Texas Instruments bq24740/1EVM User manual

1 Introduction
1.1 EVM Features
User's GuideSLUU284A – June 2007 – Revised October 2008
bq24740/1EVM (HPA206) For Multicell Synchronous
Notebook Charger
Contents1 Introduction ................................................................................................................... 12 Test Summary ................................................................................................................ 43 PCB Layout Guideline ....................................................................................................... 84 Bill of Materials, Board Layout, and Schematics ........................................................................ 8
List of Figures
1 Original Test Setup for HPA206 (bq24740EVM) ........................................................................ 62 Test Setup for HPA206 (bq24740EVM) .................................................................................. 73 Top and Silk Layer ......................................................................................................... 114 Second Layer ............................................................................................................... 125 Third Layer .................................................................................................................. 136 Bottom Layer ................................................................................................................ 147 Bottom Assembly ........................................................................................................... 158 Top Assembly ............................................................................................................... 16
•Evaluation module for bq24740/1•High-efficiency NMOS-NMOS synchronous buck charger with 300-kHz frequency•Battery/adapter to system power selector function•User-selectable 2-cell, 3-cell, or 4-cell Li-ion battery voltage•User-programmable battery regulation voltage with external voltage source (4.2/cell by default)•User-programmable charge current with external voltage source (3 A by default)•User-programmable input current limit with external voltage source (4.5 A for bq24740, 4 A forbq24741 by default)•Pin-programmable interface for control and status communications with host•AC adapter operating range 18 V to 22 V•LED indication for control and status signals•Test points for key signals available for testing purpose. Easy probe hook-up•Jumpers available. Easy to change connections
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1.2 General Description
1.3 I/O Description
Introduction www.ti.com
The bq24740/1 evaluation module is a complete charger module for evaluating a multicell synchronousnotebook charge and path selection solution using the bq24740/1 devices. It is designed to deliver up to 6A of charge current to Li-ion or Li-polymer applications. The charge current is programmable by externalvoltage input.
The bq24740/1 has a highly integrated battery charge controller designed to work with external hostcommands. The battery voltage, charge current, input current limit, and other system parameters are pinprogrammable.
The dynamic power management (DPM) function modifies the charge current depending on system loadconditions, avoiding ac adapter overload.
High-accuracy current sense amplifiers enable accurate measurement of the ac adapter current, allowingmonitoring of overall system power.
For details, see the bq24740 data sheet (SLUS736 ), and the bq24741 data sheet (SLUS875 ).
Jack Description
J1–ACPWR AC adapter, positive outputJ1–PGND AC adapter, negative outputJ2–1 } BYPASS BYPASS drive signal on EVM} BYPASS_EXJ2–2 Gate of Q2J2–3 External BYPASS drive signalJ3–1 } ACDRV ACDRV drive signal on EVM} ACDRV_EXJ3–2 Gate of Q1J3–3 External ACDRV drive signalJ4–BYPASS_EX External BYPASS drive signalJ4–ACDRV_EX External ACDRV drive signalJ4–GND GroundJ5–1 } BATDRV_EX External ACDRV drive signal} BATDRVJ5–2 Gate of Q3J5–3 ACDRV drive signal on EVMJ6–VREF IC REFERENCE VOLTAGE vrefJ6–VDAC VDAC pinJ6–VDACEXT External VDAC voltageJ6–GND GroundJ7–PULLUP Pullup voltage sourceJ7–LEDPWR LED pullup power line
