Texas Instruments AWR1642 User manual

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AWR1642 Evaluation Module (AWR1642BOOST) Single-Chip mmWave
Sensing Solution
User's Guide
SWRU508B–May 2017–Revised April 2018
AWR1642 Evaluation Module (AWR1642BOOST)
Single-Chip mmWave Sensing Solution
The AWR1642 BoosterPack™ from Texas Instruments™ is an easy-to-use evaluation board for the
AWR1642 mmWave sensing device, with direct connectivity to the microcontroller (MCU) LaunchPad™
Development Kit. The BoosterPack contains everything required to start developing software for on-chip
C67x DSP core and low-power ARM®R4F controllers, including onboard emulation for programming and
debugging as well as onboard buttons and LEDs for quick integration of a simple user interface.
Contents
1 Getting Started............................................................................................................... 2
1.1 Introduction .......................................................................................................... 2
1.2 Key Features ....................................................................................................... 2
1.3 Kit Contents.......................................................................................................... 2
2 Hardware...................................................................................................................... 3
2.1 Block Diagram....................................................................................................... 5
2.2 Power Connections................................................................................................. 6
2.3 Connectors .......................................................................................................... 6
2.4 PC Connection..................................................................................................... 10
2.5 Connecting the BoosterPack to the LaunchPad or the MMWAVE-DEVPACK............................ 11
2.6 Antenna............................................................................................................. 11
2.7 Jumpers, Switches, and LEDs................................................................................... 13
3 Design Files and Software Tools......................................................................................... 16
3.1 Hardware........................................................................................................... 16
3.2 Software, Development Tools, and Example Code........................................................... 16
4 Design Revision History .................................................................................................. 17
5 Mechanical Mounting of PCB............................................................................................. 18
6 PCB Storage and Handling Recommendations........................................................................ 18
7 Regulatory Information .................................................................................................... 19
8 Troubleshooting ............................................................................................................ 19
Trademarks
BoosterPack, Texas Instruments, LaunchPad, Code Composer Studio are trademarks of Texas
Instruments.
ARM is a registered trademark of ARM Limited.
Windows is a registered trademark of Microsoft Corporation.
All other trademarks are the property of their respective owners.

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1 Getting Started
1.1 Introduction
The AWR1642 BoosterPack from Texas Instruments is an easy-to-use evaluation board for the AWR1642
mmWave sensing device, with direct connectivity to the microcontroller (MCU) LaunchPad Development
Kit. The BoosterPack contains everything required to start developing software for on-chip C67x DSP core
and low-power ARM R4F controllers, including onboard emulation for programming and debugging as well
as onboard buttons and LEDs for quick integration of a simple user interface.
The standard 20-pin BoosterPack headers make the device compatible with a wide variety of TI MCU
LaunchPads and enables easy prototyping.
1.2 Key Features
• Two 20-pin LaundPad connectors that leverages the ecosystem of the TI LaunchPad
• XDS110 based JTAG emulation with a serial port for onboard QSPI flash programming
• Back-channel UART through USB-to-PC for logging purposes
• Onboard antenna
• 60-pin, high-density (HD) connector for raw analog-to-digital converter (ADC) data over LVDS and
trace-data capability
• Onboard CAN-FD transceiver
• One button and two LEDs for basic user interface
• 5-V power jack to power the board
1.3 Kit Contents
The following items are included with the AWR1642BOOST kit.
• AWR1642BOOST evaluation board
• Mounting brackets, screws, and nuts to place the printed-circuit board (PCB) vertical
• Micro USB cable to connect to PC
NOTE: A 5-V, > 2.5-A supply brick with a 2.1-mm barrel jack (center positive) is not included. TI
recommends using an external power supply that complies with applicable regional safety
standards, such as UL, CSA, VDE, CCC, PSE, and more. The length of the power cable
should be < 3 m.
1.3.1 mmWave Proximity Demo
TI provides sample demo codes to easily get started with the AWR1642 evaluation module (EVM) and to
experience the functionality of the AWR1642 radar sensor. For details on getting started with these
demos, see www.ti.com/tool/mmwave-sdk.

