Samsung SGH x495 - Cell Phone - T-Mobile User manual

GSMTELEPHONE
SGH-X495
GSMTELEPHONECONTENTS
1.Specification
2.Circuit Description
3. ExplodedViews and PartsList
4. ElectricalPartsList
5.BlockDiagrams
6.PCB Diagrams
7. FlowChartofTroubleshooting

Samsung ElectronicsCo.,Ltd.June.2005
Printedin Korea.
CodeNo.:GH68-07423A
BASIC.
T
hisServiceManual isa propertyofSamsung ElectronicsCo.,Ltd.
A
nyunauthorized use ofManualcan bepunished underapplicable
I
nternationaland/ordomesticlaw.
ⓒ

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1. Specification
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1-1
GSM850
Phase1DCS1800 Phase1PC1900 Phase1
Freq.Band[MHz]
Uplink/Downlink 824~849 869~894 1710~1785 1805~1880 1850~1910 1930~1990
ARFCNrange128~251 512~885 512~810
Tx/Rxspacing 45MHz95MHz80MHz
Mod.Bit rate/
Bit Period 270.833kbps 3.692us270.833kbps 3.692us270.833kbps 3.692us
TimeSlot
Period/FramePeriod 576.9us 4.615ms576.9us 4.615ms576.9us 4.615ms
Modulation 0.3GMSK0.3GMSK0.3GMSK
MS Power33dBm~5dBm30dBm~0dBm30dBm~0dBm
PowerClass 5pcl~19pcl0pcl~15pcl0pcl~15pcl
Sensitivity-102dBm-100dBm-100dBm
TDMAMux 8 8 8
Cell Radius35Km2Km2Km
1-1.GSMGeneralSpecification

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Specification
1-2
TXPower
control levelGSM850
5 33±2 dBm
6 31±2 dBm
7 29±2 dBm
8 27±2 dBm
9 25±2 dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3dBm
18 7±3 dBm
19 5±3 dBm
TXPower
control levelDCS1800
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
1-2.GSMTXpowerclass
TXPower
control levelPCS1900
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm

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2. Circuit Description
2-1
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2-1.SGH-X495 RFCircuitDescription
2-1-1.RX PART
-ASM(U100)→Switching Tx,Rx pathforGSM850,DCS1800,PCS1900 by logic controlling.
-ASMControlLogic(U100)→TruthTable
VC1VC2VC3
TxMode(GSM850)HL L
TxMode(DCS1800/1900)LHL
RxMode(GSM850)L L L
RxMode(DCS1800)L L L
RxMode(PCS1900)L L H
-FILTER
ToconvertElectromagneticFieldWavetoAcousticWave and then pass thespecificfrequency band.
-GSMFILTER(F101)→For filtering thefrequency band between 869 and 894 MHz
-DCS FILTER(F102)→For filtering thefrequency band between 1805 and 1880 MHz.
-PCS FILTER(F100)→For filtering thefrequency band between 1930 and 1990 MHz.
-VC-TCXO (OSC101)
Thismodulegeneratesthe26MHzreference clockto drivethelogic and RF.Afterdivision by twoareference clock of
13MHzis suppliedtotheotherpartsofthesystemthrough thepinCLKOUT.Afteradditionalprocess,thereference
clockappliestotheU100 RxIQdemodulatorand TxIQmodulator.And then,theoscillatoriscontrolled by serialdata
toselectchanneland usefast lockmodeforGPRShigh class operation.
-Transceiver (U101)
Thereceiver front-end whichamplifiestheGSM,DCSaerialsignal,convertsthe chosenchanneldowntoalowIFsignal
of100 kHz.Thefirststagesaresymmetrical lownoise amplifiers(LNAs).TheLNAsarefollowed by anIQdownmixer.
Itconsistsoftwomixersin parallelbutdriven by quadratureoutofphaseLOsignals.TheIn phase(I) and Quadrature
phase(Q) IFsignalsarelowpass filteredto provideprotection fromhigh frequency offset interferes.ThelowIFIand Q
signalsarethenfedintothe channelfilter.Thefront-end lowIFIand Qoutputsentertheintegrated bandpass channel
filterwith provision for five8 dBgainstepsinfrontofthefilter.
2-1-2.TX PART
Iand Qbaseband signalsare appliedtotheIQmodulatorthatshiftsthemodulation spectrumup tothetransmit IF.It is
designedforlowharmonicdistortion,lowcarrierleakage and high imagerejection to keepthephase erroras small as
possible.

