Texas Instruments LaunchPad MSP430FR2476 User manual

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MSP430FR2476 LaunchPad™ Development Kit (LP ‑ MSP430FR2476)
User's Guide
SLAU802–March 2019
MSP430FR2476 LaunchPad™ Development Kit
(LP ‑‑ MSP430FR2476)
The MSP430FR2476 LaunchPad™ development kit is an easy-to-use evaluation module (EVM) for the
MSP430FR2476 microcontroller (MCU). The kit contains everything needed to start developing on the
ultra-low-power MSP430FRx FRAM microcontroller platform, including onboard debug probe for
programming, debugging, and energy measurements. The board also features onboard buttons and LEDs
for quick integration of a simple user interface, an onboard temperature sensor, and a CR2032 coin cell
battery holder.
Figure 1 shows the LP-MSP430FR2476 LaunchPad development kit.
Figure 1. LP-MSP430FR2476 LaunchPad Development Kit

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Contents
1 Getting Started............................................................................................................... 3
1.1 Introduction .......................................................................................................... 3
1.2 Key Features ........................................................................................................ 3
1.3 What’s Included..................................................................................................... 3
1.4 First Steps: Out-of-Box Experience .............................................................................. 3
1.5 Next Steps: Looking Into the Provided Code ................................................................... 4
2 Hardware...................................................................................................................... 4
2.1 Block Diagram....................................................................................................... 5
2.2 Hardware Features ................................................................................................. 5
2.3 Power ............................................................................................................... 10
2.4 Measure Current Draw of the MSP430 MCU.................................................................. 11
2.5 Clocking ............................................................................................................ 12
2.6 Using the eZ-FET Debug Probe With a Different Target .................................................... 12
2.7 BoosterPack Plug-in Module Pinout ............................................................................ 12
2.8 Design Files........................................................................................................ 14
2.9 Hardware Change Log............................................................................................ 14
3 Software Examples ........................................................................................................ 14
3.1 Out-of-Box Software Example................................................................................... 14
3.2 Blink LED Example................................................................................................ 15
4 Resources................................................................................................................... 16
4.1 Integrated Development Environments......................................................................... 16
4.2 LaunchPad Development Kit Websites......................................................................... 19
4.3 MSP430Ware and TI Resource Explorer ...................................................................... 19
4.4 FRAM Utilities...................................................................................................... 20
4.5 MSP430FR2476 MCU............................................................................................ 20
4.6 Community Resources ........................................................................................... 20
5 FAQ .......................................................................................................................... 21
6 Schematics.................................................................................................................. 22
List of Figures
1 LP-MSP430FR2476 LaunchPad Development Kit...................................................................... 1
2 LP-MSP430FR2476 Overview............................................................................................. 4
3 LP-MSP430FR2476 Block Diagram....................................................................................... 5
4 MSP430FR2476 Pinout..................................................................................................... 6
5 eZ-FET Debug Probe ....................................................................................................... 7
6 eZ-FET Isolation Jumper Block Diagram................................................................................. 9
7 Application Backchannel UART in Device Manager .................................................................... 9
8 LP-MSP430FR2476 Power Block Diagram............................................................................. 10
9 BoosterPack Checker Tool ............................................................................................... 13
10 LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout.................................. 13
11 TI Resource Explorer Cloud .............................................................................................. 16
12 CCS Cloud .................................................................................................................. 17
13 Directing the Project>Import Function to the Demo Project.......................................................... 18
14 When CCS Has Found the Project ...................................................................................... 18
15 Using TI Resource Explorer to Browse LP-MSP430FR2476 in MSP430Ware.................................... 19
16 Schematics (1 of 4) ........................................................................................................ 22
17 Schematics (2 of 4) ........................................................................................................ 23
18 Schematics (3 of 4) ........................................................................................................ 24
19 Schematics (4 of 4) ........................................................................................................ 25

