Telit Wireless Solutions LE50-868 User manual

LE50-868 RF Module User Guide
1VV0300905 Rev.1 – 2011-05-18

LE50-868 RF Module User Guide
1VV0300905 rev.1 – 2011-05-18
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 2 of 35
APPLICABILITY TABLE
PRODUCT
LE50-868

LE50-868 RF Module User Guide
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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be entirely reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products described
herein and reserves the right to revise this document and to make changes from time to time
in content hereof with no obligation to notify any person of revisions or changes. Telit does
not assume any liability arising out of the application or use of any product, software, or
circuit described herein; neither does it convey license under its patent rights or the rights of
others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in your
country. Such references or information must not be construed to mean that Telit intends to
announce such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a
product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer
programs, including the exclusive right to copy or reproduce in any form the copyrighted
computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW
computer programs contained in the Telit products described in this instruction manual may
not be copied (reverse engineered) or reproduced in any manner without the express written
permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products
shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any
license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied
SW, except for the normal non-exclusive, royalty free license to use that arises by operation
of law in the sale of a product.

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Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the operation
of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic
Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s)
specifically disclaim any expressed or implied warranty of fitness for such High Risk
Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
Copyright © Telit Communications S.p.A. 2011.

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Contents
1.Introduction .............................................................................................................7
1.1.Scope............................................................................................................................ 7
1.2.Audience....................................................................................................................... 7
1.3.Contact Information, Support ...................................................................................... 7
1.4.Document Organization ............................................................................................... 8
1.5.Text Conventions.......................................................................................................... 8
1.6.Related Documents ..................................................................................................... 9
2.Requirements ........................................................................................................10
2.1.General Requirements .............................................................................................. 10
2.2.Functional Requirements .......................................................................................... 12
2.3.Software ..................................................................................................................... 13
2.4.Temperature Requirements...................................................................................... 13
3.General Characteristics .........................................................................................14
3.1.Mechanical Characteristics ....................................................................................... 14
3.2.Mechanical dimensions ............................................................................................. 15
3.3.Recommended Land pattern..................................................................................... 15
3.4.DC Characteristics..................................................................................................... 16
3.5.Functional Characteristics ........................................................................................ 16
3.6.Digital Characteristic................................................................................................. 18
3.7.Absolut Maximum Ratings......................................................................................... 18
3.8.Ordering Information ................................................................................................. 18
4.Technical Description ............................................................................................20
4.1.Pin-out of the module ................................................................................................ 20
4.2.Pin-out of the DIP Module ......................................................................................... 22
4.3.Description of the signals .......................................................................................... 23
5.Process Information...............................................................................................24
5.1.Delivery ...................................................................................................................... 24

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5.2.Storage....................................................................................................................... 24
5.3.Soldering pad pattern ................................................................................................ 25
5.4.Solder past ................................................................................................................. 25
5.5.Placement .................................................................................................................. 26
5.6.Soldering Profile (RoHS Process) ............................................................................. 26
6.Board Mounting Recommendation.........................................................................28
6.1.Electrical environment .............................................................................................. 28
6.2.Power supply decoupling on LE50-868 module ....................................................... 28
6.3.RF layout considerations ........................................................................................... 29
6.4.Antenna connections on printed circuit boards ........................................................ 29
6.5.LE50-868 Interfacing ................................................................................................ 31
7.Annexes .................................................................................................................32
7.1.Examples of propagation attenuation ....................................................................... 32
8.Safety Recommendations.......................................................................................33
9.Glossary .................................................................................................................34
10.Document History ...............................................................................................35

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1. Introduction
1.1. Scope
Scope of this document is to give an overview of the fonts, styles and general structure -- first
chapter included -- to use when writing Telit documents. The aim of this document is to
present the features and the application of the LE50-868 radio module. After the introduction,
the characteristics of the LE50-868 radio module will be described within the following
distinct chapters:
Requirements
General Characteristics
Technical description
Process information
Board Mounting Recommendations
Antenna Considerations
1.2. Audience
This document is intended for developers using Telit LE50-868 Module..
1.3. Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit Technical Support Center (TTSC) at:
[email protected]
[email protected]
[email protected]
[email protected]
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:
http://www.telit.com