J8– EXTPWR EXTPWR pinJ8–GND GroundJ8–BAT Connected to battery packJ8–SYS Connected to systemJ9–1 } 4.2V REG REGN pinJ9–2 VADJ pinJ10–VEXT External power supply, positive outputJ10–GND External power supply, negative outputJ11– CHGEN CHGEN pin for bq24740, CE pin for bq24741J11– IADSLP IADSLP pin or bq24740, TRICKLE pin for bq24741J11–CELLS CELLS pinJ12–VADJ VADJ pin
2bq24740/1EVM (HPA206) For Multicell Synchronous Notebook Charger SLUU284A – June 2007 – Revised October 2008Submit Documentation Feedback

1.4 Control and Key Parameters Setting
www.ti.com Introduction
Jack Description
J12–ACSET ACSET pinJ12–SRSET SRSET pinJ13–VPULUP Pullup voltage sourceJ13–CELLS CELLS pin outputJ13–GND GroundJ14– LOPWRMODE LPMD pin for bq24740, LPMOD pin for bq24741.J14–IADPTF R25 terminal connected to C18J14–VREF IC reference voltage VREFJ14– DPMDET DPMDET pinJ15–BYPASS BYPASS pinJ15–LED LED driveJ16–EXT BATDRV External BATDRV drive signalJ16–GND GroundJ17–ACDRV ACDRV pinJ17–LED LED driveJ18–BATDRV BATDRV pinJ18–LED LED driveJ19–VPULUP Pullup voltage sourceJ19– IADSLP IADSLP pin output for bq24740, TRICKLE pin output for bq24741J20–VPULUP Pullup voltage sourceJ20– CHGEN CHGEN pin output for bq24740, CE pin output for bq24741J21–VREF IC reference voltage VREFJ21–VDAC VDAC pin (#11)J21–VDACEXT External VDAC voltage
Jack Description Factory Setting
J2 BYPASS drive setting Jumper on 1-21-2: Use onboard BYPASS drive2-3: Use external BYPASS driveJ3 ACDRV drive setting Jumper on 1-21-2: Use onboard ACDRV drive2-3: Use external ACDRV driveJ5 BATRDRV drive setting Jumper on 2-31-2: Use External BARDRV drive2-3: Use onboard BATDRV driveJ7 The pullup power source supplies the LEDs when on. LED has no power source when Jumper Onoff.J9 Connect REGN to VADJ when on Jumper OffJ13 Number of cells selection Jumper on 2-3 (3 cells)1-2 (PULLUP-CELLS) : 4 cells2-3 (GND-LO) : 3 cellsOpen: 2 cellsJ15 The conduction of the BYPASS MOSFET is indicated by LED when on. Jumper OnJ17 The conduction of the AC MOSFET is indicated by LED when on. Jumper OnJ18 The conduction of the battery MOSFET is indicated by LED when on. Jumper OnJ19 IADSLP pulled to high when on for bq24740, TRICKLE pulled to high when on for Jumper Offbq24741
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1.5 Recommended Operating Conditions
2 Test Summary
2.1 Definitions
Test Summary www.ti.com
Jack Description Factory Setting
J20 Disable charge process when on for bq24740, enable charge process when on for Jumper On for bq24740, Off forbq24741 bq24741J21 VDAC voltage source setting Jumper on 1-2 (VREF andVDAC)1-2 : Connect VREF to VDAC2-3 : Connect external voltage source to VDAC
SYMBOL DESCRIPTION MIN TYP MAX UNIT Notes
V
IN
Supply voltage Input voltage from ac adapter input 18 19 22 VV
BAT
Battery voltage Voltage applied at VBAT terminal of J8 6 7–16.8 20 VMaximum input current from ac adapterI
AC
Supply current 0 4.5 AinputI
chrg
Charge current Battery charge current 2 3 or 4 6 AOperating junctionT
J
0 125 °Ctemperature range
This procedure details how to configure the HPA206 evaluation board. On the test procedure the followingnaming conventions are followed. See the HPA206 schematic for details.
VXXX : External voltage supply name (VADP, VBT, VSBT)LOADW: External load name (LOADR, LOADI)V(TPyyy): Voltage at HPA206 internal test point TPyyy. For example, V(TP12) means the voltageat TP12.V(Jxx): Voltage at HPA206 jack terminal Jxx.V(TP(XXX)): Voltage at test point XXX. For example, V(ACDET) means the voltage at the test pointwhich is marked as ACDET.V(XXX, YYY): Voltage across point XXX and YYY.I(JXX(YYY)): Current going out from the YYY terminal of jack XX.Jxx(BBB): Terminal or pin BBB of jack xxJxx ON : HPA206 internal jumper Jxx terminals are shortedJxx OFF: HPA206 internal jumper Jxx terminals are openJxx (-YY-) ON: HPA206 internal jumper Jxx adjacent terminals marked as YY are shortedMeasure:→A,B Check specified parameters A, B. If measured values are not within specified limits theunit under test has failed.Observe →A,B A,B Observe if A, B occur. If they do not occur, the unit under test has failed.
