Telit Wireless Solutions LM960 Guide

[01.2017]
Mod.08
18 2017-01 Rev.0
LM960
HW Design Guide
1VV0301485 Rev.1 –2018-05-30

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SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE
NOTICE
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products
described herein and reserves the right to revise this document and to make changes from
time to time in content hereof with no obligation to notify any person of revisions or changes.
Telit does not assume any liability arising out of the application or use of any product,
software, or circuit described herein; neither does it convey license under its patent rights
or the rights of others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in
your country. Such references or information must not be construed to mean that Telit
intends to announce such Telit products, programming, or services in your country.
COPYRIGHTS
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale
of a product.
COMPUTER SOFTWARE COPYRIGHTS
The Telit and 3rd Party supplied Software (SW) products described in this instruction
manual may include copyrighted Telit and other 3rd Party supplied computer programs
stored in semiconductor memories or other media. Laws in the Italy and other countries
preserve for Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted
computer programs, including the exclusive right to copy or reproduce in any form the
copyrighted computer program. Accordingly, any copyrighted Telit or other 3rd Party
supplied SW computer programs contained in the Telit products described in this instruction
manual may not be copied (reverse engineered) or reproduced in any manner without the
express written permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase
of Telit products shall not be deemed to grant either directly or by implication, estoppel, or
otherwise, any license under the copyrights, patents or patent applications of Telit or other
3rd Party supplied SW, except for the normal non-exclusive, royalty free license to use that
arises by operation of law in the sale of a product.

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USAGE AND DISCLOSURE RESTRICTIONS
I. License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
II. Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language or
computer language, in any form or by any means, without prior written permission of Telit
III. High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the
operation of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air
Traffic Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its
supplier(s) specifically disclaim any expressed or implied warranty of fitness for such High
Risk Activities.
IV. Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
V. Third Party Rights
The software may include Third Party Right software. In this case you agree to comply with
all terms and conditions imposed on you in respect of such separate software. In addition
to Third Party Terms, the disclaimer of warranty and limitation of liability provisions in this
License shall apply to the Third Party Right software.
TELIT HEREBY DISCLAIMS ANY AND ALL WARRANTIES EXPRESS OR IMPLIED
FROM ANY THIRD PARTIES REGARDING ANY SEPARATE FILES, ANY THIRD PARTY
MATERIALS INCLUDED IN THE SOFTWARE, ANY THIRD PARTY MATERIALS FROM
WHICH THE SOFTWARE IS DERIVED (COLLECTIVELY “OTHER CODE”), AND THE
USE OF ANY OR ALL THE OTHER CODE IN CONNECTION WITH THE SOFTWARE,
INCLUDING (WITHOUT LIMITATION) ANY WARRANTIES OF SATISFACTORY
QUALITY OR FITNESS FOR A PARTICULAR PURPOSE.
NO THIRD PARTY LICENSORS OF OTHER CODE SHALL HAVE ANY LIABILITY FOR
ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL
DAMAGES (INCLUDING WITHOUT LIMITATION LOST PROFITS), HOWEVER CAUSED
AND WHETHER MADE UNDER CONTRACT, TORT OR OTHER LEGAL THEORY,
ARISING IN ANY WAY OUT OF THE USE OR DISTRIBUTION OF THE OTHER CODE
OR THE EXERCISE OF ANY RIGHTS GRANTED UNDER EITHER OR BOTH THIS
LICENSE AND THE LEGAL TERMS APPLICABLE TO ANY SEPARATE FILES, EVEN IF
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

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Applicability Table
PRODUCTS
LM960

