RF-Star RF-BM-ND06 User manual

RF-BM-ND06 nRF52840
Multi-Protocol Module
Supporting BLE5.3, ZigBee, Thread
Version 1.2
Shenzhen RF-star Technology Co., Ltd.
May 25th, 2023
All rights reserved. Those responsible for unauthorized reproduction will be prosecuted.

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1 Device Overview
1.1 Description
RF-BM-ND06 is an RF module based on Nordic multiprotocol SoC nRF52840-QIAA-R with best-in-class 32-bit ARM®
Cortex®-M4 processor. It integrates a 32.768 kHz and a 32 MHz crystal, a power filter, an antenna matching, and a high-
performance PCB antenna. It supports BLE stack v5.0, Bluetooth 5.0 low energy, Bluetooth mesh, Thread, ZigBee, IEEE
802.15.4-2006 and 2.4 GHz proprietary and can be preprogrammed with a serial interface communication protocol for
simple programming. It also has a range of analog and digital interfaces such as NFC-A, ADC, high-speed 32 MHz SPI,
UART, SPI, I2C, PWM, I2S, PPI and PDM. It features high-performance digital interfaces, robust connection distance,
and rigid reliability. All pins of RF-BM-ND06 are pulled out.
1.2 Key Features
•RF features
- Bluetooth 5.3 low energy
- Bluetooth mesh
- Thread
- ZigBee
- IEEE 802.15.4-2006
- 2.4 GHz proprietary
- Nordic SoftDevice ready with support for concurrent
multiprotocol
•TX power: -20 dBm ~ +8 dBm
•On-air compatible with nRF52, nRF51, nRF24L and
nRF24AP series
•ARM® Cortex®-M4 32-bit processor with FPU, 64 MHz
•Supply voltage range: 1.7 V ~ 3.6 V
•Memory
- Flash: 1 MB
- RAM: 256 KB
•Advanced peripherals
- USB 2.0 full speed (12 Mbps) controller
- QSPI 32 MHz interface
- High-speed 32 MHz SPI
- NFC-A
- Programmable Peripheral interconnect (PPI)
- 29 GPIOs
- 12-bit, 200 ksps ADC, 8 configurable channels with
programmable gain
- 64 level comparator
- 15 level low-power comparator with wake-up from
System OFF mode
- 5x 32-bit timer with counter mode
- Temperature sensor
- 4 x 4-channel PWM
- I2S (PDM)
- 4 x SPI master / 3 x SPI slave with EasyDMA
- 2 x I2C compatible two-wire master/slave
- 2 x UART (CTS/RTS)
- Quadrature decoder (QDEC)
- 3x real-time counter (RTC)
•Secure enablers
- ARM® TrustZone® Cryptocell 310 security
subsystem
- Secure boot ready
- Secure erase
•Quadrature decoder (QDEC)
•Dimension: 24.0 mm x 20.5 mm x 2.20 mm
•Certificates: RoHS, FCC, CE, SRRC
1.3 Applications
•Internet of Things (IoT) •Internet Gateway

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•Cloud Connectivity
•Industrial Control
•Home Automation
•Smart Plug and Metering
•Wireless Audio
•Access Control
•IP Network Sensor Nodes
•Security Systems
•Wearables
•Building automation
•Retail
•Sensor networks
•Medical devices
•Remote controls
1.4 Functional Block Diagram
Figure 1. Functional Block Diagram of RF-BM-ND06
1.5 Part Number Conventions
The part numbers are of the form of RF-BM-ND06 where the fields are defined as follows:
Figure 2. Part Number Conventions of RF-BM-ND06
RF
BM
ND
Company Name
RF-STAR
Wireless Type
Bluetooth Module
Chipset Manufacturer
Nordic Semiconductor
-
-
06
Module Version
nRF52840 Second Version
nRF52840
GPIOs
Debug
Reset
PCB Antenna
LC Filter
Power Supply
1.7 V ~ 5.5 V
Antenna
Matching
32.0 MHz
32.768 kHz
Pad RF pin

