Texas Instruments BQ25638 Series User manual

EVM User's Guide: BQ25638EVM
BQ25638x Evaluation Module
Description
The BQ25638EVM evaluation module (EVM) is a
complete evaluation system for the BQ25638 IC, a
buck single-cell battery charger with an input range of
3.9 V - 18 V and NVDC power path management.
The BQ25638EVM has a max input of 18 V and a
max charge current of 5 A.
Get Started
1. Order the EVM on ti.com.
2. Order the EV2400 to communicate with the EVM.
3. Download the BQ25638 BQZ file.
4. Download the BQ25638 EVM design files on
ti.com.
Features
• Narrow VDC (NVDC) power path management for
powering the systems and charging the battery.
• Supports I2C communication for systems
configuration and status reporting.
• Test points for key signals available for testing
purposes.
• Jumpers for easy configuration.
• One push-button for wake-up and reset input with
adjustable timers.
• Charge status (STAT) and Power Good (PG)
LEDS for charging monitoring.
• Connections for EV2400.
Applications
•Gaming and computer accessories
•Smart phone, tablet
•IP camera, EPOS
•Portable medical equipment
BQ25638EVM Hardware Board
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1 Evaluation Module Overview
1.1 Introduction
The BMS068 evaluation module (EVM) is a complete charger module for evaluating the BQ25638x devices. The
BQ25638x are I2C-controlled single-cell chargers with NVDC Power Path Management, Integrated ADC, and
OTG Output.
This user's guide provides detailed testing instructions for the BQ25638 evaluation modules (EVM). Also
included are descriptions of the necessary equipment, equipment setup, and procedures. The reference
documentation contains the printed-circuit board layouts, schematics, and the bill of materials (BOM).
Throughout this user's guide, the abbreviations EVM, BQ25638xEVM, BMS068, and the term evaluation module
are synonymous with the BMS068 evaluation module, unless otherwise noted.
Caution
Caution: Hot surface.
Contact can cause burns.
Do not touch!
1.2 Kit Contents
The kit includes the following:
• 1 BQ25638 EVM
1.3 Specifications
Table 1-1 lists the recommended operating conditions for this EVM.
Table 1-1. Recommended Operating Conditions
Symbol Description Min Typ Max Unit
VVBUS, VVAC Input voltage applied to VBUS pin 3.9 18.0 V
VBAT Battery voltage applied to BAT pin 4.8 V
IVBUS Input current into VBUS 3.2 A
ISW Output current from SW flowing to SYS pin load
and battery at BAT pin
5.0 A
IBAT Fast charging current into battery at BAT pin 5.0 A
Continuous RMS discharge current through internal
BATFET
7 A
1.4 Device Information
This EVM does not include the EV2400 or USB2ANY interface boards. To evaluate the EVM, an EV2400 must
be ordered separately to evaluate the EVM with the BQ25638 bqz GUI.
For detailed features and operation, see Table 1-2 for a list of devices and the corresponding data sheets.
Table 1-2. Device Data Sheets
Device Data Sheet EVM Label
BQ25638 SLUSF18 BQ25638EVM
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2 Hardware
2.1 I/O Information
Table 2-1 lists the input and output connections available on this EVM and their respective descriptions.
Table 2-1. EVM I/O Connections
Jack Description
J1(2) - VIN Positive rail of the charger input voltage
J1(1) - GND Ground
J2(1) - SYS Positive rail of the charger system output voltage,
typically connected to the system load
J2(2) - GND Ground
J3(1) - VPMID Positive rail of the charger output voltage for power
bank applications in reverse boost mode (OTG).
This output also shares the rail with the VIN input
rail in forward buck mode
J3(2)-GND Ground
J4(1) - BAT+ Positive rail of the charger battery input, connected
to the positive terminal of the external battery
J4(2) -
TS
Connection available for external thermistor if
required
J4(3) - GND Ground
J5 Input source Micro B USB port
J6 I2C connector for the USB2ANY interface board
J7 I2C connector for the EV2400 interface board
2.2 Jumper Information
Table 2-2 lists the jumper and shunt installations available on this EVM and their respective descriptions.