Assembly drawings have location for jumpers, test points and individual components.
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2.2 Equipment
2.2.1 Power Supplies
2.2.2 Load #1
2.2.3 Load #2
2.2.4 Meters
2.3 Equipment Setup
www.ti.com Test Summary
Power supply #1 (PS#1): a power supply capable of supplying 20 V at 5 A is required.Power supply #2 (PS#2): a power supply capable of supplying 5 V at 1 A is required.Power supply #3 (PS#3): a power supply capable of supplying 20 V at 1 A is required.
A 30-V (or above), 5-A (or above) electronic load that can operate at constant current mode
A HP 6060B 3- to 60-V/0-to 60-A, 300-W system DC electronic load or equivalent
Seven Fluke 75 multimeters, (equivalent or better)or four equivalent voltage meters and three equivalent current meters.
The current meters must be capable of measuring a 5-A+ current.
A. Set the power supply #1 for 0 V ±100 mVDC, 5 V ±0.1-A current limit and then turn off supply.B. Connect the output of power supply #1 in series with a current meter (multimeter) to J1 (ACPWR,GND).
C. Connect a voltage meter across J1 (ACPWR, GND).D. Set the power supply #2 for 3.3 V ±100 mVDC, 1 ±0.1-A current limit and then disable the output.E. Set the power supply #3 for 10.5 V ±100 mVDC, 1 ±0.1-A current limit and then disable the output.F. Connect the output of power supply #2 to J10 (VEXT, GND).G. Turn off Load #1.H. Turn off Load #2.I. Connect a voltage meter across J8 (BAT, GND).J. Connect a voltage meter across J8 (SYS, GND).K. J2 (BYPASS): ON, J3 (ACDRV): ON, J5 (BATDRV): ON, J7: ON, J21 (VREF, VDAC): ON, J9: OFF,J19: OFF, J13 (CELLS, GND): ON, J15: ON, J17: ON, J18: ON. J20: ON (for bq24740 only), OFF (Forbq24741 only).
After the preceding steps, the test setup for HPA206 (bq24740EVM) is shown in Figure 1 .
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BQ24740 EVM
ACPWR
J1
GND
SYS
J8
GND
BAT
J20
/EXTPWR
APPLICATION CIRCUIT
PH
BAT SYS
ACPWR
J6
J11
J12
J15
J2
U1
J5
J7
J17 J18
J14
J10
J16
J4
J3
J21 J9 J19 J13
BQ24740 EVM
ACPWR
J1
GND
SYS
J8
GND
BAT
J20
/EXTPWR
APPLICATION CIRCUIT
PH
BAT SYS
ACPWR
J6
J11
J12
J15
J2
U1
J5
J7
J17 J18
J14
J10
J16
J4
J3
J21 J9 J19 J13
J8
V
Iin
I
Power
supply #1 V
V
Power
supply #2
2.4 Procedure
2.4.1 AC Adapter Detection Threshold
2.4.2 Selection of Regulation Voltage
Test Summary www.ti.com
Figure 1. Original Test Setup for HPA206 (bq24740EVM)
1. Make sure the Equipment Setup steps of the previous section are followed.2. Enable the output of PS#2.3. Turn on PS#1.Measure →V(J8(VSYS)) = 0 ±500 mVMeasure →V(TP(VREF)) = 0 ±1 VMeasure →V(TP(REGN)) = 0 V ±500 mV4. Increase the output voltage of PS#1 until D7 ( EXTPWR) is on, but do not exceed 20 V.Measure →V(TP(ACDET)) = 2.4 V ±200 mVMeasure →V(J1(POS)) = 17.9 V ±1 VMeasure →V(J8(SYS)) = 17.9 V ±1 VMeasure →V(TP(VREF)) = 3.3 V ±200 mVMeasure →D2 (BYPASS) on. D3 (ACDRV) on.Observe →D5 ( CHGEN) off (for bq24740 only), D5 (CE) on (for bq24741 only).
