RF-Star RF-TI1352P2 User manual

RF-TI1352P2 CC1352P7 SimpleLinkTM High-
Performance Sub-1G + 2.4 G Multi-band Module
With Integrated Power Amplifier
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Oct. 31th, 2023
All rights reserved. Those responsible for unauthorized reproduction will be prosecuted.

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1 Device Overview
1.1 Description
RF-TI1352P2 is an RF module based on TI SoC CC1352P7 with an integrated power amplifier. It integrates a 48 MHz
and a 32.768 kHz crystal, a 256 KB ROM, a 704 KB Flash, and the IPEX connectors and half-hole RF output pins of
different radio frequency to guarantee the external antenna connection. Its ARM® Cortex®-M4F core application
processor optimized for long-range and low-power. It features small size, robust connection distance, and rigid reliability.
The multi-band module supporting multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM driver for Thread,
Zigbee®, Matter, Bluetooth® 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOTY®,
proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz). 1.27-mm pitch stamp stick package for easy
assembling and cost-effective PCB design.
1.2 Key Features
•TX power:
- Up to +20 dBm (Sub-1 GHz) with temperature
compensation
- Up to +5 dBm (2.4 GHz) with temperature
•RF Section
-Bluetooth 5.2 Low Energy
-ZigBee, Thread, Matter
-IEEE 802.15.4
-IPv6-nabld smart objects (6LoWPAN)
-MIOTY®
-Wireless M-Bus
-Wi-SUN®
-KNX RF
-Amazon Sidewalk
-Proprietary systems
-SimpleLinkTM TI 15.4-Stack (Sub-1 GHz)
-Dynamic Multiprotocol Manager (DDM) driver
compensation
•Excellent receiver sensitivity
- -121 dBm @ Sub-1 GHz (SimpleLink Long-range
Mode)
- -110 dBm @ Sub-1 GHz (50 kbps)
- -104 dBm for Bluetooth 125 kbps (LE coded PHY)
•Wide Operation Range
- 1.8 V to 3.8 V single power supply
- Operating temperature: -40 °C to +85 °C
- Storage temperature: -40 °C to +125 °C
•Microcontroller
- Powerful 48 MHz ARM® Cortex®-M4F
processor
- 2-pin cJTAG and JTAG debugging
- Supports OTA upgrade
•Memory
- 704 KB of in-system programmable flash
- 256 KB of ROM for protocols and library
functions
- 8 KB of Cache SRAM
- 80 KB of ultra-low leakage SRAM
•Ultra-low power sensor controller with 4KB of
SRAM
- Sample, store, and process sensor data
- Operation independent from system CPU
- Fast wake-up for low-power operation
•Rich Peripherals

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- 24 GPIOs, digital peripherals can be routed
to any GPIOs
- 4× 32-bit or 8× 16-bit general-purpose
timers
- 12-bit ADC, 200 kSamples/s, 8 channels
- 2 × comparators with internal reference DAC
(1 × continuous time, 1 × ultra-low power)
- Programmable current source
- 2 × UART
- 2 × SSI (SPI, MICROWIRE, TI)
- I2C
- I2S
- Real-time clock (RTC)
- Capacitive sensing, up to 8 channels
- Integrated temperature and battery monitor
•Security Enablers
- AES 128-bit and 256-bit Crypto accelerator
- ECC and RSA public key hardware accelerator
- SHA2 accelerator (full suite up to SHA-512)
- True random number generator (TRNG)
•External system
- On-chip buck DC/DC converter
- TCXO support
•Dimension: 26.9 mm × 16.9 mm × 2.1 mm
1.3 Applications
•Building security systems – motion detector,
electronic smart lock, door and window sensor,
garage door system, gateway
•HVAC – thermostat, wireless environmental
sensor, HVAC system controller, gateway
•Fire safety system – smoke and heat detector,
fire alarm control panel (FACP)
•Video surveillance – IP network camera
•Elevators and escalators – elevator main
control panel for elevators and escalators
•Smart meters – water meter, gas meter,
electricity meter, and heat cost allocators
•Grid communications – wireless
communications – Long-range sensor
applications
•Other alternative energy – energy harvesting
•Industrial transport – asset tracking
•Factory automation and control
•Medical
•Electronic point of sale (EPOS) – Electronic
Shelf Label (ESL)
•Wired networking – wireless LAN or Wi-Fi
access points, edge router
•Portable electronics – RF smart remote control
•Home theater & entertainment – smart
speakers, smart display, set-top box
•Connected peripherals – consumer wireless
module, pointing devices, keyboards and
keypads
•Gaming – electronic and robotic toys
•Wearables (non-medical) – smart trackers,
smart clothing