5-V Power
AWR1642
Flash
60-pin HD
Connector
Micro USB
Connector
SOP ControlsNRST_SWGPIO1_SW
Onboard Antenna
CAN-FD
Connector
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2 Hardware
Figure 1 and Figure 2 show the front and rear view of the EVM, respectively.
Figure 1. EVM (Front)

Micro USB
Connector
Heat Sink Area
20-SLQ/DXQFK3DGŒ
Connector (J6)
20-SLQ/DXQFK3DGŒ
Connector (J5)
XDS110
PMIC
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Figure 2. EVM (Rear)

AWR1642
BP Connector
XDS110
CANFD
SOP
PC Interface
through USB
UART and JTAG
SPI, UART, I2C,
Rst, Nerrs,
SOPs, Loggers,
CAN, and GPIOs
60-pin HD
LVDS data and Clk
JTAG and trace
40-Mhz
XTAL
QSPI
Flash
Optional for 3.3-V
from MCU
LaunchPadTM
PMIC
LDO1
4 RX and 2 TX PCBs
LDO2
1.8 V
1.3 V
1.2 V
3.3 VIO
1.8 V
2.3 V
EN control from the
MCU PGOOD signal to MCU for power
sequencing
5-V input
from jack
and MCU
Power and 2 GPIO
LED indicators
Control signals for
external MCU interface
Current
measurement
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2.1 Block Diagram
Figure 3 shows the block diagram.
Figure 3. Block Diagram

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2.2 Power Connections
The BoosterPack is powered by the 5-V power jack (5-A current limit), shown in Figure 4. As soon as the
power is provided, the NRST and 5-V LEDs should glow, indicating that the board is powered on.
NOTE: After the 5-V power supply is provided to the EVM, it is recommended to press the NRST
switch (SW2) one time to ensure a reliable boot-up state.
Figure 4. Power Connector
2.3 Connectors
2.3.1 20-Pin BoosterPack Connectors
The BoosterPack has the standard LaunchPad connectors (J5 and J6, shown in Figure 5) that enable it to
be directly connected to all TI MCU LaunchPads. While connecting the BoosterPack to other LaunchPads,
ensure the pin-1 orientation is correct by matching the 3V3 and 5-V signal marking on the boards.
Figure 5. 20-Pin BoosterPack Connectors

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Table 1 and Table 2 provide the connector-pin information.
Table 1. J5 Connector Pin
Pin Number Description Pin Number Description
1 NERROUT 2 GND
3 NERRIN 4 DSS LOGGER
5 MCUCLK OUT 6 SPI_CS
7 NC 8 GPIO01
9 MSS LOGGER 10 nRESET
11 WARMRST 12 SPI_MOSI
13 BSS LOGGER 14 SPI_MISO
15 SOP2 16 HOSTINT
17 SOP1 18 GPIO02
19 SOP0 20 NC
(1) Voltage input to the GPADC available on the AWR1642.
(2) Indicates the state of the onboard VIO supply for the AWR device coming from the onboard PMIC. A HIGH on the PGOOD
signal (3.3 V) indicates the supply is stable. Because the I/Os are not failsafe, the MCU must not drive any I/O signals to the
AWR device before this I/O supply is stable to avoid leakage current into the I/Os.
(3) Controls the onboard PMIC enable. The MCU can use this to shut down the PMIC and AWR device during the periods it does
not use the AWR device and save power. The power up of the PMIC takes approximately 5 ms once the enable signal is made
high.
Table 2. J6 Connector Pin
Pin Number Description Pin Number Description
1 3V3 2 5 V
3 NC 4 GND
5 RS232RX (Tx from AWR device) 6 ANA1(1)
7 RS232RX (Rx into AWR device) 8 ANA2(1)
9 SYNC_IN 10 ANA3(1)
11 NC 12 ANA4(1)
13 SPI_CLK 14 PGOOD (onboard VIO)(2)
15 GPIO0 16 PMIC Enable(3)
17 SCL 18 SYNC_OUT
19 SDA 20 PMIC CLK OUT

