Sony ICD-B200RS User manual

1
Ver. 1.0 2005.04
SERVICE MANUAL
US Model
ICD-B200RS
SPECIFICATIONS
Recording media Built-in flash memory 32MB,
Monaural recording
Recording time HQ : 3 hours 40 minutes
SP : 9 hours 50 minutes
LP : 16 hours 10minutes
Frequency range HQ : 250 Hz – 6,800 Hz
SP/LP: 220 Hz – 3,400 Hz
Speaker approx. 2.0 cm (13/16 in.) dia.
Power output 250 mW
Input/Output • Earphone jack (minijack) for 8 – 300 ohms
ear receiver/headphones
•Microphone jack (minijack, monaural)
Plug in power
Minimum input level 0.6 mV
3 kilohms or lower impedance microphone
Power requirements Two LR03 (size AAA) alkaline batteries: 3 V DC
Dimensions (w/h/d) (not incl. projecting parts and controls)
30.0 ×103.5 ×16.0 mm (1 3/16 ×4 1/8 ×21/32 in.)
Mass (incl. batteries) 58 g (2.1 oz)
Supplied accessories Operating instructions (1)/Ear receiver
(MDR-E0110LP) (1)
Design and specifications are subject to change without
notice.
Sony Corporation
Personal Audio Group
Published by Sony Engineering Corporation
IC RECORDER
9-879-655-01
2005D04-1
© 2005.04

2
ICD-B200RS
Notes on Chip Component Replacement
•Never reuse a disconnected chip component.
•Notice that the minus side of a tantalum capacitor may be
damaged by heat.
zUNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
TABLE OF CONTENTS
1. GENERAL ................................................................... 3
2. DISASSEMBLY
2-1. Case (Front) Assy ............................................................ 4
2-2. SWITCH Board, MAIN Board ....................................... 5
2-3. AUDIO Board.................................................................. 5
3. SERVICE MODE ....................................................... 6
4. DIAGRAMS
4-1. Block Diagram ................................................................ 11
4-2. Printed Wiring Board – AUDIO Section – ..................... 12
4-3. Schematic Diagram – AUDIO Section – ........................ 13
4-4. Printed Wiring Board – MAIN Section – ....................... 14
4-5. Printed Wiring Board – SWITCH Section – .................. 15
4-6. Schematic Diagram – MAIN Section –.......................... 16
5. EXPLODED VIEWS
5-1. MAIN Board Section....................................................... 20
5-2. Case (Rear) Section ......................................................... 21
6. ELECTRICAL PARTS LIST .................................. 22

3
ICD-B200RS
SECTION 1
GENERAL This section is extracted
from instruction manual.
Index to Parts and Controls
Main unit
MIC (built-in microphone)
Display window
MENU
DISPLAY
zX REC (record) /PAUSE
Nx PLAY/STOP (ENTER)
– .
(review/fast backward) /
>+
(cue/fast forward) (SELECT)
Speaker
Rear Hook for handstrap
(not supplied)
MIC SENS
(microphone
sensitivity)
Battery
compartment
Display window
Folder indication
Alarm indicator
Repeat play indicator
Selected message
number
REC DATE (recorded
date) indication
REMAIN indicator
MIC jack (PLUG IN POWER)
EAR (earphone) jack
OPR (operation) indicator
ERASE
FOLDER
VOL (volume) +/–
DIVIDE
HOLD
xSTOP
Remaining memory
indicator
Remaining battery
indicator
Recording mode
indication
REC (recording)
indicator
Number of messages
in a folder/Menu
indication/Counter
/Remaining time
indication /
Recording date
indication /Current
time indication /
Messages

4
ICD-B200RS SECTION 2
DISASSEMBLY
•This set can be disassembled in the order shown below.
Note: Follow the disassembly procedure in the numerical order given.
2-1. CASE (FRONT) ASSY
2-1. CASE (FRONT) ASSY
(Page 4)
2-2. SWITCH BOARD,
MAIN BOARD
(Page 5)
SET
2-3. AUDIO BOARD
(Page 5)
2 screw
3 screw
4 claw
5 two claws
7 case (front) assy
6 two claws
1 battery case lid

