Texas Instruments TPS6104 Series User manual

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0.1 1 10 100
VI= 5 V
VI= 3.6 V
VI= 2.4 V
Efficiency vs Output Current
IO− Output Current − mA
Efficiency − %
VIN SW
FB
EN GND
L1
10 mHD1
R1
R2
CFF
CO
1mF
VOUT
VIN to 28 V
VIN
1.8 V to 6 V
CIN
4.7 mF
5
42
3
1
VO= 18 V
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61040 , TPS61041
SLVS413I –OCTOBER 2002–REVISED DECEMBER 2016
TPS6104x Low-Power DC-DC Boost Converter in SOT-23 and WSON Packages
1
1 Features
1• 1.8-V to 6-V Input Voltage Range
• Adjustable Output Voltage Range up to 28 V
• 400-mA (TPS61040) and 250-mA (TPS61041)
Internal Switch Current
• Up to 1-MHz Switching Frequency
• 28-μA Typical No-Load Quiescent Current
• 1-μA Typical Shutdown Current
• Internal Soft Start
• Available in SOT23-5, TSOT23-5,
and 2-mm × 2-mm × 0.8-mm WSON Packages
2 Applications
• LCD Bias Supply
• White-LED Supply for LCD Backlights
• Digital Still Camera
• PDAs, Organizers, and Handheld PCs
• Cellular Phones
• Internet Audio Players
• Standard 3.3-V or 5-V to 12-V Conversion
3 Description
The TPS6104x is a high-frequency boost converter
dedicated for small to medium LCD bias supply and
white LED backlight supplies. The device is ideal to
generate output voltages up to 28 V from a dual-cell
NiMH/NiCd or a single-cell Li-Ion battery. The part
can also be used to generate standard 3.3-V or 5-V
to 12-V power conversions.
The TPS6104x operates with a switching frequency
up to 1 MHz. This frequency allows the use of small
external components using ceramic as well as
tantalum output capacitors. Together with the thin
WSON package, the TPS6104x gives a very small
overall solution size. The TPS61040 device has an
internal 400-mA switch current limit, while the
TPS61041 device has a 250-mA switch current limit,
offering lower output voltage ripple and allows the
use of a smaller form factor inductor for lower power
applications. The low quiescent current (typically 28
μA) together with an optimized control scheme,
allows device operation at very high efficiencies over
the entire load current range.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TPS61040 SOT-23 (5) 2.90 mm × 1.60 mm SOT (5) 2.90 mm ×1.60 mm
WSON (6) 2.00 mm × 2.00 mm
TPS61041 SOT-23 (5) 2.90 mm ×1.60 mm
WSON (6) 2.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Typical Application Schematic

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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 6
7 Detailed Description.............................................. 9
7.1 Overview................................................................... 9
7.2 Functional Block Diagram......................................... 9
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 10
8 Application and Implementation ........................ 11
8.1 Application Information............................................ 11
8.2 Typical Application.................................................. 11
8.3 System Examples ................................................... 16
9 Power Supply Recommendations...................... 19
10 Layout................................................................... 19
10.1 Layout Guidelines ................................................. 19
10.2 Layout Example .................................................... 19
11 Device and Documentation Support................. 20
11.1 Third-Party Products Disclaimer ........................... 20
11.2 Related Links ........................................................ 20
11.3 Community Resources.......................................... 20
11.4 Trademarks........................................................... 20
11.5 Electrostatic Discharge Caution............................ 20
11.6 Glossary................................................................ 20
12 Mechanical, Packaging, and Orderable
Information........................................................... 20
4 Revision History
Changes from Revision H (October 2015) to Revision I Page
• Changed CIN from: 4.7 mF To: 4.7 µF and COFrom: 1 mF To: 1 µF in the Typical Application Schematic.......................... 1
Changes from Revision G (December 2014) to Revision H Page
• Added 500 µs/div label to X-axis of Figure 15. ................................................................................................................... 15
Changes from Revision F (December 2010) to Revision G Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1