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Table of Contents
1 Device Overview............................................................................................................................................................. 1
1.1 Description............................................................................................................................................................ 1
1.2 Key Features ....................................................................................................................................................... 1
1.3 Applications.......................................................................................................................................................... 1
1.4 Functional Block Diagram .............................................................................................................................. 2
1.5 Part Number Conventions.............................................................................................................................. 2
Table of Contents................................................................................................................................................................ 3
2 Module Configuration and Functions ...................................................................................................................... 5
2.1 Module Parameters........................................................................................................................................... 5
2.2 Module Pin Diagram ......................................................................................................................................... 6
2.3 Pin Functions....................................................................................................................................................... 6
3 Specifications .................................................................................................................................................................10
3.1 Recommended Operating Conditions .....................................................................................................10
3.2 Handling Ratings..............................................................................................................................................10
4 Application, Implementation, and Layout.............................................................................................................11
4.1 Module Photos..................................................................................................................................................11
4.2 Recommended PCB Footprint....................................................................................................................11
4.3 Schematic Diagram.........................................................................................................................................12
4.4 Reference Design............................................................................................................................................13
4.5 Antenna................................................................................................................................................................14
4.5.1 Antenna Design Recommendation ..............................................................................................14
4.6 Basic Operation of Hardware Design ......................................................................................................14
4.7 Trouble Shooting..............................................................................................................................................15
4.7.1 Unsatisfactory Transmission Distance........................................................................................15
4.7.2 Vulnerable Module..............................................................................................................................16
4.7.3 High Bit Error Rate .............................................................................................................................16
4.8 Electrostatics Discharge Warnings ...........................................................................................................16
4.9 Soldering and Reflow Condition.................................................................................................................16
5 Optional Package Specification ..............................................................................................................................18
6 Certification .....................................................................................................................................................................20
6.1 RoHS ....................................................................................................................................................................20

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6.2 FCC.......................................................................................................................................................................20
6.3 CE..........................................................................................................................................................................21
6.4 SRRC ...................................................................................................................................................................21
7 Revision History ............................................................................................................................................................22
8 Contact Us.......................................................................................................................................................................23

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2 Module Configuration and Functions
2.1 Module Parameters
Table 1. Parameters of RF-BM-ND06
Chipset
nRF52840
Supply Power Voltage
1.7 V ~ 5.5 V, recommended to 3.3 V
Frequency
2402 MHz ~ 2480 MHz
Transmit Power
-20.0 dBm ~ +8.0 dBm
Receiving Sensitivity
-95 dBm conductive sensitivity in BLE mode
-103 dBm sensitivity in 125 kbps BLE mode (long range)
Data Rate
Bluetooth ® 5: 2 Mbps, 1 Mbps, 500 kbps and 125 kbps
IEEE 802.15.4-2006: 250 kbps
Proprietary 2.4 GHz: 2 Mbps, 1 Mbps
Power Consumption
4.8 mA peak current in TX (@0 dBm)
4.6 mA peak current in RX
GPIO
48
Crystal
32 MHz, 32.768 kHz
RAM
256 KB
Flash
1 MB
Package
LGA Packaging
Dimension
24.0 mm x 20.5 mm x 2.20 mm
Type of Antenna
PCB Antenna/Pad RF pin
Operating Temperature
-40 ℃ ～ +85 ℃
Storage Temperature
-40 ℃ ～ +125 ℃

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2.2 Module Pin Diagram
Figure 3. Pin Diagram of RF-BM-ND06
2.3 Pin Functions
Table 2. Pin Functions of RF-BM-ND06
Pin
Name
Chip Pin
Pin Function
Description
1
P0.12
P0.12
TRACEDATA1
Digital
Trace data
General purpose I/O
Trace buffer TRACEDATA[1]
2
VCC
VDD
Power
Power supply: 1.7 V ~ 3.6 V
3
VDD_HV
VDDH
Power
High voltage power supply: 2.5 V ~ 5.5 V
4
VDD_USB
VBUS
Power
USB power supply: 4.35 V ~ 5.5 V
5
D-
D-
Digital
USB D-
6
D+
D+
Digital
USB D+
7
P0.13
P0.13
Digital
General purpose I/O
8
P0.14
P0.14
Digital
General purpose I/O
9
P0.15
P0.15
Digital
General purpose I/O
10
P0.16
P0.16
Digital
General purpose I/O
11
P0.17
P0.17
Digital
General purpose I/O