Table 2-2. EVM Jumper Shunt and Switch Installation
Jack Description BQ25638 Setting
JP1 /INT pull-up. Installed
JP2 SCL pull-up rail. not required if using EV2400. Installed
JP3 SDA pull-up rail. not required if using EV2400. Installed
JP4 I/O Pullup rail selection. Selection has either BAT or SYS as the pullup rail. Installed
Pullup to SYS
JP5 D-_ILIM to 2.2 kohm resistor. Not Installed
JP6 Micro B USB input D- connection to charger D- pin. Not Installed
JP7 PG pin LED indicator connection. On PG enabled chargers, this indicates the Power Good status. Installed
JP8 STAT pin LED indicator connection. This indicates the current charger status. Installed
JP9 Micro B USB input D+ connection to charger D+ pin. Not Installed
JP10 USB2ANY pull-up rail. Not required if using EV2400. Installed
JP11 TS resistor divider pull-up rail. Short pins 1-2
JP12 Charger D+ pin and charger D- pin short connection. Connect this on D+/D- detection enabled
chargers to simulate the connection of a DCP-type USB port as defined by USB BC1.2 and set
IINDPM register to highest setting.
Not Installed
JP13 Connect 10 kohm in parallel with TS resistor network to simulate a battery at 25 C. Disconnect if
using external thermistor.
Installed
JP14 CE pin connection to ground to enable charging. When removed, CE pin pulls up to disable charge. Installed
JP15 D-_ILIM to 3.32 kohm resistor. Not Installed
JP16 D-_ILIM to ground. Installed
S1 QON control switch. Press either for exiting Shipping Mode or System Reset. Default Off
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2.3 Equipment
This section includes a list of supplies required to perform tests on this EVM.
1. Power Supplies: Power Supply #1 (PS #1): A power supply capable of supplying 5 V at 3.5 A is required.
While this part can handle larger voltage and current, the part is not necessary for this procedure.
2. Load #1 for simulating a battery: 4-Quadrant Supply, Constant Voltage < 4.5 V) "Kepco" Load, BOP,
20-5M, DC 0 to ±20 V, 0 to ±5 A (or higher)
Alternative Option: A 0–20V/0–3.5 A, > 30-W DC electronic load set in a constant voltage loading mode
3. Load #2 for simulating a load at SYS or load at VBUS in reverse/OTG mode: Electronic or Resistive
Load capable sinking up to 5-A from up to 9 V (or higher)
4. Meters: 4x "Fluke 75" multi-meters, (equivalent or better).
Alternative Option: (2x) equivalent voltage meters and (2x) equivalent 5-A or higher rated current meters.
5. Computer: A Windows 10 based computer with at least one USB port and a USB cable. Must have the
latest version of Battery Management Studio installed.
6. USB-TO-GPIO Communication Kit: EV2400 USB-based PC interface board.
7. Software: BQStudio software with latest .bqz file for BQ25638x provided by Texas Instruments. Download
and install bqStudio from https://www.ti.com/tool/BQSTUDIO.
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2.4 Hardware Setup
Use the following list to set up the EVM testing equipment:
1. Review EVM jumper connections in Table 2-2.
2. Set PS #1 for 5-V DC, 2-A current limit and then turn off the supply.
3. Connect the output of PS#1 in series with a current meter to J1 (VBUS and PGND).
4. Connect a voltage meter across TP10 (VBUS) and TP29 (PGND), or across J1.
5. Turn on Load #1, set to constant voltage mode, and output to 2.5-V. Disable Load. Connect Load in series
with a current meter (multimeter), ground side, to J4 (BAT and PGND) as shown in Figure 2-1 in not using a
source meter with current measuring capabilities.