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Trademarks
LaunchPad, BoosterPack, Code Composer Studio, EnergyTrace, MSP430, E2E are trademarks of Texas
Instruments.
IAR Embedded Workbench, C-SPY are registered trademarks of IAR Systems.
All other trademarks are the property of their respective owners.
1 Getting Started
1.1 Introduction
The 16-MHz MSP430FR2476 MCU features 64KB of embedded ferroelectric random access memory
(FRAM), a nonvolatile memory known for its ultra-low power, high endurance, and high speed write
access. Combined with 8KB of on-chip RAM, users have access to 64KB of memory to split between their
program and data as required. For example, a data logging application could require a large data memory
with relatively small program memory, so the memory can be allocated as required between program and
data memory.
Rapid prototyping is simplified by the 40-pin BoosterPack™ plug-in module headers, which support a wide
range of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity,
graphical displays, environmental sensing, and much more. Design your own BoosterPack plug-in module
or choose among many already available from TI and third-party developers.
Free software development tools are also available, such as TI’s Eclipse-based Code Composer Studio™
IDE (CCS) and IAR Embedded Workbench®IDE. Both of these IDEs support EnergyTrace™ technology
for real-time power profiling and debugging when paired with the MSP430FR2476 LaunchPad
development kit.
1.2 Key Features
• MSP430™ ultra-low-power FRAM technology based MSP430FR2476 16-bit MCU
• EnergyTrace technology available for ultra-low-power debugging
• 40-pin LaunchPad development kit standard leveraging the BoosterPack plug-in module ecosystem
• Onboard eZ-FET debug probe
• 2 buttons and 2 LEDs (1 RGB LED) for user interaction
• Temperature sensor for the Out-of-Box Experience demo
1.3 What’s Included
1.3.1 Kit Contents
• 1 LP-MSP430FR2476 LaunchPad development kit
• 1 micro USB cable
• 1 quick start guide
1.3.2 Software Examples
• Out-of-Box software
1.4 First Steps: Out-of-Box Experience
An easy way to get started with the EVM is by using its preprogrammed out-of-box code. This code
demonstrates some key features of the EVM.
1.4.1 Connecting to the Computer
Connect the LaunchPad development kit using the included USB cable to a computer. A green power LED
should illuminate. For proper operation, drivers are needed. TI recommends that you get the drivers by
installing an IDE such as TI's Code Composer Studio IDE or IAR Embedded Workbench IDE. Drivers are
also available at www.ti.com/MSPdrivers.

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1.4.2 Running the Out-of-Box Experience (OOBE)
The OOBE of the LP-MSP430FR2476 LaunchPad development kit demonstrates how to implement a
simple thermometer by using the internal ADC of the MSP430FR2476 MCU to measure the output voltage
from an analog temperature sensor.
When powering up the Out-of-Box demo, the board performs an initial temperature calibration and
illuminates RGB LED2 in a green color. Try to heat the temperature sensor U1 by blowing hot air on it to
see if you can get LED2 to turn red or using a compressed air can to blow cold air onto the sensor to see
LED2 turn blue. LED2 indicates the relative difference between the current temperature and the calibrated
measurement.
Press button S1 to recalibrate the temperature to the most recent measurement and send a UART
message (at 9600 baud) containing the new calibrated temperature through the backchannel UART. Press
button S2 at any time to send a UART message containing the current ambient temperature measurement
in Celsius.
1.5 Next Steps: Looking Into the Provided Code
After the EVM features have been explored, the fun can begin. It’s time to open an integrated
development environment and start editing the code examples. See Section 4 for available IDEs and
where to download them.
The quickest way to get started using the LaunchPad development kit is to use TI’s cloud development
tools. The cloud-based Resource Explorer provides access to all of the examples and resources in
MSP430Ware software. Code Composer Studio Cloud is a simple Cloud-based IDE that enables
developing and running applications on the LaunchPad development kit.
The out-of-box source code and more code examples are provided and available on the download page.
Code is licensed under BSD, and TI encourages reuse and modifications to fit specific needs.
Section 3 describes all functions in detail and provides a project structure to help familiarize you with the
code.
With the onboard eZ-FET debug probe, debugging and downloading new code is simple. A connection
between the EVM and a PC through the provided USB cable is all that is needed.
2 Hardware
Figure 2 shows an overview of the LP-MSP430FR2476 hardware.
Figure 2. LP-MSP430FR2476 Overview

