RF-Star SimpleLink RF-BM-2642B1 User manual

RF-BM-2642B1
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Shenzhen RF-star Technology Co., Ltd. Page 1 of 22
RF-BM-2642B1 CC2642R SimpleLink™
Bluetooth 5.1 Low Energy Wireless Module
Version 1.0
Shenzhen RF-star Technology Co., Ltd.
May 26th, 2023
All rights reserved. Those responsible for unauthorized reproduction will be prosecuted.

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1 Device Overview
1.1 Description
RF-BM-2642B1 is an RF module based on TI lower-power CC2642R SoC. It integrates a 48 MHz crystal and a 32.768
kHz crystal, 352 KB of in-system Programmable Flash, 256 KB ROM, 8 KB of cache SRAM, 80 KB of ultra-low leakage
SRAM. Its ARM® Cortex®-M4F core application processor can operate at an extremely low current at flexible power
modes. Its 2.4 GHz RF transceiver is compatible with Bluetooth 5.1 Low Energy, Bluetooth Mesh, and Direction Finding.
It features a small size, robust connection distance, and rigid reliability.
1.2 Key Features
•RF Features
- Bluetooth 5.1 Low Energy
•Receiving sensitivity
- -105 dBm for BLE 125 kbps (LE coded PHY)
- -97 dBm for 1 Mbps PHY
•TX Power: +5 dBm with temperature
compensation
•Powerful 48 MHz ARM® Cortex®-M4F processor
•Memory
- 352 KB of in-system programmable flash
- 256 KB of ROM for Protocols and library
functions
- 8 KB of cache SRAM
- 80 KB of ultra-low leakage SRAM
- Support OTA upgrade
•Wide Operation Range
- Power Supply: 1.8 V ~ 3.8 V
- Operating temperature: -40 °C to +85 °C
- Storage temperature: -40 °C to +125 °C
•Rich Peripherals
- 31 GPIOs
- 4 × 32-bit or 8 × 16-bit general-purpose timers
- 12-bit ADC, 200 ksamples/s, 8 channels
- 2 × comparators with internal reference DAC
- Ultra-low power analog comparator
- Programmable current source
- 2 × UART
- 2 × SSI (SPI, MICROWAVE, TI)
- I2C
- I2S
- Real-time clock (RTC)
- AES 128- and 256-bit Crypto accelerator
- ECC and RSA public key hardware accelerator
- SHA2 accelerator (full suite up to SHA-512)
- True random number generator (TRNG)
- Capacitive sensing, up to 8 channels
- Integrated temperature and battery monitor
•External system
- On-chip buck DC/DC converter
•Transmission range:
- 70 m (@ PCB antenna)
•Dimension: 24.8 mm x 15.0 mm x 2.2 mm
•Certificates:
- FCC
- CE
- IC
1.3 Applications
•Personal electronics
•Mobile phone accessories
•Sports and fitness equipment
•HID applications
•Smart grid and automatic meter reading
•Wireless sensor networks

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•Active RFID
•Energy harvesting applications
•Electronic Shelf Label (ESL)
•Home and building automation
•Wireless alarm and security systems
•Long-range sensor applications
1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-BM-2642B1
1.5 Part Number Conventions
The part numbers are of the form of RF-BM-2642B1 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BM-2642B1
CC2642R
31 GPIOs
Power EMI
Filter
LC Balun
PCB Antenna
RF-N
RF-P
ANT Matching
Reset
Power Supply
1.8 V ~ 3.8 V
48.0 MHz
32.768 kHz
RF
BM
2642
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset
TI CC2642R
-
-
B1
Module Version
The First Version

