RF-Star RF-TI1352P2 User manual

RF-TI1352P2 CC1352P7 SimpleLinkTM High-
Performance Sub-1G + 2.4 G Multi-band Module
With Integrated Power Amplifier
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
Oct. 31th, 2023
All rights reserved. Those responsible for unauthorized reproduction will be prosecuted.

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1 Device Overview
1.1 Description
RF-TI1352P2 is an RF module based on TI SoC CC1352P7 with an integrated power amplifier. It integrates a 48 MHz
and a 32.768 kHz crystal, a 256 KB ROM, a 704 KB Flash, and the IPEX connectors and half-hole RF output pins of
different radio frequency to guarantee the external antenna connection. Its ARM® Cortex®-M4F core application
processor optimized for long-range and low-power. It features small size, robust connection distance, and rigid reliability.
The multi-band module supporting multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM driver for Thread,
Zigbee®, Matter, Bluetooth® 5.3 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOTY®,
proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz). 1.27-mm pitch stamp stick package for easy
assembling and cost-effective PCB design.
1.2 Key Features
•TX power:
- Up to +20 dBm (Sub-1 GHz) with temperature
compensation
- Up to +5 dBm (2.4 GHz) with temperature
•RF Section
-Bluetooth 5.2 Low Energy
-ZigBee, Thread, Matter
-IEEE 802.15.4
-IPv6-nabld smart objects (6LoWPAN)
-MIOTY®
-Wireless M-Bus
-Wi-SUN®
-KNX RF
-Amazon Sidewalk
-Proprietary systems
-SimpleLinkTM TI 15.4-Stack (Sub-1 GHz)
-Dynamic Multiprotocol Manager (DDM) driver
compensation
•Excellent receiver sensitivity
- -121 dBm @ Sub-1 GHz (SimpleLink Long-range
Mode)
- -110 dBm @ Sub-1 GHz (50 kbps)
- -104 dBm for Bluetooth 125 kbps (LE coded PHY)
•Wide Operation Range
- 1.8 V to 3.8 V single power supply
- Operating temperature: -40 °C to +85 °C
- Storage temperature: -40 °C to +125 °C
•Microcontroller
- Powerful 48 MHz ARM® Cortex®-M4F
processor
- 2-pin cJTAG and JTAG debugging
- Supports OTA upgrade
•Memory
- 704 KB of in-system programmable flash
- 256 KB of ROM for protocols and library
functions
- 8 KB of Cache SRAM
- 80 KB of ultra-low leakage SRAM
•Ultra-low power sensor controller with 4KB of
SRAM
- Sample, store, and process sensor data
- Operation independent from system CPU
- Fast wake-up for low-power operation
•Rich Peripherals

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- 24 GPIOs, digital peripherals can be routed
to any GPIOs
- 4× 32-bit or 8× 16-bit general-purpose
timers
- 12-bit ADC, 200 kSamples/s, 8 channels
- 2 × comparators with internal reference DAC
(1 × continuous time, 1 × ultra-low power)
- Programmable current source
- 2 × UART
- 2 × SSI (SPI, MICROWIRE, TI)
- I2C
- I2S
- Real-time clock (RTC)
- Capacitive sensing, up to 8 channels
- Integrated temperature and battery monitor
•Security Enablers
- AES 128-bit and 256-bit Crypto accelerator
- ECC and RSA public key hardware accelerator
- SHA2 accelerator (full suite up to SHA-512)
- True random number generator (TRNG)
•External system
- On-chip buck DC/DC converter
- TCXO support
•Dimension: 26.9 mm × 16.9 mm × 2.1 mm
1.3 Applications
•Building security systems – motion detector,
electronic smart lock, door and window sensor,
garage door system, gateway
•HVAC – thermostat, wireless environmental
sensor, HVAC system controller, gateway
•Fire safety system – smoke and heat detector,
fire alarm control panel (FACP)
•Video surveillance – IP network camera
•Elevators and escalators – elevator main
control panel for elevators and escalators
•Smart meters – water meter, gas meter,
electricity meter, and heat cost allocators
•Grid communications – wireless
communications – Long-range sensor
applications
•Other alternative energy – energy harvesting
•Industrial transport – asset tracking
•Factory automation and control
•Medical
•Electronic point of sale (EPOS) – Electronic
Shelf Label (ESL)
•Wired networking – wireless LAN or Wi-Fi
access points, edge router
•Portable electronics – RF smart remote control
•Home theater & entertainment – smart
speakers, smart display, set-top box
•Connected peripherals – consumer wireless
module, pointing devices, keyboards and
keypads
•Gaming – electronic and robotic toys
•Wearables (non-medical) – smart trackers,
smart clothing