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To register for product news and announcements or for product questions contact Telit
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.
Telit appreciates feedback from the users of our information.
1.4. Document Organization
This document contains the following chapters
“Chapter 1: “Introduction” provides a scope for this document, target audience, contact and
support information, and text conventions.
“Chapter 2: “General Requirement” gives an overview of the limitations imposed by
Reference standards.
“Chapter 3: “General Characteristics” describes in details the characteristics of the product.
“Chapter 4: “Technical Description” describes in details the signals and pin-out of the
product.
“Chapter 5: “Process information” describes in details the delivery, storage, soldering and
placement of the product.
“Chapter 6: “Board Mounting Recommendations” describes in details the interface and
coupling of the product.
“Chapter 7: “Annexes” describe examples of propagation attenuation.
“Chapter 8: “Safety Recommendations” describes recommendation for proper usage.
“Chapter 39: “Document history” describes the revision history of the product.
1.5. Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when
integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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1.6. Related Documents
[1] EN 300 220-2 v2.3.1, ETSI Standards for SRD , February 2010
[2] ERC Rec 70-03, ERC Recommendation for SRD, June 2010
[3] 2002/95/EC, Directive of the European Parliament and of the Council, 27 January 2003
[4] Tools : User Manual, 1VV300873 Short Range Tool User Guide
[5] Star Network User Guide, 1vv0300899 M-ONE Protocol Stack User Guide
[6] 2006/771/EC, Harmonization of the radio spectrum for use by short-range devices
[7] 2009/381/EC, Amending Decision 2006/771/EC on harmonization of the radio
spectrum for use by short-range devices

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2. Requirements
2.1. General Requirements
The LE50-868 module is a multi-band radio board, delivering up to 25 mW in the 868 MHz
ISM band (unlicensed frequency band). It is dedicated to low power applications that require
mesh network structure.
LE50-868 is also pin-to-pin compatible with Telit ZE Family (ZigBee 2007 and PRO stack),
ME Family (Wireless M-bus) and LE Family (basic point to point, broadcast stack).
The “ERC recommendation 70-03” describes the different usable sub-bands in the 868 MHz
license free band, in terms of bandwidth, maximum power, duty cycle and channel spacing. It
gives the following limitations:
ERC recommendation 70-03
Band Frequency band
(MHz) Maximum radiated power (mW) Channel spacing (kHz) Duty cycle (%)
Annex1 g 863.0 – 870.0 25 =< 100 for 47 or more channels 100
Annex1 g1 868.0 – 868.6 25 No channel spacing specified 1
Annex7 a 868.6 - 868.7 10 25 1
Annex1 g2 868.7 - 869.2 25 No channel spacing specified 0,1
Annex7 d 869.2 – 869.25 10 25 0.1
Annex7 b 869.25 – 869.3 10 25 0.1
Annex7 e 869.3 – 869.4 10 25 1
Annex1 g3 869.4 - 869.65 500 25 (for 1 or more channels) 10
Annex7 c 869.65 – 869.7 25 25 10
Annex1 g4 869.7 – 870.0 5 No channel spacing specified 100
These bands are free to use but the module and the user must respect some limitations. Most
of these restrictions are integrated in the conception of the module, except the duty cycle. For
example, the 869.400 to 869.650 MHz band is limited to a 10% duty cycle. This means that
each module is limited to a total transmit time of 6 minutes per hour. It is the responsibility of
the user to respect the duty cycle.
Finally, the module complies with the new European Directive 2002/95/EC concerning the
Restrictive Usage of Hazardous Substances (RoHS).

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National Restrictions for non specific SR devices Annex 1 band g1-g4:
Country Restriction Reason/Remark
Band G
Austria Not Implemented Planned
Finland Limited Implementation
Audio, video and voice not allowed -
Planned 2011
Georgia Not Implemented
Greece Limited Implementation to 863-865 MHz
Lithuania Limited implementation
Only 863-868 MHz and duty cycle can not
be increased to 1%
Norway Not implemented
Russian
Federation Not Implemented
864-865 MHz with max e.r.p 25 mW,
duty cycle 0.1% or LBT. Forbidden to use
at the airports (aerodromes)
Spain Limited implementation to the band 863-868 MHz
Sweden Not Implemented
The Netherlands Not Implemented Under study
Ukraine Limited implementation
863-865 / 868-868.6 / 868.6-868.7 /
869.2-869.25 MHz
Band G1
Georgia Not Implemented
Russian
Federation Not Implemented
Ukraine Not Implemented e.i.r.p. ≤25 mW
Band G3
Georgia Not Implemented
Russian
Federation Not Implemented
Ukraine Not Implemented
Band G4
Finland Limited implementation Only 5mW e.r.p. - Planned 2011
Georgia Not Implemented
Russian
Federation Not Implemented
Ukraine Not Implemented
National Restrictions for non specific SR devices Annex 7 band a-e:
Country Restriction Reason/Remark
Band A
France Duty cycle limited to
0.1%