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2.3.2 60-Pin HD Connector
The 60-pin HD connector provides the high speed LVDS data, control signals (SPI, UART, I2C, NRST,
NERR, SOPs) and JTAG debug signals. The connector can be connected to the MMWAVE-DEVPACK
board to further get to the standard TSW1400 EVM. Figure 6 shows the HD connector, and Table 3
provides the connector information.
Figure 6. HD Connector

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(1) Indicates the state of the onboard VIO supply for the AWR device coming from the onboard PMIC. A HIGH on the PGOOD signal (3.3 V)
indicates the supply is stable. Because the I/Os are not failsafe, the MCU must not drive any I/O signals to the AWR device before this
I/O supply is stable to avoid leakage current into the I/Os.
Table 3. J1 Connector Pin
Pin Number Description Pin Number Description
1 5V 2 5V
3 5V 4 TDO
5 TDI 6 TCK
7 SPI_CS 8 TMS
9 SPI_CLK 10 HOSTINT
11 SPI_MOSI 12 SPI_MISO
13 PGOOD (onboard VIO)(1) 14 NERROUT
15 DMM_CLK 16 SYNC_IN
17 DMM_SYNC 18 GND
19 TRACE_DATA0 20 NC
21 TRACE_DATA1 22 NC
23 TRACE_DATA2 24 GND
25 TRACE_DATA3 26 LVDS_FRCLKP
27 TRACE_DATA4 28 LVDS_FRCLKM
29 TRACE_DATA5 30 GND
31 TRACE_DATA6 32 NC
33 TRACE_DATA7 34 NC
35 TRACE_DATA8 36 GND
37 TRACE_DATA9 38 NC
39 TRACE_DATA10 40 NC
41 TRACE_DATA11 42 GND
43 TRACE_DATA12 44 LVDS_CLKP
45 TRACE_DATA13 46 LVDS_CLKM
47 TRACE_DATA14 48 GND
49 TRACE_DATA15 50 LVDS_1P
51 I2C_SDA 52 LVDS_1M
53 I2C_SCL 54 GND
55 RS232RX (Rx into AWR device) 56 LVDS_0P
57 RS232TX (Tx from AWR device) 58 LVDS_0M
59 nRESET 60 GND

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2.3.3 CAN Interface Connector
The J3 connector provides the CAN_L and CAN_H signals from the onboard CAND-FD transceiver
(TCAN1042HGVDRQ1). These signals can be directly wired to the CAN bus.
Because the digital CAN signals (Tx and Rx) are muxed with the SPI interface signals on the AWR device,
one of the two paths must be selected. In the Rev A of the board, to enable the CAN interface, R11 and
R12 resisters must be populated with 0 Ω; R4, R6, R28, and R63 resistors must be removed to disconnect
the SPI path. In the Rev B board, this is done by placing the switch S2 on the "CAN" position.
Figure 7 shows the CAN connector.
Figure 7. CAN Connector
2.4 PC Connection
The connectivity is provided through the micro USB connector over the onboard XDS110
(TM4C1294NCPDT) emulator. This connection provides the following interfaces to the PC:
• JTAG for Code Composer Studio™ (CCS) connectivity
• UART1 for flashing the onboard serial flash, downloading FW through Radar Studio, and getting
application data sent through the UART
• MSS logger UART (can be used to get MSS code logs on the PC)
When the USB is connected to the PC, the device manager should recognize the following COM ports,
shown in Figure 8:
• XDS110 Class Application/User UART – UART1 port
• XDS110 Class Auxiliary Data Port – MSS logger port
Figure 8. COM Ports
If Windows®is unable to recognize the COM ports, users must install the EMU pack available at XDS
Emulation Software Package.

