Siemens PEGASUS-DTC AX72 User manual

Release 1.1
Technical Documentation 01/2006
TD_Repair_L1-L3_AX72_R1.1.pdf Page 1 of 41
Service Manual
AX72
Level 1- Level 3 (basic)
Release Date Department Notes to change
R1.0 16.11.2005 BenQ Mobile CC S CES New document
R1.1 05.01.2006 BenQ Mobile CC S CES Part Modification
Company Confidential
2006©BenQ

Release 1.1
Technical Documentation 01/2006
TD_Repair_L1-L3_AX72_R1.1.pdf Page 2 of 41
Table of Content
1Key Feature................................................................................................................................3
2AX72 Interface to Accessories.................................................................................................5
3Unit Description of AX72 ..........................................................................................................5
4Exploded View of AX72.............................................................................................................6
5Disassembly of AX72................................................................................................................7
6Assembly of AX72...................................................................................................................12
7BenQ Service Equipment User Manual.................................................................................13
8GRT Software: Functionality Configuration........................................................................14
9GRT Software: Regular Usage ...............................................................................................16
9JPICS (Java based Product Information Controlling System)............................................21
9International Mobile Equipment Identity, IMEI......................................................................27
10 General Testing Information...................................................................................................28
11 Introduction of Service Repair Documentation Level 3 – AX72..........................................34
12 List of available level 3 spare parts.......................................................................................35
13 Hardware requirements ..........................................................................................................35
14 AX72 Board layout ..................................................................................................................36
15 SIM Card Problems .................................................................................................................37
16 IO Connector Problems ..........................................................................................................38
17 LED_Keypad illumination Problems......................................................................................39
18 Battery Connector Problems..................................................................................................40
19 Display Problems ....................................................................................................................41
Company Confidential
2006©BenQ

Release 1.1
Technical Documentation 01/2006
TD_Repair_L1-L3_AX72_R1.1.pdf Page 3 of 41
1 Key Feature
Bands • Triple Band E-GSM 900 / GSM 1800 / GSM 1900
• EGSM Phase 2 / phase 2+
• GPRS Multi Class 8
Battery • Li-Ion Battery Pack
• Nominal Voltage : 3.7V
• Nominal Capacity : 600 mAh
• GSM Capacity: 580 mAh
• Power Input: 2.0 A (0.6 ms) / 0.25 A (0.4 ms)
• Cut-off Threshold 3.2 V
Stand-by Time • up to 220 h (standard battery)
Talk Time • up to 300 min (standard battery)
SIM Card • Small (”Plug In”) 3V SIM card (Phase II)
• To insert the SIM card, the battery pack must be
removed.
GSM Antenna • Integrated triple band antenna for EMEA/APAC.
Dimensions • 101 x 44 x 20 mm (L x W x H)
Weight • Approx. 80 g
Charging time • < 2 h for 100%
Receiver Sensitivity • GSM 900: -102dBm (Specification, static & with fading)
• GSM 1800/1900: -102 dBm (Specification, static & with
fading)
Receiver sensitivity must comply with the corresponding GSM
recommendations in all operating conditions (temperature,
battery level, etc)
Transmitter Power • GSM 900: nominal 2W (Specification: Class 4 Mobile
phone)
• GSM 1800/1900: nominal 1W (Specification: Class 1
Mobile phone)
Transmitter output characteristics is according to GSM 11.10
specification implying all specified operating conditions
(temperature, battery level ...).
Transmitter set points will be specified for GSM and PCN when
typical values and statistical values become available.
Company Confidential
2006©BenQ