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1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-TI1352P2
1.5 Part Number Conventions
The part numbers are of the form of RF-TI1352P2 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-TI1352P2
RF
TI
1352
RF-STAR
Company Name
Chip Manufacturer
TI
Chipset
TI CC1352P7
-
P2
Module Version
TheSecond PA Version
CC1352P7
GPIOs
Power
Filter
48.0 MHz
32.768 kHz
Reset
Sub-1 GHz
Antenna
Matching
2.4
GHz
Antenna
Matching
IPEX
Connector
Half-hole
Interface
Power Supply
1.8 V ~ 3.8 V
PA (Sub-1
GHz) Antenna
Matching
Switch
IPEX
Connector
Half-hole
Interface
Ant
Switch
Ant
Switch

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Table of Contents
1 Device Overview............................................................................................................................................................. 1
1.1 Description............................................................................................................................................................ 1
1.2 Key Features ....................................................................................................................................................... 1
1.3 Applications.......................................................................................................................................................... 2
1.4 Functional Block Diagram .............................................................................................................................. 3
1.5 Part Number Conventions.............................................................................................................................. 3
Table of Contents................................................................................................................................................................ 4
2 Module Configuration and Functions ...................................................................................................................... 6
2.1 Module Parameters........................................................................................................................................... 6
2.2 Module Pin Diagram ......................................................................................................................................... 7
3.3 Pin Functions....................................................................................................................................................... 8
3 Specifications .................................................................................................................................................................10
3.1 Recommended Operating Conditions .....................................................................................................10
3.2 Handling Ratings..............................................................................................................................................10
3.3 PA Output Control............................................................................................................................................10
4 Application, Implementation, and Layout.............................................................................................................11
4.1 Module Photos..................................................................................................................................................11
4.2 Recommended PCB Footprint....................................................................................................................11
4.3 Schematic Diagram.........................................................................................................................................12
4.4 Antenna................................................................................................................................................................12
4.4.1 Antenna Design Recommendation ..............................................................................................12
4.4.2 Antenna Output Mode Modification..............................................................................................13
4.4.3 External Antenna Design Recommendation of the Half-Hole ANT Pin..........................13
4.4.4 IPEX Connector Specification........................................................................................................15
4.5 Basic Operation of Hardware Design ......................................................................................................15
4.6 Trouble Shooting..............................................................................................................................................16
4.6.1 Unsatisfactory Transmission Distance........................................................................................16
4.6.2 Vulnerable Module..............................................................................................................................17
4.6.3 High Bit Error Rate .............................................................................................................................17
4.7 Electrostatics Discharge Warnings ...........................................................................................................17
4.8 Soldering and Reflow Condition.................................................................................................................17

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5 Optional Package Specification ..............................................................................................................................19
6 Revision History ............................................................................................................................................................21
7 Contact Us.......................................................................................................................................................................22

