RF-Star RF-BM-ND04 User manual

RF-BM-ND04 and RF-BM-ND04I nRF52832
Bluetooth 5.0 Low Energy and
Bluetooth Mesh Module
Version 1.2
Shenzhen RF-star Technology Co., Ltd.
May 26th, 2023
All rights reserved. Those responsible for unauthorized reproduction will be prosecuted.

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1 Device Overview
1.1 Module Series
There is a series of RF-BM-ND04(I) Bluetooth 5.0 Low Energy modules. All of them are based on Nordic nRF52832
SoC. Those modules are pin-to-pin compatible with each other as well.
Table 1. Module Series of RF-BM-ND04(I)
Model
Antenna Output
Mode
Chip Model
TX
Power
FLASH
RAM
Protocol
ND04
PCB onboard
nRF52832
+4 dBm
512 KB
64 KB
BLE5.0
Bluetooth Mesh
ND04I
IPEX connector/Half-
hole RF pin
1.2 Description
RF-BM-ND04(I) is an RF module based on Nordic BLE SoC nRF52832 with ARM® Cortex®-M4 32-bit processor. It
integrates a 32.768 kHz and a 32 MHz crystal, an LC filter, an antenna matching, and a meander line inverted-F PCB
antenna or the IPEX connector respectively. It supports BLE stack v5.0 including the high-speed 2 Mbps feature and
can be preprogrammed with serial interface communication protocols, such as NFC, ANT and 2.4 GHz proprietary for
simple programming. RF-BM-ND04(I) also supports Bluetooth mesh which can be run concurrently with Bluetooth LE,
enabling smartphones to provision, commission, configure and control mesh nodes. The module has NFC-A Tag for use
in simplified pairing and payment solutions. It has numerous digital peripherals and interfaces such as ADC, PDM, PWM,
I2C and I2S for many applications. It features low power consumption, small size, robust connection distance, and rigid
reliability. 1.27-mm pitch stamp stick package for easy assembling and cost-effective PCB design.
1.3 Key Features
•RF Features
- Bluetooth 5.0 low energy
- Bluetooth Mesh
- NFC
- ANT
- 2.4 GHz proprietary
•TX power: -20 dBm to +4 dBm
•ARM® Cortex®-M4 32-bit processor with FPU, 64
MHz
•Supply voltage range 1.7 V ~ 3.6 V
•Memory
- 512 KB flash
- 64 KB RAM
•Rich peripherals
- NFC-A
- 12-bit, 200 ksps ADC
- 29 GPIOs
- PWM
- PDM
- SPI master/slave
- I2C master/slave
- I2S
- UART (CTS/RTS)
•Dimension: 24.8 mm x 15.0 mm x 2.3 mm
•Certificates of RF-BM-ND04: FCC, SRRC,CE

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1.4 Applications
•Internet of Things (IoT)
•Internet gateway
•Industrial control
•Home automation
•Smart plug and metering
•Beacons
•Access control
•IP Network sensor nodes
•Security systems
•Wearables
•Building automation
•Retail
•Sensor networks
•Medical devices
1.5 Functional Block Diagram
RF-BM-ND04
nRF52832
GPIO
Debug
Reset
PCB
Antenna
LC Filter
Power Supply
1.7 V ~ 3.6 V
Antenna
Matching
32.0 MHz
32.768 kHz

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RF-BM-ND04I
Figure 1. Functional Block Diagram of RF-BM-ND04(I)
1.6 Part Number Conventions
The part numbers are of the form of RF-BM-ND04(I) where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BM-ND04(I)
RF
BM
ND
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset Manufacturer
Nordic Semiconductor
-
-
04(I)
Module Version
Without I: nRF52832 PCB Version
With I: nRF52832 IPEX Version
nRF52832
GPIO
Debug
Reset
LC Filter
Power Supply
1.7 V ~ 3.6 V
Antenna
Matching
32.0 MHz
32.768 kHz
IPEX
Connector
Half-hole
Interface
Antenna
Switch