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CircuitDescription
2-2
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Themodulatorisloadedat itsIFoutputby anintegratedlowpass filterthatsuppress unwantedspurspriorto get into
thephasedetector.The clock driveisgenerated by division oftheRFLOsignalprovidedforthetransmit offsetmixer.
Baseband IQsignalfedinto offsetPLL,thisfunction isincludedinsideofU101 chip.OSC100 chip generatesmodulator
signalwhich powerlevel isabout6.5dBmand fedintoPowerAmplifier(U102).ThePAoutputpowerand power ramping
arewell controlled by AutoPowerControlcircuit.WeuseoffsetPLL belowtable.
Modulation Spectrum
200kHzoffset
30 kHzbandwidth
GSM-35dBc
DCS-35dBc
400kHzoffset
30 kHzbandwidth
GSM-66dBc
DCS-65dBc
600kHz~1.8MHzoffset
30 kHzbandwidth
GSM-75dBc
DCS-68dBc
2-2.Baseband Circuitdescription ofSGH-X495
2-2-1.PCF50601
-PowerManagement
Tenlow-dropoutregulatorsdesignedspecificallyforGSMapplicationspowertheterminaland helpensureoptimalsystem
performance and long batterylife.Aprogrammableboostconverterprovides supportfor1.8V,3.0VSIMs,while a self-
resetting,electronicallyfusedswitchsuppliespowertoexternalaccessories.Ancillarysupportfunctions,suchasRTC
module and High VoltageChargepump,Clock generator,aidinreducing both boardarea and systemcomplexity.
I2C BUSserial interface providesaccess tocontroland configuration registers.Thisinterface givesamicroprocessor full
controlofthePCF50601 and enables systemdesignerstomaximize bothstandby and talktimes.
Supervisoryfunctions.including aresetgenerator,aninputvoltagemonitor,and atemperaturesensor,supportreliable
systemdesign.Thesefunctionsworktogethertoensurepropersystembehaviorduring start-up orinthe eventofafault
condition(lowmicroprocessorvoltage,insufficientbatteryenergy,orexcessivedietemperature).
-BacklightBrightness Modulator
TheBacklightBrightness Modulator(BBM)containsaprogrammablePulse-widthmodulator (PWM)and FET
tomodulatetheintensity ofaseriesofLED?sortocontrolaDC/DCconverterthatdrivesLCDbacklight.
Thisphone(SGH-X495)usePWMcontrol tocontrast thebacklightbrightness.
-ClockGenerator
TheClockGenerator(CG)generatesall clocksforinternaland externalusage.The32768 Hzcrystal
oscillatorprovidesanaccuratelowclockfrequencyfor thePCF50601 andothercircuitry.

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CircuitDescription
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2-2-2.LCD Connector
LCDisconsisted ofmainLCD(color65K UFBLCD)and sub LCD(B/WLCD).
ChipselectsignalsLCD_MAIN_CSand LCD_SUB_CS,canenableEachLCD.BACKLIGHTsignalenableswhiteLED
ofmainLCD."LCD_RESET"signal initiatestheresetprocess oftheLCD.
16-bit datalines(HD(0)~HD(15)) transfersdata and commandstoLCD.Data and commandsuse"HA(1)"signal.If this
signal islow,inputstoLCDare commands.If it ishigh,inputstoLCDaredata.
ThesignalwhichinformsthestateofLCDiswhetherinputoroutput,isrequired.But inthis system,thereisno input
statefromLCD.So only"HA(1)"signal isusedtoindicatewritedataorcommand toLCD.PowersignalsforLCDare
"VBATand "VDD3".
"SPK_P"and "SPK_N"areusedforaudiospeakercontaining voice ormelody.And "VDD_VIB"fromPCF50601
enablesthemotor.
2-2-3.Key
Thisisconsisted ofkeyinterface pinsamong OM6359,KBIO(0:7).Thesesignalscomposethematrix.Result ofmatrix
informsthekeystatusto keyinterface intheOM6359.Poweron/off keyis separatedfromthematrix.So poweron/off
signal isconnectedwithPCF50601 toenablePCF50601.TwelvekeyLEDsareusethe"VDD_KEY"as supply voltage.
"FLIP"informsthestatusof folder (open orclosed)totheOM6359.Thisusesthehall effectIC,A321ELH-SAMSUNG.
AmagnetundermainLCDenablesA321ELH-SAMSUNG.
2-2-4.EMIESDFilter
This systemusestheEMIESDfilter,EMIF09 to protectnoisefromIFCONNECTORpart.
2-2-5. IFconnetor
It is18-pinconnector.Theyaredesignedto useVBAT,V_EXT_CHARGE,TXD0,RXD0,RTS0,CTS0,JIG_REC,
CHARGER_OK,RXD1,TXD1,AUX_MIC,AUX_SPKand GND.Theyconnectedto powersupplyIC,microprocessor
and signalprocessor IC.
2-2-6.BatteryCharge Management
Acompleteconstant-current/constant-voltagelinearchargerisused forsinglecell lithium-ionbatteries.
IfTAconnected tophone,"+DCVOLT"enablechargerICandsupplycurrent tobattery.
Whenfaultconditioncaused,"CHG_ON"signal levelchangelowtohighandchargerICstopcharging
process.
2-2-7.Audio
EARP_Pand EARP_NfromOM6359 are connectedtothemainspeaker.MIC_Pand MIC_Nare connectedtothemain
MIC.YMU788 isasynthesizerLSI formobilephones.It isaLSIasaninput/outputdevice forsound sources,whichis
themobilephones,suchasMP3,AAC,etc,inaddition toringing-melodies.
Asasynthesis,YMU788 isequipped 32 voiceswith different tones.Since thedevice iscapableofsimultaneously
generating up tosynchronouswiththeplay oftheFMsynthesizer,various sampled voicescan beusedas sound effects.
Since theplay dataofYMU788 areinterpretedatanytimethrough FIFO,thelength ofthedata(playing period)isnot
limited,sothedevice canflexiblysupportapplication suchasincoming call melody musicdistribution service.