Target device
MSP430FR2476
Crystal
32.768 kHz
Micro-B USB
3.3-V LDO
TPS73533
ESD protection
TPD2E001 Debug MCU
MSP430F5528
LEDs
red and green Crystal
4 MHz
UART or SBW to target
User interface
2 buttons, 2 LEDs
40-pin
LaunchPad
standard headers
Power to target
Reset
button
EnergyTrace MCU
MSP430G2452
Temperature
sensor TMP235
CR2032 coin cell
battery holder
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2.1 Block Diagram
Figure 3 shows the block diagram.
Figure 3. LP-MSP430FR2476 Block Diagram
2.2 Hardware Features
2.2.1 MSP430FR2476 MCU
The MSP430FR2476 is an ultra-low-power MSP430FRx FRAM-based microcontroller (MCU), which offer
extended data logging and security capabilities. The MSP430FR2476 offers the small LQFP package
(7 mm × 7 mm) in the FRAM microcontroller portfolio, combined with a variety of integrated peripherals
and ultra-low power consumption. FRAM is a cutting edge memory technology, combining the best
features of flash and RAM into one nonvolatile memory. For more information on FRAM, visit
www.ti.com/fram.
Device features include:
• 1.8-V to 3.6-V operation
• 16-bit RISC architecture up to 16-MHz system clock and 8-MHz FRAM access
• 64KB of program FRAM, 512 bytes of information FRAM, and 8KB of RAM
• 12-channel 12-bit ADC
• One enhanced comparator with integrated 6-bit DAC as reference voltage
• Four 16-bit timers with three capture/compare registers (Timer_B3)
• One 16-bit timer with seven capture/compare registers (Timer_B7)
• One 16-bit counter-only RTC
• 16-bit cyclic redundancy check (CRC)
• 43 GPIOs

DNC
29
P3.7/TA3.2
30
P4.0/TA3.1
31
P4.1/TA3.0
32
P4.2/TA3CLK
33
P2.7/UCB1STE
34
35
36
P5.4/UCB1STE/TA3CLK/A11
9
P1.0/UCB0STE/TA0CLK/A0/Veref+
10
11
12
TEST/SBWTCK
1
P1.4/UCA0TXD/UCA0SIMO/TA1.2/TCK/A4/VREF+
2
P1.5/UCA0RXD/UCA0SOMI/TA1.1/TMS/A5
3
P1.6/UCA0CLK/TA1CLK/TDI/TCLK/A6
4
P1.7/UCA0STE/SMCLK/TDO/A7
5
P4.3/UCB1SOMI/UCB1SCL/TB0.5/A8
6
P4.4/UCB1SIMO/UCB1SDA/TB0.6/A9
7
P5.3/UCB1CLK/TA3.0/A10
8
P2.3/TA2.0
P3.4/TA2CLK/COMP0OUT
P5.5/UCB0CLK/TA2CLK
P5.6/UCB0STE/TA2.0
P5.7/TA2.1/COMP0.2
19
P6.0/TA2.2/COMP0.3
20
P3.0/TA2.2
21
P3.3/TA2.1
22
23
24
P3.1/UCA1STE
25
P2.4/UCA1CLK
26
P2.5/UCA1RXD/UCA1SOMI
27
P2.6/UCA1TXD/UCA1SIMO
28
DVCC
RST/NMI/SBWTDIO
MSP430FR2476TPT
MSP430FR2475TPT
P5.0/UCA0CLK/TB0.2
P5.1/UCA0RXD/UCA0SOMI/TB0.3
P5.2/UCA0TXD/UCA0SIMO/TB0.4
43
P2.0/XOUT
44
P2.1/XIN
45
DVSS
46 47 48
P3.5/UCB1CLK/TB0TRG
P3.2/UCB1SIMO/UCB1SDA
P3.6/UCB1SOMI/UCB1SCL
37
P6.1/TB0CLK
38
P6.2/TB0.0
39
P4.7/UCA0STE/TB0.1
40 41 42
P1.1/UCB0CLK/TA0.1/COMP0.0/A1
P1.2/UCB0SIMO/UCB0SDA/TA0.2/A2/Veref-
P1.3/UCB0SOMI/UCB0SCL/MCLK/A3
13 14
P4.5/UCB0SOMI/UCB0SCL/TA3.2
15
P4.6/UCB0SIMO/UCB0SDA/TA3.1
16 17 18
P2.2/ACLK/COMP0.1
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Figure 4. MSP430FR2476 Pinout