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2.5 Connecting the BoosterPack to the LaunchPad or the MMWAVE-DEVPACK
The development pack may be required with the BoosterPack for the following use cases:
• Connecting to Radar Studio
Radar Studio is a tool that provides capability to configure the mmWave front end from the PC. This
tool is available in the DFP package.
• Capturing high-speed LVDS data using the SW1400 FPGA platform from TI (see High Speed Data
Capture and Pattern Generation Platform).
The TSW1400 FPGA platform allows users to capture the raw ADC data over the high-speed debug
interface and post process it in the PC.
• Getting DSP trace data through the MIPI 60-pin interface
• Use the DMM interface
This BoosterPack can be stacked on top of the Launchpad or the MMWAVE-DEVPACK by using the two
20-pin connectors. The connectors do not have a key to prevent the misalignment of the pins or reverse
connection. Hence, care must be taken to ensure reverse mounting does not take place.
On the AWR1642 BoosterPack, TI has provided 3V3 markings near pin 1, shown in Figure 9. The same
marking is provided on compatible LaunchPads (must be aligned before powering up the boards).
Figure 9. 3V3 and 5V Marking on BoosterPack
For details on these use cases, see the MMWAVE-DEVPACK User's Guide.
2.6 Antenna
The BoosterPack includes onboard-etched antennas for the four receivers and two transmitters that
enable tracking multiple objects with their distance and angle information. This antenna design enables
estimation of distance and elevation angle that enables object detection in a two-dimensional plane.
Figure 10 shows the PCB antennas.

RX1 RX2 RX3 RX4 TX1 TX2
RX Antennas TX Antennas
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Figure 10. PCB Antennas
The antenna peak gain is > 9 dBi across the operating frequency band of 76 to 81 GHz. The peak output
power with the antenna gain is < 55 dBm EIRP, as required by the European regulations. The radiation
pattern of the antenna in the horizontal plane (H-plane Phi = 0 degrees) and elevation plane (E-plane Phi
= 90 degrees) is shown by Figure 11.
Figure 11. Antenna Pattern

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2.7 Jumpers, Switches, and LEDs
2.7.1 Sense-on-Power (SOP) Jumpers
The AWR1642 device can be set to operate in three different modes based on the state of the SOP lines.
These lines are sensed only during boot up of the AWR device. The state of the device is detailed by
Table 4.
A closed jumpers refers to a 1, and an open jumper refers to a 0 state of the SOP signal going to the
AWR device.
Table 4. SOP Jumper Information
Reference Usage Comments
P3 SOP 2
SOP[2:0]
101 (SOP mode 5) = flash
programming
P2 SOP 1 001 (SOP mode 4) =
functional mode
P4 SOP 0 011 (SOP mode 2) = dev
mode
Figure 12 shows the SOP jumpers.
Figure 12. SOP Jumpers

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2.7.2 Current Measurement
The P5 jumper enables the measurement of the current being consumed by the reference design (AWR
device, PMIC, and LDOs) at a 5-V level.
To measure the current, resistor R118 must be removed and a series ammeter can be put across the P5
pins (shown in Figure 13).
Figure 13. P5 Pins
2.7.3 Push Buttons and LEDs
Table 5 provides the switch and LED information.
Table 5. Switch and LED Information
Reference Usage Comments
SW2 RESET
Used to RESET the AWR1642 device.
This signal is also brought out on the 20-
pin connector and 60-pin HD connector so
an external processor can control the
AWR device. The onboard XDS110 can
also use this reset.
SW1 GPIO_1 When pushed, the GPIO_1 is pulled to
VCC.
DS2 5-V supply indication This LED indicates the presence of the 5-
V supply.
DS4 nRESET This LED is used to indicate the state of
nRESET pin. If this LED is glowing, the
device is out of reset. This LED will glow
only after the 5-V supply is provided.
DS1 Nerr_OUT Glows if there is any HW error in the AWR
device
DS3 GPIO_1 Glows when the GPIO is logic-1