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CircuitDescription
2-4
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Thehardwaresequencerbuilt inthisdevice allowsplaying ofthe complexmusicwithoutgiving excessiveloadtothe
CPUoftheportabletelephones.
Forthepurposeofenabling YMU788 to demonstrateitsfull capabilities,Yamahapurposeto use"SMAF:Syntheticmusic
MobileApplication Format"asadatadistribution format that iscompatiblewithmultimedia.Since theSMAFtakesa
structurethatsetsimportance on thesynchronization betweensound and images,variouscontentscan bewrittenintoit
including incoming call melody withwordsthatcan beusedfortraining karaoke,and commercialchannel thatcombines
texts,imagesand sounds,and others.ThehardwaresequencerofYMU788 directlyinterpretsand playsblocksrelevant to
synthesis(playing music and reproducing ADPCMwithFMsynthesizer) thatareincludedin datadistributedinSMAF.
2-2-8.Memory
SignalsintheOM6359 enabletwomemories.They usetwo volt supply voltage,VDD3inthePCF50601 &VDD_1.9V
withaLDO.This systemusesIntel'smemory,RD38F3050LOZTQ0.It isconsisted of128MbitsflashNORmemoryand
64MbitsSRAM.Ithas16 bit dataline,HD[0~15]whichisconnectedtoOM6359.Ithas26 bit address lines,
HA[1~26].NCSFLASH&NCSRAMsignalsare chipselect.Writing process,HWR_Nislowand it enableswriting
process toflashmemoryand SRAM.During reading process,HRD_Nislowand it enablesreading process toflash
memoryand SRAM.Reading orwriting procedureisprocessedafterHWR_NorHRD_Nisenabled.
2-2-9. OM6359
OM6359 isconsisted ofARMcore and DSP core.Ithas8x1Kwordon-chip program/dataRAM,55 Kwords
on-chip programROMintheDSP.Ithas4K*32bitsROMand 2K*32bitsRAMintheARMcore.DSP isconsisted
ofKBS,JTAG,EMIand UART.ARMcoreisconsisted ofEMI,PIC(ProgrammableInterruptController),
reset/power/clock unit,DMAcontroller,TIC(TestInterface Controller),peripheralbridge,PPI,SSI(SynchronousSerial
Interface),ACC(Asynchronouscommunicationscontrollers),timer,ADC,RTC(Real-TimeClock)and keyboardinterface.
KBIO(0:7),address linesofDSP core and HD[0~15].HA[1~26],address linesofARMcore and HD[0~15],datalinesof
ARMcore are connectedtomemory,YMU788.
NCSRAM,NCSFLASHintheARMcore are connectedtoeachmemory.HWR_Nand HRD_Ncontrol theprocess of
memory.ExternalIRQ(InterruptReQuest)signalsfromeach units,suchas,PMUneedthe compatibleprocess.
KBIO[0~7] receivethestatusfromkeyand RXD0/TXD0areusedforthe communication using datalink
cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR).
Ithas JTAG controlpins(TDI/TDO/TCK) forARMcore and DSP core.Itreceives13MHz clockinCKIpinfrom
externalTCXO.ADC(Analog toDigitalConvertor) partreceivesthestatusoftemperature,batterytype and battery voltage.
2-2-10.TOH2600DGI4KRA(26MHz)
This systemusesthe26MHzTCXO,TOH2600DGI4KRA,SEM.AFCcontrolsignalfromOM6359 controlsfrequency
from26MHzx-tal.The clock outputfrequency ofUAA3536 is13MHz.ThisclockisconnectedtoOM6359,YMU788.