6. Connect a voltage meter across TP13 (BAT) and TP27 (PGND), or across J4-3 and J4-1 as in Figure 2-1.
7. Connect a voltage meter across TP14 (SYS) and TP27 (PGND), or across J2-1 and J2-2 as in Figure 2-1.
8. Connect a voltage meter across TP12 (PMID) and TP29 (PGND), or across J3-1 and J3-2 as in Figure 2-1.
9. Connect the EV2400 USB interface board to the computer with a USB cable and from I2C port to J5 with the
4-pin cable as in Figure 2-1.
10. Install shunts as shown in Table 2-2. Note that the shunts in Figure 2-1 are not necessarily installed per the
table.
Power Supply #1
EV2400
4-pin Connector
USB
+
±Load #1
+
±
+
±
VSYS
VBAT
>+
±
Figure 2-1. Test Setup for BQ25638x EVM
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3 Software
3.1 Software Setup
Use the following to set up the EVM testing software:
1. On the computer connected to the EV2400 interface board, launch Battery Management Studio (BQStudio).
Select Charger as seen in Figure 3-1.
Figure 3-1. BQStudio Device Type Selection Window
2. Select the appropriate configuration file based on the device BQ25638x from the window shown in Figure
3-2.
Figure 3-2. BQStudio Charger Selection Window (choose Chargerxxbq25638x.bqz)
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3. Choose , on the window that appears, and the main window of the BQ25638x EVM
software appears, as shown in Figure 3-3.
Figure 3-3. Main Window of BQ25638x EVM Software
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3.2 Test Procedure
3.2.1 Initial Power Up
Use the following steps for enabling the EVM test setup:
1. Make sure that Section 2.4 steps have been followed.
2. Make sure that Section 3.1 steps have been followed.
3. Turn on PS #1:
•Measure → VSYS (SYS-TP19 and PGND-TP21) = 3.70V ±0.2V
Note
Completely disconnect Load #1 from BATTERY connections if different value is seen.
3.2.2 I2C Register Communication Verification
Use the following steps for communication verification :
1. In the EVM software, click the button
• Verify that the GUI reads in the top right corner.
Note
If the device reads verify Section 2.4 and Section 3.2.1 steps have been
followed.
2. In the Field View (see Figure 3-3), make the following changes as necessary:
• Set
• Set
• Set
• Set
• Set
• Set
• Set
• Check
• Uncheck
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3.2.3 Charger Mode Verification
Use the following steps for charger mode verification:
1. PS #1 is on from Section 3.2.1. In the EVM software, click twice.
• Verify that all Fault statuses read Normal.
2. To confirm SYS voltage regulation, enable Load #1 (see Section 2.4) and take DMM measurements as
follows:
•Measure → VSYS (SYS-TP14 and PGND-TP27 or TP29) = 3.65V ±0.3V.
•Measure → VBAT (BAT-TP13 and PGND-TP27 or TP29) = 2.5V ±0.2V.
•Measure → IBAT = 200 mA ±50mA.
3. To confirm battery charge current regulation, change Load #1 to 3.7V and take DMM measurements as
follows:
•Measure → VSYS (SYS-TP14 and PGND-TP27 or TP29) = 3.8V ±0.3V.
•Measure → VBAT (BAT-TP13 and PGND-TP27 or TP29) = 3.7V ±0.2V.
•Measure → IBAT = 480 mA ±100mA.
4. To confirm input current limit operation, in the EVM software on the 16-bit tab, set fast charge current to 1040
mA and then take DMM measurement ( or PS #1 measurement if accurate) as follows:
•Measure → IIN = 500 mA ±200mA.
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3.2.4 Boost Mode Verification
Use the following steps for boost mode verification:
1. Turn off and disconnect PS #1.
2. Set Load #1, the battery simulator, to 3.7V and 2 A current limit.
Note
If Load #1 connected from BATTERY-J4(3) to GND-J4(1) is not a four quadrant supply, then
remove Load #1 and use PS #1, set to 3.7V, 2 A current limit and connect to BATTERY-J4(3) and
GND-J4(1).