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12
P0.18
P0.18/nRESET
Digital
General purpose I/O. Recommended usage:
QSPI/CSN
Reset, active low.
13
P0.19
P0.19
Digital
General purpose I/O. Recommended usage:
QSPI/SCK
14
P0.20
P0.20
Digital
General purpose I/O
15
P0.21
P0.21
Digital
General purpose I/O. Recommended usage: QSPI
16
P0.22
P0.22
Digital
General purpose I/O. Recommended usage: QSPI
17
P0.23
P0.23
Digital
General purpose I/O. Recommended usage: QSPI
18
P0.24
P0.24
Digital
General purpose I/O
19
P0.25
P0.25
Digital
General purpose I/O
20
P1.00
P1.00
TRACEDATA0
Digital
Trace data
General purpose I/O. Recommended usage: QSPI
Trace buffer TRACEDATA[0]
Serial wire output
21
SWDIO
SWDIO
Debug
Serial wire debug I/O for debugging and
programming
22
SWCLK
SWDCLK
Debug
Serial wire debug clock input for debugging and
programming
23
NFC1
P0.09/NFC1
Digital
NFC input
General purpose I/O, NFC antenna connection.
Standard drive, low-frequency I/O only
24
NFC2
P0.10/NFC2
Digital
NFC input
General purpose I/O, NFC antenna connection.
Standard drive, low-frequency I/O only
25
P1.01
P1.01
Digital
General purpose I/O. Standard drive, low-frequency
I/O only
26
P1.02
P1.02
Digital
General purpose I/O. Standard drive, low-frequency
I/O only
27
P1.03
P1.03
Digital
General purpose I/O. Standard drive, low-frequency
I/O only
28
P1.04
P1.04
Digital
General purpose I/O. Standard drive, low-frequency
I/O only
29
P1.05
P1.05
Digital
General purpose I/O. Standard drive, low-frequency
I/O only

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30
P1.06
P1.06
Digital
General purpose I/O. Standard drive, low-frequency
I/O only
31
RF_OUT
ANT
RF
Single-ended radio antenna connection
32
P1.07
P1.07
TRACECLK
Digital
Trace clock
General purpose I/O
Trace buffer clock
33
P1.10
P1.10
Digital
General purpose I/O. Standard drive, low-frequency
I/O only
34
P1.11
P1.11
Digital
General purpose I/O. Standard drive, low-frequency
I/O only
35
P1.12
P1.12
Digital
General purpose I/O. Standard drive, low-frequency
I/O only
36
P1.13
P1.13
Digital
General purpose I/O. Standard drive, low-frequency
I/O only
37
P1.14
P1.14
Digital
General purpose I/O. Standard drive, low-frequency
I/O only
38
P1.15
P1.15
Digital
General purpose I/O. Standard drive, low-frequency
I/O only
39
P0.03
P0.03/AIN1
Digital or Analog
General purpose I/O, Analog input
Standard drive, low-frequency I/O only
40
P0.02
P0.02/AIN0
Digital or Analog
General purpose I/O, Analog input
Standard drive, low-frequency I/O only
41
P0.28
P0.28/AIN4
Digital or Analog
General purpose I/O, Analog input
Standard drive, low-frequency I/O only
42
P0.29
P0.29/AIN5
Digital or Analog
General purpose I/O, Analog input
Standard drive, low-frequency I/O only
43
P0.30
P0.30/AIN6
Digital or Analog
General purpose I/O, Analog input
Standard drive, low-frequency I/O only
44
P0.31
P0.31/AIN7
Digital or Analog
General purpose I/O, Analog input
Standard drive, low-frequency I/O only
45
P0.26
P0.26
Digital
General purpose I/O
46
P0.27
P0.27
Digital
General purpose I/O
47
P0.04
P0.04/AIN2
Digital or Analog
General purpose I/O, Analog input