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1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-TI1352P2
1.5 Part Number Conventions
The part numbers are of the form of RF-TI1352P2 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-TI1352P2
RF
TI
1352
RF-STAR
Company Name
Chip Manufacturer
TI
Chipset
TI CC1352P7
-
P2
Module Version
TheSecond PA Version
CC1352P7
GPIOs
Power
Filter
48.0 MHz
32.768 kHz
Reset
Sub-1 GHz
Antenna
Matching
2.4
GHz
Antenna
Matching
IPEX
Connector
Half-hole
Interface
Power Supply
1.8 V ~ 3.8 V
PA (Sub-1
GHz) Antenna
Matching
Switch
IPEX
Connector
Half-hole
Interface
Ant
Switch
Ant
Switch

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Table of Contents
1 Device Overview............................................................................................................................................................. 1
1.1 Description............................................................................................................................................................ 1
1.2 Key Features ....................................................................................................................................................... 1
1.3 Applications.......................................................................................................................................................... 2
1.4 Functional Block Diagram .............................................................................................................................. 3
1.5 Part Number Conventions.............................................................................................................................. 3
Table of Contents................................................................................................................................................................ 4
2 Module Configuration and Functions ...................................................................................................................... 6
2.1 Module Parameters........................................................................................................................................... 6
2.2 Module Pin Diagram ......................................................................................................................................... 7
3.3 Pin Functions....................................................................................................................................................... 8
3 Specifications .................................................................................................................................................................10
3.1 Recommended Operating Conditions .....................................................................................................10
3.2 Handling Ratings..............................................................................................................................................10
3.3 PA Output Control............................................................................................................................................10
4 Application, Implementation, and Layout.............................................................................................................11
4.1 Module Photos..................................................................................................................................................11
4.2 Recommended PCB Footprint....................................................................................................................11
4.3 Schematic Diagram.........................................................................................................................................12
4.4 Antenna................................................................................................................................................................12
4.4.1 Antenna Design Recommendation ..............................................................................................12
4.4.2 Antenna Output Mode Modification..............................................................................................13
4.4.3 External Antenna Design Recommendation of the Half-Hole ANT Pin..........................13
4.4.4 IPEX Connector Specification........................................................................................................15
4.5 Basic Operation of Hardware Design ......................................................................................................15
4.6 Trouble Shooting..............................................................................................................................................16
4.6.1 Unsatisfactory Transmission Distance........................................................................................16
4.6.2 Vulnerable Module..............................................................................................................................17
4.6.3 High Bit Error Rate .............................................................................................................................17
4.7 Electrostatics Discharge Warnings ...........................................................................................................17
4.8 Soldering and Reflow Condition.................................................................................................................17

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5 Optional Package Specification ..............................................................................................................................19
6 Revision History ............................................................................................................................................................21
7 Contact Us.......................................................................................................................................................................22