1. Increase the voltage of PS#1 until V(J1(POS)) = 19 V ±0.1 V.Measure →V(J8(BAT, GND)) = 0 V ±2 VUninstall J20 enable the charging (for bq24740 only)Observe →D5 ( CHGEN) onInstall J20 enable the charging (for bq24741 only)Observe →D5 (CE) offMeasure →V(TP(REGN)) = 6 V ±500 mVMeasure →V(J8(BAT)) = 12.6 V ±200 mV2. Install J13 (CELLS, VPULUP)Measure →V(J8(BAT)) = 16.8 V ±200 mV3. Install J13(CELLS, GND)Measure →V(J8(BAT)) = 12.6 V ±200 mV
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2.4.3 Charge Current and AC Current Regulation (DPM)
BQ24740 EVM
ACPWR
J1
GND
SYS
J8
GND
BAT
J20
/EXTPWR
APPLICATION CIRCUIT
PH
BAT SYS
ACPWR
J6
J11
J12
J15
J2
U1
J5
J7
J17 J18
J14
J10
J16
J4
J3
J21 J9 J19 J13
BQ24740 EVM
ACPWR
J1
GND
SYS
J8
GND
BAT
J20
/EXTPWR
APPLICATION CIRCUIT
PH
BAT SYS
ACPWR
J6
J11
J12
J15
J2
U1
J5
J7
J17 J18
J14
J10
J16
J4
J3
J21 J9 J19 J13
J1
V
Iin
I
Power
supply #1
Power
supply #2
V
V
ILoad
#1
Load
#2
I
V
V
ILoad
#1
Load
#2
I
2.4.4 Power Path Selection
www.ti.com Test Summary
1. Install J20 disable the charging (for bq24740 only). Uninstall J20 disable the charging (for bq24741only).
2. Connect the Load #2 in series with a current meter (multimeter) to J8 (BAT, GND). Ensure that avoltage meter is connected across J8 (BAT, GND). Turn on the Load #2. Use the constant voltagemode. Set the output voltage to 10.5 V.3. Connect the output of the Load #1 in series with a current meter (multimeter) to J8 (SYS, GND).Ensure that a voltage meter is connected across J8 (SYS, GND). Turn on the power of the Load #1.Set the load current to 4 A ±50 mA (for bq24740 only) or 3.4A ±50mA (for bq24741 only), but disablethe output. The setup is now like Figure 2 for HPA206. Ensure that Ibat = 0 A ±10 mA and Isys = 0 A±10 mA.
Figure 2. Test Setup for HPA206 (bq24740EVM)
4. Uninstall J20 Enable the charging (for bq24740 only).Observe →D5 ( CHGEN) onInstall J20 Enable the charging (for bq24741 only).Observe →D5 (CE) off.5. Measure →Ibat = 3000 mA ±200 mA6. Enable the output of the Load #1.Observe →D6 (DPMDET) onMeasure →Isys = 4000 mA ±200 mA, Ibat = 1000 mA ±500 mA, Iin = 4500 mA ±400 mA (for bq24740only)
Measure →Isys = 3400 mA ±200mA, Ibat = 1000 mA ±500 mA, Iin = 4000 mA ±400 mA (for bq24741only)
7. Turn off the Load #1.Measure →Isys = 0 ±100 mA, Ibat = 3000 mA ±200 mA
1. Install J20. (Disable the charging) (for bq24740 only).Observe →D5 ( CHGEN) off.Uninstall J20 disable the charging (for bq24741 only)Observe →D5 (CE) on2. Replace Load #2 and current meter with PS#3. Ensure that a voltage meter is connected across J8(BAT, GND). Enable the output of the PS #3. Ensure that the output voltage is 10.5 V ±500 mV.3. Measure →V(J8(SYS)) = 19 V ±1 V (adapter connected to system)Observe →D2(BYPASS) on, D3 (ACDRV) on, D4 (BATDRV) off4. Turn off PS#1.Measure →V(J8(SYS)) = 10.5 V ±1 V (battery connected to system)5. Observe →D2(BYPASS) off, D3 (ACDRV off, D4 (BATDRV) on.