5
ICD-B200RS
2-2. SWITCH BOARD, MAIN BOARD
2-3. AUDIO BOARD
1 CN705
2 SWITCH board
4 MAIN board
S701
3 CN701
5 claw
6
9
8
7
claw
S702
3 screw
2 cushion (battery case lid)
1 battery case lid
0 AUDIO board
4 speaker (2cm)

6
ICD-B200RS SECTION 3
SERVICE MODE
3-1. Setting the Service Mode
To enter the service mode, use the following procedure:
With the power on, turn the HOLD switch on while pressing the
xSTOP key and the VOLUME– key.
3-2. Resetting the Service Mode
The service mode is reset by turning the power off (removing the
power cord).
3-3. Initial State of the Service Mode
3-3-2. FlashMemory ID display
The ID of FlashMemory is displayed. This ID represents the
manufacturer code and device code.
The service mode has the initial screen of “Version display”. A
desired test mode under service mode is selected by pressing the
.+ keyor >– key. Then, the testingoperation in theselected
mode is determined by using the Bx key.
3-3-1. Version display
The version display is the initial screen in service mode and shows
the set name and the version No.
3-3-3. BadBlock count display
The count of initially faulty blocks for FlashMemory data is
displayed.
(Initial screen)
Version
display
Key Test
Reset Menu
Dsp Loop
Test Battery
Value
Flash
Memory
ID display
BadBlock
count
display
Lcd
Test
Beep
Test
Set name
Version No
"1.00"
Device code
Manufacturer cod
e
TOSHIBA
SAMSUNG
Manufacturer code
98
EC
Device code
(Memory Size)
16MB 32MB
73 75
73 75
BadBlock
count

7
ICD-B200RS
3-3-4. LCD test
The initial screen for LCD test displays the blinking characters
“LCD”. The LCD test mode includes seven different LCD tests.
The LCD test mode is executed by pressing the Bx key while the
“LCD”characters are blinking.
Pressing of the xSTOP key during any LCD test (display) will
return to this initial screen for LCD test. The LCD tests present the
following displays:
1. All LCD segments on
2. All LCD segments off
3. All LCD segments blinking
4. Even segments displayed
5. Odd segments displayed
6. LCD1 segments displayed
7. LCD set characters displayed
1) Segment test
The segment test is intended to check whether Com-Seg Map is
correct or not. When this test mode is selected, the initial screen
displays the blinking characters “SEG”.
The number of segments are 120. The segment test is executed by
pressing the Bx key while the “LCD” characters are blinking.
Pressing of the xSTOP key during any display of the segment
test will return to the initial screen for LCD test. The segment test
includes the following displays:
Initial screen for LCD TEST
All ON
STOP
Character display
Segment
ODD EVEN
All OFF
All blinking
STOP
This cycle is repeated until
the
key is pressed (toggle).
Segment
Initial screen
for LCD TEST

8
ICD-B200RS
2) MOJI test
The MOJI test is intended to show the character display (characters/
digits). When this test mode is selected, the initial screen displays
the blinking characters “MOJI”. The MOJI test is executed by
pressing the Bx key while the “MOJI”characters are blinking.
Pressing of the xSTOP key during any display of the MOJI test
will return to the initial screen for LCD test.The MOJI test includes
the following displays:
3-3-5. BEEP test
The beep test is intended to sound 2.4 kHz beeps. When this test
mode is selected, the initial screen displays the blinking characters
“BEEP”. The beep test is executed by pressing the Bx key while
the “BEEP” characters are blinking. By pressing the xSTOP key,
the beep sound will stop returning you to the initial screen for beep
test. The beep test includes the following displays:
Initial screen
for LCD TEST
STOP
This cycle is repeated until
the
key is pressed (toggle).
Character display
3-3-6. Battery value
The voltage value of the battery inserted into the set is displayed in
hexadecimalformat.Thevalueisinvalidwhen the adapterisinserted.
STOP
Initial screen
for BEEP TEST
beep
3-3-7. DSP LOOP test
The DSP loop test has the following flow:
DSP
MIC MIC AMP
POWER
AMP
SPEAKER
Note : Incoming voice data from the MIC is outputted to the
speaker as it is.
Voice Voice
VOICE
VoiceVoice
Battery voltage value
(HEX value)
BATTERY display screen
The initial screen for DSP loop test displays the blinking characters
“DSP”. The DSP loop test is executed by pressing the Bx key
while the “DSP” characters are blinking. Pressing of the xSTOP
key during any display of DSP loop test will return you to the initial
screen for DSP loop test.
Thevolumecanbe changedby using theVOLUME+ or VOLUME–
key. Thevolumevaluecan besetto 0 to30 levels,butisnot displayed
on the screen when changed. The DSP loop test includes the
following displays:
STOP
STOP
STOP
SP MODE LP MODEHQ MODE
Initial screen for
DSP LOOP TEST
Note: The volume value can be set to 0 to 30 levels,
but is not displayed on the screen when changed.

