Samsung Yepp YP-30S User manual

DIGITAL AUDIO PLAYER
YP-30S
DIGITAL AUDIO PLAYER CONTENTS
Precautions
Specifications
Parts Description
Mass-production Initialization
Program
Troubleshooting Guide
Exploded View and Disassembly
Order
Electrical Part List
Block Diagram
Internal Block Diagram of Main IC
PCB Wiring Diagrams
Schematic Diagram
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.

ELECTRONICS
©Samsung Electronics Co., Ltd. OCT. 2001
Printed in Korea
AH68-00999A

Precautions
Samsung Electronics 1-1
1. Precautions
1-1 Static electricity sense device
Some semi-conductor parts may be easily damaged due to static electricity.
These elements are generally called as static electricity sense device (ESD). Typically examples of EST
include IC, some transistor and chip element for semi-conductor with electrical field effect.
The following methods should be used to reduce damage of elements occurred due to static electricity:
1. Contact and emit all the grounding objects with static electricity from your body before handling with
elements for semi-conductor or devices with elements for semi-conductor. You should purchase and use
static electricity arm rings or commercially available. You should remove it due to potential shock before
supplying power to the device under test.
2. You should place appliance on the conductive surface like aluminum film to prevent that static electricity
is accumulated or the device is disclosed outside after removing electrical appliance with the ESD device.
3. You should use only soldering iron that is ground when soldering the ESD device.
4. Minimize physical operation when handling with the ESD device for replacement without packing
(Otherwise, namely friction between cloth fibers or lifting of the foot from the carpet floor may cause sta-
tic electricity enough to damage the ESD device).
1-2 Cautions for Safety
1. To remove dust from cabinet, use a dry cloth without using liquid and aerosol cleaner.
2. You should not use attachments not recommended by the company. Otherwise, it may cause critical
damage.
3. You should not use this product near water such as bathtub, swimming pool or lake etc.
4. Power supply: A type of battery as displayed on the label should be only used.
5. You should not put any object or liquid into product. Otherwise, it may cause failure or mal-operation.
6. If replacement material is required, service engineer should use materials with the same standard. The
use of non-standardized materials may cause failure of product.

1-2 Samsung Electronics
MEMO

2. Specifications
Specifications
Samsung Electronics 2-1
Standards and design may be changed without notice and related weight and dimensions are only approxi-
mate.
Power
Playing Time
Memory capacity
Dimensions (WxHxD) / Weight
Material of case
File transfer speed
Earphones output Power
Ratio of signal to noise
Scope of output frequency
Processor
Temperature characteristics
1.5V (1EA of AAA cell)
Lasts 5 hours(based on Alkaline cell)
64MB
44 x 65 x 14.5 mm/34g
Plastic / Aluminum
Max. 7 Mbps (USB)
5mW (16Ωearphone)
85dB with 20KHz LPP
20Hz – 20KHz
18MHz, 20bit RISC
-5 ~ 35OC

2-2 Samsung Electronics
MEMO

3. Parts Description
Parts Description
Samsung Electronics 3-1
Front Side
Rear Side

3-2 Samsung Electronics
The followings are displayed depending on setting:
Remained memory : 32
Compression Ratio : 128
Pause Status : STOP
EQ Display
BASS Function
Current Time
Display EQ Display
Repetition Display/
Section Repetition Display
Repetition of Semi-music
Repetition of All music
Shuffle Play
Play of Initial Part
Under Setting of Section Repetition
Section Repetition Play
Hold Display
(No Display in Release)
Display of Cell Remained
Text Display Area
(Information of the current
status is displayed as text)
Mode Display
Voice Recording Mode
Music Play Mode
Track
Number
Play Time Display/
Recording Time Display
Recording Time
Play Time
Remaining Time
Total Time
Play Time
Classification of
Display Method/
Display of Recording
Time
Screen Display Window