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3.Exploded View and Parts List
3-1
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3-1. Exploded View
QIF01
QFR01
QSC14
QMP01
QKP01
QVO01
QME01
QAN02
QRE01
QCR11
QRF03
QMI01
QBA01
QFU01
QSP01
QMO01
QLC01
QFL01
QMW02
QSC01
QCR17
QRF01
QVK01

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Exploded view and PartList
3-2
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Location NO. Description SEC CODE
QAN02
ㅤ
INTENNA-SGHX495;IAPT0GDP4020HA,SGH-X GH42-00574A
QBA01
ㅤ
BATTERY-1000MAH,SIL,MAIN;BST471ASA,S GH43-01788A
QCR11
ㅤ
SCREW-MACHINE;PH,+,M1.7,L4,ZPC(BLK), 6001-001654
QCR17
ㅤ
SCREW-MACHINE;CH,+,M1.7,L5,ZPC(BLK), 6001-001639
QFL01
ㅤ
MEC-FOLDER LOWER;SGH-X495,EU,-,-,-,- GH75-06454A
QFR01
ㅤ
MEC-FRONT COVER;SGH-X495,EU,-,-,-,-, GH75-06966B
QFU01
ㅤ
MEC-FOLDER UPPER;SGH-X495,T-MOBILE,- GH75-06471B
QKP01
ㅤ
MEC-KEYPAD;SGH-X495,T-MOBILE,-,-,-,- GH75-06617A
QLC01
ㅤ
LCD-SGH-X497 MODULE;UG-12R168-C,SGH- GH07-00763A
QME01
ㅤ
UNIT-METAL DOME;SGH-X497,SSM5017P850 GH59-02046A
QMI01
ㅤ
MICROPHONE-ASSY-SGHX497;2,130~500uA, GH30-00198A
QMO01
ㅤ
MOTOR DC-SGHZ130;DMJBRK20C,SGH-Z130, GH31-00154D
QMP01
ㅤ
PBA MAIN-SGHX495;SGH-X495,TMB,USA,PB GH92-02214A
QMW02
ㅤ
PCT-WINDOW MAIN;SGH-X495,ACRYLIC SHE GH72-19918B
QRF01
ㅤ
MPR-RF SHEET;SGH-X495,PC SHEET 0.3T, GH74-14435C
QSC01
ㅤ
MPR-SCREW SHEET;SGH-X495,PC SHEET 0. GH74-13610B
QSC14
ㅤ
MPR-TAPE FRONT FPC;SGH-E330,3M 1352 GH74-08876A
QSP01
ㅤ
SPEAKER;0.5W,8ohm,89dB,800Hz,17X13mm 3001-001779
QVK01
ㅤ
UNIT-VOLUME KEY;SGH-X497,SSV5017P860 GH59-02053A
QVO01
ㅤ
MEC-VOLUME KEY;SGH-X495,T-MOBILE,-,- GH75-07274B
QRE01
ㅤ
MEC-REAR COVER;SGH-X495,USA,-,-,-,-, GH75-06959B
ㅤ
QRF03 PMO-EAR COVER;SGH-X495,PC W91543+ELA GH72-23535B
ㅤ
QIF01 PMO-IF COVER;SGH-X495,PC G73797+ELAS GH72-23556B
ㅤ
QMI03 RMO-RUBBER MIC REAR;SGH-X497,CR RUBB GH73-04847A
3-2. Parts List