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Contents
NOTICE 2
COPYRIGHTS................................................................................................ 2
COMPUTER SOFTWARE COPYRIGHTS...................................................... 2
USAGE AND DISCLOSURE RESTRICTIONS............................................... 3
APPLICABILITY TABLE................................................................................ 4
CONTENTS.................................................................................................... 5
1. INTRODUCTION.......................................................................... 9
Scope........................................................................................... 9
Audience....................................................................................... 9
Contact Information, Support........................................................ 9
Text Conventions........................................................................ 11
Related Documents.................................................................... 12
2. GENERAL PRODUCT DESCRIPTION ...................................... 13
Overview..................................................................................... 13
Product Variants and Frequency Bands...................................... 13
2.2.1. RF Bands per Regional Variant .................................................. 13
Target market ............................................................................. 14
Main features.............................................................................. 14
Block Diagram ............................................................................ 16
TX Output Power........................................................................ 16
RX Sensitivity ............................................................................. 16
Mechanical specifications........................................................... 18
2.8.1. Dimensions................................................................................. 18
2.8.2. Weight ........................................................................................ 18
Environmental Requirements...................................................... 18
2.9.1. Temperature Range.................................................................... 18
2.9.2. RoHS Compliance...................................................................... 19
3. PINS ALLOCATION................................................................... 20
Pin-out........................................................................................ 20
LM960 Signals That Must Be Connected.................................... 24
Pin Layout................................................................................... 25

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4. POWER SUPPLY....................................................................... 26
Power Supply Requirements....................................................... 26
Power Consumption ................................................................... 26
General Design Rules................................................................. 27
4.3.1. Electrical Design Guidelines ....................................................... 27
4.3.1.1. + 5V Input Source Power Supply – Design Guidelines................ 27
4.3.2. Thermal Design Guidelines......................................................... 28
4.3.3. Power Supply PCB layout Guidelines ......................................... 29
RTC............................................................................................ 29
Reference Voltage...................................................................... 29
Internal LDO for GNSS bias........................................................ 30
5. ELECTRICAL SPECIFICATIONS .............................................. 31
Absolute Maximum Ratings – Not Operational............................ 31
Recommended Operating Conditions ......................................... 31
6. DIGITAL SECTION .................................................................... 32
Logic Levels................................................................................ 32
6.1.1. 1.8V Pins – Absolute Maximum Ratings..................................... 32
6.1.2. 1.8V Standard GPIOs................................................................. 32
6.1.3. 1.8V SIM Card Pins.................................................................... 33
6.1.4. 2.85V Pins – Absolute Maximum Ratings ................................... 33
6.1.5. SIM Card Pins @2.85V............................................................... 33
Power On.................................................................................... 34
6.2.1. Initialization and Activation State ................................................ 34
Power Off.................................................................................... 35
Reset.......................................................................................... 36
6.4.1. Graceful Reset............................................................................ 36
6.4.2. Unconditional Hardware Reset ................................................... 37
Communication ports.................................................................. 37
6.5.1. USB Interface ............................................................................. 38
6.5.2. PCIe Interface............................................................................. 40
6.5.3. SIM Interface.............................................................................. 42
6.5.3.1. SIM Schematic Example............................................................. 42
6.5.4. Control Signals ........................................................................... 43
6.5.4.1. W_DISABLE_N........................................................................... 43
6.5.4.2. PCIE_WAKE_N.......................................................................... 44
6.5.4.3. WAN_LED_N.............................................................................. 44
6.5.5. General Purpose I/O................................................................... 44

