RF-Star RF-ZM-2530B1 User manual

RF-ZM-2530B1 and RF-ZM-2530B1I CC2530
Low-Power 2.4 GHz IEEE 802.15.4 and ZigBee
Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
May 25th, 2023
All rights reserved. Those responsible for unauthorized reproduction will be prosecuted.

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1 Device Overview
1.1 Description
RF-ZM-2530B1/B1I is the low-power IEEE 802.15.4, ZigBee and RF4CE modules based on TI CC2530F256. To meet
the industrial application requirements, the module can be widely applied to a short-distance wireless network
communication field with the characteristics of low power consumption, small dimension, strong anti-interference ability,
and so on. The module also uses an onboard power supply filter circuit and RF optimization matching circuit, which
makes the module have higher stability and a farther transmission distance.
1.2 Key Features
•RF Features
- 2.4 GHz IEEE 8.02.15.4 compliant RF
transceiver
- ZigBee
- RF4CE
•TX power: up to +4.5 dBm
•Receiving sensitivity: -97 dBm
•High-performance and low-power 8051
microcontroller core with code prefetch
•Memory
- Flash: 256 KB
- RAM: 8 KB with retention in all power modes
•Rich Peripherals
- Five-channel DMA
- Integrated high-performance op-amp and
ultralow-power comparator
- IEEE 802.15.4 MAC timer, general-purpose
timers (one 16-bit, two 8-bit)
- IR generation circuitry
- 32-kHz sleep timer with capture
- CSMA/CA hardware support
- Accurate digital RSSI /LQI support
- Battery monitor and temperature sensor
- 12-bit ADC with 8 channels and configurable
resolution
- AES security coprocessor
- Two powerful USARTs with support for
several serial protocols
- 19 general-purpose I/O pins (17 × 4 mA, 2 ×
20 mA)
- Watchdog timer
1.3 Applications
•2.4 GHz IEEE 802.15.4 systems
•RF4CE remote control systems
•ZigBee systems
•Home automation
•Building automation
•Industrial control and monitoring
•Low-power wireless sensor networks
•Consumer electronics
•Health care

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1.4 Functional Block Diagram
RF-BM-2530B1
RF-ZM-2530B1I
Figure 1. Functional Block Diagram of RF-ZM-2530B1/B1I
CC2530
GPIOs
Debug
32.0 MHz
32.768 kHz
Reset
LC Balun
PCB Antenna
RF-N
RF-P
ANT Matching
Power Supply
2.0 V ~ 3.6 V
CC2530
GPIOs
Debug
Reset
Power Supply
2.0 V ~ 3.6 V
32 MHz
LC Balun
32.768 kHz
RF-N
RF-P
Half-Hole
Interface
IPEX Connector
Antenna
Switch

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1.6 Part Number Conventions
The part numbers are of the form of RF-ZM-2530B1/B1I where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-ZM-2530B1/B1I
RF
ZM
2530
Company Name
RF-STAR
Wireless Type
ZigBee Module
Chipset
TI CC2530
-
-
B1
Module Version
The First Version
I
Antenna Type
IPEX connector

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Table of Contents
1 Device Overview............................................................................................................................................................. 1
1.1 Description............................................................................................................................................................ 1
1.2 Key Features ....................................................................................................................................................... 1
1.3 Applications.......................................................................................................................................................... 1
1.4 Functional Block Diagram .............................................................................................................................. 2
1.6 Part Number Conventions.............................................................................................................................. 3
Table of Contents................................................................................................................................................................ 4
2 Module Configuration and Functions ...................................................................................................................... 6
2.1 Module Parameters........................................................................................................................................... 6
2.2 Module Pin Diagram ......................................................................................................................................... 7
2.3 Pin Functions....................................................................................................................................................... 7
3 Specifications .................................................................................................................................................................10
3.1 Recommended Operating Conditions .....................................................................................................10
3.2 Handling Ratings..............................................................................................................................................10
4 Application, Implementation, and Layout.............................................................................................................11
4.1 Module Photos..................................................................................................................................................11
4.2 Recommended PCB Footprint....................................................................................................................11
4.3 Schematic Diagram.........................................................................................................................................12
5.4 Reference Design of RF-BM-2530B1/B1I..............................................................................................14
5.5 Antenna................................................................................................................................................................15
5.5.1 Antenna Design Recommendation ..............................................................................................15
5.5.2 Antenna Output Mode Modification of RF-ZM-2530B1I.......................................................15
5.5.3 External Antenna Design Recommendation of the Half-Hole ANT Pin..........................16
5.5.4 IPEX Connector Specification........................................................................................................17
5.6 Basic Operation of Hardware Design ......................................................................................................18
5.7 Trouble Shooting..............................................................................................................................................19
5.7.1 Unsatisfactory Transmission Distance........................................................................................19
5.7.2 Vulnerable Module..............................................................................................................................19
5.7.3 High Bit Error Rate .............................................................................................................................19
5.8 Electrostatics Discharge Warnings ...........................................................................................................20
5.9 Soldering and Reflow Condition.................................................................................................................20