9
ICD-B200RS
3-3-8. Reset menu
The reset menu is used to initialize menu contents.When this mode
is selected, the initial screen for reset menu displays the characters
“RST MENU”. Pressing of Bx key during “RST MENU”
character display will cause the menu information to be initialized.
The reset menu includes the following items:
Initialization
of MENU contents
Initial screen
for RESET MENU
Note: The display remains unchanged
when the MENU is being reset.
3-3-9. KEY test
The key test is intended to check whether any key pressed is
recognized or not (AD misdetection check). When this test mode is
selected,the initialscreenforkeytestdisplays the blinkingcharacters
“KEY TEST”. By pressing the Bx key while the “KEY TEST”
characters are blinking, the characters “PLAY” will be displayed
entering the key test screen.
Once the key test is started, the test will not be completed until all
of keys are pressed. To exit from the key test mode, turn the power
off (remove the power cord). The key test includes the following
key tests:
DIVIDE FOLDER ERASE
All of keys or switches completed
to be pressed.
FlashMemory being accessed
(Initialization of MENU information) Completed
KEY TEST screen
Initial screen for KEY TEST
STOP
DISPLAY VOLUME–VOLUME+
MENU
MENU item
REC MODE
VOR
CONTINUE
ALARM
BEEP
SETDATE
Initial setting
SP
OFF
OFF
OFF
ON
No setting
KEY name
xSTOP
Bx
>+
.–
zX
MENU
DISPLAY
VOLUME–
VOLUME+
FOLDER
ERASE
DIVIDE
LCD display
STOP
PLAY
FF
REW
REC
MENU
DISP
VOL M
VOL P
FOL
ERASE
DIVIDE

10
ICD-B200RS SECTION 4
DIAGRAMS
THIS NOTE IS COMMON FOR PRINTED WIRING
BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is
printed in each block.)
Common Note on Schematic Diagrams:
•All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
•All resistors are in Ωand 1/4W or less unless otherwise
specified.
•f: internal component.
•C: panel designation.
•A: B+ Line.
•Power voltage is dc 3V and fed with regulated dc power
supply from battery terminal.
•Voltage and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : REC
():PB
•Voltagesaretakenwith aVOM(Input impedance10MΩ).
Voltage variations may be noted due to normal produc-
tion tolerances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
•Circled numbers refer to waveforms.
•Signal path.
E: PB
a: REC
Common Note on Printed Wiring Boards:
•X: parts extracted from the component side.
•Y: parts extracted from the conductor side.
•f: internal component.
•: Pattern from the side which enables seeing.
Caution:
Pattern face side: Partsonthe patternfacesideseen from
(SIDE B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
•Waverforms
– AUDIO board –
0.8 Vp-p
4.096 MHz
1IC101 ta (XOUT)
0.5 V/DIV, 0.1 µ sec/DIV
– MAIN board –
1 IC704 1(32KOUT)
2.2 Vp-p
1.2 Vp-p
3.2 Vp-p
5 MHz
32.768 kHz
32.768 kHz
2 IC704 8(OSCOUT)
1.0 V/DIV, 10 µ sec/DIV
3 IC703 ul (X2)
0.5 V/DIV, 10 µ sec/DIV
1.0 V/DIV, 0.2
µ sec/DIV