Mass-production Initialization Program
Samsung Electronics 4-1
4. Mass-production Initialization Program
4-1 About Mass-production Initialization Program
Program for test and product initialization is provided as separate software in service of this product.
This program is not provided to customers and is only designed to use good product inspection and initial-
ization of the ASS’Y PCB obtained from the service center.
4-1-1 Method to supply program
Always perform downloading since this program is not provided as a separate diskette but is distrib-
uted via YP-30S SVC Manual Sub-Chapter of ITSELF System.
4-1-2 Environment for using program
(1) IBM compatible PC (PII 233 or more is recommended)
(2) WINDOWS 98SE/ME/2000
(3) USB Interface
(4) Supporting 16bits Color or more and using Video Card
(5) HDD 5Mbyte or more
4-1-3 Program Function
(1) Downloading FONT, ICON, LOGO
(2) Testing Download, Delete, Format
(3) Downloading Sample Song
(4) Saving UID
4-1-4 Method to install program
(1) Execute downloaded program (YP30MASS. Exe)
(2) Execute installation in accordance with guide of a dialog box.
(3) Program (yepp Mass Program.exe) is installed on the desktop if installation is completed.
4-1-5 Method to use program
ASS’Y PCB obtained from the service center is not initialized and subject to good product inspection.
Please execute as follows for good product inspection and initialization of the obtained ASS’Y.
(1) Connect ASS’Y PCB of YP 30S to PC via the USB cable.
(2) After connecting YP-30S to PC, wait 1 minute for YP-30S to format itself.
(3) No USB communication is done when YP-30S is in clock display mode. Please change to general
mode by pressing the (√/ ■) button.
(4) Execute program (yepp Mass Program.exe) installed on the basic screen.
(5) Select all the test items (all are basically selected).
(6) Click START from the operation button.
(7) Good product inspection and initialization are successfully completed if a pop-up window called
PASS.
(8) You can view saved contents if clicking the pop-up window called PASS and then clicking the Test
Information TAB.

Mass-production Initialization Program
4-2 Samsung Electronics
4-2 Explanation of Mass-production Initialization Program
1. TAB
If clicking each tab, you can see the relevant contents.
(1) Procedure List
-. Test progress information message is output.
(2) Error List
-. Error message occurred during test progress is output.
(3) Test Information
-. Result information is output after completing test.
2. SELECT MODEL (model selection)
(1) YP-30S
-. For YP-30S (selected for this product)
(2) YP-MF
-. For YP-MF series
3. SAMPLE SONG TYPE
(1) OTHER
-. Music file to be initially saved among products released in area except for USA.
-. Music files at “ MUSIC kor ” where program is installed.
-. File name: “Yepp-1 groove.mp3”, “Yepp-2 funk.mp3”
WW W

Mass-production Initialization Program
Samsung Electronics 4-3
(2) USA
-. Music file to be initially saved among products released in USA.
-. Music files at “ MUSIC eng ” where program is installed.
-. File name: “Yepp-1 groove.mp3”, “Yepp-2 funk.mp3”
4. Test item (explanation)
Select items to test.
(1) Font/Icon/Logo
-. Ascii Font, Icon, Default Logo, User Logo download check box
(2) DOWNLOAD
-. Download test check box (file download for test, not for consumer)
(3) DELETE
-. Delete test check box
(4) FORMAT
-. Format test check box
(5) SAMPLE SONG
-. Sample song download check box (basic file provided to consumers)
(6) SETUID
-. Check box to register UID
❈All items are basically checked (select the only relevant check box if necessary)
5. Operation button
Execute the selected test item.
(1) START
-. Perform test for only .
(2) STOP
-. Suspend test during test.
(3) CLOSE
-. Complete test application.
Test progress information
1. Circle is filled with blue if no error occurs in the selected test items.
2. Circle is filled with red if error occurs in the selected test items.
WW W

4-4 Samsung Electronics
MEMO

5. Troubleshooting Guide
Troubleshooting Guide
Samsung Electronics 5-1
Status of Non-conforming
Poor power connection
Poor switch
No back-light ON
Poor display or No display
(forming of stripe, partial dark)
Black screen in display
of FONT and LOGO
Poor USB communication
(perform test sequentially)
Cause
Poor contact of PCB’s
battery(+) terminal
Poor key (SW1 – SW6) contact
Poor LCD contact
Poor LCD
No initialization
Poor initialization work
Poor computer
Poor USB cable
Soldering of USB port
Point of Repair
Replace battery(+) terminal plate.
Replace the relevant switch.
Replace LCD.
Replace LCD.
Execute initialization program.
Execute initialization program.
- Test in comparison with other YP-30S set
- Test in comparison with other computer
- Test in comparison with other USB cable
- Ensure soldering status