GND SW
VIN NC
EN FB
3
2
1
4
5
6
3
2
4
5
1
SW
GND
FB
VIN
EN
3
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5 Pin Configuration and Functions
DDC Package, DBV Package
5 Pins
Top View
DRV Package
6 Pins
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME DDC,
DBV NO. DRV NO.
EN 4 3 I This is the enable pin of the device. Pulling this pin to ground forces the device into shutdown mode reducing the supply current to less than 1 μA. This pin should not be left floating and needs
to be terminated.
FB 3 4 I This is the feedback pin of the device. Connect this pin to the external voltage divider to program
the desired output voltage.
GND 2 1 – Ground
NC – 5 – No connection
SW 1 6 I Connect the inductor and the Schottky diode to this pin. This is the switch pin and is connected to
the drain of the internal power MOSFET.
VIN 5 2 I Supply voltage pin

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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltages on pin VIN (2) –0.3 7 V
Voltages on pins EN, FB (2) –0.3 VIN + 0.3 V
Switch voltage on pin SW (2) 30 30 V
Operating junction temperature, TJ–40 150 °C
Storage temperature, Tstg –65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±XXX V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±YYY V may actually have higher performance.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2) ±750
(1) See application section for further information.
6.3 Recommended Operating Conditions MIN NOM MAX UNIT
VIN Input voltage range 1.8 6 V
VOUT Output voltage range 28 V
L Inductor(1) 2.2 10 μH
f Switching frequency(1) 1 MHz
CIN Input capacitor (1) 4.7 μF
COUT Output capacitor (1) 1μF
TAOperating ambient temperature –40 85 °C
TJOperating junction temperature –40 125 °C
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.4 Thermal Information
THERMAL METRIC(1) TPS61040 TPS61041 UNITDBV DDC DRV DBV DRV
5 PINS 5 PINS 6 PINS 5 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 205.2 214.7 83.0 205.2 83.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 118.3 38.5 57.1 118.3 57.1 °C/W
RθJB Junction-to-board thermal resistance 34.8 35.4 52.9 34.8 52.9 °C/W
ψJT Junction-to-top characterization parameter 12.2 0.4 2.4 12.2 2.4 °C/W
ψJB Junction-to-board characterization parameter 33.9 34.8 53.4 33.9 53.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — 26.9 — 26.9 °C/W

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(1) The line and load regulation depend on the external component selection. See the application section for further information.
6.5 Electrical Characteristics
VIN = 2.4 V, EN = VIN, TA= –40°C to 85°C, typical values are at TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
VIN Input voltage range 1.8 6 V
IQOperating quiescent current IOUT = 0 mA, not switching, VFB = 1.3 V 28 50 μA
ISD Shutdown current EN = GND 0.1 1 μA
VUVLO Undervoltage lockout threshold 1.5 1.7 V
ENABLE
VIH EN high level input voltage 1.3 V
VIL EN low level input voltage 0.4 V
IIEN input leakage current EN = GND or VIN 0.1 1 μA
POWER SWITCH AND CURRENT LIMIT
Vsw Maximum switch voltage 30 V
toff Minimum off time 250 400 550 ns
ton Maximum on time 4 6 7.5 μs
RDS(on) MOSFET on-resistance VIN = 2.4 V; ISW = 200 mA; TPS61040 600 1000 mΩ
RDS(on) MOSFET on-resistance VIN = 2.4 V; ISW = 200 mA; TPS61041 750 1250 mΩ
MOSFET leakage current VSW = 28 V 1 10 μA
ILIM MOSFET current limit TPS61040 350 400 450 mA
ILIM MOSFET current limit TPS61041 215 250 285 mA
OUTPUT
VOUT Adjustable output voltage range VIN 28 V
Vref Internal voltage reference 1.233 V
IFB Feedback input bias current VFB = 1.3 V 1 μA
VFB Feedback trip point voltage 1.8 V ≤VIN ≤6 V 1.208 1.233 1.258 V
Line regulation (1) 1.8 V ≤VIN ≤6 V; VOUT = 18 V; Iload = 10 mA;
CFF = not connected 0.05 %/V
Load regulation(1) VIN = 2.4 V; VOUT = 18 V; 0 mA ≤IOUT ≤30 mA 0.15 %/mA