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6 Optional Package Specification ..............................................................................................................................22
7 Revision History ............................................................................................................................................................24
8 Contact Us.......................................................................................................................................................................25

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-ZM-2530B1/B1I
Chipset
CC2530F256
Supply Power Voltage
2.0 V ~ 3.6 V, recommended to 3.3 V
Frequency
2394 MHz ~ 2507 MHz
Maximum Transmit Power
+4.5 dBm
Receiving Sensitivity
-97 dBm
GPIO
19
Crystal
32 MHz, 32.768 kHz
RAM
8 KB
Flash
256 KB
Package
SMT packaging (1.27-mm half-hole pitch stamp stick)
Dimension
RF-ZM-2530B1: 15.3 mm x 22.3 mm x 2.1 mm
RF-ZM-2530B1I: 15.3 mm x 22.3 mm x 2.2 mm
Type of Antenna
RF-ZM-2530B1: PCB antenna
RF-ZM-2530B1I: IPEX connector/Half-hole ANT pin
Operating Temperature
-40 ℃～+85 ℃
Storage Temperature
-40 ℃～+125 ℃

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2.2 Module Pin Diagram
RF-ZM-2530B1 RF-ZM-2530B1I
Figure 3. Pin Diagram of RF-ZM-2530B1/B1I
2.3 Pin Functions
Table 2. Pin Functions of RF-ZM-2530B1
Pin
Name
Chip Pin
Pin Type
Description
1
GND
GND
Ground
2
VCC
VCC
VCC
Power supply: 2.0 V ~ 3.6 V. Recommend to 3.3 V
3
RES
RESET_N
Reset
Reset, active low
4
P22_DC
P2_2
Digital I/O
Port 2.2 / Connect to the DC of CC Debugger
5
P21_DD
P2_1
Digital I/O
Port 2.1 / Connect to the DD of CC Debugger
6
P20
P2_0
Digital I/O
Port 2.0
7
P17
P1_7
Digital I/O
Port 1.7
8
P16
P1_6
Digital I/O
Port 1.6
9
GND
GND
Ground
10
P15
P1_5
Digital I/O
Port 1.5
11
P14
P1_4
Digital I/O
Port 1.4
12
P13
P1_3
Digital I/O
Port 1.3
13
P12
P1_2
Digital I/O
Port 1.2

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14
P11
P1_1
Digital I/O
Port 1.1
15
P10
P1_0
Digital I/O
Port 1.0
16
P07
P0_7
Digital I/O
Port 0.7
17
P06
P0_6
Digital I/O
Port 0.6
18
P05
P0_5
Digital I/O
Port 0.5
19
P04
P0_4
Digital I/O
Port 0.4
20
P03
P0_4
Digital I/O
Port 0.3
21
P02
P0_2
Digital I/O
Port 0.2
22
P01
P0_1
Digital I/O
Port 0.1
23
P00
P0_0
Digital I/O
Port 0.0
24
GND
GND
Ground
Table 3. Pin Functions of RF-ZM-2530B1I
Pin
Name
Chip Pin
Pin Type
Description
1
GND
GND
Ground
2
VCC
VCC
VCC
Power supply: 2.0 V ~ 3.6 V, Recommend to 3.3 V
3
RES
RESET_N
Reset
Reset, active low
4
P22_DC
P2_2
Digital I/O
Port 2.2 / Connect to the DC of CC Debugger
5
P21_DD
P2_1
Digital I/O
Port 2.1 / Connect to the DD of CC Debugger
6
P20
P2_0
Digital I/O
Port 2.0
7
P17
P1_7
Digital I/O
Port 1.7
8
P16
P1_6
Digital I/O
Port 1.6
9
GND
GND
Ground
10
P15
P1_5
Digital I/O
Port 1.5
11
P14
P1_4
Digital I/O
Port 1.4
12
P13
P1_3
Digital I/O
Port 1.3
13
P12
P1_2
Digital I/O
Port 1.2
14
P11
P1_1
Digital I/O
Port 1.1
15
P10
P1_0
Digital I/O
Port 1.0
16
P07
P0_7
Digital I/O
Port 0.7
17
P06
P0_6
Digital I/O
Port 0.6
18
P05
P0_5
Digital I/O
Port 0.5