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6.5.5.1. Using a GPIO Pin as Input.......................................................... 45
6.5.5.2. Using a GPIO Pin as Output....................................................... 45
6.5.6. I2C – Inter-integrated circuit........................................................ 46
Using the Temperature Monitor Function.................................... 46
7. RF SECTION.............................................................................. 47
Antenna requirements................................................................. 47
Primary Antenna Requirements.................................................. 47
Secondary Antenna Requirements ............................................. 47
GNSS Receiver .......................................................................... 48
7.4.1. GNSS RF Front End Design....................................................... 48
Antenna connection.................................................................... 49
7.5.1. Support bands in antenna port.................................................... 49
7.5.2. Antenna Connector..................................................................... 49
7.5.3. Antenna Cable............................................................................ 49
7.5.4. Antenna Installation Guidelines................................................... 50
8. AUDIO SECTION ....................................................................... 51
Audio Interface ........................................................................... 51
Digital Audio ............................................................................... 51
9. MECHANICAL DESIGN............................................................. 52
General....................................................................................... 52
Finishing & Dimensions .............................................................. 52
Drawing (TBD)............................................................................ 52
10. APPLICATION GUIDE............................................................... 53
Debug of the LM960 Module in Production................................. 53
Bypass Capacitor on Power Supplies ......................................... 53
EMC Recommendations............................................................. 54
11. PACKAGING.............................................................................. 57
Tray............................................................................................ 57
12. CONFORMITY ASSESSMENT ISSUES .................................... 59
Approvals.................................................................................... 59
Declaration of Conformity ........................................................... 59
FCC certificates.......................................................................... 59
IC certificates.............................................................................. 59
FCC/IC Regulatory notices ......................................................... 59
RED Regulatory notices.............................................................. 61

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13. SAFETY RECOMMENDATIONS................................................ 63
READ CAREFULLY.................................................................... 63
14. REFERENCE TABLE OF RF BANDS CHARACTERISTICS..... 64
15. ACRONYMS............................................................................... 67
16. DOCUMENT HISTORY .............................................................. 69

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1. INTRODUCTION
Scope
This document introduces the Telit LM960 module and presents possible and
recommended hardware solutions for developing a product based on the LM960 module.
All the features and solutions detailed in this document are applicable to all LM960 variants,
where “LM960” refers to the variants listed in the Applicability Table.
If a specific feature is applicable to a specific product only, it will be clearly marked.
Information – LM960 refers to all modules listed in the Applicability
Table.
This document takes into account all the basic functions of a wireless module; a valid
hardware solution is suggested for each function, and incorrect solutions and common
errors to be avoided are pointed out.
Obviously, this document cannot embrace every hardware solution or every product that
can be designed. Where the suggested hardware configurations need not be considered
mandatory, the information given should beused as a guide and astarting point for properly
developing your product with the Telit LM960 module.
Information – The integration of the WCDMA/HSPA+/LTE LM960
cellular module within a user application must be done according to
the design rules described in this manual.
Audience
This document is intended for Telit customers, especially system integrators, about to
implement their applications using the Telit LM960 module.
Contact Information, Support
For general contact, technical support services, technical questions and report
documentation errors contact Telit Technical Support at:
[e-mail]
[e-mail]
TS-[email protected]
[e-mail]

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For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments
and suggestions for improvements.
Telit appreciates feedback from the users of our information.

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Text Conventions
Danger –
This information MUST be followed or catastrophic
equipment failure or bodily injury may occur.
Caution or Warning –
Alerts the user to important points about
integrating the module, if these points are not followed, the module and
end user equipment may fail or malfunction.
Tip or Information –
Provides advice and suggestions that may be
useful when integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.

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Related Documents
LM960 SW User Guide, 1VV0301477
LM960 AT Commands Reference Guide, 80568ST10869A
Generic EVB HW User Guide, 1VV0301249
LM960 Interface Board HW User Guide, 1VV0301502
SIM Integration Design Guide Application Note Rev10, 80000NT10001A