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Description SEC CODE
BAG PE;LDPE,T0.05,W120,L300,TRP,-,- 6902-000296
BAG PE;LDPE,T0.05,W80,L140,TRP,-,-1- 6902-000297
BAG PP;PP,T0.05,W140,L300,TRP,-,-1-P 6902-000377
LCD-SGHX497 MAIN;UG-12R168-B,SGH-X49 GH07-00707A
LCD-SGHX497 SUB;UG-09B125-A,SGH-X497 GH07-00708A
ADAPTOR-SGHR225 TAD;TAD037JBE,SGH-R2 GH44-00184G
UNIT-AWB SIM CARD;SGH-X105,87444394, GH59-00943A
UNIT-EARPHONE;SGH-X475,AEP131SLE,-,E GH59-01700A
LABEL(R)-WATER SOAK T_MOBILE;COMM,-, GH68-05914A
LABEL(R)-T_MOBILE GUIDE;SGH-X475,-,M GH68-06581A
LABEL(R)-MAIN(TMB);SGH-X495,TMB,POLY GH68-06971A
MANUAL-USER;SGH-X495,TMB,ENGLISH,USA GH68-06976A
MANUAL-USER;SGH-X495,TMB,SPANISH,USA GH68-06977A
MANUAL-AGC GUIDE;SGH-X495,TMB,ENGLIS GH68-06978A
MANUAL-ACTIVATION CARD;SGH-X495,TMB, GH68-07399A
LABEL-DR;SGH-X495,-,PE,T1.5,45,11,SI GH68-07547A
LABEL-RF;SGH-X495,-,ART,T0.2,42,38,S GH68-07548A
LABEL(R)-UNIT IMEI(TMB);SGH-X495,TMB GH68-07687A
CUSHION-SGHX495(UNIT CLAM);SGH-X495, GH69-03058A
CUSHION-SGHX495(UP CLAM);SGH-X495,HI GH69-03059A
CUSHION-SGHX495(LOW CLAM);SGH-X495,H GH69-03060A
BOX(P)-SGHX495(IN/BOX_WALL);SGH-X495 GH69-03076B
BOX(P)-SGHX495(CLAM_MASTER);SGH-X495 GH69-03130A
BOX(P)-SGHX495(PATTION);SGH-X495,SC3 GH69-03132A
PMO-BATT LOCKER;SGH-X495,PC K2261,BL GH72-19954B
PCT-WINDOW SUB;SGH-X495,ACRYIC SHEET GH72-19964A
PMO-STOPPER;SGH-X495,POLY URETHANE,W GH72-21517B
RMO-RUBBER TOP LCD A;SGH-X495,CR RUB GH73-04923A
RMO-RUBBER TOP LCD B;SGH-X495,CR RUB GH73-04924A
MPR-BOHO VINYL SUB(S-R);SGH-X495,STA GH74-03429B
MPR-BOHO VINYL REAR;SGH-S342i,3M 418 GH74-12905A
MPR-TAPE WINDOW SUB;SGH-X495,TESA #4 GH74-13223A
MPR-BOHO VINYL IF;SGH-E720,#950,85X1 GH74-13606A
MPR-TAPE WINDOW MAIN;SGH-X495,3M 949 GH74-13608A
MPR-BOHO VINYL MAIN;SGH-X495,3M 4187 GH74-14431A
MPR-BOHO VINYL MAIN(S);SGH-X497,SP-1 GH74-14431B
MPR-BOHO VINYL SUB;SGH-X495,ST-5555, GH74-14432A
MPR-TAPE EL;SPH-B1200,3M 851,5X3.5XT GH74-14881A
MPR-TAPE PBA EMI;SGH-X495,GOLD PU T0 GH74-15484A
MPR-BOHO VINYL M/TMB(S);SGH-X495,STA GH74-15517B
MPR-SPONGE MOTOR;SGH-X495,SRS,D8XT0. GH74-15610A
MPR-SPONGE PBA;SGH-X495,SRS,38X64XT5 GH74-15911A
MPR-TAPE PBA A;SGH-X495,3M851,3X2XT0 GH74-16066A
MPR-BOHO VINYL SUB;SGH-X495,ST-5555, GH74-17302A
AS-LCD PCB SVC;SGH-X497,LJ96-02137A, GH81-01219A
A/S-LCD FPCB SVC;SGH-X497,POLYMIDE,2 GH81-01956A
PAA ETC-MANUAL;SGH-X495,TMB,USA,MANU GH99-10352A

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Exploded view and PartList
3-4
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3-3. Test Jig (GH80-01909A)
3-3-1. RF Test Cable
(GH39-00283A) 3-3-2. Test Cable (GH39-00217A) 3-3-3. Serial Cable
3-3-4. Power Supply Cable 3-3-5. DATA CABLE
(GH39-00219A) 3-3-6. TA (GH44-00184G)

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4. Electrical Parts List
4-1
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Design LOC Description SEC CODE
BAT300 BATTERY 4302-001180
C101 C-CERAMIC,CHIP 2203-000278
C102 C-CERAMIC,CHIP 2203-000812
C103 C-CERAMIC,CHIP 2203-000854
C104 C-CERAMIC,CHIP 2203-000854
C105 C-CERAMIC,CHIP 2203-000278
C106 C-CERAMIC,CHIP 2203-000278
C107 C-CERAMIC,CHIP 2203-000854
C108 C-CERAMIC,CHIP 2203-005057
C109 C-CERAMIC,CHIP 2203-005482
C110 C-CERAMIC,CHIP 2203-005057
C111 C-CERAMIC,CHIP 2203-005482
C112 C-CERAMIC,CHIP 2203-000233
C113 C-CERAMIC,CHIP 2203-000233
C114 C-CERAMIC,CHIP 2203-005482
C115 C-CERAMIC,CHIP 2203-005057
C116 C-CERAMIC,CHIP 2203-005138
C117 C-CERAMIC,CHIP 2203-001383
C118 C-CERAMIC,CHIP 2203-000359
C119 C-CERAMIC,CHIP 2203-000696
C120 C-CERAMIC,CHIP 2203-000836
C121 C-CERAMIC,CHIP 2203-001101
C122 C-CERAMIC,CHIP 2203-005482
C123 C-CERAMIC,CHIP 2203-005057
C124 C-CERAMIC,CHIP 2203-006053
C125 C-CERAMIC,CHIP 2203-000438
C126 C-CERAMIC,CHIP 2203-000233
C127 C-TA,CHIP 2404-001239
C128 C-CERAMIC,CHIP 2203-006141
C129 C-CERAMIC,CHIP 2203-000438
C130 C-CERAMIC,CHIP 2203-006190
C132 C-CERAMIC,CHIP 2203-005503
C133 C-CERAMIC,CHIP 2203-000311
C134 C-CERAMIC,CHIP 2203-000233
C135 C-CERAMIC,CHIP 2203-000254
C136 C-CERAMIC,CHIP 2203-001153
C137 C-CERAMIC,CHIP 2203-000550