1111
ICD-B200RS
ICD-B200RS
4-1. BLOCK DIAGRAM
Signal path
: PB
: REC
47 MIP LOUT0
23
EGPI011 EGPI014 EGPI013 EGPI015 BGPI02 EGPI012 RSTN
26 51
XOUT
52
34
XIN
25 27 58 24 54
72
SI0
90
21
5
76
75
77
68
87
82
9
8
65
88
84
80
2
67
66
79
LCD701
LIQUID
CRYSTAL
DISPLAY
PANEL
LED
DRIVER
Q701
13
17
7
14
11
10
19
64
86
1
2
18
4
7
8
9
16
17
18
19
91
I
98
73
SD0
74
SCK0
89
DSPIFACK
69
XDSPIFRQ
70
DSPIFRW
71
XDSPRST
29
I
32
•
41
I
44
23
I
26
32
I
63
RESET
IC702
+3V(VDD)
MIC101
MIC
J101
MIC
IC701
FLASH MEMORY
I/O0
I
I/O7
R/B
RE
CE
CLE
ALE
WE
WP
SL701
(TEST)
Q702
VDD
FMI00
I
FMI07
XFMR/B
22 MIC SENS
XFMRE
XFMCE
XFMCLE
XFMALE
XFMWE
XFMWP
XTEST
WAKEUP
9AVREF
6AVREFON
KEY1
KEY2
KEY3
HOLD
S701
HOLD
OFF ON
I/O
TIMER
COUNTER
CONTROL
OSC
INTERRUPT
CONTROL
RTCCE
RTCINT
RTCDI
RTCCLK
RTCDO
AMPPOW
16
HP MUTE
BEEP
LMUTE
XT1
DSPPOW
FLMPOW
XRESET
100
BATT
X1
X2
LEDPB
LEDREC
COM0
I
COM3
S0
I
S31
SI
SO
SCLK
CE
INT
32KOUT
4
3
2
7
6
1
+3.3V
(VCC C)
D701
REC/PB
(GRN)(PB)
(RED)(REC)
J103
EAR
IC101
A/D,D/A CONVERTER,
DSP
(PLUG IN POWER)
X101
4.096MHz
X701
5MHz
IC703
MEMORY
CONTROL,
SYSTEM
CONTROL
S709-713
S703-708
S715
KEY-IN
DETECT
Q703,704,706
VCC
+3.3V
(VCCB)
VCC
VCCA +3.3V
(VCC A)
+3.3V
(VCC B)
48
5
1
3
2
-IN
+IN
BYPASS
VDD
VO1
VO2 SP1
SPEAKER
IC104
SPEAKER AMP
+3V
(VDD)
X702
32.768kHz
IC704
REAL TIME CLOCK
VDD +3.3V
(VCC C)
+3.3V
(VCC A) 5 1
3
IC502
+3.3V REG
VOUT VIN
OSCIN
OSCOUT CE
DC-DC
CONVERTER
(3.7V)
+3.3V
(VCC B) 5 1
3
IC503
+3.3V REG
VOUT VIN
CE
+3.3V
(VCC C) 2 3
IC504
+3.3V REG
VOUT VIN
1 3
IC506
VOLTAGE DETECT
+3(VDD)
OUT VDD
IC102
MIC AMP
IC508,Q504
Q101
MUTE
DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION LR03)
2PCS,3V
KEY MATRIX
S702
MIC SENS
LOW
HIGH
Q104
HP MUTE
BATTERY
DETECT
Q501
4 6
MIC
SENS
Q102