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2.2.2 eZ-FET Onboard Debug Probe With EnergyTrace™ Technology
To keep development easy and cost effective, TI’s LaunchPad development kits integrate an onboard
debug probe, which eliminates the need for expensive programmers. The LP-MSP430FR2476 has the eZ-
FET debug probe (see Figure 5), which is a simple and low-cost debugger that supports all MSP430™
device derivatives.
Figure 5. eZ-FET Debug Probe
The LP-MSP430FR2476 LaunchPad development kit features EnergyTrace technology but does not have
support for EnergyTrace++ technology. The EnergyTrace technology functionality varies across the MSP
portfolio (see Table 1).
Table 1. EnergyTrace Technology
Features EnergyTrace Technology EnergyTrace++ Technology
Current monitoring ✔ ✔
CPU state ✔
Peripheral and system state ✔
Devices supported All MSP430 MCUs MSP430FR59xx and MSP430FR69xx
MCUs
Development tool required MSP-FET or eZ-FET MSP-FET or eZ-FET
The dotted line through J101 shown in Figure 5 divides the eZ-FET debug probe from the target area. The
signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. For more
details on the isolation jumper block, see Section 2.2.3.
The eZ-FET also provides a backchannel UART-over-USB connection with the host, which can be very
useful during debugging and for easy communication with a PC. For more details on this connection, see
Section 2.2.4.
The eZ-FET hardware schematics are available in Section 6 and in the hardware design files download
page. For more information on the software and the debugger, visit the eZ-FET wiki.

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2.2.3 Debug Probe Connection: Isolation Jumper Block
The isolation jumper block at jumper J101 lets you connect or disconnect signals that cross from the eZ-
FET domain into the MSP430FR2476 target domain. This includes eZ-FET Spy-Bi-Wire signals,
application UART signals, and 3.3-V and 5-V power.
Reasons to open these connections:
• To remove any and all influence from the eZ-FET debug probe for high accuracy target power
measurements
• To control 3-V and 5-V power flow between the eZ-FET and target domains
• To expose the target MCU pins for uses other than onboard debugging and application UART
communication
• To expose the programming and UART interface of the eZ-FET to use it for devices other than the
onboard MCU
• To select the CR2032 battery holder as the 3-V source
Table 2. Isolation Block Connections
Jumper Description
GND Ground
5V 5-V VBUS from USB
3V3 3.3-V rail, derived from VBUS in the eZ-FET domain or 3V rail derived from CR2032 battery
RXD << Backchannel UART: The target FR2476 receives data through this signal. The arrows indicate the direction of the
signal.
TXD >> Backchannel UART: The target FR2476 sends data through this signal. The arrows indicate the direction of the
signal.
SBW RST Spy-Bi-Wire debug: SBWTDIO data signal. This pin also functions as the RST signal (active low).
SBW TST Spy-Bi-Wire debug: SBWTCK clock signal. This pin also functions as the TST signal.

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Figure 6. eZ-FET Isolation Jumper Block Diagram
2.2.4 Application (or Backchannel) UART
The backchannel UART allows communication with the USB host that is not part of the target application’s
main functionality. This is very useful during development and also provides a communication channel to
the host PC. Data from this communication channel can be used to create a graphical user interface (GUI)
or other programs on the PC that communicate with the LaunchPad development kit.
Figure 6 shows the pathway of the backchannel UART. The backchannel UART is the UART on
eUSCI_A0.
A virtual COM port for the application backchannel UART is generated on the host when the LaunchPad
development kit enumerates on the host. You can use any PC application that interfaces with COM ports,
including terminal applications like Hyperterminal or Docklight, to open this port and communicate with the
target application. You need to identify the COM port for the backchannel. On Windows PCs, Device
Manager can assist.
Figure 7. Application Backchannel UART in Device Manager

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The backchannel UART is the "MSP Application UART1" port. In this case, Figure 7 shows COM13, but
this port can vary from one host PC to the next. After you identify the correct COM port, configure it in
your host application according to its documentation. You can then open the port and begin
communication to it from the host.
On the target MSP430FR2476 MCU, the backchannel is connected to the eUSCI_A0 module. The eZ-FET
has a configurable baud rate, and it is important to configure the PC application with the same baud rate
as the eUSCI_A0.
2.2.5 Special Features
2.2.5.1 TMP235 Temperature Sensor
The MSP430FR2476 MCU LaunchPad development kit features a TMP235A2 temperature sensor that is
accurate to ±0.5°C (typical) from –40°C to +150°C. The analog output of the TMP235 is connected to
analog input A1 (P1.1) on the MSP430FR2476 through a capacitor (C7) and a pair of resistors (R12 and
R13). The capacitor and resistors can be replaced if a custom RC circuit is needed. For applications that
use the temperature sensor and a connected BoosterPack plug-in module, determine if there are any pin
conflicts. The 3.3-V power rail can be disconnected from the TMP235 device by removing the shunt
jumper at J9. This is useful in low-power applications that do not use the temperature sensor.
2.2.5.2 CR2032 Coin Cell Battery
On the back of the LP-MSP430FR2476 board is a holder for a CR2032 coin cell battery (battery not
included). A CR2032 battery can be added to demonstrate battery-powered applications. See
Section 2.3.2 for additional details on how to power the LaunchPad development kit with the coin cell
battery.
2.3 Power
The board accommodates various powering methods, including through the onboard eZ-FET, using the
CR2032 battery, or using external or BoosterPack plug-in module power (see Figure 8).
Figure 8. LP-MSP430FR2476 Power Block Diagram
2.3.1 eZ-FET USB Power
The most common power-supply scenario is from USB through the eZ-FET debugger. This provides 5-V
power from the USB and also regulates this power rail to 3.3 V for eZ-FET operation and 3.3 V to the
target side of the LaunchPad development kit. Power from the eZ-FET is controlled by jumper J101. For
3.3 V, make sure that a jumper is connected across the J101 3V3 terminal.