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Table of Contents
1 Device Overview............................................................................................................................................................. 2
1.1 Description............................................................................................................................................................ 2
1.2 Key Features ....................................................................................................................................................... 2
1.3 Applications.......................................................................................................................................................... 2
1.4 Functional Block Diagram .............................................................................................................................. 3
1.5 Part Number Conventions.............................................................................................................................. 3
Table of Contents................................................................................................................................................................ 4
2 Module Configuration and Functions ...................................................................................................................... 6
2.1 Module Parameters........................................................................................................................................... 6
2.2 Module Pin Diagram ......................................................................................................................................... 7
2.3 Pin Functions....................................................................................................................................................... 7
3 Specifications ................................................................................................................................................................... 9
3.1 Recommended Operating Conditions ....................................................................................................... 9
3.2 Handling Ratings................................................................................................................................................ 9
4 Application, Implementation, and Layout.............................................................................................................10
4.1 Module Photos..................................................................................................................................................10
4.2 Recommended PCB Footprint....................................................................................................................10
4.3 Schematic Diagram.........................................................................................................................................11
4.4 Reference Design............................................................................................................................................12
4.5 Antenna................................................................................................................................................................12
4.5.1 Antenna Design Recommendation ..............................................................................................12
4.6 Basic Operation of Hardware Design ......................................................................................................13
4.7 Trouble Shooting..............................................................................................................................................14
4.7.1 Unsatisfactory Transmission Distance........................................................................................14
4.7.2 Vulnerable Module..............................................................................................................................14
4.7.3 High Bit Error Rate .............................................................................................................................14
4.8 Electrostatics Discharge Warnings ...........................................................................................................15
4.9 Soldering and Reflow Condition.................................................................................................................15
5 Optional Package Specification ..............................................................................................................................17
6 Certification .....................................................................................................................................................................19
6.1 FCC.......................................................................................................................................................................19

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6.2 IC............................................................................................................................................................................19
6.3 CE..........................................................................................................................................................................20
7 Revision History ............................................................................................................................................................21
8 Contact Us.......................................................................................................................................................................22

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-BM-2642B1
Chipset
CC2642R
Supply Power Voltage
1.8 V ~ 3.8 V, recommended to 3.3 V
Frequency
2402 MHz ~ 2480 MHz
Maximum Transmit Power
+5.0 dBm
Receiving Sensitivity
-105 dBm for BLE 125 kbps (LE coded PHY)
-97 dBm for 1 Mbps PHY
GPIO
31
Support Protocol
Bluetooth 5.1 Low Energy
Crystal
48 MHz, 32.768 kHz
Package
SMT Packaging (1.27-mm half-hole pitch stamp stick)
Dimension
23.50 mm × 17.0 mm × 2.2 mm
Type of Antenna
PCB Antenna
Operating Temperature
-40 ℃～+85 ℃
Storage Temperature
-40 ℃～+125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-BM-2642B1
2.3 Pin Functions
Table 2. Pin Functions of RF-BM-2642B1
Pin
Name
Chip Pin
Function
Description
1
P00
DIO_0
Digital
GPIO
2
P01
DIO_1
Digital
GPIO
3
P02
DIO_2
Digital
GPIO
4
P03
DIO_3
Digital
GPIO
5
P04
DIO_4
Digital
GPIO
6
P05
DIO_5
Digital
GPIO, high-drive capability
7
P06
DIO_6
Digital
GPIO, high-drive capability
8
P07
DIO_7
Digital
GPIO, high-drive capability
9
P08
DIO_8
Digital
GPIO
10
P09
DIO_9
Digital
GPIO
11
P10
DIO_10
Digital
GPIO