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Georgia No info
Russian
Federation Not implemented
Ukraine Limited implementation The maximal transmitter power 10 mW
Band B
Georgia No info
Russian
Federation Not implemented
Ukraine No info
Band C
Georgia No info
Russian
Federation Not implemented
Ukraine Not implemented Under study
Band D
Georgia No info
Russian
Federation Not implemented
Ukraine Limited implemented The maximal transmitter power 10 mW
Band E
France Not implemented
Georgia No info
Greece Not implemented
Macedonia Not implemented Planned
Russian
Federation Not implemented
Ukraine No info
2.2. Functional Requirements
The LE50-868 module is a complete solution from serial interface to RF interface. The LE50-
868 module has a digital part and a RF part. The radio link is a Half Duplex bi-directional
link.
The digital part has the following functionalities:
Communication interface
I/O management
Micro controller with embedded Telit RF proprietary Star Network stack

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The RF part has the following functionalities:
Frequency synthesis
Front-end
Low noise reception
Power amplification
Packet handling
2.3. Software
The LE50-868 module is provided pre-flashed with Telit in-house Star Network stack. Please
refer to Star Network Stack User Guide [5] for detail information.
2.4. Temperature Requirements
Minimum Typical Maximum Unit
Operating
Temperature - 40 25 + 85 °C
Relative humidity @
25°C 20 75 %
Storage
Temperature - 40 25 + 85 °C

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3. General Characteristics
3.1. Mechanical Characteristics
Size : Rectangular 25.8 x 15 mm
Height : 3 mm
Weight : 1.7 g
PCB thickness: 0.8 mm
Cover : Dimensions : 21 x 14.2 x 2.2mm
Thickness : 200µm
Components : All SMD components, on one side of the PCB.
Connectors : The terminals allowing conveying I/O signals are LGA
Mounting : SMD
LGA on the 4 external sides
Number of pins : 30

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3.2. Mechanical dimensions
3.3. Recommended Land pattern

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3.4. DC Characteristics
Characteristics NE50 Min. Typ. Max.
Power Supply
(VDD): +2.0V +3.3V +3.6V
Consumption
Transmission @ 25mW: 45mA 50mA
Reception : 26mA 30mA
Stand-by (32.768 khz On) : 3µA
I/O low level : GND - 0.2x VDD
I/O high level : 0.8x VDD - VDD
3.5. Functional Characteristics
ERC/REC70-03
Frequency (MHz)
Band g
863.000 -
870.000
Band g1
868.000 -
868.600
Band g2
868.700 -
869.200
Band g3
869.400 -
869.650
Band g4
869.700 -
870.000
Global
RF data rate (1): 19.2 kbps
(2): 38.4 kbps
(3): 115.2 kbps
Numbers of
channels
20 (1)
10 (2)
0 (3)
6 (1)
3 (2)
1 (3)
5 (1)
2 (2)
1 (3)
1 (1)
1 (2)
0 (3)
3 (1)
2 (2)
0 (3)
Channel width 100 kHz (1)
200 kHz (2)
100 kHz (1)
200 kHz (2)
600 kHz (3)
100 kHz (1)
200 kHz (2)
500 kHz (3)
250 kHz 100 kHz (1)
150 kHz (2)
Channel 0 865.550 MHz (1)
865.600 MHz (2)
868.050 MHz (1)
868.100 MHz (2)
868.300 MHz (3)
868.750 MHz (1)
868.850 MHz (2)
868.950 MHz (3)
869.5250 MHz 869.750 MHz (1)
869.775 MHz (2)
Total Bandwidth 2 MHz 600 kHz 500 kHz 250 kHz 300 kHz
Transmission
Duty cycle ≤1% ≤1% ≤0.1% ≤10% No requirement
Modulation GFSK with ± 10 kHz deviation (1)
GFSK with ± 20 kHz deviation (2)
GFSK with ± 50 kHz deviation (3)
Max permitted
e.r.p 25 mW 25 mW 25 mW 500 mW 5 mW
e.r.p 8 levels with 3dB steps from -8dBm (ATS202 = 0) to +13dBm (ATS202 = 7)
20 mW 20 mW 20 mW 20 mW 5 mW