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2.3.2 CR2032 Battery Power
A CR2032 battery holder is on the back of the LP-MSP430FR2476 board to power the LaunchPad
development kit from a single coin battery. To power the LaunchPad kit from the CR2032 coin cell, insert
the battery securely and in the correct orientation, and remove all of the shunt jumpers from J101 except
the 3V3 jumper. Place the 3V3 jumper in the lower configuration to connect the battery output to the target
side 3.3-V rail. This placement is also shown on the silkscreen on the PCB. Place a shunt jumper across
J10. Alternatively, place an ammeter across the pins of J10 to measure current out of the battery.
Do not use the eZ-FET emulation circuit when the LP-MSP430FR2476 is powered from the CR2032 coin
cell battery. Remove all of the shunt jumpers on J101 except the 3V3 (which is in the lower position) to
disconnect the eZ-FET circuit from the target side of the LaunchPad development kit. The CR2032 voltage
level will decrease with use and can cause voltage level violations on the eZ-FET portion of the design if
left connected. To debug the target device, the LaunchPad development kit should be configured for eZ-
FET USB Power as shown in Section 2.3.1
When not using the CR2032 battery to power the board, be sure the 3V3 shunt jumper on J101 is not
placed in the battery configuration. It is also useful to remove the jumper from J10 to disconnect the
battery from the rest of the power domains. This ensures there is no risk of applying an external voltage
source to the battery.
2.3.3 BoosterPack Plug-in Module and External Power Supply
Headers J6 is present on the board to supply external power directly. It is important to comply with the
device voltage operation specifications when supplying external power. The MSP430FR2476 has an
operating range of 1.8 V to 3.6 V. More information can be found in the MSP430FR247x Mixed-Signal
Microcontrollers data sheet.
2.4 Measure Current Draw of the MSP430 MCU
To measure the current draw of the MSP430FR2476 MCU using a multimeter, use the 3V3 jumper on the
J101 jumper isolation block. The current measured includes the target device and any current drawn
through the BoosterPack plug-in module headers.
To measure ultra-low power, follow these steps:
• Remove the 3V3 jumper in the J101 isolation block, and attach an ammeter across this jumper. Be
sure to use the correct pair of pins as outlined in Section 2.3 to select between eZ-FET power and
CR2032 power.
• Consider the effect that the backchannel UART and any circuitry attached to the MSP430FR2476 can
have on current draw. Consider disconnecting these at the isolation jumper block, or at least consider
their current sinking and sourcing capability in the final measurement.
• If using the CR2032 to supply power, remove all shunt jumpers at J101, except 3V3 in the lower
position, and connect J10 with a shunt jumper.
• Make sure there are no floating inputs/outputs (I/Os) on the MSP430FR2476. These cause
unnecessary extra current draw. Every I/O should either be driven out or, if it is an input, should be
pulled or driven to a high or low level.
• Begin target execution.
• Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a
stable measurement. It is easier to measure quiescent states.
EnergyTrace technology can also be used to compare various current profiles and better optimize your
energy performance.

