Texas Instruments CC3235MODSF SimpleLink User manual

CC3235MODSF SimpleLink™ Wi-Fi®and IoT
Solution With MCU LaunchPad™ Hardware
User's Guide
Literature Number: SWRU548
February 2019

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Contents
Contents
1 CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD)...................................... 3
1.1 Introduction ................................................................................................................... 5
1.1.1 CC3235MODSF LaunchPad™ ................................................................................... 5
1.1.2 LAUNCHCC3235MOD Key Features............................................................................ 6
1.1.3 What's Included ..................................................................................................... 6
1.1.4 Regulatory Compliance ........................................................................................... 6
1.1.5 First Steps: Out-of-Box Experience .............................................................................. 7
1.1.6 Next Steps: Looking into the Provided Code ................................................................... 7
1.2 Hardware ..................................................................................................................... 8
1.2.1 Block Diagram....................................................................................................... 9
1.2.2 Hardware Features................................................................................................ 11
1.2.3 BoosterPack Header Pin Assignment ......................................................................... 25
1.2.4 Electrical Characteristics ........................................................................................ 26
1.2.5 Antenna Characteristics ......................................................................................... 26
1.3 Layout Guidelines .......................................................................................................... 27
1.3.1 LAUNCHCC3235MOD Board Layout........................................................................... 27
1.3.2 General Layout Recommendations............................................................................. 31
1.3.3 RF Layout Recommendations .................................................................................. 31
1.3.4 Antenna Placement and Routing ............................................................................... 33
1.3.5 Transmission Line Considerations ............................................................................. 33
1.4 Operational Setup and Testing .......................................................................................... 35
1.4.1 Measuring the CC3235MOD Current Draw ................................................................... 35
1.4.2 RF Connections ................................................................................................... 36
1.4.3 Design Files ....................................................................................................... 37
1.4.4 Software ........................................................................................................... 37
1.5 Development Environment Requirements .............................................................................. 37
1.5.1 CCS................................................................................................................. 37
1.5.2 IAR .................................................................................................................. 37
1.6 Additional Resources ..................................................................................................... 38
1.6.1 CC3235MODx Product Page ................................................................................... 38
1.6.2 Download CCS, IAR ............................................................................................. 38
1.6.3 SimpleLink™ Academy for CC3235 SDK ..................................................................... 38
1.6.4 TI E2E Community ............................................................................................... 38
1.7 Assembly Drawing and Schematics .................................................................................... 39
1.7.1 Assembly Drawing ................................................................................................ 39
1.7.2 Schematics ........................................................................................................ 40

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CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD)
Chapter 1
SWRU548–February 2019
CC3235MODSF LaunchPad™ Development Kit
(LAUNCHCC3235MOD)
Start your design with the industry's first programmable FCC, IC/ISED, ETSI/CE, and MIC Certified
wireless microcontroller (MCU) module with built-in Dual-Band (2.4 GHz and 5 GHz) Wi-Fi®connectivity.
Created for the Internet-of-Things (IoT), the SimpleLink™ CC3235MODx family of devices from Texas
Instruments™ are wireless modules that integrate two physically separated, on-chip MCUs:
• An application processor – ARM®Cortex®-M4 MCU with a user-dedicated 256KB of RAM and an
optional 1MB of Serial Flash.
• A network processor MCU to run all Wi-Fi and Internet logic layers. This ROM based subsystem
includes an 802.11 a/b/g/n radio, baseband, and MAC with a powerful crypto engine for fast, secure
internet connections with 256-bit encryption.
The LAUNCHCC3235MODis a low-cost evaluation platform for MCUs based on ARM Cortex-M4 devices.
The LaunchPad™ design highlights the CC3235MODSF fully-integrated industrial module solution and
Dual-Band Wi-Fi capabilities. The LAUNCHCC3235MOD also features temperature and accelerometer
sensors, programmable user buttons, an RBG LED for custom applications, and onboard emulation for
debugging. The stackable headers interface demonstrates how easy it is to expand the functionality of the
LaunchPad when interfacing with other peripherals on existing BoosterPack™ add-on boards, such as
graphical displays, audio codec, antenna selection, environmental sensing, and more.
Figure 1-1 shows the CC3235MODSF LaunchPad development kit.