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Electrical Parts List
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Design LOC Description SEC CODE
C138 C-CERAMIC,CHIP 2203-006137
C139 C-CERAMIC,CHIP 2203-005482
C140 C-CERAMIC,CHIP 2203-000679
C141 C-CERAMIC,CHIP 2203-005482
C142 C-CERAMIC,CHIP 2203-005057
C143 C-CERAMIC,CHIP 2203-000233
C144 C-CERAMIC,CHIP 2203-000254
C145 C-CERAMIC,CHIP 2203-000438
C146 C-CERAMIC,CHIP 2203-000438
C147 C-CERAMIC,CHIP 2203-000438
C152 C-CERAMIC,CHIP 2203-000278
C153 C-CERAMIC,CHIP 2203-000278
C154 C-CERAMIC,CHIP 2203-000995
C155 C-CERAMIC,CHIP 2203-000995
C156 C-CERAMIC,CHIP 2203-000438
C157 C-CERAMIC,CHIP 2203-001239
C158 C-CERAMIC,CHIP 2203-001239
C200 C-CERAMIC,CHIP 2203-005061
C203 C-CERAMIC,CHIP 2203-005061
C204 C-CERAMIC,CHIP 2203-000254
C206 C-CERAMIC,CHIP 2203-005061
C207 C-CERAMIC,CHIP 2203-000254
C208 C-CERAMIC,CHIP 2203-000254
C210 C-CERAMIC,CHIP 2203-006423
C212 C-CERAMIC,CHIP 2203-005061
C213 C-CERAMIC,CHIP 2203-005482
C214 C-CERAMIC,CHIP 2203-000854
C215 C-CERAMIC,CHIP 2203-006423
C216 C-CERAMIC,CHIP 2203-000854
C218 C-CERAMIC,CHIP 2203-005061
C219 C-CERAMIC,CHIP 2203-005482
C220 C-CERAMIC,CHIP 2203-000254
C221 C-CERAMIC,CHIP 2203-006423
C222 C-CERAMIC,CHIP 2203-006423
C223 C-CERAMIC,CHIP 2203-005482
C224 C-CERAMIC,CHIP 2203-000438
C225 C-CERAMIC,CHIP 2203-005482

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Electrical Parts List
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This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
C300 C-CERAMIC,CHIP 2203-005482
C301 C-CERAMIC,CHIP 2203-006105
C302 C-CERAMIC,CHIP 2203-005482
C304 C-TA,CHIP 2404-001394
C305 C-CERAMIC,CHIP 2203-005482
C306 C-CERAMIC,CHIP 2203-005482
C307 C-TA,CHIP 2404-001374
C308 C-CERAMIC,CHIP 2203-006257
C309 C-CERAMIC,CHIP 2203-005482
C310 C-CERAMIC,CHIP 2203-006208
C311 C-TA,CHIP 2404-001225
C312 C-CERAMIC,CHIP 2203-005395
C313 C-CERAMIC,CHIP 2203-000386
C314 C-CERAMIC,CHIP 2203-005482
C315 C-CERAMIC,CHIP 2203-006257
C316 C-CERAMIC,CHIP 2203-000628
C317 C-CERAMIC,CHIP 2203-006562
C318 C-CERAMIC,CHIP 2203-000628
C319 C-CERAMIC,CHIP 2203-006562
C320 C-CERAMIC,CHIP 2203-006053
C321 C-CERAMIC,CHIP 2203-000885
C322 C-CERAMIC,CHIP 2203-006208
C323 C-CERAMIC,CHIP 2203-006324
C324 C-CERAMIC,CHIP 2203-000812
C325 C-CERAMIC,CHIP 2203-005065
C326 C-TA,CHIP 2404-001225
C327 C-TA,CHIP 2404-001225
C328 C-CERAMIC,CHIP 2203-005482
C329 C-CERAMIC,CHIP 2203-005482
C330 C-CERAMIC,CHIP 2203-005482
C332 C-CERAMIC,CHIP 2203-006257
C333 C-CERAMIC,CHIP 2203-006562
C334 C-CERAMIC,CHIP 2203-006208
C335 C-CERAMIC,CHIP 2203-006208
C336 C-CERAMIC,CHIP 2203-000679
C337 C-CERAMIC,CHIP 2203-006053
C338 C-CERAMIC,CHIP 2203-006208