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2.5 Clocking
The LP-MSP430FR2476 provides an external clock in addition to the internal clocks in the device.
• Q1: 32.768-kHz 12.5-pF crystal
The 32.768-kHz crystal allows for lower LPM sleep currents than do the other low-frequency clock
sources. Therefore, the presence of the crystal allows the full range of low-power modes to be used.
The internal clocks in the device default to the following configuration:
• MCLK: DCO at 1 MHz
• SMCLK: DCO at 1 MHz
• ACLK: REFO at 32.768 kHz
For more information about configuring internal clocks and using the external oscillators, see the
MSP430FR4xx and MSP430FR2xx Family User's Guide.
2.6 Using the eZ-FET Debug Probe With a Different Target
The eZ-FET debug probe on the LaunchPad development kit can interface to most MSP430 MCUs, not
just the onboard MSP430FR2476 target device.
To interface to another MCU, disconnect all jumpers in the isolation jumper block. This is necessary
because the debug probe cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW)
connection.
Next, make sure the target board has proper connections for SBW. To be compatible with SBW, the
capacitor on RST/SBWTDIO must be 2.2 nF or less. For documentation on designing MSP430 JTAG
interface circuitry, see the MSP430 Hardware Tools User's Guide.
Finally, wire together the following signals from the debug probe side of the isolation jumper block to the
target hardware:
• 5 V (if 5 V is needed)
• 3.3 V
• GND
• SBWTDIO
• SBWTCK
• TXD (if the UART backchannel is to be used)
• RXD (if the UART backchannel is to be used)
This wiring can be done either with jumper wires or by designing the board with a connector that plugs into
the isolation jumper block.
2.7 BoosterPack Plug-in Module Pinout
The LaunchPad development kit adheres to the 40-pin LaunchPad development kit pinout standard. This
standard was created to aid compatibility between LaunchPad development kits and BoosterPack plug-in
modules across the TI ecosystem.
While most BoosterPack plug-in modules are compliant with the standard, some are not. The LP-
MSP430FR2476 LaunchPad development kit is compatible with all 40-pin BoosterPack plug-in modules
that are compliant with the standard. If the reseller or owner of the BoosterPack plug-in module does not
explicitly indicate compatibility with the LP-MSP430FR2476 LaunchPad development kit, compare the
schematic of the candidate BoosterPack plug-in module with the LaunchPad development kit to ensure
compatibility. Keep in mind that sometimes conflicts can be resolved by changing the MSP430FR2476
device pin function configuration in software.

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Figure 9. BoosterPack Checker Tool
To check the compatibility of a BoosterPack plug-in module with the LaunchPad development kit of your
choice, use the BoosterPack Checker Tool. This allows you to select any LaunchPad development kit that
TI offers and determine its compatibility with any number of BoosterPack plug-in modules that we offer.
You can also add your own BoosterPack plug-in module to check its compatibility as you prototype that
next design.
Figure 10 shows the 40-pin pinout of the MSP430FR2476 LaunchPad development kit.
Note that software's configuration of the pin functions plays a role in compatibility. The LaunchPad
development kit side of the dashed line shows only the applicable function for conforming to the standard.
However, each pin has other functionality that can be configured by the software. See the
MSP430FR2476 device data sheet for more details on individual pin functions.
Figure 10. LaunchPad Development Kit to BoosterPack Plug-in Module Connector Pinout

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2.8 Design Files
2.8.1 Hardware
Schematics can be found in Section 6. All design files including schematics, layout, bill of materials
(BOM), Gerber files, and documentation are available in the LP-MSP430FR2476 design files.
2.8.2 Software
All software files including TI-TXT object-code firmware images, software example projects, and
documentation are available on the LP-MSP430FR2476 software download page.
2.9 Hardware Change Log
Table 3 lists the hardware revision history.
Table 3. Hardware Change Log
PCB Revision Description
Rev A Initial release
3 Software Examples
Two software examples are included with the MSP430FR2476 LaunchPad development kit (see Table 4),
which can be found in the MSP430FR2476 LaunchPad development kit download page and are also
available in MSP430Ware software.
Table 4. Software Examples
Demo Name BoosterPack Plug-in Module
Required Description More Details
OutofBox_LP-MSP430FR2476 None The out-of-box demo that is factory-programmed on the LaunchPad development kit. Demonstrates
features of MSP430FR2476 device. Section 3.1
BlinkLED_LP-MSP430FR2476 None Blinks an LED on the LaunchPad development kit at a
fixed interval. Section 3.2
To use any of the software examples with the LaunchPad development kit, you must have an integrated
development environment (IDE) that supports the MSP430FR2476 device (see Table 5).
Table 5. IDE Minimum Requirements for LP-MSP430FR2476
Code Composer Studio IDE IAR Embedded Workbench for Texas
Instruments MSP430 IDE
v8.0 or later v7.12.1 or later
For more details on how to get started quickly and where to download the latest CCS and IAR IDEs, see
Section 4.
3.1 Out-of-Box Software Example
This section describes the functionality and structure of the Out-of-Box software that is preloaded in the
EVM.
The Out-of-Box Experience (OOBE) of the LP-MSP430FR2476 LaunchPad development kit demonstrates
how to implement a simple thermometer by using the internal ADC of the MSP430FR2476 to measure the
output voltage from an analog temperature sensor.