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19
P04
P0_4
Digital I/O
Port 0.4
20
P03
P0_4
Digital I/O
Port 0.3
21
P02
P0_2
Digital I/O
Port 0.2
22
P01
P0_1
Digital I/O
Port 0.1
23
P00
P0_0
Digital I/O
Port 0.0
24
GND
GND
Ground
25
GND
GND
Ground
26
ANT
External ANT pin
27
GND
GND
Ground

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 4. Recommended Operating Conditions of RF-ZM-2530B1/B1I
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
2.0
3.3
3.6
V
Operating Temperature
/
-40
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 5. Handling Ratings of RF-ZM-2530B1/B1I
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±2000
V
Moisture Sensitivity Level
3
Charged Device Model
±500
V

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4 Application, Implementation, and Layout
4.1 Module Photos
RF-ZM-2530B1 RF-ZM-2530B1I
Figure 4. Photos of RF-ZM-2530B1/B1I
4.2 Recommended PCB Footprint
RF-ZM-2530B1

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RF-ZM-2530B1I
Figure 5. Recommended PCB Footprint of RF-ZM-2530B1/B1I (mm)
4.3 Schematic Diagram

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Figure 6. Schematic Diagram of RF-ZM-2530B1/B1I

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5.4 Reference Design of RF-BM-2530B1/B1I
Figure 7. Reference Design of RF-ZM-2530B1
Figure 8. Reference Design of RF-ZM-2530B1I

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5.5 Antenna
5.5.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna are key factors to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
(1) Place the antenna on the edge (corner) of the PCB.
(2) Make sure that there is no signal line or copper foil in each layer below the antenna.
(3) It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is
minimally affected.
Figure 9. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
5.5.2 Antenna Output Mode Modification of RF-ZM-2530B1I
1. RF-ZM-2530B1I has two antenna output modes. The one is an IPEX connector and an half-hole ANT pin (ANT pin,
see pin function table for details).
The default delivery is the IPEX connector, and the capacitor connected to the IPEX is welded. If you want to use
the external antenna by the ANT pin, the capacitor position should be removed to the left solder joint to have the access
to the ANT pin. The location of the capacitor is shown in the figure below.

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Figure 10. Antenna Output Mode Change of RF-ZM-2530B1I
5.5.3 External Antenna Design Recommendation of the Half-Hole ANT Pin
1. A Π-type matching circuit is reserved for the antenna, and 50 Ω impedance control is performed on the RF traces.
The traces are as short as possible, and 135° or arc traces are used as much as possible. No vias are used to
change layers. More GND vias are placed around the RF traces.
Figure 11. Reference Design of the External Antenna
Figure 12. Reference Design of the External Antenna Traces

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2. The RF trace width and copper-clad spacing can be calculated by SI9000 software, and the impedance is controlled
to 50 Ω according to the actual board thickness, number of layers, plate, dielectric thickness, dielectric constant,
copper thickness, line width, line spacing, and solder mask thickness.
Example: FR4 is a double-layer board with a thickness of 1.0 mm. Through calculation, the width of the trace is
0.8254 mm, and the spacing between traces and copper is 0.22 mm.
Figure 13. SI9000 Impedance Calculation Diagram
5.5.4 IPEX Connector Specification
RF-ZM-2530B1 module is integrated the IPEX version 1 antenna seat, the specification of the antenna seat is as follows:
Figure 14. Specification of Antenna Seat

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The specification of the IPEX wire end is as follows:
Figure 15. Specification of IPEX Wire
5.6 Basic Operation of Hardware Design
1. It is recommended to offer the module a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power
supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic interference.
4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power
routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered
to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close
to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degree.
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.

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7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for
example, USB 3.0.
5.7 Trouble Shooting
5.7.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in the communication packet loss rate.
The performances of ground absorption and reflection of radio waves will be poor when the module is tested close
to the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor.
3. The signal attenuation will be very obvious if there is metal near the antenna or if the module is placed inside the
metal shell.
4. The incorrect power register set or the high data rate in the open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and modules or the poor quality of antenna will affect the communication distance.
5.7.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity-sensitive components, please ensure the suitable humidity during installation and application.
If there is no special demand, it is not recommended to use at too high or too low temperature.
5.7.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.