Telit Wireless Solutions LM960 Guide

[01.2017]
Mod.08
18 2017-01 Rev.0
LM960
HW Design Guide
1VV0301485 Rev.1 –2018-05-30

LM960 HW Design Guide
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SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
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USAGE AND DISCLOSURE RESTRICTIONS
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Components, units, or third-party products used in the product described herein are NOT
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Applicability Table
PRODUCTS
LM960

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Contents
NOTICE 2
COPYRIGHTS................................................................................................ 2
COMPUTER SOFTWARE COPYRIGHTS...................................................... 2
USAGE AND DISCLOSURE RESTRICTIONS............................................... 3
APPLICABILITY TABLE................................................................................ 4
CONTENTS.................................................................................................... 5
1. INTRODUCTION.......................................................................... 9
Scope........................................................................................... 9
Audience....................................................................................... 9
Contact Information, Support........................................................ 9
Text Conventions........................................................................ 11
Related Documents.................................................................... 12
2. GENERAL PRODUCT DESCRIPTION ...................................... 13
Overview..................................................................................... 13
Product Variants and Frequency Bands...................................... 13
2.2.1. RF Bands per Regional Variant .................................................. 13
Target market ............................................................................. 14
Main features.............................................................................. 14
Block Diagram ............................................................................ 16
TX Output Power........................................................................ 16
RX Sensitivity ............................................................................. 16
Mechanical specifications........................................................... 18
2.8.1. Dimensions................................................................................. 18
2.8.2. Weight ........................................................................................ 18
Environmental Requirements...................................................... 18
2.9.1. Temperature Range.................................................................... 18
2.9.2. RoHS Compliance...................................................................... 19
3. PINS ALLOCATION................................................................... 20
Pin-out........................................................................................ 20
LM960 Signals That Must Be Connected.................................... 24
Pin Layout................................................................................... 25

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4. POWER SUPPLY....................................................................... 26
Power Supply Requirements....................................................... 26
Power Consumption ................................................................... 26
General Design Rules................................................................. 27
4.3.1. Electrical Design Guidelines ....................................................... 27
4.3.1.1. + 5V Input Source Power Supply – Design Guidelines................ 27
4.3.2. Thermal Design Guidelines......................................................... 28
4.3.3. Power Supply PCB layout Guidelines ......................................... 29
RTC............................................................................................ 29
Reference Voltage...................................................................... 29
Internal LDO for GNSS bias........................................................ 30
5. ELECTRICAL SPECIFICATIONS .............................................. 31
Absolute Maximum Ratings – Not Operational............................ 31
Recommended Operating Conditions ......................................... 31
6. DIGITAL SECTION .................................................................... 32
Logic Levels................................................................................ 32
6.1.1. 1.8V Pins – Absolute Maximum Ratings..................................... 32
6.1.2. 1.8V Standard GPIOs................................................................. 32
6.1.3. 1.8V SIM Card Pins.................................................................... 33
6.1.4. 2.85V Pins – Absolute Maximum Ratings ................................... 33
6.1.5. SIM Card Pins @2.85V............................................................... 33
Power On.................................................................................... 34
6.2.1. Initialization and Activation State ................................................ 34
Power Off.................................................................................... 35
Reset.......................................................................................... 36
6.4.1. Graceful Reset............................................................................ 36
6.4.2. Unconditional Hardware Reset ................................................... 37
Communication ports.................................................................. 37
6.5.1. USB Interface ............................................................................. 38
6.5.2. PCIe Interface............................................................................. 40
6.5.3. SIM Interface.............................................................................. 42
6.5.3.1. SIM Schematic Example............................................................. 42
6.5.4. Control Signals ........................................................................... 43
6.5.4.1. W_DISABLE_N........................................................................... 43
6.5.4.2. PCIE_WAKE_N.......................................................................... 44
6.5.4.3. WAN_LED_N.............................................................................. 44
6.5.5. General Purpose I/O................................................................... 44

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6.5.5.1. Using a GPIO Pin as Input.......................................................... 45
6.5.5.2. Using a GPIO Pin as Output....................................................... 45
6.5.6. I2C – Inter-integrated circuit........................................................ 46
Using the Temperature Monitor Function.................................... 46
7. RF SECTION.............................................................................. 47
Antenna requirements................................................................. 47
Primary Antenna Requirements.................................................. 47
Secondary Antenna Requirements ............................................. 47
GNSS Receiver .......................................................................... 48
7.4.1. GNSS RF Front End Design....................................................... 48
Antenna connection.................................................................... 49
7.5.1. Support bands in antenna port.................................................... 49
7.5.2. Antenna Connector..................................................................... 49
7.5.3. Antenna Cable............................................................................ 49
7.5.4. Antenna Installation Guidelines................................................... 50
8. AUDIO SECTION ....................................................................... 51
Audio Interface ........................................................................... 51
Digital Audio ............................................................................... 51
9. MECHANICAL DESIGN............................................................. 52
General....................................................................................... 52
Finishing & Dimensions .............................................................. 52
Drawing (TBD)............................................................................ 52
10. APPLICATION GUIDE............................................................... 53
Debug of the LM960 Module in Production................................. 53
Bypass Capacitor on Power Supplies ......................................... 53
EMC Recommendations............................................................. 54
11. PACKAGING.............................................................................. 57
Tray............................................................................................ 57
12. CONFORMITY ASSESSMENT ISSUES .................................... 59
Approvals.................................................................................... 59
Declaration of Conformity ........................................................... 59
FCC certificates.......................................................................... 59
IC certificates.............................................................................. 59
FCC/IC Regulatory notices ......................................................... 59
RED Regulatory notices.............................................................. 61

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13. SAFETY RECOMMENDATIONS................................................ 63
READ CAREFULLY.................................................................... 63
14. REFERENCE TABLE OF RF BANDS CHARACTERISTICS..... 64
15. ACRONYMS............................................................................... 67
16. DOCUMENT HISTORY .............................................................. 69

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1. INTRODUCTION
Scope
This document introduces the Telit LM960 module and presents possible and
recommended hardware solutions for developing a product based on the LM960 module.
All the features and solutions detailed in this document are applicable to all LM960 variants,
where “LM960” refers to the variants listed in the Applicability Table.
If a specific feature is applicable to a specific product only, it will be clearly marked.
Information – LM960 refers to all modules listed in the Applicability
Table.
This document takes into account all the basic functions of a wireless module; a valid
hardware solution is suggested for each function, and incorrect solutions and common
errors to be avoided are pointed out.
Obviously, this document cannot embrace every hardware solution or every product that
can be designed. Where the suggested hardware configurations need not be considered
mandatory, the information given should beused as a guide and astarting point for properly
developing your product with the Telit LM960 module.
Information – The integration of the WCDMA/HSPA+/LTE LM960
cellular module within a user application must be done according to
the design rules described in this manual.
Audience
This document is intended for Telit customers, especially system integrators, about to
implement their applications using the Telit LM960 module.
Contact Information, Support
For general contact, technical support services, technical questions and report
documentation errors contact Telit Technical Support at:
[e-mail]
[e-mail]
TS-[email protected]
[e-mail]

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For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:
http://www.telit.com
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Our aim is to make this guide as helpful as possible. Keep us informed of your comments
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