5-2 Samsung Electronics
MEMO

Exploded View and Disassembly Order
Samsung Electronics 6-1
6. Exploded View and Disassembly Order
AH64-01376A
AH97-00789A
AH97-00790A
AH97-00791A
AH97-00792A
AH64-01407A
AH64-01379A
AH64-01382A
AH61-00790A
6003-001257
AH92-01100A
AH92-01382A
AH07-00059A
AH64-01381A
AH39-00301A
AH59-01014A
AH61-00845A
AH63-00380A
AH63-00328A
AH97-00844A
AH80-00028A
CABINET-TOP;YP-30S,ANODIZING,AL,0.7T
ASSY-CASE BOTTOM; ASSY, YP-30S
ASSY-FRAME TOP; ASSY, YP-30S
ASSY-FRAME BOTTOM; ASSY, YP-30S
ASSY-COVER BATTERY; ASSY, YP-30S
WINDOW-LCD; YP-30S, ACRYL, 1.5
KNOB-HOLD; YP-30S, ABS
DECORATION-RING; YP-30S, ABS
HOLDER-LCD; YP-30S, ABS
SCREW-TAPTITE; PH, +, B, M1, L, L6.5, NI PLT, SW
ASSY PCB-MIC; YP-30S, ONE-BOARD (For 64MB YP-30S)
ASSY PCB-32MB-ONE-BOARD; YP-30S(For 32MB YP-30S/CT)
LCD; UG-12T14-FGHT X-A, YP-30S, -, 32X4
KNOB-VOLUME; YP-30S, ABS
CABLE FORM; YD-150B, YP-MF64,4P, 1.2M, -,-,PVC, BEIGE, 4PX1200MM,-,USB CABLE
SPEAKER SYSTEM; YP-30S, YH-30SGU, 0.22V,0.2
HANGER-NECKLES; YP-30S
BAND; -,-,PVC, YP-30S,DOMESTIC(For Asia)
BAND-ARM; -,-,PVC,YP-30S(Except Asia)
ASSY-CRADLE; -,YP-30S
INSTALL-MFN CD; YP-30S,30S CD, CD, KOR-CD
Disassembly and assembly method
1. Remove No . while pressing No. "PUSH OPEN".
2. Remove No.
3. Remove No.
6. Remove No.
9. After lifting No. up from the connector lightly, apply heat with a soldering iron on the soldering part.
10. Separate No. and No. .
1. After ensuring No. is properly placed at No. , insert frame (without care, SW2 or SW3 may be damaged).
3. Securely insert No. and No. into the No. connector and then fix them at the PCB.
4. When properly placing No. (+, -), adjust orientation accurately.
(Back light soldering condition of LCD: 360˚C, within 2 seconds)
2. Since a flaw may occur if lifting No. up from the lower part and then inserting it, lower it down from the upper part for insertion.
Cautions in assembling
7. Lift No. up (separate it No. , No. , No. and No. ).
8. Lift the No. LCD connector up.
5. Carefully extend No. a little, and lift up and remove it along with the main body
4. Pull and remove No. while pressing the upper part of No. (take care so that No. switch would not be pressed).