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CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD)
Figure 1-1. CC3235MODSF SimpleLinkTM Wi-Fi® LaunchPad Development Kit

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CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD)
1.1 Introduction
1.1.1 CC3235MODSF LaunchPad™
Created for the Internet of Things (IoT), the SimpleLink CC3235MODx is a wireless module with built-in
Dual-Band Wi-Fi connectivity for the LaunchPad ecosystem, which integrates a high-performance ARM
Cortex-M4 MCU and lets customers develop an entire application with one device. With on-chip Wi-Fi,
Internet, and robust security protocols, no prior Wi-Fi experience is required for fast development.
The CC3235MODSF LaunchPad, referred to by its part number LAUNCHCC3235MOD, is a low-cost
evaluation platform for ARM Cortex-M4-based MCUs. The LaunchPad design highlights the
CC3235MODSF Internet-on-a chip solution and Dual-Band Wi-Fi capabilities. The CC3235MODSF
LaunchPad also features temperature and accelerometer sensors, programmable user buttons, an RGB
LED for custom applications, and onboard emulation for debugging. The stackable headers of the
CC3235MODSF LaunchPad XL interface demonstrate how easy it is to expand the functionality of the
LaunchPad when interfacing with other peripherals on many existing BoosterPack add-on boards, such as
graphical displays, audio codecs, antenna selection, environmental sensing, and more. Figure 1-1 shows
the CC3235MOD LaunchPad.
Multiple development environment tools are also available, including TI’s Eclipse-based Code Composer
Studio™ (CCS) integrated development environment (IDE) and IAR Embedded Workbench®. More
information about the LaunchPad, the supported BoosterPack modules, and the available resources can
be found at TI’s LaunchPad portal.
NOTE: The maximum RF power transmitted in each WLAN 2.4 GHz band is 22 dBm (EIRP power).
The maximum RF power transmitted in each WLAN 5 GHz band is 23 dBm (EIRP power).
NOTE: The antennas used for this transmitter must be installed to provide a separation distance of
at least 20 cm from all persons, and must not be colocated or operating in conjunction with
any other antenna or transmitter.

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1.1.2 LAUNCHCC3235MOD Key Features
The LAUNCHCC3235MOD SimpleLink LaunchPad includes the following features:
• CC3235MODSF, SimpleLinkTM Dual-Band Wi-Fi®module solution
– Integrated MCU
– 40.0-MHz Crystal
– 32.768-kHz Crystal (RTC)
– 32-Mbit SPI Serial Flash
– RF and Full Power-Management Components
• 40-pin LaunchPad standard that leverages the BoosterPack ecosystem
• TI standard, XDS110-based JTAG emulation with serial port for flash programming
• Supports 4-wire JTAG and 2-wire SWD
• Two buttons and one RGB LED for user interaction
• Back-channel universal asynchronous receiver/transmitter (UART) through USB to PC
• Onboard chip antenna with U.FL for conducted testing selectable using 0-Ωresistors
• Onboard accelerometer and temperature sensor for out-of-box demo with option to isolate the sensors
from the inter-integrated circuit (I2C) bus
• Micro-USB connector for power and debug connections
• Headers for current measurement and external JTAG connection (option to use the onboard XDS110
to debug customer platforms)
• Bus-powered device with no external power required for Wi-Fi
• Long-range transmission with highly optimized antenna (200 m typical in open air using an access
point with 6-dBi antenna AP)
• Can be powered externally, with two AA or two AAA alkaline batteries working down to 2.3-V typical
• Dimensions: 106.1 mm (L) × 58.42 mm (W)
1.1.3 What's Included
1.1.3.1 Kit Contents
• CC3235MODSF LaunchPad development tool (LAUNCHCC3235MOD)
• Micro USB cable
• Quick start guide
1.1.3.2 Software Examples
• Out-of-Box Experience (OOBE) Software
1.1.4 Regulatory Compliance
Certifications in Process
Indoor Usage Restrictions:
The device is restricted to indoor use only when operating in the 5150 to 5350 MHz frequency range.
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CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD)
1.1.5 First Steps: Out-of-Box Experience
An easy way to get started with the EVM is by using its preprogrammed out-of-box experience code. It
demonstrates some key features of the EVM.
1.1.5.1 Connecting to the Computer
Connect the LaunchPad development kit by connecting the included USB cable to a computer. A red
power LED should illuminate. For proper operation, the SimpleLink drivers and Service Pack from the
CC3235 Software Development Kit (SDK) are needed. The SDK is available at
http://www.ti.com/tool/simplelink-cc32xx-sdk.
1.1.5.2 Running the Out-of-Box Experience
The CC3235MODSF LaunchPad development kit's Out-of-Box Experience (OOBE) demonstrates and
highlights the following features:
• Easy connection to the CC3235MODSF LaunchPad:
– Using the SimpleLinkTM Wi-Fi® Starter Pro application (available on iOS and Android™), users can
use Access Point (AP) provisioning or SmartConfig™ provisioning for a fast CC3235MOD
connection.
– Configuring the device in AP mode gives users a direct connection to the CC3235MODSF
LaunchPad.
Once the device is provisioned and connected to an AP in station mode, the profile is stored on the
local file system so that any reset to the CC3235MODSF automatically connects it to the AP.
• Easy access to the CC3235MODSF through its internal web server, using either:
– The SimpleLinkTM Wi-Fi® Starter Pro application
– Any browser; web pages stored on the serial flash are loaded on the browser, to provide ease of
use.
This feature demonstrates configuring and reading onboard sensors.
• Over-The-Air (OTA) updates that demonstrate an update of a full image. OTA service enables in-
system updates of the MCU application, CC3235 firmware releases (Service Pack) made available by
TI, and other vendor files. An update procedure executed in a full-system integrity fashion, such as
failure to upgrade any image components, results in rolling back to the previous valid version.
1.1.6 Next Steps: Looking into the Provided Code
After the EVM features have been explored, the user can open an integrated development environment
and start editing the code examples from the SDK. See Section 1.6.2 for available IDEs and where to
download them. The Out-of-Box source code and more code examples are provided in the CC3235 SDK.
Code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs.
With the onboard XDS110 debug probe, debugging and downloading new code is simple. A USB
connection between the EVM and a PC through the provided USB cable is all that is needed.

