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10 USB HSIC .................................................................................................................................................................55
11 SERIAL PORTS..........................................................................................................................................................56
11.1 MODEM SERIAL PORT 1(USIF0) ...................................................................................................................................57
11.2 MODEM SERIAL PORT 2(USIF1) ...................................................................................................................................59
11.3 RS232 LEVEL TRANSLATION................................................................................................................................................60
12 AUDIO SECTION OVERVIEW ....................................................................................................................................62
12.1 ANALOG VOICE INTERFACE .................................................................................................................................................62
12.1.1 MIC connection ....................................................................................................................................................63
12.1.2 LINE IN Connection...............................................................................................................................................65
12.1.3 EAR Connection ....................................................................................................................................................66
12.2 DIGITAL VOICE INTERFACE..................................................................................................................................................67
12.2.1 Electrical Characteristics ......................................................................................................................................67
12.2.2 CODEC Examples ..................................................................................................................................................67
13 GENERAL PURPOSE I/O ...........................................................................................................................................68
13.1 GPIO LOGIC LEVELS ..........................................................................................................................................................69
13.2 USING A GPIO PAD AS INPUT ...........................................................................................................................................70
13.3 USING A GPIO PAD AS OUTPUT........................................................................................................................................70
13.4 INDICATION OF NETWORK SERVICE AVAILABILITY .....................................................................................................................71
13.5 RTC BYPASS OUT .............................................................................................................................................................72
13.6 EXTERNAL SIM HOLDER IMPLEMENTATION ...........................................................................................................................72
13.7 VAUX POWER OUTPUT.....................................................................................................................................................72
13.8 ADC CONVERTER .............................................................................................................................................................73
13.8.1 Description ...........................................................................................................................................................73
13.8.2 Using ADC Converter ............................................................................................................................................73
14 MOUNTING THE UE910 ON THE APPLICATION ........................................................................................................74
14.1 GENERAL ........................................................................................................................................................................74
14.2 MODULE FINISHING &DIMENSIONS .....................................................................................................................................74
14.3 RECOMMENDED FOOT PRINT FOR THE APPLICATION.................................................................................................................76
14.4 STENCIL ..........................................................................................................................................................................77
14.5 PCB PAD DESIGN..............................................................................................................................................................77
14.6 PCB PAD DIMENSIONS.......................................................................................................................................................78
14.7 SOLDER PASTE..................................................................................................................................................................80
14.7.1 UE910 Solder reflow.............................................................................................................................................80
14.8 PACKING SYSTEM (TRAY)....................................................................................................................................................82
14.9 PACKING SYSTEM (REEL)....................................................................................................................................................84
14.9.1 Carrier Tape Detail ...............................................................................................................................................84
14.9.2 Reel Detail ............................................................................................................................................................85
14.9.3 Packaging Detail ..................................................................................................................................................86
14.10 MOISTURE SENSITIVITY ....................................................................................................................................................86
15 SAFETY RECOMMANDATIONS .................................................................................................................................87
16 CONFORMITY ASSESSMENT ISSUES.........................................................................................................................88
16.1 1999/5/EC DIRECTIVE .....................................................................................................................................................88
16.2 FCC/IC REGULATORY NOTICES............................................................................................................................................91