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1 2 3 4 5 6
IO= 10 mA
IO= 5 mA
VI− Input Voltage − V
L = 10 µH
VO= 18 V
Efficiency − %
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0.1 1 10 100
L = 10 µH
L = 3.3 µH
IL− Load Current − mA
VO= 18 V
Efficiency − %
Efficiency − %
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90
0.1 1 10 100
VI= 5 V
VI= 3.6 V
VI= 2.4 V
IO− Output Current − mA
VO= 18 V
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80
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90
0.1 1 10 100
TPS61040
TPS61041
IL− Load Current − mA
L = 10 µH
VO= 18 V
Efficiency − %
6
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6.6 Typical Characteristics
Table 1. Table of Graphs
FIGURE
ηEfficiency vs Load current Figure 1,
Figure 2,
Figure 3
vs Input voltage Figure 4
IQQuiescent current vs Input voltage and temperature Figure 5
VFB Feedback voltage vs Temperature Figure 6
ISW Switch current limit vs Temperature Figure 7
ICL Switch current limit vs Supply voltage, TPS61041 Figure 8
vs Supply voltage, TPS61040 Figure 9
RDS(on) RDS(on) vs Temperature Figure 10
vs Supply voltage Figure 11
Line transient response Figure 13
Load transient response Figure 14
Start-up behavior Figure 15
Figure 1. Efficiency vs Output Current Figure 2. Efficiency vs Load Current
Figure 3. Efficiency vs Load Current Figure 4. Efficiency vs Input Voltage

380
385
390
395
400
405
410
415
420
1.8 2.4 3 3.6 4.2 4.8 5.4 6
VCC − Supply Voltage − V
TA= 27°C
I(CL) − Current Limit − mA
0
200
400
600
800
1000
1200
−40−30 −20 −10 0 10 20 30 40 50 60 70 80 90
TA− Temperature − °C
TPS61041
TPS61040
rDS(on) − Static Drain-Source On-State Resistance − mΩ
230
250
270
290
310
330
350
370
390
410
430
−40−30−20−10 0 10 20 30 40 50 60 70 80 90
TPS61040
TPS61041
TA− Temperature − °C
I(SW) − Switch Current Limit − mA
240
242
244
246
248
250
252
254
256
258
260
1.8 2.4 3 3.6 4.2 4.8 5.4 6
VCC − Supply Voltage − V
TA= 27°C
I(CL) − Current Limit − mA
0
5
10
15
20
25
30
35
40
1.8 2.4 3 3.6 4.2 4.8 5.4 6
VI− Input Voltage − V
TA= 85°C
TA= 27°C
TA= −40°C
Quiescent Current − µA
1.23
1.232
1.234
1.236
1.238
1.24
−40 −20 0 20 40 60 80 100 120
VCC = 2.4 V
TA− Temperature − °C
VFB − Feedback Voltage − V
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Figure 5. TPS61040 Quiescent Current vs Input Voltage Figure 6. Feedback Voltage vs Free-Air Temperature
Figure 7. TPS6104x Switch Current Limit vs Free-Air
Temperature Figure 8. TPS61041 Current Limit vs Supply Voltage
Figure 9. TPS61040 Current Limit vs Supply Voltage Figure 10. TPS6104x Static Drain-Source On-State
Resistance vs Free-Air Temperature

0
100
200
300
400
500
600
700
800
900
1000
1.8 2.4 3 3.6 4.2 4.8 5.4 6
VCC − Supply Voltage − V
TPS61041
TPS61040
rDS(on) − Static Drain-Source On-State Resistance − mΩ
8
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Figure 11. TPS6104x Static Drain-Source On-State Resistance vs Supply Voltage