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Table of Contents
1 Device Overview............................................................................................................................................................. 1
1.1 Module Series ..................................................................................................................................................... 1
1.2 Description............................................................................................................................................................ 1
1.3 Key Features ....................................................................................................................................................... 1
1.4 Applications.......................................................................................................................................................... 2
1.5 Functional Block Diagram .............................................................................................................................. 2
1.6 Part Number Conventions.............................................................................................................................. 3
Table of Contents................................................................................................................................................................ 4
2 Module Configuration and Functions ...................................................................................................................... 6
2.1 Module Parameters........................................................................................................................................... 6
2.2 Module Pin Diagram ......................................................................................................................................... 7
2.3 Pin Functions....................................................................................................................................................... 7
3 Specifications .................................................................................................................................................................12
3.1 Recommended Operating Conditions .....................................................................................................12
3.2 Handling Ratings..............................................................................................................................................12
3.3 Power Consumption .......................................................................................................................................12
4 Application, Implementation, and Layout.............................................................................................................13
4.1 Module Photos..................................................................................................................................................13
4.2 Recommended PCB Footprint....................................................................................................................13
4.3 Schematic Diagram.........................................................................................................................................14
4.4 Reference Design............................................................................................................................................15
4.5 Antenna................................................................................................................................................................16
4.5.1 Antenna Design Recommendation ..............................................................................................16
4.5.2 IPEX Connector...................................................................................................................................17
4.5.3 Antenna Output Mode Modification..............................................................................................18
4.5.4 External Antenna Design Recommendation of the Half-Hole ANT Pin..........................18
4.6 Basic Operation of Hardware Design ......................................................................................................19
4.7 Trouble Shooting..............................................................................................................................................20
4.7.1 Unsatisfactory Transmission Distance........................................................................................20
4.7.2 Vulnerable Module..............................................................................................................................21
4.7.3 High Bit Error Rate .............................................................................................................................21
4.8 Electrostatics Discharge Warnings ...........................................................................................................21

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4.9 Soldering and Reflow Condition.................................................................................................................21
5 Optional Package Specification ..............................................................................................................................23
6 Certification .....................................................................................................................................................................25
6.1 FCC.......................................................................................................................................................................25
6.2 SRRC ...................................................................................................................................................................25
6.3 CE..........................................................................................................................................................................26
7 Revision History ............................................................................................................................................................27
8 Contact Us.......................................................................................................................................................................28

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2 Module Configuration and Functions
2.1 Module Parameters
Table 2. Parameters of RF-BM-ND04(I)
Chipset
nRF52832
Supply Power Voltage
1.7 V ~ 3.6 V, recommended to 3.3 V
Frequency
2402 MHz ~ 2480 MHz
Transmit Power
-20.0 dBm ~ +4.0 dBm (Typical: 0 dBm)
Receiving Sensitivity
-96 dBm
Data Rate
1 Mbps, 2 Mbps
Power Consumption
5.3 mA peak current in TX (0 dBm)
5.4 mA peak current in RX
GPIO
29
Crystal
32 MHz, 32.768 kHz
RAM
64 KB
Flash
512 KB
Package
SMT Packaging (1.27-mm half-hole pitch stamp stick)
Frequency Error
±20 kHz
Dimension
24.8 mm x 15.0 mm x 2.3 mm
Type of Antenna
RF-BM-ND04: PCB antenna
RF-BM-ND04I: IPEX connector / half-hole RF ANT pin
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃

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2.2 Module Pin Diagram
RF-BM-ND04 RF-BM-ND04I
Figure 3. Pin Diagram of RF-BM-ND04(I)
2.3 Pin Functions
Table 3. Pin Functions of RF-BM-ND04
Pin
Name
Chip Pin
Pin Type
Description
1
GND
GND
GND
GND
2
VCC
VCC
Power
Power supply 1.7 V ~ 3.6 V, Recommend 3.3 V
3
P21/RST
P0.21
nRESET
Digital I/O
General purpose I/O
Reset, active low. Internal pullup.
4
P22
P0.22
Digital I/O
General purpose I/O
5
P23
P0.23
Digital I/O
General purpose I/O
6
P24
P0.24
Digital I/O
General purpose I/O
7
P25
P0.25
Digital I/O
General purpose I/O
8
P28
P0.28/AIN4
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input