1212
ICD-B200RS
ICD-B200RS
4-2. PRINTED WIRING BOARD — AUDIO SECTION —
1
A
B
C
D
E
F
G
H
I
234567891011
A
R134
RB102RB103
RB101
C127
C129
C128
C126
C508
R504
R508R507
R130
R140
C139
R141
R117
R106
FB104
C133
C130
R116
C513
C120
C501
R125
C512
R512
IC101
26
50
100
76
25
1
51
75
IC504
1
2
3
1
2
3
5
4
IC503
IC506
1
2
5
10
15
20
23
24
6
4
1
3
C504 C510
C119
C131
C138
X101
MIC101
SP1
SPEAKER BLK
RED
CN701
DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION LR03)
2PCS,3V
AUDIO BOARD (SIDE B)
1-862-929-
MIC
(21)
21
FB101
C514
C108
R122 R109
R148 R147
R138
R517
R519
R157
R113
R101
C113
C114
C121
R118
C110
R156
R139
R135
C507
R516 R515
R506
R518
R129
R105
FB103
R115
C115 R111
Q101
R110
C116
FB102
R112
C111
R128
R127
C107
C103
R151
C134
C106
S702
MIC SENS
MIC
(PLUG IN POWER)
EAR
HIGH
LOW
R124
Q102
G D S
G D S
Q104
G D S
S D G
J103
J101
R514 IC508
D504
L502
Q504
IC104
Q501
41
58
4
5
5
8
4
1
3
1
2
TP507
TP505
TP504
TP501
TP109
TP503
TP502
TP508
TP509
1-862-929- (21)
21
TP105
TP110
TP101
TP103
TP106
R121
C135 C104
C102
C101
IC102
1
4
8
5
C105
C502
C503
C516
C509
IC502
1
2
3
5
4
C505
C506
AUDIO BOARD (SIDE A)
MAIN
BOARD
CN702
(Page 14)
• Semiconductor
Location
Ref. No. Location
D504 B-5
(IC101) G-6
IC102 D-7
IC104 B-7
IC502 D-5
(IC503) G-5
(IC504) H-5
(IC506) G-2
IC508 C-5
Q101 C-9
Q102 D-5
(Q104) G-9
Q501 A-4
Q504 C-5
( ): SIDE B
:Uses unleaded solder.

1313
ICD-B200RS
ICD-B200RS
4-3. SCHEMATIC DIAGRAM — AUDIO SECTION —
IC B/D
IC B/D
C504
C510
C502
MIC101
J101
R101
R130 C133
TP101
IC102
C102
R148
R147
R124
C105
C106
R122 R109
C108
R121
C134
C135
C101
C104
C103
C119
C130
R116
C127
C128
R135
C129
C131
R115
C116
R127
R138
R129
C107
R110
C115
R111
R113
C121
R156
TP105
TP103
TP106
C509 C501
TP509
C503 C508
R504
C514 C513
C512
R514
R517
L502D504
C507
C506 C505
TP501
TP504
R157
TP507
S702
R508
R507
CN701
TP505
R105
C113
C114
C111
TP109
C120
C126
R516
TP508
J103
X101
Q101
SP1
IC508
Q504
Q501
FB101
FB102
Q102
RB102 RB103
RB101
FB103
FB104
R151
R134
IC101
R125
IC104
R128
C110
R118
R112
C138
R117 R140
C139
R106
R139
R506
C516
IC506
R519
R515 R518
IC502 IC503 IC504
R512
TP110
R141
TP502
Q104
(Page 16)
• See page 10 for Waveform. • See page 17 for IC Block Diagrams.

1414
ICD-B200RS
ICD-B200RS
4-4. PRINTED WIRING BOARD — MAIN SECTION —
1
A
B
C
D
E
F
G
H
I
2345678
LIQUID CRYSTAL DISPLAY PANEL
D701
R779
R741
C706
R769
C705
R778
C728
R765 R770 R768
C730
C704
R776 R760
R758
R767
C712
C708
R710 R716
R707
R706
C711
R701
R724
R711
R702
IC703
R703
R729
C733
R777
R712 R713
R709
R775
Q706
2
76
100
51
26 50
75
25
1
1
10
CN702
5
20
15
24
23
TP720
C703
C707
D702
X701
Q702
B C E
A
S712
AUDIO
BOARD
CN701
(Page 12)
MAIN BOARD
(SIDE A)
ERASE
S711
FOLDER
VOL
S709 S710S713
DIVIDE
1-862-928- (21)
21
E C B
R704
1
1
2
3
C702
R705
IC702
SL701
(TEST)
C701
R726 R727
C720
R725
R708
R733
Q704
Q703
CN704 IC701
25
48
24
1
X702
R736
510
16
R732
C715
36 LCD701
R734
R730
R731
10 6
15
IC704
C721
C719
TP506
TP764
TP786
TP767
C1
C2
B1
E
B2
TP778
TP703
TP701
TP704
TP718
TP721
TP702
TP785
TP716
TP766
D701
R
G
ET701
B C E B C E
Q701
C714
B
MAIN BOARD (SIDE B)
(REC)
(PLAY)
1-862-928- (21)
21
SW BOARD
CN705
(Page 15)
OPR
• Semiconductor
Location
Ref. No. Location
D701 D-8
(D702) H-2
IC701 C-5
IC702 B-8
(IC703) H-5
IC704 D-2
Q701 D-8
(Q702) I-3
Q703 A-2
Q704 B-2
(Q706) I-2
( ): SIDE B
:Uses unleaded solder.