3. In the EVM software on the 16-bit tab, confirm that VOTG, the OTG regulation voltage, is set to 5040 mV
and IOTG, the OTG current limit, is set to 1000 mA.
4. In the EVM software on the 8-bit tab, check
5. Connect Load #2 across VPMID-J3(1) and PGND-J3(2).
6. Set Load #2 to 500 mA constant current load and the turn on the load.
7. To confirm the VOTG regulation,
•Measure→ VBUS = 5040 mV + 155 mV
8. Turn off and disconnect the power supply.
9. Remove Load #2 from the connection.
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3.2.5 Helpful Tips
1. The leads and cables to the various power supplies, batteries and loads have resistance. The current meters
also have series resistance. The charger dynamically reduces charge current depending on the voltage
sensed at the VBUS pin (using the VINDPM feature), BAT pin (as part of normal termination), and TS pin
(through the battery temperature monitoring feature via battery thermistor). Therefore, voltmeters must be
used to measure the voltage as close to the IC pins as possible instead of relying on the digital readouts of
the power supply. If a battery thermistor is not available, then that shunts JP11 and JP13 in place.
2. When using a source meter that can source and sink current as your battery simulator, TI highly
recommends adding a large (>=1000+ μF) capacitor at the EVM BATTERY and GND connector to prevent
oscillations at the BAT pin due to mismatched impedances of the charger output and source meter
input within their respective regulation loop bandwidths. Configuring the source meter for 4-wire sensing
eliminates the need for a separate voltmeter to measure the voltage at the BAT pin. When using 4-wire
sensing, always make sure that the sensing leads are properly connected to prevent accidental overvoltage
by the power leads.
3. For precise measurements of input and output current, especially near termination, the current meter in
series with the battery or battery simulator must not be set to auto-range and needs to be removed entirely.
An alternate method for measuring charge current is to either use an oscilloscope with hall effect current
probe or by a differential voltage measurement across the relevant sensing resistors populated on the
BQ25638xEVM.
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4 Hardware Design Files
4.1 Schematic
Figure 4-1 illustrates the schematic for the BQ25638EVM.
PGND
VIN SYSTEM
GND GND
VBUS 1
2
D-
D+ 3
4
ID
GND 5
8
7 611
10 9
J5
10.0k
R13
10.0k
R14
0.047uF
C5
PGND
SDA
2
1
JP14
AGND
Green
12
D4 Green
12
D5
VIN
TP16
TP13 TP14
TEST POINTS
PGND
PGND
4.7k
R26
AGND
S1
4
3
2
1
J7
SCL
REGN
BTST
1
2
JP7
10.0k
R15
TP9
10uF
C16
AGND
NT1
Net-Tie
PMID
VBUS
/QON
BAT- (GND)
Thermistor
BAT+
30.1k
R27
NORMAL
5.23k
R24
AGND
TS
REGN
TS
10.0k
R6
1
2
JP13
VIN
SCL
SW
BAT
SYS
STAT
/QON
/INT
TS
PGND
PGND
1000pF
C3
10uF
C17
PGND
PGND
10.0k
R16
SDA
1
2
JP8
TP12
TP17
TP18 TP19 TP20
TP21
TP25TP24
TP31 TP32TP30
/CE
STAT
BAT SYS
VBUSVIN
PMID
TP15
REGN BTST TS
/CE /QON STAT
/INT
CHARGE