Release 1.1
Technical Documentation 01/2006
TD_Repair_L1-L3_AX72_R1.1.pdf Page 4 of 41
Speech Codec
• Half Rate, Full Rate, Enhanced Full Rate and Adaptive
Multi Rate speech coders are available as standard.
Temperature
Range
• -100C to +550C (Normal operation)
• -300C to +850C (Storage capability)
Display • Type: Full Graphic
• Resolution: 130 x 130 Pixel
• No. of colours: 65K
• Technology: C-STN
• Active area: 27.3mm x 27.3mm
• Pixel size: 0.21mm x 0.21mm. (1 Pixel consists of 3
sub-pixels in red, green and blue)
• Illumination: White (3 LEDs integrated)
• Frame Rate: 15 frames/sec
12-Block Keypad • IMF technology
• 12-key-block (0-9, #, *)
• two function keys (SEND, END)
• ON/OFF key combined with the END key; the symbol 
(I inside O) is used as a symbol for ON/OFF.
• 4 way-navikey
• 2 soft-keys for different SW-enabled functions
• tactile finder on key “5“
• 6 amber LEDs for keypad
Acoustics
• Three-in-one-earpiece for handset, handsfree and
ringing tones
• Omnidirectional microphone
• Loud signal emitter (soundringer) (>100dB(A) SPL
@5cm, 'Hongkong-Spec.') only for rectangular sound
signals (NOT POSSIBLE for Soundringer melodies)
• Polyphonic ringer tones 16 voices
• Different selectable volume levels for handsfree, handset
and ringer mode (for the amount see SW product
description)
Company Confidential
2006©BenQ

Release 1.1
Technical Documentation 01/2006
TD_Repair_L1-L3_AX72_R1.1.pdf Page 5 of 41
2 AX72 Interface to Accessories
There are no specific mechanical interfaces to the car cradle. The car cradle is designed to
fit the existing design. The I/O-Connector (Lumberg-slim-connector) is in use. The
compatible interface is suitable to use the travel charger.
3 Unit Description of AX72
The AX72 is designed as a Mono Block with non-exchangeable housing. The Upper case,
lower case and battery cover are painted parts. IMD Lens will be mounted by Ultrasonic,
Display, 130X130; semi-bridgeless keypad, 4-way Navi-Key, 12 keys block; IMD lens; IRDA
window; No ID concept will be realized on Battery cover.
Company Confidential
2006©BenQ

Release 1.1
Technical Documentation 01/2006
TD_Repair_L1-L3_AX72_R1.1.pdf Page 6 of 41
4 Exploded View of AX72
Upper case shell
Ke
yp
ad
Earphon
Displa
Main board
Microphon
Vibramotor
U
pp
er case shell
Screw
Batter
y
Li-ion
Batter
y
cove
r
Company Confidential
2006©BenQ

Release 1.1
Technical Documentation 01/2006
TD_Repair_L1-L3_AX72_R1.1.pdf Page 7 of 41
5 Disassembly of AX72
All repairs as well as disassembling and assembling have to be carried out in an ESD
protected environment and with ESD protected equipment/tools. For all activities the
international ESD regulations have to be considered.
For more details please check information in c – market
https://market.benqmobile.com/SO/welcome.lookup.asp
There you can find the document “ESD Guideline”.
Step 1
Front view of the AX72
Step 2
Back View of the AX72
Step 3
Remove Battery cover.
Step 4
Company Confidential
2006©BenQ

Release 1.1
Technical Documentation 01/2006
TD_Repair_L1-L3_AX72_R1.1.pdf Page 8 of 41
Remove Battery
Step 5
Remove SIM Card
Step 6
Remove the 4 screws (as indicated) with T5 Plus screw driver.
Company Confidential
2006©BenQ

Release 1.1
Technical Documentation 01/2006
TD_Repair_L1-L3_AX72_R1.1.pdf Page 9 of 41
Step 7
Remove Vibramotor
Step 8
Remove Microphone
Step 9
Remove Main board.
Company Confidential
2006©BenQ

Release 1.1
Technical Documentation 01/2006
TD_Repair_L1-L3_AX72_R1.1.pdf Page 10 of 41
Step 10
Remove Display module. Place foil over Display module for protection
Step 11
Remove Earphone
Step 12
Company Confidential
2006©BenQ