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-TI1352P2
Chipset
CC1352P7
Supply Power Voltage
1.8 V ~ 3.8 V, 3.3 V is recommended
Frequency
800 MHz ~ 928 MHz, 2402 MHz ~ 2480 MHz
Maximum Transmit Power
+20.0 dBm (Sub-1 GHz)
+5 dBm (2.4 GHz)
Receiving Sensitivity
-121 dBm @ Sub-1 GHz (Long-range Mode)
-110 dBm @ Sub-1 GHz (50 kbps)
-104 dBm @ Sub-1 GHz (100 kbps)
-97 dBm @ Bluetooth 5.0 (1 Mbps)
-92 dBm @ Bluetooth 5.0 (2 Mbps)
-104 dBm @ Bluetooth 5.0 (125 kbps LE Coded PHY)
GPIO
24
Flash
704 KB
ROM
256 KB
SRAM
88 KB
Power Consumption
RX current: 5.8 mA @3.6 V, 868 MHz
6.9 mA @3.0 V, 2.4 GHz
TX current: 63.0 mA @ +20 dBm, 3.3 V, 915 MHz
85.0 mA @ +20 dBm, 3.0 V, 2.4 GHz
22.0 mA @ +10 dBm, 2.4 GHz
MCU 48 MHz (CoreMark): 2.9 mA (60 μA/MHz)
Sensor Controller: 30.1 μA @ low power mode, 2 MHz, running infinite loop
808 μA @ active mode, 24 MHz, running infinite loop
Standby mode: 0.85 µA
Sleep Mode: 150 nA
Support Protocol
Thread, Zigbee®, Matter, Bluetooth® 5.3 Low Energy, IEEE 802.15.4g, IPv6-
enabled smart objects, (6LoWPAN), MIOTY®, Wireless M-Bus, Wi-SUN®, KNX
RF, Amazon Sidewalk, proprietary systems, SimpleLink™ TI 15.4-Stack (Sub-1
GHz)

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Crystal
48 MHz, 32.768 kHz
Package
SMT packaging (1.27-mm half-hole pitch stamp stick)
Dimension
26.5 mm × 16.9 mm × 2.1 mm
Type of Antenna
Half-hole ANT interface, IPEX connector
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃
2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-TI1352P2

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3.3 Pin Functions
Table 2. Pin Functions of RF-TI1352P2
Pin
Name
Chip Pin
Function
Description
1
NC
-
-
None connect
2
NC
-
-
-None connect
3
DIO5
DIO_5
Digital
GPIO, high-drive capability
4
DIO6
DIO_6
Digital
GPIO, high-drive capability
5
DIO7
DIO_7
Digital
GPIO, high-drive capability
6
DIO8
DIO_8
Digital
GPIO
7
DIO9
DIO_9
Digital
GPIO
8
DIO10
DIO_10
Digital
GPIO
9
DIO11
DIO_11
Digital
GPIO
10
DIO12
DIO_12
Digital
GPIO
11
DIO13
DIO_13
Digital
GPIO
12
DIO14
DIO_14
Digital
GPIO
13
DIO15
DIO_15
Digital
GPIO
14
VDD
VDDS
VDD
Power Supply: 1.8 V ~ 3.8 V, recommend to 3.3 V
15
GND
GND
GND
Ground
16
TMSC
JTAG_TMSC
Digital
JTAG TMSC, high-drive capability
17
TCKC
JTAG_TCKC
Digital
JTAG TCKC
18
RES
RESET_N
Digital
Reset, active low. Internal pullup.
19
DIO16
DIO_16
Digital
GPIO, JTAG_TDO, high-drive capability
20
DIO17
DIO_17
Digital
GPIO, JTAG_TDI, high-drive capability
21
DIO18
DIO_18
Digital
GPIO
22
DIO19
DIO_19
Digital
GPIO
23
DIO20
DIO_20
Digital
GPIO
24
DIO21
DIO_21
Digital
GPIO

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25
DIO22
DIO_22
Digital
GPIO
26
DIO23
DIO_23
Digital or Analog
GPIO, analog capability
27
DIO24
DIO_24
Digital or Analog
GPIO, analog capability
28
DIO25
DIO_25
Digital or Analog
GPIO, analog capability
29
DIO26
DIO_26
Digital or Analog
GPIO, analog capability
30
DIO27
DIO_27
Digital or Analog
GPIO, analog capability
31
DIO28
DIO_28
Digital or Analog
GPIO, analog capability
32
NC
-
-
None connect
33
NC
-
-
None connect
34
GND
GND
Ground
Ground
35
2G4-OUT
RF Out
2.4 GHz antenna pinout
36
GND
GND
Antenna Ground
Antenna Ground
37
SUB-OUT
RF Out
Sub 1GHz antenna pinout
38
GND
GND
Ground
Ground