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1.2 Hardware
Figure 1-2 shows the CC3235MODSF LaunchPad EVM.
Figure 1-2. CC3235MODSF LaunchPad™ EVM Overview

CC3235
MAC/PHY
WRF_BGN F
BGN
RF_ANT1
32-Mbit
SFlash
External SPI
Programming
40 MHz
32.768 kHz
UART
SPI
nReset
PM
2.3 V to 3.6 V
VBAT
User GPIOx
Aband
F
D
5 GHz
SPDT
WRF_A
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CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD)
1.2.1 Block Diagram
Figure 1-3 shows a functional block diagram of the CC3235MODx module.
Figure 1-3. CC3235MODx Functional Block Diagram

CC3235MODSF12MOBR
Acc
BMA280
Temperature
Sensor
TMP116
Two 20-pin LaunchPad headers
(compatible with TI MCU standard)
INT (GPIO13)
I2C
FTDI
FT2232D
and
SWD Circuit
USB
Connector
LDO
3.3 V VCC
Two AA
Battery
Connectors
Reverse
Protection
Push buttons
GPIO13, GPIO22 RGB LED GPIO9, GPIO10, GPIO11
JTAG and SWD
UART (Flashing)
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Figure 1-4 shows a functional block diagram of the LAUNCHCC3235MOD SimpleLink LaunchPad.
Figure 1-4. LAUNCHCC3235MOD Functional Block Diagram

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CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD)
1.2.2 Hardware Features
• CC3235MODSF, SimpleLinkTM Dual-Band Wi-Fi®module solution with integrated MCU
• 40-pin LaunchPad™ standard that leverages the BoosterPack™ ecosystem
• TI Standard XDS110-based JTAG emulation with serial port for flash programming
• Supports both 4-wire JTAG and 2-wire SWD
• Two buttons and a RGB LED for user interaction
• Virtual COM port UART through USB on PC
• Onboard chip antenna with U.FL or SMA for conducted testing, selectable using 0-Ωresistors
• Onboard accelerometer and temperature sensor for out-of-box demo, with the option to isolate them
from the inter-integrated circuit (I2C) bus
• Micro USB connector for power and debug connections
• Headers for current measurement and external JTAG connection, with an option to use the onboard
XDS110 to debug customer platforms
• Bus-powered device, with no external power required for Wi-Fi®
• Long-range transmission with a highly optimized antenna (200-meter typical in open air with a 6-dBi
antenna AP)
• Can be powered externally, working down to 2.3 V
1.2.2.1 Key Benefits
The CC3235MODx modules offer the following benefits:
• Fully Integrated and Green/RoHS Modules Includes All Required Clocks, SPI Flash, and Passives
• 802.11 a/b/g/n: 2.4 GHz and 5 GHz
• FCC, IC/ISED, ETSI/CE, and MIC Certified
• FIPS 140-2 Level 1 Validated IC Inside
• Multilayered security features, help developers protect identities, data, and software IP
• Low-Power Modes for battery powered application
• Coexistence with 2.4 GHz Radios
• Industrial Temperature: –40°C to +85°C
• CC3235MODx Multiple-core architecture, system-on-chip (SoC)
• 1.27-mm Pitch QFM Package for Easy Assembly and Low-Cost PCB Design
• Transferrable Wi-Fi Alliance®Certification
• Application microcontroller subsystem:
– Arm®Cortex®-M4 core at 80 MHz
– User-dedicated memory
• 256 KB RAM
• Optional 1 MB executable Flash
– Rich set of peripherals and timers
– 26 I/O pins with flexible multiplexing options
• UART, I2S, I2C, SPI, SD, ADC, and 8-bit parallel interface
• 8-bit Synchronous Image Interface
• Timers and PWM
– Debug Interfaces: JTAG, cJTAG, and SWD
•Wi-Fi network processor subsystem:
– Wi-Fi®core:
• 802.11 a/b/g/n 2.4 GHz and 5 GHz
• Modes:

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• Access Point (AP)
• Station (STA)
• Wi-Fi Direct®(only supported on 2.4 GHz)
• Security:
• WEP
• WPA™/WPA2™ PSK
• WPA2 Enterprise
– Internet and application protocols:
• HTTPs server, mDNS, DNS-SD, DHCP
• IPv4 and IPv6 TCP/IP stack
• 16 BSD sockets (fully secured TLS v1.2 and SSL 3.0)
– Built-in power management subsystem:
• Configurable low-power profiles (always, intermittent, tag)
• Advanced low-power modes
• Integrated DC/DC regulators
•Multilayered security features:
– Separate execution environments
– Networking security
– Device identity and key
– Hardware accelerator cryptographic engines (AES, DES, SHA/MD5, CRC)
– Application-level security (encryption, authentication, access control)
– Initial secure programming
– Software tamper detection
– Secure boot
– Certificate signing request (CSR)
– Unique per device key pair
• Application Throughput
– UDP: 16 Mbps
– TCP: 13 Mbps
•Power-Management Subsystem:
– Integrated DC/DC converters support a wide range of supply voltage:
• VBAT wide-voltage mode: 2.3 V to 3.6 V
• VIO is always tied with VBAT
– Advanced low-power modes:
• Shutdown: 1 µA, hibernate: 5 µA
• Low-power deep sleep (LPDS): 120 µA
• Idle connected (MCU in LPDS): 710 µA
• RX traffic (MCU active): 59 mA
• TX traffic (MCU active): 223 mA
– Wi-Fi TX Power
• 2.4 GHz: 16.5 dBm at 1 DSSS
• 5 GHz: 14.5 dBm at 6 OFDM
– Wi-Fi RX Sensitivity
• 2.4 GHz: –94.5 dBm at 1 DSSS
• 5 GHz: –89 dBm at 6 OFDM

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CC3235MODSF LaunchPad™ Development Kit (LAUNCHCC3235MOD)
• Additional Integrated Components
– 40.0 MHz Crystal
– 32.768 kHz Crystal (RTC)
– 32 Mbit SPI Serial Flash
– RF Filters, Diplexer and Passive Components
• Footprint Compatible QFM Package
– CC3235MODx: 1.27-mm Pitch,
63-Pin, 20.5-mm × 17.5-mm
• Module Supports SimpleLink Developer's Ecosystem

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1.2.2.2 XDS110-Based Onboard Debug Probe
To keep development easy and cost effective, TI's LaunchPad development kits integrate an onboard
debug probe, which eliminates the need for expensive programmers. The CC3235MODSF LaunchPad
has the XDS-110-based debug probe (see Figure 1-5), which is a simple and low-cost debugger that
supports nearly all TI Arm device derivatives.
Figure 1-5. XDS-110 Debug Probe
The dotted line through J101 shown in Figure 1-5 divides the XDS110 debug probe from the target area.
The signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. More
details on the isolation jumper block are in Section 1.2.2.3.
The XDS110 debug probe also provides a "backchannel" UART-over-USB connection with the host, which
can be very useful during debugging and for easy communication with a PC. More details can be found in
Section 1.2.2.4.
The XDS110 debug probe hardware can be found in the schematics in Section 1.7.2 and in the hardware
design files.
1.2.2.3 Debug Probe Connection: Isolation Jumper Block
The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from
the XDS110 domain into the CC3235MOD target domain. This includes JTAG signals, application UART
signals, and 3.3-V and 5-V power.
Reasons to open these connections:
• To remove any and all influence from the XDS110 debug probe for high accuracy target power
measurements
• To control 3-V and 5-V power flow between the XDS110 and target domains