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This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
C339 C-CERAMIC,CHIP 2203-006208
C340 C-CERAMIC,CHIP 2203-006053
C400 C-TA,CHIP 2404-001348
C401 C-CERAMIC,CHIP 2203-000995
C402 C-CERAMIC,CHIP 2203-005482
C403 C-CERAMIC,CHIP 2203-005061
C404 C-CERAMIC,CHIP 2203-006562
C406 C-CERAMIC,CHIP 2203-000278
C407 C-CERAMIC,CHIP 2203-000679
C408 C-CERAMIC,CHIP 2203-005482
C409 C-CERAMIC,CHIP 2203-005061
C410 C-CERAMIC,CHIP 2203-005736
C411 C-CERAMIC,CHIP 2203-000679
C412 C-CERAMIC,CHIP 2203-005482
C413 C-CERAMIC,CHIP 2203-000679
C415 C-CERAMIC,CHIP 2203-000489
C416 C-CERAMIC,CHIP 2203-000679
C418 C-CERAMIC,CHIP 2203-000278
C419 C-CERAMIC,CHIP 2203-006423
C420 C-CERAMIC,CHIP 2203-005736
C421 C-CERAMIC,CHIP 2203-000885
C422 C-CERAMIC,CHIP 2203-000254
C423 C-CERAMIC,CHIP 2203-001153
C424 C-CERAMIC,CHIP 2203-005483
C425 C-CERAMIC,CHIP 2203-005483
C426 C-CERAMIC,CHIP 2203-006562
C429 C-CERAMIC,CHIP 2203-000995
C430 C-CERAMIC,CHIP 2203-000995
C433 C-CERAMIC,CHIP 2203-006562
C435 C-CERAMIC,CHIP 2203-000995
C437 C-CERAMIC,CHIP 2203-006053
C438 C-CERAMIC,CHIP 2203-005482
C439 C-TA,CHIP 2404-001352
C501 C-CERAMIC,CHIP 2203-002443
C502 C-CERAMIC,CHIP 2203-005482
C503 C-CERAMIC,CHIP 2203-005482
C504 C-CERAMIC,CHIP 2203-000278

SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
4-5
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
C505 C-CERAMIC,CHIP 2203-000679
C507 C-CERAMIC,CHIP 2203-000995
C508 C-CERAMIC,CHIP 2203-000278
C509 C-CERAMIC,CHIP 2203-000995
C510 C-CERAMIC,CHIP 2203-000995
C511 C-CERAMIC,CHIP 2203-000278
C513 C-CERAMIC,CHIP 2203-006562
C514 C-CERAMIC,CHIP 2203-006562
C515 C-CERAMIC,CHIP 2203-006562
CN300 CONNECTOR-CARD EDGE 3709-001355
CN502 CONNECTOR-SOCKET 3710-001611
CN503 CONNECTOR-HEADER 3711-005783
CON101 CONNECTOR-COAXIAL 3705-001358
EAR400 JACK-PHONE [phone]
F100 FILTER-SAW 2904-001571
F101 FILTER-SAW 2904-001580
F102 FILTER-SAW 2904-001570
HEA1 CONNECTOR-HEADER 3711-005728
L101 INDUCTOR-SMD 2703-002207
L102 INDUCTOR-SMD 2703-002199
L103 INDUCTOR-SMD 2703-002207
L104 INDUCTOR-SMD 2703-002203
L105 INDUCTOR-SMD 2703-002700
L106 INDUCTOR-SMD 2703-001726
L107 INDUCTOR-SMD 2703-002308
L108 INDUCTOR-SMD 2703-002700
L109 INDUCTOR-SMD 2703-002308
L110 INDUCTOR-SMD 2703-002308
L111 INDUCTOR-SMD 2703-002199
L112 INDUCTOR-SMD 2703-002368
L113 INDUCTOR-SMD 2703-002201
L114 INDUCTOR-SMD 2703-002368
L115 INDUCTOR-SMD 2703-002203
L116 INDUCTOR-SMD 2703-002368
L117 INDUCTOR-SMD 2703-001708
L300 CORE-FERRITE BEAD 3301-001105
L400 CORE-FERRITE BEAD 3301-001362