1515
ICD-B200RS
ICD-B200RS
4-5. PRINTED WIRING BOARD — SWITCH SECTION —
1
A
B
C
D
E
F
G
H
I
2345678
.
.
R764
R748 R763
R750
R749
R753
S708
MENU
DISPLAY
B x PLAY/STOP(ENTER)
x STOP
S704
z X REC/PAUSE
(SELECT)
S707
S706
S703
S715
S705
SWITCH BOARD (SIDE B)
1-862-930- (21)
21
CN705
10
6
5
1
TP706
TP707
TP709
TP708
ONOFF
TP705
B
SWITCH BOARD (SIDE A)
1-862-930-
HOLD
S701
MAIN
BOARD
CN704
(Page 14)
(21)
21
:Uses unleaded solder.

1616
ICD-B200RS
ICD-B200RS
4-6. SCHEMATIC DIAGRAM — MAIN SECTION —
IC B/D
TP705
R704
R705
C701
C702
R727R726
C706
C705
C707
R706
R707
R729
R730 R732
R736R734
C730
S704
R709
R708
X701
IC703
C715
R713
R712
R711
C714
R702 R703
R701
R753
R748
R749
R750
R763
R764
S703
S705
S706
S707
S708
S715
S701
CN705
TP708
TP705
TP706
TP707
S709
S710
S711
S712
S713
R769
R770
R768
R765
R767
C719
C720
TP701
TP702
TP703
R716TP704
TP716
Q702
R775
R733 R776
R760
R777
TP721
R758
TP786
C703
C704
TP506
TP764
TP766
TP767
LCD701
CN702
CN704
C711
C712
C721
R731
Q703 Q704
R710
TP718
D701
R741
IC702
TP778
Q706
C728
D702
X702
SL701
IC704
C708
R778
Q701
ET701
TP709
R779
R725
R724
C733
(Page 13)
• See page 10 for Waveforms. • See page 17 for IC Block Diagram. • See page 18 for IC Pin Function Description.

17
ICD-B200RS
•IC Block Diagrams
– AUDIO Board –
IC104 MM3111AWLE
1
BIAS
3
4
2
8
6
5
7
SHUTDOWN
BYPASS
+IN
-IN
VO2
GND
VDD
VO1
1
2
3
4
8
7
6
5
REG
GND
V+
OUT
IN-
NOISE
REG
STBY
IN+
IC102 NJM2781RB1
VDD
VDD
OSCIN
OSCOUT
CE
INTR
32KOUT
SCLK
SO
SI
VSS
32 kHz
OUTPUT
CONTROL COMPARATOR
W
COMPARATOR
D
ADDRESS
REGISTER
I/O
CONTROL
ADDRESS
DECODER
SHIFT
REGISTER
INTERRUPT
CONTROL
OSC
DETECT
VOLTAGE
DETECT
ALARM W REGISTER
(WEEK, MIN, HOUR)
ALARM D REGISTER
(MIN, HOUR)
DIV OSC
DIVIDER
CORRECTION
9
10
8
7
6
2
3
4
5
1
TIMER COUNTER
SEC, MIN, HOUR, WEEK,
DAY, MONTH, YEAR
– MAIN Board –
IC704 RS5C348A-E2-FB