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-TI1352P2
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
/
1.8
3.3
3.8
V
Operating Temperature
/
-40
+25
+85
℃
3.2 Handling Ratings
Table 4. Handling Ratings of RF-TI1352P2
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±2000
V
Moisture Sensitivity Level
3
Charged Device Model
±500
V
3.3 PA Output Control
The Sub-1 GHz PA of the CC1352P7 switches the RF switch by controlling the output of DIO29 and DIO30, and then
switches the PA and non-PA RF output to realize the control of the transmission power range.
Table 3. RF Control Truth Table
Power
DIO29 (Output)
DIO30 (Output)
+5 dBm ~ + 20 dBm (PA)
1
0
< 5 dBm
0
1

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-TI1352P2
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-TI1352P2

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4.3 Schematic Diagram
Figure 6. Schematic Diagram of RF-TI1352P2
4.4 Antenna
4.4.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure that
the antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-
quality antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna are key factors to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:

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（1）Place the antenna on the edge (corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is
minimally affected.
Figure 7. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.4.2 Antenna Output Mode Modification
1. The module has two antenna output modes: IPEX connector and half-hole ANT pin. The default RF is IPEX
connector, if the ANT pin antenna output mode needs to used, pls conduct according to the following steps.
Move the component in the red circle to the green circle, vice versa. The left is for Sub-1 GHz and the right is for
2.4 GHz.
Figure 8. Antenna Output Mode Modification of RF-TI1352P2
4.4.3 External Antenna Design Recommendation of the Half-Hole ANT Pin
1. A Π-type matching circuit is reserved for the antenna, and 50 Ω impedance control is performed on the RF traces.
The traces are as short as possible, and 135° or arc traces are used as much as possible. No vias are used to

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change layers. More GND vias are placed around the RF traces.
Figure 9. Reference Design of the External Antenna
Figure 10. Reference Design of the External Antenna Traces
2. The RF trace width and copper-clad spacing can be calculated by SI9000 software, and the impedance is controlled
to 50 Ω according to the actual board thickness, number of layers, plate, dielectric thickness, dielectric constant,
copper thickness, line width, line spacing, and solder mask thickness.
Example: FR4 is a double-layer board with a thickness of 1.0 mm. Through calculation, the width of the trace is
0.8254 mm, and the spacing between traces and copper is 0.22 mm.
Figure 11. SI9000 Impedance Calculation Diagram

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4.4.4 IPEX Connector Specification
RF-TI1352P2 module is integrated the IPEX version 1 antenna seat, the specification of the antenna seat is as follows:
Figure 12. Specification of Antenna Seat
The specification of the IPEX wire end is as follows:
Figure 13. Specification of IPEX Wire
4.5 Basic Operation of Hardware Design
1. It is recommended to offer the module a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power

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supply. Otherwise, the reverse connection may cause permanent damage to the module.
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic interference.
4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power
routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered
to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close
to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degree.
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same Sub-1 GHz and 2.4 GHz physical
layer, for example, USB 3.0.
4.6 Trouble Shooting
4.6.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in the communication packet loss rate.
The performances of ground absorption and reflection of radio waves will be poor when the module is tested close
to the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor.
3. The signal attenuation will be very obvious if there is metal near the antenna or if the module is placed inside the
metal shell.
4. The incorrect power register set or the high data rate in the open air may shorten the communication distance. The
higher the data rate, the closer the distance.

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5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and modules or the poor quality of antenna will affect the communication distance.
4.6.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity-sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
4.6.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.7 Electrostatics Discharge Warnings
The module will be damaged by the discharge of static. RF-star suggests that all modules should follow the 3 precautions
below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti-static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing failure.
4.8 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5/Ag3.0/Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.

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Table 5. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃~ 235 ℃
230 ℃~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s
Figure 14. Recommended Reflow for Lead-Free Solder

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5 Optional Package Specification
The default package method is by tray. If you need the modules to be shipped by tape & reel, pls contact us in advance.
Figure 15. Default Package by Tray