Texas Instruments TMS570LS12x User manual

TMS570LS12x Hercules Development Kit (HDK)
User's Guide
Literature Number: SPNU568
September 2012

Contents
Preface ....................................................................................................................................... 4
1 Introduction ........................................................................................................................ 5
1.1 Scope of Document ......................................................................................................... 5
1.2 TMS570LS12 HERCULES Development Kit (HDK) Features ........................................................ 5
1.3 HDK Board Block Diagram ................................................................................................ 6
1.4 TMS570LS12 HDK Contents .............................................................................................. 6
1.5 HDK Specifications ......................................................................................................... 7
1.6 Basic Operation ............................................................................................................. 7
1.7 Memory Map ................................................................................................................. 7
1.8 Power Supply ................................................................................................................ 7
2 Physical Description ............................................................................................................ 8
2.1 Board Layout ................................................................................................................ 8
2.2 Connectors ................................................................................................................... 9
2.2.1 20-Pin ARM JTAG Header ...................................................................................... 10
2.2.2 Ethernet Interface ................................................................................................ 10
2.2.3 CAN Interface ..................................................................................................... 10
2.2.4 J19, MIPI ETM Connector ....................................................................................... 11
2.2.5 J7, XDS100V2 USB JTAG Interface ........................................................................... 12
2.2.6 P1, +5 V to +12 V Input .......................................................................................... 12
2.2.7 SCI Interface ...................................................................................................... 12
2.2.8 Daughter Card Interface ......................................................................................... 13
2.3 LEDs ........................................................................................................................ 16
2.4 S2 DIP Switch .............................................................................................................. 16
2.5 Jumpers ..................................................................................................................... 17
2.6 S4, Power On Reset Switch ............................................................................................. 17
2.7 S3, System Reset Switch ................................................................................................ 17
A Operation Notices .............................................................................................................. 18
2Contents SPNU568–September 2012
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List of Figures
1-1. TMS570LS12 HDK Board Block Diagram............................................................................... 6
2-1. TMS570LS12 HDK Board, Interfaces Top Side ........................................................................ 8
2-2. Connectors on TMS570LS12 HDK....................................................................................... 9
2-3. J2, J3 CAN Bus Interface (Screw Terminal)........................................................................... 11
2-4. J19, 60 Pin MIPI ETM Header........................................................................................... 11
2-5. +12 V Input Jack........................................................................................................... 12
2-6. J9, J10, and J11 on HDK................................................................................................. 13
2-7. DIP Switch Settings ....................................................................................................... 16
List of Tables
1-1. TMS570LS12 Memory Map ............................................................................................... 7
1-2. Power Test Points .......................................................................................................... 7
2-1. Connectors on HDK Board ................................................................................................ 9
2-2. 20-Pin ARM JTAG Header............................................................................................... 10
2-3. J1, Ethernet Interface..................................................................................................... 10
2-4. J19, MIPI Connector Signal Mapping................................................................................... 11
2-5. J7, XDS100V2 USB JTAG Interface.................................................................................... 12
2-6. Expansion Connector P2 (J10, Right, TopView) ...................................................................... 13
2-7. Expansion Connector P1 (J9, Left, TopView) ......................................................................... 14
2-8. Expansion Connector P3 (J11, Bottom One, TopView).............................................................. 15
2-9. Demo LEDs ................................................................................................................ 16
2-10. Other LEDs as Indicator.................................................................................................. 16
2-11. S2 DIP Switch Functions ................................................................................................. 17
2-12. Jumpers..................................................................................................................... 17
3
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Preface
SPNU568–September 2012
Read This First
About This Manual
This document describes the board level operations of the TMS570LS12 Hercules™ Development Kit
(HDK). The HDK is based on the Texas Instruments TMS570LS1227 Microcontroller. The TMS570LS12
HDK is a table top card that allows engineers and software developers to evaluate certain characteristics
of the TMS570LS1227 microcontroller to determine if the microcontroller meets the designer’s application
requirements as well as begin early application development. Evaluators can create software to execute
on board or expand the system in a variety of ways.
Notational Conventions
This document uses the following conventions.
The TMS570LS12 HDK will sometimes be referred to as the HDK.
Program listings, program examples, and interactive displays are shown in a special italic typeface. Here
is a sample program listing:
• equations
• !rd = !strobe&rw
Information About Cautions
This book may contain cautions.
This is an example of a caution statement.
A caution statement describes a situation that could potentially damage your software, or hardware, or
other equipment. The information in a caution is provided for your protection. Please read each caution
carefully.
Related Documentation From Texas Instruments
Information regarding this device can be found at the following Texas Instruments website:
http://www.ti.com/tms570
Hercules, Code Composer Studio are trademarks of Texas Instruments.
ARM is a registered trademark of ARM Limited.
All other trademarks are the property of their respective owners.
4Read This First SPNU568–September 2012
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Chapter 1
SPNU568–September 2012
Introduction
This development kit provides a product-ready hardware and software platform for evaluating the
functionality of the Texas Instruments TMS570LS12 microcontroller family. Schematics, list of materials,
and PCB layout are available to ease hardware development and reduce time to market.