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Reception
Sensitivity
for PER < 10-3
(1): Max - 104 dBm
(2): Max - 101 dBm
(3): Max - 99 dBm
Remaining PER < 1.10-6
Saturation
for PER < 10-3 Up to - 10 dBm
ETSI EN 300 220 V2.3.1 (2009-12)
Transmission
Frequency error +/- 12.5 kHz @ 25 kHz channelization
+/- 87 kHz (100 ppm) > 25 kHz channelization
ACP - 37 dBm in 16 kHz BW under normal test conditions
- 32 dBm in 16 kHz BW under extreme test conditions
Modulation
bandwidth
Reference
Bandwidth (RBW)
Limit Lower envelope
point
Minimum frequency
Upper envelope
point
maximum frequency
1 kHz - 30 dBm (1 μW) fe, lower fe, upper
1 kHz - 36 dBm (250 nW) (fe, lower – 200 kHz)(fe, upper +200 kHz)
10 kHz - 36 d m (250 nW) (fe, lower – 400 kHz)(fe, upper +400 kHz)
100 kHz - 36 dBm (250 nW) (fe, lower – 1 MHz)(fe, upper +1 MHz)
Unwanted
emissions in the
spurious domain
Frequency 47 MHz to 74 MHz 7,5
MHz to 118 MHz 174
MHz to 230 MHz 470
MHz to 862 MHz
Other frequencies below
1 000 MHz
Frequencies above 1
000 MHz
State
Operating - 54 dBm (4 nW) - 36 dBm (250 nW) - 30 dBm (1 μW)
Standby - 57 dBm (2 nW) - 57 dBm (2 nW) - 47 dBm (20 nW)
Reception
Blocking for
class 2
equipments
Frequency offset of the
unwanted signal Receiver bandwidth Frequency offset of the unwanted signal
+/-2 MHz
10 kHz +/-2 MHz
100 kHz
250 kHz
+/-10 MHz
10 kHz +/-10 MHz
100 kHz
250 kHz
spurious
radiation
Below 1000 MHz Above 1000 MHz
- 57 dBm (2 nW) - 47 dBm (20 nW)

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3.6. Digital Characteristic
Function Characteristics
µC
32 kB + 4 kB in system programmable flash
4 kB RAM
2 kB E2PROM
Serial link
RS232 TTL Full Duplex
1200 to 115200 bps
7 or 8 bits
Parity management
Flow control
None
Software (Xon/Xoff)
Hardware (RTS/CTS)
Embedded software
functionality
Star Network Telit RF proprietary stack
Flexibility:
Pre flashed
Customization capability
Download over the air
3.7. Absolut Maximum Ratings
Voltage applied to Vcc, VDD : -0.3V to +3.6V
Voltage applied to “TTL” Input : -0.3V to VDD+0.3V
3.8. Ordering Information
The following equipments can be ordered:
The SMD version
The DIP interface version
The Demo Kit
The versions below are considered standard and should be readily available. For other
versions, please contact Telit. Please make sure to give the complete part number when
ordering.

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Equipment and Part Number
SMD Version
LE50-868
DIP Version
LE50-868
Demo Kit
D LE50 DEMO

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4. Technical Description
4.1. Pin-out of the module
TOP VIEW (COVER SIDE)
Pin Pin name Pin type Signal level Function
J30 GND Gnd RF Ground connection for external antenna
J29 Ext_Antenna RF RF I/O connection to external antenna
J28 GND Gnd RF Ground connection for external antenna
J27 GND Gnd Ground
J26 GND Gnd Ground
J25 VDD Power Digital and Radio part power supply pin
J24 CTS I TTL Clear To Send
J23 RESET I TTL µC reset ( Active low with internal pull-up )
J22 RTS O TTL Request To Send
J21 RXD I TTL RxD UART – Serial Data Reception
J20 GND Gnd Ground
J19 TXD O TTL TxD UART – Serial Data Transmission
J18 STAND_BY I TTL Standby ( Active high with internal pull-down )