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9
P29
P0.29/AIN5
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input
10
P30
P0.30/AIN6
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input
11
P26
P0.26
Digital I/O
General purpose I/O
12
P27
P0.27
Digital I/O
General purpose I/O
13
P02
P0.02/AIN0
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input
14
P03
P0.03/AIN1
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input
15
P04
P0.04/AIN2
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input
16
P05
P0.05/AIN3
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input
17
P06
P0.06
Digital I/O
General purpose I/O
18
P07
P0.07
Digital I/O
General purpose I/O
19
P08
P0.08
Digital I/O
General purpose I/O
20
P09
P0.09
NFC1
Digital I/O
NFC input
General purpose I/O
NFC antenna connction
21
P10
P0.10
NFC2
Digital I/O
NFC output
General purpose I/O
NFC antenna connction
22
P11
P0.11
Digital I/O
General purpose I/O
23
P12
P0.12
Digital I/O
General purpose I/O
24
P13
P0.13
Digital I/O
General purpose I/O
25
P14
P0.14
TRACEDATA[3]
Digital I/O
General purpose I/O
Trace port output
26
P15
P0.15
TRACEDATA[2]
Digital I/O
General purpose I/O
Trace port output
27
P16
P0.16
Digital I/O
General purpose I/O

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TRACEDATA[1]
Trace port output
28
SWDIO
SWDIO
Digital I/O
Serial wire debug I/O for debugging and
programming
29
SWCLK
SWDCLK
Digital input
Serial wire debug clock input for debugging and
programming
30
P17
P0.17
Digital I/O
General purpose I/O
31
P18
P0.18
TRACEDATA[0]
SWO
Digital I/O
General purpose I/O
Trace port output
Single wire output
32
P19
P0.19
Digital I/O
General purpose I/O
33
P20
P0.20
TRACECLK
Digital I/O
General purpose I/O
Trace port clock output
Table 4. Pin Functions of RF-BM-ND04I
Pin
Name
Chip Pin
Pin Type
Description
1
GND
GND
GND
Ground
2
ANT
ANT
ANT
External RF antenna interface
3
GND
GND
GND
Ground
4
GND
GND
GND
Ground
5
VCC
VCC
Power
Power supply 1.7 V ~ 3.6 V, Recommend 3.3 V
6
P21/RST
P0.21
nRESET
Digital I/O
General purpose I/O
Reset, active low. Internal pullup.
7
P22
P0.22
Digital I/O
General purpose I/O
8
P23
P0.23
Digital I/O
General purpose I/O
9
P24
P0.24
Digital I/O
General purpose I/O
10
P25
P0.25
Digital I/O
General purpose I/O
11
P28
P0.28/AIN4
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input
12
P29
P0.29/AIN5
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input

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13
P30
P0.30/AIN6
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input
14
P26
P0.26
Digital I/O
General purpose I/O
15
P27
P0.27
Digital I/O
General purpose I/O
16
P02
P0.02/AIN0
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input
17
P03
P0.03/AIN1
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input
18
P04
P0.04/AIN2
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input
19
P05
P0.05/AIN3
Digital I/O
Analog input
General purpose I/O
SAADC/COMP/LPCOMP input
20
P06
P0.06
Digital I/O
General purpose I/O
21
P07
P0.07
Digital I/O
General purpose I/O
22
P08
P0.08
Digital I/O
General purpose I/O
23
P09
P0.09
NFC1
Digital I/O
NFC input
General purpose I/O
NFC antenna connction
24
P10
P0.10
NFC2
Digital I/O
NFC output
General purpose I/O
NFC antenna connction
25
P11
P0.11
Digital I/O
General purpose I/O
26
P12
P0.12
Digital I/O
General purpose I/O
27
P13
P0.13
Digital I/O
General purpose I/O
28
P14
P0.14
TRACEDATA[3]
Digital I/O
General purpose I/O
Trace port output
29
P15
P0.15
TRACEDATA[2]
Digital I/O
General purpose I/O
Trace port output
30
P16
P0.16
TRACEDATA[1]
Digital I/O
General purpose I/O
Trace port output
31
SWDIO
SWDIO
Digital I/O
Serial wire debug I/O for debugging and