1.1 Scope of Document
This user's guide lists the contents of the development kit, points out the features of the major
components, and provides the instructions necessary to verify your development kit is in working order.
Any additional usage instructions or details fall outside the scope of this document. Additional resources
will be listed at the end of this user's guide.
1.2 TMS570LS12 HERCULES Development Kit (HDK) Features
The HDK comes with a full complement of on board devices that suit a wide variety of application
environments. Key features include:
• A Hercules TMS570LS1227 337-pin BGA microcontroller
• Integrated USB JTAG Emulator (XDS100v2)
• External JTAG Headers ( ARM®20 pin and TI Compact 20-pin CTI)
• 10/100 Mbps Ethernet interface
• Two CAN transceivers (SN65HVDA541Q1) and screw terminal blocks
• One ambient light sensor
• One ambient temperature sensor
• Microcontroller’s serial communication interface (SCI) universal asynchronous receiver/transmitter
(UART) accessible through a USB virtual COM port
• One 8MB SDRAM
• Eight user programmable white LEDs around the MCU silicon
• One user programmable pushbutton
• Three expansion connectors for hardware prototyping
• Reset pushbuttons (nPORRST and nRST)
• One SD card slot (SPI mode)
• Embedded trace macrocell (ETM) debug interface via MIPI connector
• Configurable pin mux options
• 5 V and 3.3 V analog-to-digital converter (ADC) option jumper
• Current measurement capability for 3.3 V IO, 1.2 V core, 1.2 V core, 1.2 V PLL, 3.3 V or 5 V ADC, and
3.3 V VCCP
• Accepts an external power supply between +5V and +12V
5
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SDRAM
CAN1
ETM
SPI/ADC
JTAG
POR
RST
PWR
USB
EMU
EXP Conn1
SPI2
SD
Slot
XDS100V2
CPLD
FTDI
2332
Ext JTAG
EMIF/
ETM/
SPI2
ENET
RJ45
ENET
PHY
MII/
RMII
CAN
PHY
EXP Conn2
EXP Conn3
Pinmux
DIP
PIN MUX
TMS570LS1227
180 MHz
PIN MUX
CAN/
FRAY/LIN/
GIO/HET
Light
Sensor
Temp
Sensor
CAN2
CAN
PHY
GIO
Button
3.3V/5V A/D 3.3V I/O
1.2V Core
HDK Board Block Diagram www.ti.com
1.3 HDK Board Block Diagram
Figure 1-1 illustrates the HDK block diagram.
Figure 1-1. TMS570LS12 HDK Board Block Diagram
1.4 TMS570LS12 HDK Contents
The kit contains everything needed to develop and run applications for TMS570LS1227 microcontrollers
including:
• Board:
– TMS570LS12 Card
• Cables and Accessories
– 12 V power supply with power adapters for US, or Europe
– Type A to mini B USB cable for using on board XDS100V2 JTAG emulator
– Ethernet cable
– Flashlight for light sensor demo
• CCS DVD Containing:
– Texas Instruments’ Code Composer Studio™ Integrated Development Environments (IDE)
• Hercules DVD Containing:
– Hercules Safety Demos
– Hardware Abstraction Layer Code Generator (HALCoGen)
– Training Videos
– Device Documentation
6Introduction SPNU568–September 2012
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www.ti.com HDK Specifications
1.5 HDK Specifications
• Board supply voltage: 5 V–12 V Vdc
• Board supply current: 130 mA typ (fully active, CPU at 180 MHz)
• Dimensions: 4.90” x 4.30” x 0.85” (LxWxH)
1.6 Basic Operation
The HDK is designed to work with TI’s Code Composer Studio and other third party ARM IDEs. The IDE
communicates with the board through the embedded emulator or an external JTAG emulator. To start,
follow the instructions in the Quick Start Guide to install Hercules-specific software. This process will install
all of the necessary development tools, documentation and drivers.
1.7 Memory Map
The TMS570LS12 family of MCUs have a large byte addressable address space. Table 1-1 shows the
address space of a TMS570LS1227 microcontroller on the left with specific details of how each region is
used by the HDK on the right. By default, the internal memory sits at the beginning of the address space.
The SDRAM is mapped into CS0 space on the EMIF. CS[4:2] are used for synchronous memory for
example SRAM, NOR Flash, NAND Flash, and so forth.
Table 1-1. TMS570LS12 Memory Map
Start Address End Address HDK
0x0000 0000 0x002F FFFF Flash
0x0800 0000 0x0803 FFFF RAM
0x0840 0000 0x0843 FFFF RAM-ECC
0x6000 0000 0x63FF FFFF CS2 Async RAM
0x6400 0000 0x67FF FFFF CS3 Async RAM
0x6800 0000 0x7BFF FFFF CS4 Async RAM
0x8000 0000 0x87FF FFFF CS0 Sync SDRAM
1.8 Power Supply
The HDK board operates from a single +12 V external power supply connected to the main power input
(P1), a 2.5 mm, barrel-type plug. Internally, the +12 V input is converted into +1.2 V, +3.3 V and +5.0 V
using Texas Instruments swift voltage regulators and PTH power module. The +1.2 V supply is used for
the MCU core while the +3.3 V supply is used for the MCU's I/O buffers and other module on the board.