Ipeak(typ) ILIM
VIN
L100 ns
Ipeak(typ) 400 mA
VIN
L100 ns for the TPS61040-Q1
Ipeak(typ) 250 mA
VIN
L100 ns for the TPS61041-Q1
=
=
=
+
+
+
×
×
×
+
+
-
RS Latch
Logic
S
R
Gate
Driver
_
Current Limit
Power MOSFET
N-Channel
RSENSE
Soft
Start
6 s Maxm
On Time
VREF = 1.233 V
Error Comparator
400 ns Min
Off Time
Under Voltage
Lockout
Bias Supply
VIN
FB
EN
GND
SW
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7 Detailed Description
7.1 Overview
The TPS6104x is a high-frequency boost converter dedicated for small to medium LCD bias supply and white
LED backlight supplies. The device is ideal to generate output voltages up to 28 V from a dual-cell NiMH/NiCd or
a single cell device Li-Ion battery.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 Peak Current Control
The internal switch turns on until the inductor current reaches the typical dc current limit (ILIM) of 400 mA
(TPS61040) or 250 mA (TPS61041). Due to the internal propagation delay of typical 100 ns, the actual current
exceeds the dc current limit threshold by a small amount. The typical peak current limit can be calculated:
(1)
The higher the input voltage and the lower the inductor value, the greater the peak.
By selecting the TPS6104x, it is possible to tailor the design to the specific application current limit requirements.
A lower current limit supports applications requiring lower output power and allows the use of an inductor with a
lower current rating and a smaller form factor. A lower current limit usually has a lower output voltage ripple as
well.

ILIM
2
ILIM
4
10
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Feature Description (continued)
7.3.2 Soft Start
All inductive step-up converters exhibit high inrush current during start-up if no special precaution is made. This
can cause voltage drops at the input rail during start up and may result in an unwanted or early system shut
down.
The TPS6104x limits this inrush current by increasing the current limit in two steps starting from for 256
cycles to for the next 256 cycles, and then full current limit (see Figure 15).
7.3.3 Enable
Pulling the enable (EN) to ground shuts down the device reducing the shutdown current to 1 μA (typical).
Because there is a conductive path from the input to the output through the inductor and Schottky diode, the
output voltage is equal to the input voltage during shutdown. The enable pin needs to be terminated and should
not be left floating. Using a small external transistor disconnects the input from the output during shutdown as
shown in Figure 17.
7.3.4 Undervoltage Lockout
An undervoltage lockout prevents misoperation of the device at input voltages below typical 1.5 V. When the
input voltage is below the undervoltage threshold, the main switch is turned off.
7.3.5 Thermal Shutdown
An internal thermal shutdown is implemented and turns off the internal MOSFETs when the typical junction
temperature of 168°C is exceeded. The thermal shutdown has a hysteresis of typically 25°C. This data is based
on statistical means and is not tested during the regular mass production of the IC.
7.4 Device Functional Modes
7.4.1 Operation
The TPS6104x operates with an input voltage range of 1.8 V to 6 V and can generate output voltages up to 28
V. The device operates in a pulse-frequency-modulation (PFM) scheme with constant peak current control. This
control scheme maintains high efficiency over the entire load current range, and with a switching frequency up to
1 MHz, the device enables the use of very small external components.
The converter monitors the output voltage, and as soon as the feedback voltage falls below the reference voltage
of typically 1.233 V, the internal switch turns on and the current ramps up. The switch turns off as soon as the
inductor current reaches the internally set peak current of typically 400 mA (TPS61040) or 250 mA (TPS61041).
See Peak Current Control for more information. The second criteria that turns off the switch is the maximum on-
time of 6 μs (typical). This is just to limit the maximum on-time of the converter to cover for extreme conditions.
As the switch is turned off the external Schottky diode is forward biased delivering the current to the output. The
switch remains off for a minimum of 400 ns (typical), or until the feedback voltage drops below the reference
voltage again. Using this PFM peak current control scheme the converter operates in discontinuous conduction
mode (DCM) where the switching frequency depends on the output current, which results in very high efficiency
over the entire load current range. This regulation scheme is inherently stable, allowing a wider selection range
for the inductor and output capacitor.