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-TI1352P2
Chipset
CC1352P7
Supply Power Voltage
1.8 V ~ 3.8 V, 3.3 V is recommended
Frequency
800 MHz ~ 928 MHz, 2402 MHz ~ 2480 MHz
Maximum Transmit Power
+20.0 dBm (Sub-1 GHz)
+5 dBm (2.4 GHz)
Receiving Sensitivity
-121 dBm @ Sub-1 GHz (Long-range Mode)
-110 dBm @ Sub-1 GHz (50 kbps)
-104 dBm @ Sub-1 GHz (100 kbps)
-97 dBm @ Bluetooth 5.0 (1 Mbps)
-92 dBm @ Bluetooth 5.0 (2 Mbps)
-104 dBm @ Bluetooth 5.0 (125 kbps LE Coded PHY)
GPIO
24
Flash
704 KB
ROM
256 KB
SRAM
88 KB
Power Consumption
RX current: 5.8 mA @3.6 V, 868 MHz
6.9 mA @3.0 V, 2.4 GHz
TX current: 63.0 mA @ +20 dBm, 3.3 V, 915 MHz
85.0 mA @ +20 dBm, 3.0 V, 2.4 GHz
22.0 mA @ +10 dBm, 2.4 GHz
MCU 48 MHz (CoreMark): 2.9 mA (60 μA/MHz)
Sensor Controller: 30.1 μA @ low power mode, 2 MHz, running infinite loop
808 μA @ active mode, 24 MHz, running infinite loop
Standby mode: 0.85 µA
Sleep Mode: 150 nA
Support Protocol
Thread, Zigbee®, Matter, Bluetooth® 5.3 Low Energy, IEEE 802.15.4g, IPv6-
enabled smart objects, (6LoWPAN), MIOTY®, Wireless M-Bus, Wi-SUN®, KNX
RF, Amazon Sidewalk, proprietary systems, SimpleLink™ TI 15.4-Stack (Sub-1
GHz)

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Crystal
48 MHz, 32.768 kHz
Package
SMT packaging (1.27-mm half-hole pitch stamp stick)
Dimension
26.5 mm × 16.9 mm × 2.1 mm
Type of Antenna
Half-hole ANT interface, IPEX connector
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃
2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-TI1352P2

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3.3 Pin Functions
Table 2. Pin Functions of RF-TI1352P2
Pin
Name
Chip Pin
Function
Description
1
NC
-
-
None connect
2
NC
-
-
-None connect
3
DIO5
DIO_5
Digital
GPIO, high-drive capability
4
DIO6
DIO_6
Digital
GPIO, high-drive capability
5
DIO7
DIO_7
Digital
GPIO, high-drive capability
6
DIO8
DIO_8
Digital
GPIO
7
DIO9
DIO_9
Digital
GPIO
8
DIO10
DIO_10
Digital
GPIO
9
DIO11
DIO_11
Digital
GPIO
10
DIO12
DIO_12
Digital
GPIO
11
DIO13
DIO_13
Digital
GPIO
12
DIO14
DIO_14
Digital
GPIO
13
DIO15
DIO_15
Digital
GPIO
14
VDD
VDDS
VDD
Power Supply: 1.8 V ~ 3.8 V, recommend to 3.3 V
15
GND
GND
GND
Ground
16
TMSC
JTAG_TMSC
Digital
JTAG TMSC, high-drive capability
17
TCKC
JTAG_TCKC
Digital
JTAG TCKC
18
RES
RESET_N
Digital
Reset, active low. Internal pullup.
19
DIO16
DIO_16
Digital
GPIO, JTAG_TDO, high-drive capability
20
DIO17
DIO_17
Digital
GPIO, JTAG_TDI, high-drive capability
21
DIO18
DIO_18
Digital
GPIO
22
DIO19
DIO_19
Digital
GPIO
23
DIO20
DIO_20
Digital
GPIO
24
DIO21
DIO_21
Digital
GPIO

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25
DIO22
DIO_22
Digital
GPIO
26
DIO23
DIO_23
Digital or Analog
GPIO, analog capability
27
DIO24
DIO_24
Digital or Analog
GPIO, analog capability
28
DIO25
DIO_25
Digital or Analog
GPIO, analog capability
29
DIO26
DIO_26
Digital or Analog
GPIO, analog capability
30
DIO27
DIO_27
Digital or Analog
GPIO, analog capability
31
DIO28
DIO_28
Digital or Analog
GPIO, analog capability
32
NC
-
-
None connect
33
NC
-
-
None connect
34
GND
GND
Ground
Ground
35
2G4-OUT
RF Out
2.4 GHz antenna pinout
36
GND
GND
Antenna Ground
Antenna Ground
37
SUB-OUT
RF Out
Sub 1GHz antenna pinout
38
GND
GND
Ground
Ground