The +5.0 V supply is used for ADC power (second option) and USB VBUS.
There are multiple power test points on the HDK board. The three main test point pairs provide a
convenient mechanism to check the HDK’s current for each supply. Table 1-2 shows the voltages for each
test point and what the supply is used for.
Table 1-2. Power Test Points
Test Point Pair Voltage Voltage Use
TP14 and TP15 1.2 V MCU core
TP16 and TP17 3.3 V MCU IO and logic
TP18 and TP19 1.2 V MCU PLL
TP20 and TP21 3.3 V MCU Flash pump
TP22 and TP23 3.3 V or 5.0 V MCU MibADC, and ADREFHI
(J8 to enable 5 V)
7
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Hercules
TMS570LS
1227
Chapter 2
SPNU568–September 2012
Physical Description
This section describes the physical layout of the TMS570LS12 HDK board and its interfaces.
2.1 Board Layout
The TMS570LS12 HDK board is a 4.9 x 4.3 inch (125 x 109 mm) eight layer printed circuit board that is
powered by an external +5 V to approximately +12 V only power supply. Figure 2-1 shows the layout of
the TMS570LS12 HDK board.
Figure 2-1. TMS570LS12 HDK Board, Interfaces Top Side
8Physical Description SPNU568–September 2012
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J1
J2 J3
J4
J6
J7
J15
J12
J19
J10
J11
J9
P1
Hercules
TMS570LS
1227
www.ti.com Connectors
2.2 Connectors
The HDK board has 13 interfaces to various peripherals. These interfaces are described in the following
sections.
Figure 2-2. Connectors on TMS570LS12 HDK
Table 2-1. Connectors on HDK Board
Connector Size Function
J1 RJ45 Ethernet
J2 3 terminal, 2.54mm DCAN1
J3 3 terminal, 2.54mm DCAN2
J4 10x2, 2.54mm ARM 20pin JTAG header
J6 19x2, mictor RTP
J7 4pin, Mini-B USB XDS100V2 USB
J9 33x2, 2mm Exp P1, SPI1, SPI5, ADC
J10 33x2, 2mm EXP P2, SPI2, EMIF, ECLK
J11 40x2, 2mm EXP P3, SPI3, GIO, NHET, DCAN, LIN
J12 19x2, mictor DMM
J15 SD card
J19 30x2, MIPI ETM MIPI Header
P1 2.5mm +12 V In
9
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Connectors www.ti.com
2.2.1 20-Pin ARM JTAG Header
In addition to on board XDS100V2 JTAG, one 20-pin ARM JTAG header is added for using external
emulator. This is the standard interface used by JTAG emulators to interface to ARM microcontrollers. The
pinout for the connector is shown in Table 2-2.
Table 2-2. 20-Pin ARM JTAG Header
Signal Name Pin Number Pin Number Signal Name
Vref 1 2 VCC
nTRST 3 4 GND
TDI 5 6 GND
TMS 7 8 GND
TCK 9 10 GND
RTCK 11 12 GND
TDO 13 14 GND
nRST 15 16 GND
NC 17 18 GND
NC 19 20 GND
2.2.2 Ethernet Interface
The TMS570LS1227 integrates an MII/RMII Ethernet MAC on chip. This interface is routed to the on
board PHY via CBT switches. The board uses a DP83640 PHY. The interface is isolated and brought out
to a RJ-45 connector with integrated magnetics, J1. The pinmux control DIP S2 is used to control the CBT
FET switch for RMII, MII or other functions.
The J1 connector is used to provide a 10/100 Mbps Ethernet interface. This is a standard RJ-45
connector. The cable end pinout for the J1 connector is shown in Table 2-3.
Table 2-3. J1, Ethernet Interface
Pin Number Signal Pin Number Signal
1 D0+ 2 D0-
3 D1- 4 D2+
5 D2- 6 D1-
7 D3+ 8 D3-
Two LEDs are embedded into the connector to report link status (green LED) and transmit and receive
status of the PHY (yellow LED).
2.2.3 CAN Interface
The TMS570LS1227 has up to three DCAN interfaces that provide a high-speed serial interface. Two 3-
pin screw terminal blocks, J2, J3, are used to interface to the DCAN bus. The pinouts for this connector
are shown in Figure 2-3. H means CAN High (CAN H), and L means CAN Low (CAN L).
CAN Bus termination is used to minimize signal reflection on the bus. ISO-11898 requires that the CAN
bus have a nominal characteristic line impedance of 120 Ω. Therefore, the typical terminating resistor
value for each end of the bus is 120 Ω. A split termination method is used to help increase EMC
performance. Split termination is a concept that is growing in popularity because emission reduction can
be achieved very easily. Split termination is a modified standard termination in which the single 120 Ω
resistor on each end of the bus is split into two 60 Ωresistors, with a bypass capacitor tied between the
resistors and to ground. The two resistors should match as close as possible.
10 Physical Description SPNU568–September 2012
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