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3 PCB Layout Guideline
4 Bill of Materials, Board Layout, and Schematics
4.1 Bill of Materials
PCB Layout Guideline www.ti.com
1. It is critical that the exposed power pad on the backside of the bq24740/1 package be soldered to thePCB ground. Ensure that sufficient thermal vias are right underneath the IC, connecting to the groundplane on the other layers.2. Route the control stage and the power stage separately. At each layer, the signal ground and thepower ground are connected only at the power pad.3. AC current sense resistor must be connected to ACP and ACN with a Kelvin contact. Minimize thearea of this loop. Place the decoupling capacitors for these pins as close to the IC as possible.4. Connect the charge current sense resistor to SRP, SRN with a Kelvin contact. Minimize the area of thisloop. Place the decoupling capacitors for these pins as close to the IC as possible.5. Place the decoupling capacitors for PVCC, VREF, REGN underneath the IC (on the bottom layer), andmake the interconnections to the IC as short as possible.6. Place the decoupling capacitors for BAT, IADAPT close to the corresponding IC pins, and make theinterconnections to the IC as short as possible.7. Decoupling capacitor(s) for the charger input must be placed close to Q4 drain and Q5 source.
bq24740 bq24741 RefDes Value Description Size Part Number MFR-001 -002
0 0 C1, C3, C11, Open Capacitor, Ceramic 0805 STD STDC18
0 0 C12, C25 Open Capacitor, Ceramic 1206 STD STD
2 2 C13, C32 10uF Capacitor, Ceramic, 25V, 1206 STD STDX5R, 10%
4 4 C14, C15, 10uF Capacitor, Ceramic, 25V, 1210 GRM32DR61E106K MurataC28, C29 X5R, 10% A12L
1 1 C19 2.2uF Capacitor, Ceramic, 25V, 1210 STD STDX5R, 10%
5 5 C2, C7, C10, 0.1uF Capacitor, Ceramic, 50V, 0805 STD STDC16, C27 X7R, 10%
2 2 C22, C23 10nF Capacitor, Ceramic, 50V, 0603 STD STDX7R, 10%
0 0 C24 Open Capacitor, Ceramic 1210 STD STD
0 0 C31 Open Capacitor, Ceramic 1210 STD STD
1 1 C4 1uF Capacitor, Ceramic, 25V, 0603 GRM188R61E105K muRataX5R, 10% A12D
1 1 C5 100pF Capacitor, Ceramic, 50V, 0603 STD STDC0G, 5%
3 3 C6, C8, C27 1uF Capacitor, Ceramic, 25V, 0805 GRM216R61E105K muRataX5R, 10% A12D
8 8 C9, C17, 0.1uF Capacitor, Ceramic, 50V, 0603 STD STDC20, C21, X7R, 10%C26, C30,C33, C34
1 1 D1 BAT54 Diode, Schottky, 200-mA, SOT23 BAT54 Vishay-Liteon30-V
6 6 D2, D3, D4, 160-1183-1- Diode, LED, Green, 2.1-V, 0603 160-1183-1-ND Lite OnD5, D7, D8 ND 20-mA, 6-mcd
1 1 D6 160-1181-1- Diode, LED, Red, 1.8-V, 0603 160-1181-1-ND Lite OnND 20-mA, 20-mcd
1 1 D9 MBRS130TR Diode, Schottky, 1A, 30V SMB MBRS130TR IR
1 1 J1 D120/2DS Terminal Block, 2-pin, 15-A, 0.40 x 0.35 inch D120/2DS OST5.1mm
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www.ti.com Bill of Materials, Board Layout, and Schematics