ENABLE
/PG LED
CONNECT
STAT LED
CONNECT
1
2
JP6
1
2
JP9
2.0
R3
2200pF
C11
AGND
TP22 TP23
SCL SDA
AGNDPGND
3.9-18V
/PG
VPMID
GND
PGND
4.7uF
C14
VPMID
/PG
1
2
JP12
USB D-
USB D+
D-_ILIM
D+_TSBIAS
1
2
3
JP11 /PG
SCL
SDA
AGND
10.0
R23
USB2ANY
PULLUP
1
2
JP10
1 2
3 4
5 6
7 8
9 10
J6
AGND
1
2
JP5
ILIM_PD
CONNECT
TP26
TP11
3.9
VPMID
R4
3.9
R5
C4
2.2uF
0.01
R1
TP1 TP2
0.01
R2
TP3 TP4
0.01
R10
TP7 TP8
0.01
R8
TP5
30V
TP6
D1
2
1
JP2
1
2
JP3
0.1uF
C7
0.1uF
C12
0.1uF
C19
C1
1uF
D+_TSBIAS
D-_ILIM
D-_ILIM
D-_ILIM
D-_ILIM
D+_TSBIAS D+_TSBIAS
D+_TSBIAS
2
1
J1
1
2
J2
1
2
J3
TP33
Up to 3.2A
SW
TS
TP27 TP28 TP29
2.21k
R19
C2
1µF
2.21k
R18
0.1uF
C18
A1 VBUS
B1 VBUS
A2 PMID
B2 PMID
SW A3
B3
SW
SW C3
SYS D1
D2
SYS
SYS D3
BAT E1
BAT E2
E3
BAT
TS E4
F4 TS_BIAS
CE
F2
INT
F5
PG
C2
QON D4
ADCIN
C5
F1
BATP
B5
BTST
ILIM
F3
A5
REGN
SCL
D5
SDA
E5
STAT
C1
A4
PGND B4
PGND
PGND C4
BQ25638YBGR
U1
IINREG = KILIM / RILIM
ADCIN
ADCIN
TP34
TP10
100
R29
BATP
BATP
BATP
TP35
ADCIN
0.1uF
C21
AGND
0
R30
1
2
3
JP4
BAT
SYS
PULL-UP
PULL-UP
PULL-UP
PULL-UP
/CE ADCIN1
ADCIN1
TP36
0.1uF
C27
L2
PGND
1
2
JP1
/INT
1
2
JP16
D-_ILIM
AGND
2.20k
R21
3.32k
R22
1
2
JP15
D-_ILIM
1
3
2
J4
12
10uF
C8
12
10uF
C9
12
10uF
C10
12
10uF
C13
L3
Up to 3.2A
TP37
4.7uF
C6
1.21k
R20
0.33uF
C20
Up to 5A
0-4.8V
Up to 5A
L1
SRP3212-1R0MR21
Figure 4-1. BQ25638EVM Schematic
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4.2 PCB Layout
The following figures illustrate the PCB board layers.
Figure 4-2. BMS068 Board Dimensions
Figure 4-3. BMS068 Top Overlay
Figure 4-4. BMS068 Bottom Overlay Figure 4-5. BMS068 Top Layer
Figure 4-6. BMS068 Signal Layer 1 Figure 4-7. BMS068 Signal Layer 2
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Figure 4-8. BMS068 Bottom Layer
4.2.1 PCB Layout Guidelines
The switching node rise and fall times must be minimized for minimum switching loss. Proper layout of the
components to minimize high frequency current path loop is important to prevent electrical and magnetic field
radiation and high frequency resonant problems. Follow this specific order carefully to achieve the proper layout.
1. Place input capacitor as close as possible to PMID pin and GND pin connections and use shortest copper
trace connection or GND plane.
2. Place inductor input pin to SW pin as close as possible. Minimize the copper area of this trace to lower
electrical and magnetic field radiation but make the trace wide enough to carry the charging current. Do not
use multiple layers in parallel for this connection. Minimize parasitic capacitance from this area to any other
trace or plane.
3. Put output capacitor near to the inductor and the device. Ground connections need to be tied to the IC
ground with a short copper trace connection or GND plane.
4. Place decoupling capacitors next to the IC pins and make trace connection as short as possible.
5. Make sure that the number and sizes of vias allow enough copper for a given current path.
See the EVM design for the recommended component placement with trace and via locations.
