprint of RF-BM-ND06 (mm) ..........................................................13
Figure 6. Schematic Diagram of RF-BM-ND06 ...........................................................................................14
Figure 7. Reference Design of RF-BM-ND06 ..............................................................................................14
Figure 8. Recommendation of Antenna Layout ...........................................................................................16
Figure 9. Recommended Reflow for Lead Free Solder............................................................................18
Figure 10. Optional Packaging Mode ..............................................................................................................18
Figure 11. RoHS Certificate.................................................................................................................................19
Figure 12. FCC Certificate ...................................................................................................................................19
Figure 13. CE Certificate ......................................................................................................................................20
Table of Tables
Table 1. Parameters of RF-BM-ND06............................................................................................................... 8
Table 2. Pin Functions of RF-BM-ND06 ........................................................................................................... 9
Table 3. Recommended Operating Conditions of RF-BM-ND06..........................................................12
Table 4. Handling Ratings of RF-BM-ND06 ..................................................................................................12
Table 5. Temperature Table of Soldering and Reflow................................................................................17

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-BM-ND06
Chipset
nRF52840QIAA-R
Supply Power Voltage
1.7 V ~ 5.5 V, recommended to 3.3 V
Frequency
2402 MHz ~ 2480 MHz
Transmit Power
-20.0 dBm ~ +8.0 dBm (typical: 0 dBm)
Receiving Sensitivity
-95 dBm conductive sensitivity in BLE mode
-103 dBm sensitivity in 125 kbps BLE mode (long range)
Data Rate
Bluetooth ® 5: 2 Mbps, 1 Mbps, 500 kbps and 125 kbps
IEEE 802.15.4-2006: 250 kbps
Proprietary 2.4 GHz: 2 Mbps, 1 Mbps
Power Consumption
4.8 mA peak current in TX (@0 dBm)
4.6 mA peak current in RX
GPIO
48
Crystal
32 MHz, 32.768 kHz
RAM
256 KB
Flash
1 MB
Package
LGA Packaging
Frequency Error
±20 kHz
Dimension
24.0 mm x 20.5 mm x (2.20 ± 0.1) mm
Type of Antenna
PCB Antenna
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-BM-ND06
2.3 Pin Functions
Table 2. Pin Functions of RF-BM-ND06
Pin
Name
Chip Pin
Pin Type
Description
1
P0.12
SIO_12
-
-
2
VCC
Power 1.7 V ~ 3.6 V
-
1.7 V ~ 3.6 V
3
VDD_HV
Power 2.5 V ~ 5.5 V
-
2.5 V ~ 5.5 V
4
VDD_USB
4.35 V ~ 5.5 V
-
4.35 V ~ 5.5 V
5
D-
D-
Data-
USB-
6
D+
D+
Data+
USB+
7
P0.13
GPIO_13
-
LED
8
P0.14
GPIO_14
-
LED
9
P0.15
GPIO_15
-
LED
10
P0.16
GPIO_16
-
LED
11
P0.17
GPIO_17
QSPI_CS
LED

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12
P0.18
nRESET
-
System reset (active low)
13
P0.19
GPIO_19
QSPI_CLK
-
14
P0.20
GPIO_20
QSPI_DIO0
-
15
P0.21
GPIO_21
QSPI_DIO1
-
16
P0.22
GPIO_22
QSPI_DIO2
-
17
P0.23
GPIO_23
QSPI_DIO3
-
18
P0.24
GPIO_24
-
-
19
P0.25
GPIO_25
-
-
20
P1.00
GPIO_1.00
-
-
21
SWDIO
SWDIO
-
Serial wire debug I/O for debug and
programming
22
SWCLK
SWCLK
-
Serial wire debug clock input for
debug and programming
23
NFC1
NFC1/SIO_09
-
-
24
NFC2
NFC2/SIO_10
-
-
25
P1.01
GPIO_1.01
-
-
26
P1.02
GPIO_1.02
-
-
27
P1.03
nAutoRUN
nAutoRUN
FTDI USB_DTR via jumper on
J12pin1-2.
28
P1.04
GPIO_1.04
-
-
29
P1.05
GPIO_1.05
-
-
30
P1.06
GPIO_1.06
-
-
31
RF_OUT
RF-interface
-
-
32
P1.07
GPIO_1.07
-
-
33
P1.10
GPIO_1.10
-
-
34
P1.11
GPIO_1.11
-
-
35
P1.12
GPIO_1.12
SPI_CS
36
P1.13
GPIO_1.13
-
-