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• To expose the target MCU pins for other use than onboard debugging and application UART
communication
• To expose the programming and UART interface of the XDS110 so that it can be used for devices
other than the onboard MCU.
Table 1-1. Isolation Block Connections
Jumper Description
BRD Board Power. Supplies the board power from the onboard DC-
DC converter. The board power includes the sensors, LED, and
the OPAMP used to drive the ADC input.
GND Ground reference
5V 5-V VBUS from USB
VBAT 3.3-V rail, derived from VBUS in the XDS110 domain. Can also
be used to measure the current flowing into the CC3235MOD.
RX Backchannel UART: The target CC3235MODSF receives data
through this signal.
TX Backchannel UART: The target CC3235MODSF sends data
through this signal.
RST This pin functions as the RST signal (active low).
TMS Serial wire data input (SWDIO) / JTAG test mode select (TMS)
TCK Serial wire clock input (SWCLK) / JTAG clock input (TCK)
TDO JTAG test data out
TDI JTAG test data in
VBUFFER Used to power the level shifters located on the emulator side of
the board. The level shifters can be powered by shorting this pin
with a jumper. Removing the jumper enables low current
measurement.
1.2.2.4 Application (or "Backchannel") UART
The board supports a USB-based virtual COM port, using the Tiva™ ARM® MCU. The LaunchPad is
shipped with the UART lines from the CC3235MODSF connected to the UART on the Tiva MCU. The
CC3235MODSF's UART can also be routed to the 20-pin connector for use as a GPIO or external UART.
The selection is performed using jumpers on the board.
Figure 1-6 shows the UART routed to USB COM port. Ensure that a jumper is also placed on the
VBUFFER header to power the level shifters located on the emulator side of the board. Figure 1-7 shows
the UART routed to 20-pin header connector.
Figure 1-6. UART Routed to USB COM Port

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Figure 1-7. UART Routed to 20-Pin Header Connector
1.2.2.5 JTAG Headers
The headers are provided on the board to isolate the CC3235MOD from the onboard XDS110-based
JTAG emulator. These jumpers are shorted by default when the board is shipped from TI. Figure 1-5 and
Table 1-1 are for default configurations, and Figure 1-8 shows the external emulator connection. To
connect an external emulator, remove the isolation block JTAG jumpers and place the external emulator
on the JTAG IN connector.
Figure 1-8. JTAG IN Connector (J6)

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1.2.2.6 Using the XDS110 Debug Probe with a Different Target
The XDS110 debug probe on the LaunchPad development kit can interface to most Arm Cortex-M
devices, not just the onboard target CC3235MODSF device. This functionality is enabled by the J2 10-pin
Cortex-M JTAG connector (See Figure 1-9) and a 10-pin cable, such as the FFSD-05-D-06.00-01-N (sold
separately from the LaunchPad development kit).
Figure 1-9. XDS110 OUT Connector (J2)
Header J2 follows the Cortex-M Arm standard; however, pin 1 is not a voltage sense pin. The XDS110
outputs only 3.3-V JTAG signals. If another voltage level is needed, the user must provide level shifters to
translate the JTAG signal voltages.
1. Remove jumpers on the JTAG signals on the isolation block, including RST, TMS, TCK, TDO, and TDI.
2. Plug the 10-pin cable into J2, and connect to an external target.
a. J2 follows the Arm Cortex Debug Connector standard outlined in Cortex-M Debug Connectors.
3. Plug USB power into the LaunchPad development kit, or power it externally
a. JTAG levels are 3.3-V ONLY

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1.2.2.7 Power Connections
The board accommodates various power methods, including through the onboard XDS110 as well as
external or BoosterPack plug-in module power (see Figure 1-10).
Figure 1-10. LAUNCHCC3235MOD Power Block Diagram

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1.2.2.7.1 XDS110 USB Power
The most common power-supply scenario is from USB through the XDS110 debugger. This provides 5-V
power from the USB and also regulates this power rail to 3.3 V for XDS110 operation and 3.3-V to the
target side of the LaunchPad development kit. Power from the XDS110 is controlled by jumper J101.
When the board is powered from the USB connector, ensure that the jumpers are placed on the following
headers, shown in Figure 1-11.
Figure 1-11. Powering the CC3235MODSF LP from USB

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1.2.2.7.2 BoosterPack Plug-in Module and External Power Supply
Headers J19 and J20 are present on the board to supply external power directly when USB power is not
available. Use the following precautions before using the board with an external power supply.
1. Remove the USB cable.
2. Ensure that jumpers are only placed on the headers shown in Figure 1-12.
3. Use a jumper wire to connect VBAT and BRD.
4. Plug in the external power supply on J20 with the correct polarity.
Figure 1-12. Powering the CC3235MODSF LP from an External Power Supply
The OPAMP EN and LED EN jumpers are also available to remove any current draw from the onboard
OpAmp and LEDs being driven by the GPIOs, see Table 1-2.