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48
P0.05
P0.05/AIN3
Digital or Analog
General purpose I/O, Analog input
49
P0.06
P0.06
Digital
General purpose I/O
50
P0.07
P0.07
TRACECLK
Digital
Trace Clock
General purpose I/O
Trace buffer clock
51
P0.08
P0.08
Digital
General purpose I/O
52
P1.08
P1.08
Digital
General purpose I/O
53
P1.09
P1.09
TRACEDATA3
Digital
Trace data
General purpose I/O
Trace buffer TRACEDATA[3]
54
P0.11
P0.11
TRACEDATA2
Digital
Trace data
General purpose I/O
Trace buffer TRACEDATA[2]

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3 Specifications
3.1 Recommended Operating Conditions
The functional operation does not guarantee performance beyond the limits of the conditional parameter values in the
table below. Long-term work beyond this limit will affect the reliability of the module more or less.
Table 3. Recommended Operating Conditions of RF-BM-ND06
Items
Condition
Min.
Typ.
Max.
Unit
Operating Supply Voltage
Battery Mode
1.7
3.3
5.5
V
Operating Temperature
/
-40
+25
+85
℃
Environmental Hot Pendulum
/
-20
+20
℃/min
3.2 Handling Ratings
Table 4. Handling Ratings of RF-BM-ND06
Items
Condition
Min.
Typ.
Max.
Unit
Storage Temperature
Tstg
-40
+25
+125
℃
Human Body Model
HBM
±2000
V
Moisture Sensitivity Level
3
Charged Device Model
±750
V

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4 Application, Implementation, and Layout
4.1 Module Photos
Figure 4. Photos of RF-BM-ND06
4.2 Recommended PCB Footprint
Figure 5. Recommended PCB Footprint of RF-BM-ND06 (mm)

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4.3 Schematic Diagram
Figure 6. Schematic Diagram of RF-BM-ND06

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4.4 Reference Design
Figure 7. Reference Design of RF-BM-ND06

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4.5 Antenna
4.5.1 Antenna Design Recommendation
1. The antenna installation structure has a great influence on the module performance. It is necessary to ensure the
antenna is exposed and preferably vertically upward. When the module is installed inside the case, a high-quality
antenna extension wire can be used to extend the antenna to the outside of the case.
2. The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly
weakened.
3. The recommendation of antenna layout.
The inverted-F antenna position on PCB is free-space electromagnetic radiation. The location and layout of the
antenna is a key factor to increase the data rate and transmission range.
Therefore, the layout of the module antenna location and routing is recommended as follows:
1. Place the antenna on the edge (corner) of the PCB.
2. Make sure that there is no signal line or copper foil in each layer below the antenna.
3. It is best to hollow out the antenna position in the following figure to ensure that the S11 of the module is
minimally affected.
Figure 8. Recommendation of Antenna Layout
Note: The hollow-out position is based on the antenna used.
4.6 Basic Operation of Hardware Design
1. It is recommended to offer the module with a DC stabilized power supply, a tiny power supply ripple coefficient, and
reliable ground. Please pay attention to the correct connection between the positive and negative poles of the power
supply. Otherwise, the reverse connection may cause permanent damage to the module.
2. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuated voltage.
3. When designing the power supply circuit for the module, it is recommended to reserve more than 30% of the margin,