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37
P1.14
GPIO_1.14
-
-
38
P1.15
GPIO_1.15
-
-
39
P0.03
GPIO_0.03
-
Temperature sensor analog
40
P0.02
GPIO_0.02
-
Internal pull low. External pull high to
enter VSP services.
41
P0.28
GPIO_0.28
-
-
42
P0.29
GPIO_0.29
-
-
43
P0.30
GPIO_0.30
-
-
44
P0.31
GPIO_0.31
-
-
45
P0.26
GPIO_0.26
I2C_SDA
I2C RTC chip. I2C data line
46
P0.27
GPIO_0.27
I2C_SCL
I2C RTC chip. I2C clock line.
47
P0.04
GPIO_0.04
SPI_MISO
SPI EEPROM.
SPI_Eeprom_MISO, Input.
SPIOPEN in smartBASIC selects SPI
function; MOSI and CLK are outputs
when in SPI master mode
48
P0.05
GPIO_0.05
UART_RTS
49
P0.06
GPIO_0.06
UART_TX
50
P0.07
GPIO_0.07
UART_CTS
51
P0.08
GPIO_0.08
UART_RX
52
P1.08
GPIO_1.08
SPI_MOSI
53
P1.09
GPIO_1.09
SPI_CLK
54
P0.11
GPIO_0.11
-

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-BM-ND06
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
1.7
3.3
5.5
V
Operating Temperature
/
-40
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 4. Handling Ratings of RF-BM-ND06
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±2000
V
Moisture Sensitivity Level
2
Charged Device Model
±750
V

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-BM-ND06
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-BM-ND06 (mm)

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4.3 Schematic Diagram
Figure 6. Schematic Diagram of RF-BM-ND06
4.4 Reference Design
Figure 7. Reference Design of RF-BM-ND06

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4.5 Basic Operation of Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient and
the reliable ground. Please pay attention to the correct connection between the positive and negative poles of the
power supply. Otherwise, the reverse connection may cause permanent damage to the module.
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring and other parts with large electromagnetic interference.
4. The bottom of module should avoid high-frequency digital routing, high-frequency analog routing and power routing.
If it has to route the wire on the bottom of module, for example, it is assumed that the module is soldered to the Top
Layer, the copper must be spread on the connection part of the top layer and the module, and be close to the digital
part of module and routed in the Bottom Layer (all copper is well grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees.
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for
example: USB 3.0.
9. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
10. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
11. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free space electromagnetic radiation. The location and layout of antenna
is a key factor to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:

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（1）Place the antenna on the edge (corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is the best to hollow out the antenna position in the following figure so as to ensure that S11 of the module
is minimally affected.
Figure 8. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.6 Trouble Shooting
4.6.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The
performances of ground absorption and reflection of radio waves will be poor, when the module is tested close to
the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by seaside are poor.
3. The signal attenuation will be very obvious, if there is a metal near the antenna or the module is placed inside of the
metal shell.
4. The incorrect power register set or the high data rate in an open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and module or the poor quality of antenna will affect the communication distance.
4.6.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure the stable power supply and no frequently fluctuated

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voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
4.6.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.7 Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggest that all modules should follow the 3 precautions
below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti- static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of module, even causing the failure.
4.8 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 5. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s

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Peak Temperature (Tp)
220 ℃ ~ 235 ℃
230 ℃ ~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃ to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s
Figure 9. Recommended Reflow for Lead Free Solder
4.9 Optional Packaging
Figure 10. Optional Packaging Mode
Note: Default tray packaging.

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5 Certification
5.1 RoHS
RoHS Report No.: BLA-C-201811-A05-01
Figure 11. RoHS Certificate
5.2 FCC
Warnings:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) this device must accept any interference received, including interference
that may cause undesired operation.
FCC ID: 2ABN2-RF-BM-ND06
Figure 12. FCC Certificate