18
ICD-B200RS
•IC Pin Function Description
IC703 µPD780308GC-A77-8EU (MEMORY CONTROL, SYSTEM CONTROL) (MAIN BOARD)
Pin No. Pin Name I/O Description
1,2 KEY1, KEY2 I Key signal input
3DC-IN I Not used. (Open)
4HOLD I Hold switch signal input
5AMPPOW O Power down control signal output to the power amplifier IC (IC104)
6AVREFON I A/D reference voltage input
7XFMCE O Chip enable signal output to the flash memory IC (IC701)
8VDD0 — Power supply pin (+3.3 V)
9AVREF — A/D reference voltage
10 XFMWE O Write enable signal output to the flash memory IC (IC701)
11 XFMALE O ALE signal output to the flash memory IC (IC701)
12 VSS1 — Ground pin
13 XFMR/B I Ready/Busy signal input from the flash memory IC (IC701)
14 XFMCLE O CLE signal output to the flash memory IC (IC701)
15 HPJACK O Headphone detect signal input Not used in this set. (Open)
16 HPMUTE O Headphones mute switch
17 XFMRE O Read enable signal output to the flash memory IC (IC701)
18 KEY3 I Key signal input
19 XFMWP O WP signal output to the flash memory IC (IC701)
20 HPAMPPOW O Power down control signal output to the headphones amplifier (Open)
21 BEEP O Beep signal output (2.4 kHz)
22 MICSENSE O Microphone sensitivity select (H: Conference, L: Dictation)
23 to 26 COM0 to COM3 O LCD common signal output
27 BIAS O Connect to VDD. (LCD bias)
28 to 30 VLC0 to VLC2 — LCD drive power supply pin
31 VSS0 — Ground pin
32 to 63 S0 to S31 O LCD segment signal output
64 XTEST I Test pin
65 DSPPOW O Digital signal processor registor control I/F enable signal output
66 LEDREC O OPR (REC) LED (D701: red) ON/OFF signal output
67 LEDPB O OPR (PLAY) LED (D701: green) ON/OFF signal output
68 RTCCE O Real time clock chip enable signal output
69 XDSPIFRQ O I/F request signal output to the DSP IC (IC101)
70 DSPIFRW O I/F data read/write signal output to the DSP IC (IC101)
71 XDSPRST O Reset signal output to the A/D, D/A converter, DSP IC (IC101)
72 SI0 I I/F data signal input to the DSP IC (IC101)
73 SO0 O I/F data signal output to the DSP IC (IC101)
74 SCK0 O I/F signal clock output to the DSP IC (IC101)
75 RTCDI I Real time clock data signal input
76 RTCDO O Real time clock data and digital signal processor registor control data output
77 RTCCLK O Real time clock I/F data and digital signal processor registor control clock output
78 IC — Connect to ground.
79 X2 O System clock output (5 MHz)
80 X1 I System clock input (5 MHz)
81 VDD1 — Power supply pin
82 XT1 — Sub clock input (32.768 kHz)
83 XT2 — Not used in this set. (Open)
84 XRESET I Reset signal input

19
ICD-B200RS
Pin No. Pin Name I/O Description
85 XDCINDET I Not used. (Open)
86 WAKEUP I WAKE UP signal input
87 RTCINT I Real time clock (2 Hz) signal input
88 FLMPOW O Flash memory power ON/OFF signal output
89 DSPIFACK I I/F acknowledge signal input to the DSP IC (IC101)
90 LMUTE O Line mute ON/OFF signal output
91 to 98 FMI01 to FMI07 I/O Data bus signal input/output
99 AVSS — Ground pin
100 BATT I Power supply voltage detection signal input

20
ICD-B200RS SECTION 5
EXPLODED VIEWS
NOTE:
•-XX and -X mean standardized parts, so they
may have some difference from the original
one.
•The mechanical parts with no reference
numberintheexplodedviewsare notsupplied.
•Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
1A-1084-535-A CASE (FRONT) ASSY
22-050-738-11 BUTTON (FRONT)
33-254-083-01 SCREW
42-050-730-31 LID, BATTERY CASE
5A-1060-548-A SWITCH BOARD, COMPLETE
6A-1084-532-A MAIN BOARD, COMPLETE
71-780-155-21 CONDUCTIVE BOARD, CONNECTION
82-050-736-01 SPACER (LCD)
92-050-735-02 HOLDER, LCD
10 3-254-014-01 SCREW
11 2-584-596-01 CUSHION (BATTERY CASE LID)
12 2-581-505-01 SPACER (SPEAKER)
LCD701 1-805-647-11 DISPLAY PANEL, LIQUID CRYSTAL
5-1. MAIN BOARD SECTION
1
2
3
10
4
5
6
78
9
LCD701
11
12