Electric Parts List
Samsung Electronics 7-1
B3 3301-001419 CORE-FERRITE BEAD;AB,220ohm,1.6x0.8x0.8m
BT2 2409-001042 C-EDL;200000UF,3.3V,3.3V,0.15MA,TP,6
C10 2203-000726 C-CERAMIC,CHIP;3.9nF,10%,50V,X7R,TP,1608
C13 2203-000125 C-CERAMIC,CHIP;1.2nF,10%,50V,X7R,TP,1608
C14 2203-000125 C-CERAMIC,CHIP;1.2nF,10%,50V,X7R,TP,1608
C15 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C16 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C17 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C18 2203-001103 C-CERAMIC,CHIP;6.8nF,10%,50V,X7R,TP,1608
C19 2203-001103 C-CERAMIC,CHIP;6.8nF,10%,50V,X7R,TP,1608
C2 2404-000293 C-TA,CHIP;220UF,10%,6.3V,GP,TP,7343H
C20 2404-001159 C-TA,CHIP;100UF,10%,6.3V,GP,TP,6032
C21 2404-001159 C-TA,CHIP;100UF,10%,6.3V,GP,TP,6032
C22 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C3 2404-000335 C-TA,CHIP;3.3uF,20%,16V,GP,TP,3216
C30 2203-000315 C-CERAMIC,CHIP;0.12nF,5%,50V,NP0,TP,1608
C32 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C33 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C34 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C35 2404-001020 C-TA,CHIP;10uF,20%,10V,GP,TP,3216,3.2
C36 2404-000151 C-TA,CHIP;1uF,20%,16V,-,TP,3216,-
C38 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C39 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C4 2404-000293 C-TA,CHIP;220UF,10%,6.3V,GP,TP,7343H
C40 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C41 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C42 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C43 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C46 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C47 2203-005005 C-CERAMIC,CHIP;100nF,10%,16V,X7R,TP,1608
C52 2203-000315 C-CERAMIC,CHIP;0.12nF,5%,50V,NP0,TP,1608
C54 2203-000315 C-CERAMIC,CHIP;0.12nF,5%,50V,NP0,TP,1608
C55 2404-000151 C-TA,CHIP;1uF,20%,16V,-,TP,3216,-
C56 2203-000726 C-CERAMIC,CHIP;3.9nF,10%,50V,X7R,TP,1608
C6 2404-000335 C-TA,CHIP;3.3uF,20%,16V,GP,TP,3216
C60 2203-000626 C-CERAMIC,CHIP;0.022nF,5%,50V,NP0,TP,160
C61 2203-001195 C-CERAMIC,CHIP;0.007nF,0.25pF,50V,NP0,TP
C62 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C63 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C64 2203-000998 C-CERAMIC,CHIP;0.047nF,5%,50V,NP0,TP,160
C65 2203-000998 C-CERAMIC,CHIP;0.047nF,5%,50V,NP0,TP,160
C7 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
C8 2404-001158 C-TA,CHIP;47uF,10%,6.3V,GP,TP,3528
C9 2203-000257 C-CERAMIC,CHIP;10nF,10%,50V,X7R,TP,1608
D11 0404-001010 DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP
D12 0404-001010 DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP
D13 0404-001010 DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP
D3 0404-001089 DIODE-SCHOTTKY;RB551V-30,30V,500mA,SOD-3
D4 0404-001089 DIODE-SCHOTTKY;RB551V-30,30V,500mA,SOD-3
D5 0404-001010 DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP
D6 0404-001010 DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP
D7 0404-001010 DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP
D9 0404-001010 DIODE-SCHOTTKY;MA729,30V,200mA,DSM,TP
J1 3722-001605 JACK-PHONE;3P,3.6PI,AG,BLK,-
J2 3708-001630 CONNECTOR-FPC/FC/PIC;15P,0.5MM,SMD-A,-
J3 3708-001600 CONNECTOR-FPC/FC/PIC;4P,0.8MM,SMD-A,GOLD
L1 2703-001864 INDUCTOR-SMD;15UH,20%,6X6X2.8MM
L2 2703-001864 INDUCTOR-SMD;15UH,20%,6X6X2.8MM
L3 2703-002247 INDUCTOR-SMD;4.7MH,20%,3.8X3.8X2.0
L4 2703-000271 INDUCTOR-SMD;4.7uH,10%,2x1.25x1.25mm
L5 2703-000271 INDUCTOR-SMD;4.7uH,10%,2x1.25x1.25mm
MIC 3003-001062 MIC-CONDENSOR;2V,130UA-50,-42DB+-3DB,2.2
Q2 0505-001426 FET-SILICON;IRLML6401,P,-12V,-4.3A,0.05o
Q3 0504-001048 TR-DIGITAL;-,NPN,100MW,47K,SC-70,TP
R10 2007-000123 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608
R11 2007-000123 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608
R12 2007-000121 R-CHIP;820ohm,5%,1/16W,DA,TP,1608