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3.1.1 Source File Structure
The project is split into multiple files (see Table 6). This makes it easier to navigate and reuse parts of it
for other projects.
Table 6. Source File and Folders
Name Description
main.c Out-of-Box demo main function
Library: driverlib Device driver library
3.1.2 Overview
When powering up the Out-of-Box demo, the board performs an initial temperature calibration and
illuminates RGB LED2 in a green color. Try to heat the temperature sensor U1 by blowing hot air on it to
see if you can get LED2 to turn red or using a compressed air can to blow cold air onto the sensor to see
LED2 turn blue. LED2 indicates the relative difference between the current temperature and the calibrated
measurement.
Press button S1 to recalibrate the temperature to the most recent measurement and send a UART
message (at 9600 baud) containing the new calibrated temperature through the backchannel UART. Press
button S2 at any time to send a UART message containing the current ambient temperature measurement
in Celsius.
3.2 Blink LED Example
This software example shows how to software toggle a GPIO to blink an LED on the LaunchPad
development kit.
3.2.1 Source File Structure
The project is split into multiple files (see Table 7). This makes it easier to navigate and reuse parts of it
for other projects.
Table 7. Source File and Folders
Name Description
main.c The Blink LED main function
Library: Driverlib Device driver library
The main code uses the MSP430 Driver Library to halt the watchdog timer and to configure and toggle the
P1.0 GPIO pin connected to the LED inside a software loop.

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4 Resources
4.1 Integrated Development Environments
Although the source files can be viewed with any text editor, more can be done with the projects if they’re
opened with a development environment like Code Composer Studio IDE (CCS) or IAR Embedded
Workbench IDE.
4.1.1 TI Cloud Development Tools
TI’s Cloud-based software development tools provide instant access to MSP430Ware content and a web-
based IDE.
4.1.1.1 TI Resource Explorer Cloud
TI Resource Explorer Cloud provides a web interface for browsing examples, libraries and documentation
found in MSP430Ware without having to download files to your local drive.
Find out more about TI Resource Explorer Cloud at dev.ti.com.
Figure 11. TI Resource Explorer Cloud

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4.1.1.2 Code Composer Studio Cloud
Code Composer Studio Cloud (CCS Cloud) is a web-based IDE that lets you quickly create, edit, build,
and debug applications for a LaunchPad development kit. No need to download and install large software
packages, simply connect your LaunchPad development kit and begin. You can choose to select from a
large variety of examples in MSP430Ware software and Energia or develop your own application. CCS
Cloud supports debug features such as execution control, breakpoints and viewing variables.
For more information, see the full comparison between CCS Cloud and CCS Desktop.
Try Code Composer Studio Cloud now at dev.ti.com.
Figure 12. CCS Cloud
4.1.2 Code Composer Studio IDE
Code Composer Studio Desktop is a professional integrated development environment that supports TI's
microcontroller and embedded processors portfolio. Code Composer Studio Desktop comprises a suite of
tools used to develop and debug embedded applications. It includes an optimizing C/C++ compiler, source
code editor, project build environment, debugger, profiler, and many other features.
Learn more about CCS and download it at http://www.ti.com/tool/ccstudio.
CCS v8.0 or higher is required for this development kit. To load an existing project, launch CCS, choose a
workspace directory, and click Project>Import Existing CCS Eclipse Project. Browse to the desired demo
project directory that contains main.c (see Figure 13).

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Figure 13. Directing the Project>Import Function to the Demo Project
Selecting the \CCS subdirectory also works. The CCS-specific files are located there.
When you click OK, CCS should recognize the project and allow you to import it. The indication that CCS
has found it is that the project appears in the box shown in Figure 14, and it has a checkmark to the left of
it.
Figure 14. When CCS Has Found the Project
Sometimes CCS finds the project but does not show a checkmark; this might mean that your workspace
already has a project by that name. You can resolve this by renaming or deleting that project. (Even if you
do not see it in the CCS workspace, look in the workspace directory on the file system.)