2 2 J10, J16 ED555/2DS Terminal Block, 2-pin, 6-A, 0.27 x 0.25 inch ED555/2DS OST3.5mm
5 5 J2, J3, J5, PTC36SAAN Header, 3-pin, 100mil 0.100 inch x 3 PTC36SAAN SullinsJ13, J21 spacing, (36-pin strip)
3 3 J4, J11, J12 ED555/3DS Terminal Block, 3-pin, 6-A, 0.41 x 0.25 inch ED555/3DS OST3.5mm
2 2 J6, J14 ED555/4DS Terminal Block, 4-pin, 6-A, 0.55 x 0.25 inch ED555/4DS OST3.5mm
7 7 J7, J9, J15, PTC36SAAN Header, 2-pin, 100mil 0.100 inch x 2 PTC36SAAN SullinsJ17, J18, spacing, (36-pin strip)J19, J20
1 1 J8 D120/4DS Terminal Block, 4-pin, 15-A, 0.80 x 0.35 inch D120/4DS OST5.1mm
1 0 L1 8.2uH Inductor, SMT, 16A, 0.51 x 0.51 inch IHLP5050CE8R2M0 Vishay24.8milliohm 1
0 1 L1 10uH Inductor, SMT, 16A, 0.51 x 0.51 inch IHLP5050CE10RM0 Vishay24.8milliohm 1
3 3 Q1, Q2, Q3 Si4435DY MOSFET, P-ch, 30-V, 8.0-A, SO8 Si4435DY Siliconix20-milliohm
3 3 Q12, Q14, TP0610K Mosfet, P-Ch, 60V, Rds 6 SOT-23 TP0610K Vishay-SiliconixQ16 ohms, Id 185 mA
2 2 Q4, Q5 FDS6680A Transistor, MOSFET, SO8 FDS6680A FairchildNChan, 30V, 12.5A, Rds 9.5milliohm
12 12 Q6, Q7, 2N7002DICT MOSFET, N-ch, 60-V, SOT23 2N7002DICT Vishay-LiteonQ10, Q13, 115-mA, 1.2-OhmsQ15, Q17,Q18, Q19,Q20, Q21,Q22, Q23
3 3 Q8, Q9, Q11 NDS0605 MOSFET,P-ch, -60 V, SOT-23 NDS0605 Vishay180-mA, 5 Ohms
1 1 R1 430K Resistor, Chip, 1/16W, 1% 0603 STD STD
2 2 R10, R50 4 Anti-surge Resistor, Chip, 1210 ERJ-P14J4R0U Panasonic - ECG1/2W, 5%
8 8 R11, R3, R4, 10K Resistor, Chip, 1/16W, 1% 0402 STD STDR18, R19,R22, R44,R48
1 1 R12 0.01 Resistor, Chip, 1/2W, 1% 2010 STD STD
1 0 R13 0.01 Resistor, Chip, 1/2W, 1% 2010 STD STD
0 1 R13 0.02 Resistor, Chip, 1/2W, 1% 2010 STD STD
2 2 R14, R15 10K Resistor, Chip, 1/16W, 5% 0603 STD STD
3 3 R16, R45, 100K Resistor, Chip, 1/10W, 0.1% 0805 STD STDR49
1 1 R2 66.5K Resistor, Chip, 1/16W, 1% 0603 STD STD
12 12 R20, R5, 100K Resistor, Chip, 1/16W, 5% 0402 STD STDR17, R21,R23, R26,R28, R29,R31, R32,R34, R35
1 1 R24 68K Resistor, Chip, 1/10W, 0.1% 0805 STD STD
2 2 R25, R43 0 ohm Resistor, Chip, 1/16W, 5% 0402 STD STD
1 0 R27 43K Resistor, Chip, 1/10W, 0.1% 0805 STD STD
0 1 R27 150K Resistor, Chip, 1/10W, 0.1% 0805 STD STD
7 7 R30, R33, 2.2K Resistor, Chip, 1/16W, 5% 0603 STD STDR36, R38,R39, R41,R42
3 3 R37, R40, 20K Resistor, Chip, 1/16W, 5% 0603 STD STDR47
1 0 R46 82K Resistor, Chip, 1/10W, 0.1% 0805 STD STD
0 1 R46 66.5K Resistor, Chip, 1/10W, 0.1% 0805 STD STD
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Bill of Materials, Board Layout, and Schematics www.ti.com
1 0 R6 30K Resistor, Chip, 1/16W, 1% 0402 STD STD
0 1 R6 97.6K Resistor, Chip, 1/16W, 1% 0402 STD STD
1 1 R7 200K Resistor, Chip, 1/16W, 1% 0402 STD STD
1 0 R8 49.9K Resistor, Chip, 1/16W, 1% 0402 STD STD
0 1 R8 73.2K Resistor, Chip, 1/16W, 1% 0402 STD STD
1 0 R9 1.4M Resistor, Chip, 1/16W, 1% 0402 STD STD