R13 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R15 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R16 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R19 2007-000120 R-CHIP;680ohm,5%,1/16W,DA,TP,1608
R2 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R20 2007-000125 R-CHIP;3.9Kohm,5%,1/16W,DA,TP,1608
R21 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R22 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R23 2007-000123 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608
R24 2007-000123 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608
R25 2007-000123 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608
R26 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608
R29 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R3 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R30 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R31 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R33 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R34 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R4 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R40 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608
R41 2007-000123 R-CHIP;1.5Kohm,5%,1/16W,DA,TP,1608
R42 2007-000071 R-CHIP;22ohm,5%,1/16W,DA,TP,1608
R43 2007-000109 R-CHIP;1Mohm,5%,1/16W,DA,TP,1608
R44 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R45 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R46 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R47 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R48 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R49 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R5 2007-000124 R-CHIP;2.2Kohm,5%,1/16W,DA,TP,1608
R50 2007-000125 R-CHIP;3.9Kohm,5%,1/16W,DA,TP,1608
R51 2007-000125 R-CHIP;3.9Kohm,5%,1/16W,DA,TP,1608
R52 2007-000125 R-CHIP;3.9Kohm,5%,1/16W,DA,TP,1608
R53 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R54 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R55 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R57 2007-000121 R-CHIP;820ohm,5%,1/16W,DA,TP,1608
R59 2007-000987 R-CHIP;5.6ohm,5%,1/16W,DA,TP,1608
R6 2007-001147 R-CHIP;7.5ohm,5%,1/16W,DA,TP,1608
R60 2007-000102 R-CHIP;100Kohm,5%,1/16W,DA,TP,1608
R62 2007-000090 R-CHIP;10KOHM,5%,1/16W,DA,TP,1608
R7 2007-001147 R-CHIP;7.5ohm,5%,1/16W,DA,TP,1608
R8 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608
R9 2007-000113 R-CHIP;33ohm,5%,1/16W,DA,TP,1608
SW1 3408-001070 SWITCH-SLIDE;5V DC,10mA,-,OFF-<ON>,-
SW2 3404-001161 SWITCH-TACT;12V DC,50mA,220gf,5.5x4.5x1.
SW3 3404-001161 SWITCH-TACT;12V DC,50mA,220gf,5.5x4.5x1.
SW4 3404-001180 SWITCH-TACT;12V DC,50MA,260GF,5.2X5.2X1.
SW5 3404-001180 SWITCH-TACT;12V DC,50MA,260GF,5.2X5.2X1.
SW6 3408-001052 SWITCH-SLIDE;5V,0.3A,2P,<OFF-ON>,-
T1 0406-001128 DIODE-TVS;MLVS-0603-E08,50V,-,-
T2 0406-001128 DIODE-TVS;MLVS-0603-E08,50V,-,-
T3 0406-001128 DIODE-TVS;MLVS-0603-E08,50V,-,-
T4 0406-001128 DIODE-TVS;MLVS-0603-E08,50V,-,-
T5 0406-001128 DIODE-TVS;MLVS-0603-E08,50V,-,-
U1 0903-001248 IC-MICROCONTROLLER;ML66Q525,16BIT,TQFP,1
U2 1204-001881 IC-ENCODER/DECODER;MAS3519F,PLQFP,64P,-,
U3 1107-001280 IC-FLASH MEMORY;9K1208,64Mx8Bit,TSOP,48P
U4 0909-001031 IC-REAL TIME CLOCK;8563,-,TSSOP,8P,118MI
U5 1003-001233 IC-POWER DRIVER;1DDD355AA-M02,MSOP,8P,-,
U6 1203-001970 IC-VOLTAGE REGULATOR;-,SOT-89,3P,100MIL
U7 1203-002172 IC-VOL. DETECTOR;80823,SC-82AB,4P,49MIL,
Y1 2802-001168 RESONATOR-CERAMIC;12MHZ,0.5%,TP,3.7X3.1X
Y2 2801-004053 CRYSTAL-SMD;0.032768MHZ,20PPM,28-BCG,7PF
Y3 2802-001150 RESONATOR-CERAMIC;18.432MHZ,0.5%,TP,3.2X
AA61-00787A PLATE-BATTERY;YP-30S,BPS,0.2T,Au-p
AA61-00806A SPRING-BATTERY;YP-30S,SWC,0.45,-,-,-
Loc. No. Code No. Description ; Specification Remark Loc. No. Code No. Description ; Specification Remark
7. Electrical Parts List

7-2 Samsung Electronics
MEMO

8. Block Diagram
Block Diagram
Samsung Electronics 8-1

8-2 Samsung Electronics
MEMO

Internal Block Diagram of Main IC
Samsung Electronics 9-1
9. Internal Block Diagram of Main IC
9-1 MAS3519