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programming
32
SWCLK
SWDCLK
Digital input
Serial wire debug clock input for debugging and
programming
33
P17
P0.17
Digital I/O
General purpose I/O
34
P18
P0.18
TRACEDATA[0]
SWO
Digital I/O
General purpose I/O
Trace port output
Single wire output
35
P19
P0.19
Digital I/O
General purpose I/O
36
P20
P0.20
TRACECLK
Digital I/O
General purpose I/O
Trace port clock output

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3 Specifications
3.1 Recommended Operating Conditions
The functional operation does not guarantee performance beyond the limits of the conditional parameter values in the
table below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 5. Recommended Operating Conditions of RF-BM-ND04(I)
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
1.7
3.3
3.6
V
Operating Temperature
/
-40
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 6. Handling Ratings of RF-BM-ND04(I)
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±4000
V
Moisture Sensitivity Level
3
Charged Device Model
±750
V
3.3 Power Consumption
Table 7. Power Consumption
Event
Average Current
Testing Conditions / Remark
Sleeping
2.62 µA
EN disconnected
Broadcast
77.70 µA
Broadcast cycle: 200 ms
Broadcast
30.01 µA
Broadcast cycle: 500 ms
Broadcast
15.64 µA
Broadcast cycle: 1000 ms
Broadcast
8.90 µA
Broadcast cycle: 2000 ms
Broadcast
4.27 µA
Broadcast cycle: 5000 ms
Connection
72.80 µA
Connection cycle: 50 ms
Connection
38.28 µA
Connection cycle: 100 ms

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4 Application, Implementation, and Layout
4.1 Module Photos
RF-BM-ND04 RF-BM-ND04I
Figure 4. Photos of RF-BM-ND04(I)
4.2 Recommended PCB Footprint
RF-BM-ND04

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RF-BM-ND04I
Figure 5. Recommended PCB Footprint of RF-BM-ND04(I) (mm)
4.3 Schematic Diagram
RF-BM-ND04

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RF-BM-ND04I
Figure 6. Schematic Diagram of RF-BM-ND04(I)
4.4 Reference Design
Note: EN falling edge active.
RF-BM-ND04

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Note: EN falling edge active.
RF-BM-ND04I
Figure 7. Reference Design of RF-BM-ND04(I)
4.5 Antenna
4.5.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna is a key factor to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
（1）Place the antenna on the edge (corner) of the PCB.
（2）Make sure that there is no signal line or copper foil in each layer below the antenna.
（3）It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is
minimally affected.

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Figure 8. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.5.2 IPEX Connector
RF-BM-ND04I module is integrated the IPEX version 1 antenna seat, the specification of the antenna seat is as follow:
Figure 9. Specification of Antenna Seat

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The specification of the IPEX wire end is as follow:
Figure 10. Specification of IPEX Wire
4.5.3 Antenna Output Mode Modification
RF-BM-ND04I has two antenna output modes: IPEX connector output and stamp half-hole antenna output (ANT pin,
see pin function table for details).
The default delivery is IPEX connector mode. Under IPEX connector mode, C1 is off and C2 is welded. If you would like
to change to half-hole antenna output mode, please disconnect C2 and weld C2. The locations of C1 and C2 (8 pF) are
shown in the figure below.
Figure 11. Antenna Output Mode Change
4.5.4 External Antenna Design Recommendation of the Half-Hole ANT Pin
1. A Π-type matching circuit is reserved for the antenna, and 50 Ω impedance control is performed on the RF traces.

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The traces are as short as possible, and 135° or arc traces are used as much as possible. No vias are used to
change layers. More GND vias are placed around the RF traces.
Figure 12. Reference Design of the External Antenna
Figure 13. Reference Design of the External Antenna Traces
2. The RF trace width and copper-clad spacing can be calculated by SI9000 software, and the impedance is controlled
to 50 Ω according to the actual board thickness, number of layers, plate, dielectric thickness, dielectric constant,
copper thickness, line width, line spacing, and solder mask thickness.
Example: FR4 is a double-layer board with a thickness of 1.0 mm. Through calculation, the width of the trace is
0.8254 mm, and the spacing between traces and copper is 0.22 mm.
Figure 14. SI9000 Impedance Calculation Diagram
4.6 Basic Operation of Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power