12 12 SJ1,SJ2,SJ3 929950-00 Shorting jumpers, 2-pin, 929950-00 3M/ESD,SJ4,SJ5,SJ 100mil spacing,6,SJ7,SJ8,S
J9,SJ10,SJ1
1,SJ12
4 4 6-32 NYL nuts
4 4 ST1,ST2,ST 4816 STANDOFF M/F HEX 6-32 sf_thvt_325_rnd 4816 Keystone3,ST4 NYL .500"
4 4 TP1, TP2, 131-4244-00 Adaptor, 3.5-mm probe clip ( 0.200 inch 131-4244-00 TektronixTP27, TP28 or 131-5031-00)
11 11 TP4, TP5, 5002 Test Point, White, Thru Hole 0.100 x 0.100 5002 KeystoneTP7, TP8, Color Keyed inchTP9, TP10,
TP13, TP15,TP16, TP17,TP18
2 2 TP6, TP26 5001 Test Point, Black, Thru Hole 0.100 x 0.100 5001 KeystoneColor Keyed inch
1 0 U1 BQ24740RH IC, Battery Charge QFN-28 BQ24740RHD TID Controller/Selector w/DPM
0 1 U1 BQ24741RH IC, Battery Charge QFN-28 BQ24741RHD TID Controller/Selector w/DPM
1 1 -- HPA206 PCB, 4 In ×4 In ×0.062 In PCB Any
Notes: 1. These assemblies are ESD sensitive, ESD precautions shall be observed.2. These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.3. These assemblies must comply with workmanship standards IPC-A-610 Class 2.4. Ref designators marked with an asterisk ('**') cannot be substituted. All other components can be substituted with equivalent MFG'scomponents.
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4.2 Board Layout
www.ti.com Bill of Materials, Board Layout, and Schematics
Figure 3. Top and Silk Layer
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Bill of Materials, Board Layout, and Schematics www.ti.com
Figure 4. Second Layer
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www.ti.com Bill of Materials, Board Layout, and Schematics
Figure 5. Third Layer
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Bill of Materials, Board Layout, and Schematics www.ti.com
Figure 6. Bottom Layer
bq24740/1EVM (HPA206) For Multicell Synchronous Notebook Charger14 SLUU284A – June 2007 – Revised October 2008Submit Documentation Feedback

www.ti.com Bill of Materials, Board Layout, and Schematics
Figure 7. Bottom Assembly
SLUU284A – June 2007 – Revised October 2008 bq24740/1EVM (HPA206) For Multicell Synchronous Notebook Charger 15Submit Documentation Feedback

Bill of Materials, Board Layout, and Schematics www.ti.com
Figure 8. Top Assembly
bq24740/1EVM (HPA206) For Multicell Synchronous Notebook Charger16 SLUU284A – June 2007 – Revised October 2008Submit Documentation Feedback

4.3 Schematics
www.ti.com Bill of Materials, Board Layout, and Schematics
SLUU284A – June 2007 – Revised October 2008 bq24740/1EVM (HPA206) For Multicell Synchronous Notebook Charger 17Submit Documentation Feedback

Bill of Materials, Board Layout, and Schematics www.ti.com
bq24740/1EVM (HPA206) For Multicell Synchronous Notebook Charger18 SLUU284A – June 2007 – Revised October 2008Submit Documentation Feedback

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