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2. GENERAL PRODUCT DESCRIPTION
Overview
The aim of this document is to present possible and recommended hardware solutions
useful for developing a product with the Telit LM960 Mini PCIe module.
LM960 is Telit’s platform for Mini PCIe module for applications, such as M2M applications,
industrial mobile router and table PC, based on the following technologies:
•LTE / WCDMA networks for data communication
•Designed for industrial grade quality
In its most basic use case, LM960 can be applied as a wireless communication front-end
for mobile router products, offering mobile communication features to an external host
CPU through its rich interfaces.
LM960 can further support customer software applications and security features. LM960
provides a software application development environment with sufficient system resources
for creating rich on-board applications. Thanks to a dedicated application processor and
embedded security resources, product developers and manufacturers can create products
that guarantee fraud prevention and tamper evidence without extra effort for additional
security precautions.
LM960 is available in hardware variants as listed in Applicability Table
The designated RF band sets per each variant are detailed in Section 2.2, Product
Variants and Frequency Bands.
Product Variants and Frequency Bands
The operating frequencies in LTE & WCDMA modes conform to the 3GPP specifications.
2.2.1. RF Bands per Regional Variant
This table summarizes the LM960, showing the supported band sets and the supported
band pairs and triple for carrier aggregation.
RF Bands and Carrier Aggregation
LTE FDD LTE TDD HSPA+
Bands 1, 2, 3, 4, 5, 7, 8, 12, 13, 17, 18, 19, 20, 25, 26,
28, 29, 30, 32, 66, 71 38, 39, 40, 41, 42, 46,
48
1, 2, 4, 5, 8,
9, 19
GNSS GPS, GLONASS, BeiDou, Galileo
LTE 2DL carrier aggregation combinations
TBD
LTE 3DL carrier aggregation combinations
TBD

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LTE 4DL carrier aggregation combinations
TBD
LTE 5DL carrier aggregation combinations
TBD
Refer to Chapter 13 for details information about frequencies and bands.
Target market
LM960 can be used for telematics applications where tamper-resistance, confidentiality,
integrity, and authenticity of end-user information are required, for example:
•Mobile router
•Industrial equipment
•Home network
•Internet connectivity
Main features
The LM960 family of industrial grade cellular modules features LTE and multi-RAT module
together with an on-chip powerful application processor and a rich set of interfaces.
The major functions and features are listed below.
Main Features
Function Features
Module •Multi-RAT cellular module for data communication
oLTE FDD/TDD Cat18(DL)/13(UL) (1.2 Gbps/150 Mbps)
oWCDMA up to DC HSPA+, Rel.10
•Support for GPS, GLONASS, BeiDou and Galileo
Audio
subsystem •Support digital audio interface (optional)
Two USIM
ports – dual
voltage
•Support for dual SIM
•Class B and Class C support
•Clock rates up to 4 MHz
Application
processor Application processor to run customer application code
•32 bit ARM Cortex-A7 up to 1.4 GHz running the Linux operating
system

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Function Features
•4Gbit NAND Flash + 2Gbit LPDDR2 MCP is supported to allow
for customer’s own software applications
Interfaces Rich set of interfaces, including:
•USB3.0 – USB port is typically used for:
oFlashing of firmware and module configuration
oProduction testing
oAccessing the Application Processor’s file system
oAT command access
oHigh-speed WWAN access to external host
oDiagnostic monitoring and debugging
oCommunication between Java application environment and
an external host CPU
oNMEA data to an external host CPU
•PCIe(Optional)
•Peripheral Ports – GPIOs
Major software
features •Advanced security features
oBoot integrity of firmware up to customer applications
oDisable/secure re-enable of debug
oEmbedded security
•FOTA (optional)
•Telit Unified AT command set
Form factor Mini PCIe Form factor (50.95x30x2.7mm), accommodating the
multiple RF bands
Environment
and quality
requirements
The entire module is designed and qualified by Telit for satisfying the
environment and quality requirements for use in applications.
Single supply
module The module generates all its internal supply voltages.
RTC The real-time clock is supported.
Operating
temperature Range -40 °C to +85 °C (conditions as defined in Section 2.9.1, Temperature Range)

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Block Diagram
Below figure shows an overview of the internal architecture of the LM960 module.
LM960 Block Diagram
It includes the following sub-functions:
•Application processor, Module subsystem and Location processing with their
external interfaces. These three functions are contained in a single SOC.
•RF front end
•Rich IO interfaces. Depending on which LM960 software features are enabled,
some of its interfaces that are exported through multiplexing may be used
internally and thus may not be usable by the application.
•PMIC with the RTC function inside
TX Output Power
Band Power class
3G WCDMA Class 3 (0.2W)
LTE All Bands Class 3 (0.2W)
RX Sensitivity
Below the 3GPP measurement conditions used to define the RX sensitivity:

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Technology 3GPP Compliance
4G LTE Throughput >95% 10MHz Dual Receiver
3G WCDMA BER <0.1% 12.2 Kbps Dual Receiver
Product Band Typical Rx Sensitivity (dBm) * / **
(LTE BW = 10 MHz)
LM960 LTE FDD B1
LTE FDD B2
LTE FDD B3
LTE FDD B4
LTE FDD B5
LTE FDD B7
LTE FDD B8
LTE FDD B12
LTE FDD B13
LTE FDD B17
LTE FDD B18
LTE FDD B19
LTE FDD B20
LTE FDD B25
LTE FDD B26
LTE FDD B28
LTE FDD B30
LTE FDD B66
LTE TDD B38
LTE TDD B39
LTE TDD B40
LTE TDD B41
LTE TDD B42
LTE TDD B48
LTE FDD B71
TBD
LM960 WCDMA FDD B1 TBD

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WCDMA FDD B2
WCDMA FDD B4
WCDMA FDD B5
WCDMA FDD B8
WCDMA FDD B9
WCDMA FDD B19
* LTE Rx Sensitivity shall be verified by using both (all) antenna ports simultaneously.
** 3.3 Voltage / Room temperature
Mechanical specifications
2.8.1. Dimensions
The LM960 module’s overall dimensions are:
•Length: 50.95 mm, +/- 0.15 mm tolerance
•Width: 30.00 mm, +/- 0.15 mm tolerance
•Thickness: 2.70 mm, +/- 0.15 mm tolerance
2.8.2. Weight
The nominal weight of the LM960 module is TBD grams.
Environmental Requirements
2.9.1. Temperature Range
Note
Operating
Temperature Range –20°C ~ +55°C
This range is defined by 3GPP (the global
standard for wireless mobile communication).
Telit guarantees its modules to comply with all
the 3GPP requirements
and to have full
functionality of the module with in this range.
–40°C ~ +85°C
Telit guarantees full functionality within this
range as well. However, there may possibly
be some performance deviations in this
extended range relative to 3GPP
requirements, which means that some RF
parameters
may deviate from the 3GPP
specification in t
he order of a few dB. For
example: receiver sensitivity or maximum
output power may be slightly degraded.

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Note
Even so, all the functionalities, such as call
connection, SMS, USB communication,
UART activation etc., will be maintained, and
the effect of such degradations will not lead to
malfunction.
Storage and non-
operating
Temperature Range
–40°C ~ +85°C
2.9.2. RoHS Compliance
As a part of the Telit corporate policy of environmental protection, the LM960 complies
with the RoHS (Restriction of Hazardous Substances) directive of the European Union
(EU directive 2011/65/EU).

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3. PINS ALLOCATION
Pin-out
LM960 Pin-out
Pin Signal I/O Function Type Comment
USB HS 2.0 Communication Port
38 USB_D+ I/O USB 2.0 Data Plus Analog
36 USB_D- I/O USB 2.0 Data Minus Analog
USB SS 3.0 Communication and PCIe Port
25 USB_TX_P
PCIE_TX_P O USB 3.0 super-
speed/PCIe transmit
– plus
Analog
23 USB_TX_M
PCIE_TX_M O USB 3.0 super-
speed/PCIe transmit
– minus
Analog
33 USB_RX_P
PCIE_RX_P
I USB 3.0 super-
speed/PCIe receive
– plus
Analog
31 USB_RX_M
PCIE_RX_MI USB 3.0 super-
speed/PCIe receive
– minus
Analog
Peripheral Component Interconnect Express
7 PCIE_CLKREQ_N I/O PCIE reference
clock request signal. 1.8V
11 PCIE_REFCLK_M I PCI Express
differential reference
clock – minus
13 PCIE_REFCLK_P I PCI Express
differential reference
clock – plus