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This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
L401 CORE-FERRITE BEAD 3301-001362
L402 CORE-FERRITE BEAD 3301-001105
L403 CORE-FERRITE BEAD 3301-001105
L501 CORE-FERRITE BEAD 3301-001438
LED501 LED 0601-001790
LED502 LED 0601-001790
LED503 LED 0601-001790
LED504 LED 0601-001790
LED505 LED 0601-001790
LED506 LED 0601-001790
LED507 LED 0601-001790
LED508 LED 0601-001790
LED509 LED 0601-001790
LED510 LED 0601-001790
LED511 LED 0601-001790
LED512 LED 0601-001790
OSC100 OSCILLATOR-VCO 2806-001326
OSC101 OSCILLATOR-VCTCXO 2809-001281
Q100 TR-DIGITAL 0504-001151
R101 R-CHIP 2007-000162
R102 R-CHIP 2007-000162
R103 R-CHIP 2007-000162
R104 R-CHIP 2007-007148
R105 R-CHIP 2007-000141
R106 R-CHIP 2007-007528
R107 R-CHIP 2007-001288
R108 R-CHIP 2007-000171
R109 R-CHIP 2007-001329
R110 R-CHIP 2007-000144
R111 R-CHIP 2007-001308
R112 R-CHIP 2007-001308
R113 R-CHIP 2007-000566
R114 R-CHIP 2007-000148
R115 R-CHIP 2007-001288
R116 R-CHIP 2007-007311
R117 R-CHIP 2007-000566
R118 R-CHIP 2007-007699

SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
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This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
R119 R-CHIP 2007-007699
R120 R-CHIP 2007-001308
R121 R-CHIP 2007-001308
R122 R-CHIP 2007-000171
R123 R-CHIP 2007-000171
R125 R-CHIP 2007-008672
R126 R-CHIP 2007-001308
R127 R-CHIP 2007-000142
R128 R-CHIP 2007-000148
R129 R-CHIP 2007-000138
R130 R-CHIP 2007-008213
R131 R-CHIP 2007-008213
R132 R-CHIP 2007-008213
R133 R-CHIP 2007-008213
R134 R-CHIP 2007-000140
R135 R-CHIP 2007-000140
R136 R-CHIP 2007-000171
R200 R-CHIP 2007-000174
R201 R-CHIP 2007-008055
R204 R-CHIP 2007-000162
R205 R-CHIP 2007-008055
R206 R-CHIP 2007-008055
R207 R-CHIP 2007-008055
R208 R-CHIP 2007-008052
R209 R-CHIP 2007-008516
R210 R-CHIP 2007-008055
R211 R-CHIP 2007-007107
R212 R-CHIP 2007-007142
R213 R-CHIP 2007-007001
R214 R-CHIP 2007-007142
R215 R-CHIP 2007-001284
R216 R-CHIP 2007-000148
R217 R-CHIP 2007-001284
R218 R-CHIP 2007-000162
R219 R-CHIP 2007-000162
R220 R-CHIP 2007-007107
R221 R-CHIP 2007-007001

SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
4-8
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
R222 R-CHIP 2007-000171
R223 R-CHIP 2007-008588
R224 R-CHIP 2007-008588
R225 R-CHIP 2007-008542
R227 R-CHIP 2007-008542
R228 R-CHIP 2007-008542
R300 R-CHIP 2007-000157
R301 R-CHIP 2007-000148
R302 R-CHIP 2007-007573
R303 R-CHIP 2007-007334
R304 R-CHIP 2007-008117
R305 R-CHIP 2007-000151
R306 R-CHIP 2007-007100
R400 R-CHIP 2007-002796
R401 R-CHIP 2007-000140
R402 R-CHIP 2007-000148
R403 R-CHIP 2007-008054
R404 R-CHIP 2007-000140
R405 R-CHIP 2007-008542
R406 R-CHIP 2007-008055
R407 R-CHIP 2007-002796
R408 R-CHIP 2007-008055
R409 R-CHIP 2007-007334
R410 R-CHIP 2007-001313
R411 R-CHIP 2007-008542
R412 R-CHIP 2007-007334
R413 R-CHIP 2007-007589
R414 R-CHIP 2007-007138
R415 R-CHIP 2007-007981
R416 R-CHIP 2007-007529
R417 R-CHIP 2007-007489
R418 R-CHIP 2007-000138
R422 R-CHIP 2007-000138
R424 R-CHIP 2007-008542
R500 R-CHIP 2007-000162
R501 R-CHIP 2007-008055
R502 R-CHIP 2007-008531