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12
P11
DIO_11
Digital
GPIO
13
P12
DIO_12
Digital
GPIO
14
P13
DIO_13
Digital
GPIO
15
P14
DIO_14
Digital
GPIO
16
P15
DIO_15
Digital
GPIO
17
JTAG_TMSC
JTAG_TMSC
Digital
JTAG TMSC, high-drive capability
18
JTAG_TCKC
JTAG_TCKC
Digital
JTAG TCKC
19
P16
DIO_16
Digital
GPIO, JTAG_TDO, high-drive capability
20
P17
DIO_17
Digital
GPIO, JTAG_TDI, high-drive capability
21
P18
DIO_18
Digital
GPIO
22
P19
DIO_19
Digital
GPIO
23
P20
DIO_20
Digital
GPIO
24
P21
DIO_21
Digital
GPIO
25
P22
DIO_22
Digital
GPIO
26
P23
DIO_23
Digital or Analog
GPIO, analog capacity
27
P24
DIO_24
Digital or Analog
GPIO, analog capacity
28
P25
DIO_25
Digital or Analog
GPIO, analog capacity
29
P26
DIO_26
Digital or Analog
GPIO, analog capacity
30
P27
DIO_27
Digital or Analog
GPIO, analog capacity
31
P28
DIO_28
Digital or Analog
GPIO, analog capacity
32
P29
DIO_29
Digital or Analog
GPIO, analog capacity
33
P30
DIO_30
Digital or Analog
GPIO, analog capacity
34
VCC
VDDR
Power Supply: 1.8 V ~ 3.8 V, recommend to 3.3 V
35
GND
GND
Ground
Ground
36
NRESET
RESET_N
Reset, active-low. Internal pullup.

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3 Specifications
3.1 Recommended Operating Conditions
Functional operation does not guarantee performance beyond the limits of the conditional parameter values in the table
below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-BM-2642B1
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
1.8
3.3
3.8
V
Operating Temperature
/
-40
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 4. Handling Ratings of RF-BM-2642B1
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±2000
V
Moisture Sensitivity Level
3
Charged Device Model
±500
V

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-BM-2642B1
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-BM-2642B1 (mm)

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4.3 Schematic Diagram
Figure 6. Schematic Diagram of RF-BM-2642B1

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4.4 Reference Design
Figure 7. Reference Design of RF-BM-2642B1
4.5 Antenna
4.5.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside of the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna are key factors to increase the data rate and transmission range.

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Therefore, the layout of the module antenna location and routing is recommended as follows:
(1) Place the antenna on the edge (corner) of the PCB.
(2) Make sure that there is no signal line or copper foil in each layer below the antenna.
(3) It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is
minimally affected.
Figure 8. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.6 Basic Operation of Hardware Design
1. It is recommended to offer the module a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power
supply. Otherwise, the reverse connection may cause permanent damage to the module;
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,
which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic interference.
4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power
routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered
to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close
to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degree;
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the

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interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for
example, USB 3.0.
4.7 Trouble Shooting
4.7.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in the communication packet loss rate.
The performance of ground absorption and reflection of radio waves will be poor when the module is tested close to
the ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor.
3. The signal attenuation will be very obvious if there is metal near the antenna or if the module is placed inside the
metal shell.
4. The incorrect power register set or the high data rate in the open air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and modules or the poor quality of the antenna will affect the communication distance.
4.7.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuating
voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity-sensitive components, please ensure suitable humidity during installation and application. If
there is no special demand, it is not recommended to use at too high or too low temperature.
4.7.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.

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2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.8 Electrostatics Discharge Warnings
The module will be damaged by the discharge of static. RF-star suggests that all modules should follow the 3 precautions
below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti-static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing failure.
4.9 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5/Ag3.0/Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 5. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s
Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃ ~ 235 ℃
230 ℃ ~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃ to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s

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Figure 9. Recommended Reflow for Lead-Free Solder

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5 Optional Package Specification
The default package method is by tray. If you need the modules to be shipped by tape & reel, pls contact us in advance.
Figure 10. Default Package by Tray

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Figure 11. Package by Tape & Reel

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6 Certification
6.1 FCC
Warnings:
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) this device must accept any interference received, including interference
that may cause undesired operation.
FCC ID: 2ABN2-BM2642B1
Figure 12. FCC certificate
6.2 IC
IC ID: 23949-RFBM2642B1
Figure 13. IC Certificate

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6.3 CE
Figure 14. CE Certificate