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which is beneficial to the long-term stable operation of the whole machine. The module should be far away from the
power electromagnetic, transformer, high-frequency wiring, and other parts with large electromagnetic interference.
4. The bottom of the module should avoid high-frequency digital routing, high-frequency analog routing, and power
routing. If it has to route the wire on the bottom of the module, for example, it is assumed that the module is soldered
to the Top Layer, the copper must be spread on the connection part of the top layer and the module, and be close
to the digital part of the module and routed in the Bottom Layer (all copper is well-grounded).
5. Assuming that the module is soldered or placed in the Top Layer, it is also wrong to randomly route the Bottom Layer
or other layers, which will affect the spurs and receiving sensitivity of the module to some degrees.
6. Assuming that there are devices with large electromagnetic interference around the module, which will greatly affect
the module performance. It is recommended to stay away from the module according to the strength of the
interference. If circumstances permit, appropriate isolation and shielding can be done.
7. Assuming that there are routings of large electromagnetic interference around the module (high-frequency digital,
high-frequency analog, power routings), which will also greatly affect the module performance. It is recommended
to stay away from the module according to the strength of the interference. If circumstances permit, appropriate
isolation and shielding can be done.
8. It is recommended to stay away from the devices whose TTL protocol is the same 2.4 GHz physical layer, for
example, USB 3.0.
4.7 Trouble Shooting
4.7.1 Unsatisfactory Transmission Distance
1. When there is a linear communication obstacle, the communication distance will be correspondingly weakened.
Temperature, humidity, and co-channel interference will lead to an increase in communication packet loss rate. The
performances of ground absorption and reflection of radio waves will be poor when the module is tested close to the
ground.
2. Seawater has a strong ability to absorb radio waves, so the test results by the seaside are poor.
3. The signal attenuation will be very obvious if there is a metal near the antenna or the module is placed inside the
metal shell.
4. The incorrect power register set or the high data rate in an open-air may shorten the communication distance. The
higher the data rate, the closer the distance.
5. The low voltage of the power supply is lower than the recommended value at ambient temperature, and the lower
the voltage, the smaller the power is.
6. The unmatchable antennas and modules or the poor quality of the antenna will affect the communication distance.

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4.7.2 Vulnerable Module
1. Please ensure the supply voltage is between the recommended values. The module will be permanently damaged
if the voltage exceeds the maximum value. Please ensure a stable power supply and no frequently fluctuated voltage.
2. Please ensure the anti-static installation and the electrostatic sensitivity of high-frequency devices.
3. Due to some humidity-sensitive components, please ensure suitable humidity during installation and application. If
there is no special demand, it is not recommended to use at too high or too low temperature.
4.7.3 High Bit Error Rate
1. There are co-channel signal interferences nearby. It is recommended to be away from the interference sources or
modify the frequency and channel to avoid interferences.
2. The unsatisfactory power supply may also cause garbled. It is necessary to ensure the power supply's reliability.
3. If the extension wire or feeder wire is of poor quality or too long, the bit error rate will be high.
4.8 Electrostatics Discharge Warnings
The module will be damaged for the discharge of static. RF-star suggests that all modules should follow the 3 precautions
below:
1. According to the anti-static measures, bare hands are not allowed to touch modules.
2. Modules must be placed in anti-static areas.
3. Take the anti-static circuitry (when inputting HV or VHF) into consideration in product design.
Static may result in the degradation in performance of the module, even causing the failure.
4.9 Soldering and Reflow Condition
1. Heating method: Conventional Convection or IR/convection.
2. Solder paste composition: Sn96.5 / Ag3.0 / Cu0.5
3. Allowable reflow soldering times: 2 times based on the following reflow soldering profile.
4. Temperature profile: Reflow soldering shall be done according to the following temperature profile.
5. Peak temperature: 245 ℃.
Table 5. Temperature Table of Soldering and Reflow
Profile Feature
Sn-Pb Assembly
Pb-Free Assembly
Solder Paste
Sn63 / Pb37
Sn96.5 / Ag3.0 / Cu0.5
Min. Preheating Temperature (Tmin)
100 ℃
150 ℃
Max. Preheating Temperature (Tmax)
150 ℃
200 ℃
Preheating Time (Tmin to Tmax) (t1)
60 s ~ 120 s
60 s ~ 120 s

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Average Ascend Rate (Tmax to Tp)
Max. 3 ℃/s
Max. 3 ℃/s
Liquid Temperature (TL)
183 ℃
217 ℃
Time above Liquidus (tL)
60 s ~ 90 s
30 s ~ 90 s
Peak Temperature (Tp)
220 ℃ ~ 235 ℃
230 ℃ ~ 250 ℃
Average Descend Rate (Tpto Tmax)
Max. 6 ℃/s
Max. 6 ℃/s
Time from 25 ℃ to Peak Temperature (t2)
Max. 6 minutes
Max. 8 minutes
Time of Soldering Zone (tP)
20±10 s
20±10 s
Figure 9. Recommended Reflow for Lead-Free Solder

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5 Optional Package Specification
The default package method is by tray. If you need the modules to be shipped by tape & reel, pls contact us in advance.
Figure 10. Default Package by Tray

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Figure 11. Package by Tape & Reel