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4.3 Bill of Materials (BOM)
Table 4-1. Bill of Materials
Designator Qty Value Description Package Reference PartNumber Manufacturer
!PCB1 1 Printed Circuit Board BMS068
C2 1 1uF CAP, CERM, 1 uF, 35 V, +/- 10%, X7R,
AEC-Q200 Grade 0, 0603 603 GMK107AB7105KAHT Taiyo Yuden
C5 1 0.047uF CAP, CERM, 0.047 uF, 25 V, +/- 10%, X7R,
0402 402 GRM155R71E473KA88D MuRata
C6 1 4.7uF 4.7 µF +/-20% 16 V Ceramic Capacitor
X5R 0402 (1005 Metric) 402 0402YD475MAT2A KYOCERA AVX
C8, C9, C13 3
Chip Multilayer Ceramic Capacitors for
General Purpose, 0603, 10 uF, X7T,
+22%/-33%, 10%, 10 V
GRM188D71A106KA73D Murata Electronics
C17 1 10uF CAP, CERM, 10 uF, 25 V, +/- 20%, X5R,
0603 603 GRT188R61E106ME13D MuRata
C18, C21 2 0.1uF CAP, CERM, 0.1 uF, 50 V,+/- 10%, X7R,
0402 402 C1005X7R1H104K050BE TDK
D4, D5 2 Green LED, Green, SMD 1.6x0.8x0.8mm LTST-C190GKT Lite-On
FID1, FID2, FID3, FID4,
FID5, FID6 6Fiducial mark. There is nothing to buy or mount. N/A N/A N/A
H1, H2, H3, H4 4 Bumpon, Hemisphere, 0.44 X 0.20, Clear Transparent Bumpon SJ-5303 (CLEAR) 3M
J1, J2, J3 3 Terminal Block, 5.08 mm, 2x1, Brass, TH 2x1 5.08 mm Terminal Block ED120/2DS On-Shore Technology
J4 1 Terminal Block, 5.08 mm, 3x1, Brass, TH 3x1 5.08 mm Terminal Block ED120/3DS On-Shore Technology
J5 1 Connector, Receptacle, Micro-USB Type B,
R/A, Bottom Mount SMT 7.5x2.45x5mm 473460001 Molex
J6 1 Header (shrouded), 100mil, 5x2, High-
Temperature, Gold, TH 5x2 Shrouded header N2510-6002-RB 3M
J7 1 Header (friction lock), 100mil, 4x1, R/A, TH 4x1 R/A Header 22/05/3041 Molex
JP1, JP2, JP3, JP5,
JP6, JP7, JP8, JP9,
JP10, JP12, JP13, JP14,
JP15, JP16
14 Header, 100mil, 2x1, Tin, TH Header, 2 PIN, 100mil, Tin PEC02SAAN Sullins Connector
Solutions
JP4, JP11 2 Header, 100mil, 3x1, Tin, TH Header, 3 PIN, 100mil, Tin PEC03SAAN Sullins Connector
Solutions
L1 1 1uH Inductor Power Shielded 1uH 20% 5.5A
0.019Ohm DCR 1210 1210 SRP3212-1R0MR21 Bourns
LBL1 1 Thermal Transfer Printable Labels, 0.650"
W x 0.200" H - 10,000 per roll PCB Label 0.650 x 0.200 inch THT-14-423-10 Brady
R1, R2, R8, R10 4 0.01 RES, 0.01, 1%, 1 W, 2010 2010 WSL2010R0100FEA18 Vishay-Dale
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Table 4-1. Bill of Materials (continued)
Designator Qty Value Description Package Reference PartNumber Manufacturer
R6, R13, R14, R15, R16 5 10.0k RES, 10.0 k, 1%, 0.063 W, AEC-Q200
Grade 0, 0402 402 CRCW040210K0FKED Vishay-Dale
R18, R19 2 2.21k RES, 2.21 k, 1%, 0.063 W, AEC-Q200
Grade 0, 0402 402 CRCW04022K21FKED Vishay-Dale
R21 1 2.20k RES, 2.20 k, 1%, 0.063 W, AEC-Q200
Grade 0, 0402 402 CRCW04022K20FKED Vishay-Dale
R22 1 3.32k RES, 3.32 k, 1%, 0.063 W, AEC-Q200
Grade 0, 0402 402 CRCW04023K32FKED Vishay-Dale
R23 1 10 RES, 10.0, 1%, 0.25 W, AEC-Q200 Grade
0, 1206 1206 ERJ-8ENF10R0V Panasonic
R24 1 5.23k RES, 5.23 k, 1%, 0.063 W, AEC-Q200
Grade 0, 0402 402 CRCW04025K23FKED Vishay-Dale
R26 1 4.7k RES, 4.7 k, 5%, 0.063 W, AEC-Q200
Grade 0, 0402 402 CRCW04024K70JNED Vishay-Dale
R27 1 30.1k RES, 30.1 k, 1%, 0.063 W, AEC-Q200
Grade 0, 0402 402 CRCW040230K1FKED Vishay-Dale
R29 1 100 RES, 100, 1%, 0.25 W, AEC-Q200 Grade
0, 1206 1206 ERJ-8ENF1000V Panasonic
R30 1 0 RES, 0, 5%, 0.063 W, AEC-Q200 Grade 0,
0402 402 CRCW04020000Z0ED Vishay-Dale