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4.1.3 IAR Embedded Workbench for MSP430 IDE
IAR Embedded Workbench for MSP430 is another powerful integrated development environment that lets
you develop and manage complete embedded application projects. It integrates the IAR C/C++ compiler,
IAR assembler, IAR ILINK linker, editor, project manager, command line build utility, and IAR C-SPY®
debugger.
Learn more about IAR Embedded Workbench for MSP430 and download it at the IAR Systems website.
IAR v7.12.1 or higher is required for this development kit. To open the demo in IAR, click
File>Open>Workspace…, and browse to the *.eww workspace file inside the \IAR subdirectory of the
desired demo. All workspace information is contained within this file.
The subdirectory also has an *.ewp project file. This file can be opened into an existing workspace by
clicking Project>Add-Existing-Project….
Although the software examples have all of the code required to run them, IAR users can download and
install MSP430Ware, which contains MSP430 libraries and the TI Resource Explorer. These are already
included in a CCS installation (unless the user selected otherwise).
4.2 LaunchPad Development Kit Websites
More information about the LaunchPad development kit, supported BoosterPack plug-in modules, and
available resources can be found at:
•LP-MSP430FR2476 tool folder: resources specific to this particular LaunchPad development kit
•TI’s LaunchPad development kit portal: information about all LaunchPad development kits from TI
4.3 MSP430Ware and TI Resource Explorer
TI Resource Explorer is a tool integrated into CCS that allows you to browse through available design
resources. TI Resource Explorer will help you quickly find what you need inside packages including
MSP430Ware, ControlSuite, TivaWare and more. TI Resource Explorer is well organized to find
everything that you need quickly, and you can import software projects into your workspace in one click.
TI Resource Explorer Cloud is one of the TI Cloud Development tools, and is tightly integrated with CCS
Cloud. See Section 4.1.1 for more information.
MSP430Ware is a collection of code examples, software libraries, data sheets and other design resources
for all MSP430 devices delivered in a convenient package – essentially everything developers need to
become MSP experts.
In addition to providing a complete collection of existing MSP430 design resources, MSP430Ware also
includes a high-level API called MSP Driver Library. This library makes it easy to talk to MSP430
hardware. For more information, visit MSP430Ware for MSP Microcontrollers.
Figure 15. Using TI Resource Explorer to Browse LP-MSP430FR2476 in MSP430Ware

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In TI Resource Explorer, you can find these examples and many more and can easily import them into
CCS with one click.
4.4 FRAM Utilities
The Texas Instruments FRAM Utilities is a collection of embedded software utilities that leverage the ultra-
low-power and virtually unlimited write endurance of FRAM. The utilities are available for MSP430FRxx
FRAM microcontrollers and provide example code to help start application development.
4.4.1 Compute Through Power Loss
Compute Through Power Loss is a utility API set that enables ease of use with LPMx.5 low-power modes
and a powerful shutdown mode that allows an application to save and restore critical system components
when a power loss is detected.
4.4.2 Nonvolatile Storage (NVS)
The nonvolatile storage (NVS) library makes handling of nonvolatile data easy and robust against
intermittent power loss or asynchronous device resets. To keep data storage constant, the nonvolatile
storage library contains functions that store data in a way that is guaranteed to recover the last valid entry
without data corruption.
4.5 MSP430FR2476 MCU
4.5.1 Device Documentation
At some point, you will probably want more information about the MSP430FR2476 device. For every MSP
device, the documentation is organized as shown in Table 8.
Table 8. How MSP Device Documentation is Organized
Document For MSP430FR2476 Description
Device family
user’s guide MSP430FR4xx and MSP430FR2xx Family User's Guide Architectural information about the device, including all modules and peripherals such as clocks, timers, ADC, and so on
Device-specific
data sheet MSP430FR247x Mixed-Signal Microcontrollers Data Sheet Device-specific information and all parametric information for this device
4.5.2 MSP430FR2476 Code Examples
MSP430FR267x, MSP430FR247x code examples is a set of simple C examples that demonstrate how to
use the entire set of peripherals on the MSP430FR2476 MCU, including serial communication, ADC10,
timers, and others, through direct register access. Every MSP derivative has a set of these code
examples. When starting a new project or adding a new peripheral, these examples serve as a great
starting point.
4.5.3 MSP430 Application Notes and TI Designs
Many application notes can be found at www.ti.com/msp430. Also see TI reference designs for practical
design examples and topics.
4.6 Community Resources
4.6.1 TI E2E™ Community
Search the forums at e2e.ti.com. If you cannot find your answer, post your question to the community.
4.6.2 Community at Large
Many online communities focus on the LaunchPad development kit—for example, www.43oh.com. You
can find additional tools, resources, and support from these communities.