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Figure 14 through Figure 19 show the location of switches and LEDs.
Figure 14. SW1 Figure 15. SW2 Figure 16. DS2
Figure 17. DS4 Figure 18. DS1 Figure 19. DS3
2.7.4 Selection Between SPI and CAN Interface
The SPI and CAN interface are muxed on the same lines on the AWR1642 device. Based on the
configuration, the user can select if the pins E14 and D13 must be connected to the 20-pin/HD connectors
to provide the SPI interface OR to the onboard CANFD PHY (U3). This selection is done by the S2 switch.
This switch is available on the board from Rev B onwards.
Figure 20. S2 Switch to Select Between SPI or CAN Interface

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3 Design Files and Software Tools
3.1 Hardware
To view the schematics, assembly drawings, and BOM, see AWR1642BOOST Schematic, Assembly
Files, and BOM.
To view the design database and layout details, see AWR1642BOOST Hardware Files.
3.2 Software, Development Tools, and Example Code
To enable quick development of end applications on the C67x DSP and R4F core in the AWR1642, TI
provides a software development kit (SDK) that includes demo codes, software drivers, emulation
packages for debug, and more. These can be found at mmwave-sdk.

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4 Design Revision History
Table 6. Design Revision History
PCB revision Change Description
Rev B Added switch control to move between SPI and CAN interface
Enabled by default the 5-V supply from the 60-pin HD connector.
Enabled by default the SYNC_IN signal connection to J6 connector
Serial flash part number updated to MX25V1635FZNQ
Added series resisters on I2C lines.
Removed the series diode on the NRST signal.

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5 Mechanical Mounting of PCB
The field of view of the radar sensor is orthogonal to the PCB. To enable easy measurements on the
sensing objects on the horizontal plane, the PCB can be mounted vertically. The L-brackets provided with
the AWR1642 EVM kit, along with the screws and nuts help in the vertical mounting of the EVM. Figure 21
shows how the L-brackets can be assembled.
Figure 21. Vertical Assembly of EVM
6 PCB Storage and Handling Recommendations
The immersion silver finish of the PCB provides a better high-frequency performance, but is also prone to
oxidation in open environments. This oxidation causes the surface around the antenna region to blacken.
To avoid oxidation, the PCB should be stored in an ESD cover and kept at a controlled room temperature
with low humidity conditions. All ESD precautions must be taken while using and handling the EVM.

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7 Regulatory Information
The AWR1642 evaluation module (AWR1642BOOST) is in compliance with Directive 2014/53/EU. The full
text of TI's EU Declaration of Conformity is available at the following link:
http://www.ti.com/tool/awr1642boost. The compliance has been verified in the operating bands of 76- to
77-GHz and 77- to 81-GHz. Should the user choose to configure the AWR1642BOOST to operate outside
of the test conditions it should be operated inside a protected and controlled environment, such as a
shielded chamber. This evaluation board is intended only for development and not as an end product or
part of an end product. Developers and integrators that incorporate the chipset in any end products are
responsible for obtaining applicable regulatory approvals for such end product.
The European RF exposure radiation limit is fulfilled if a minimum distance of 5 cm between the user and
the radio transmitter is respected.
NOTE: The AWR1642BOOST has been tested in the 76- to 77-GHz band (2 Tx at a time) at a
maximum peak power of 26 dBm EIRP, and in the 77- to 81-GHz band (1 Tx at a time) with
maximum peak power of 21 dBm EIRP across the temperature range of –20°C to +60°C.
8 Troubleshooting
EVM Board Power-up Failure
See Section 2.2 for desired power connections. Please ensure NRST and 5-V LEDs glow brightly. When a
nonfunctional or insufficient current capacity power supply is used with the EVM, the EVM LEDs will not
turn on. See Section 2.7.3 for LED information.

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Revision History
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from A Revision (May 2017) to B Revision ...................................................................................................... Page
• Updated CAN Interface Connector section........................................................................................... 10
• Added Selection Between SPI and CAN Interface section......................................................................... 15
• Added Design Revision History section............................................................................................... 17