S1 1 Switch, Normally open, 2.3N force, 200k
operations, SMD KSR KSR221GLFS CK Components
SH-JP1, SH-JP2, SH-
JP3, SH-JP4, SH-JP5,
SH-JP7, SH-JP8, SH-
JP10, SH-JP11, SH-
JP13, SH-JP14
11 1x2 Shunt, 100mil, Gold plated, Black Shunt SNT-100-BK-G Samtec
TP1, TP2, TP3, TP4,
TP5, TP6, TP7, TP8,
TP16, TP17, TP18,
TP19, TP20, TP21,
TP22, TP23, TP24,
TP25, TP26
19 Test Point, Miniature, White, TH White Miniature Testpoint 5002 Keystone Electronics
TP9, TP10, TP11, TP12,
TP34, TP35, TP36 7 Test Point, Miniature, Red, TH Red Miniature Testpoint 5000 Keystone Electronics
TP13 1 Test Point, Miniature, Yellow, TH Yellow Miniature Testpoint 5004 Keystone Electronics
TP14, TP15, TP33 3 Test Point, Miniature, Orange, TH Orange Miniature Testpoint 5003 Keystone Electronics
TP27, TP28, TP29,
TP37 4 Test Point, Multipurpose, Black, TH Black Multipurpose Testpoint 5011 Keystone Electronics
TP30, TP31, TP32 3 Test Point, Compact, SMT Testpoint_Keystone_Compact 5016 Keystone Electronics
Hardware Design Files www.ti.com
16 BQ25638x Evaluation Module SLUUCR0A – SEPTEMBER 2023 – REVISED DECEMBER 2023
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Table 4-1. Bill of Materials (continued)
Designator Qty Value Description Package Reference PartNumber Manufacturer
U1 1
I2C Controlled, 5-A, Maximum 18-V
Input, Charger with NVDC Power Path
Management and USB OTG Boost Output
DSBGA30 BQ25638YBGR Texas Instruments
www.ti.com Hardware Design Files
SLUUCR0A – SEPTEMBER 2023 – REVISED DECEMBER 2023
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BQ25638x Evaluation Module 17
Copyright © 2023 Texas Instruments Incorporated

5 Additional Information
Trademarks
All trademarks are the property of their respective owners.
6 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (September 2023) to Revision A (December 2023) Page
• Updated schematic...........................................................................................................................................12
• Updated PCB Layout images........................................................................................................................... 13
• Updated Bill of Materials table..........................................................................................................................15
Additional Information www.ti.com
18 BQ25638x Evaluation Module SLUUCR0A – SEPTEMBER 2023 – REVISED DECEMBER 2023
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Copyright © 2023 Texas Instruments Incorporated

STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
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User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
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WARNING
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and application risks associated with handling electrical mechanical
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User shall operate the Evaluation Kit within TI’s recommended
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as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
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damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.

www.ti.com
2
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.