Tq Tqmx120 User manual

TQMx120

User's Manual

TQMx120 UM 0100

21.03.2023

TABLE OF CONTENTS

1. ABOUT THIS MANUAL..............................................................................................................................................................................4

1.1 Copyright and License Expenses.........................................................................................................................................................4

1.2 Registered Trademarks............................................................................................................................................................................4

1.3 Disclaimer.....................................................................................................................................................................................................4

1.4 Imprint...........................................................................................................................................................................................................4

1.5 Service and Support .................................................................................................................................................................................4

1.6 Tips on Safety..............................................................................................................................................................................................5

1.7 Symbols and Typographic Conventions...........................................................................................................................................5

1.8 Handling and ESD Tips ............................................................................................................................................................................5

1.9 Naming of Signals .....................................................................................................................................................................................6

1.10 Further Applicable Documents / Presumed Knowledge............................................................................................................6

2. INTRODUCTION..........................................................................................................................................................................................7

2.1 Overview.......................................................................................................................................................................................................7

2.2 Compliance..................................................................................................................................................................................................8

2.3 Versions.........................................................................................................................................................................................................9

2.4 Accessories................................................................................................................................................................................................ 12

3. FUNCTION ................................................................................................................................................................................................. 13

3.1 Block Diagram.......................................................................................................................................................................................... 13

3.2 Electrical Characteristics ...................................................................................................................................................................... 13

3.2.1 Supply Voltage ........................................................................................................................................................................................ 13

3.2.2 Power Consumption ............................................................................................................................................................................. 14

3.2.3Real Time Clock Power Consumption............................................................................................................................................. 16

3.3 Environmental Conditions .................................................................................................................................................................. 16

3.4 System Components............................................................................................................................................................................. 17

3.4.1 Processor ................................................................................................................................................................................................... 17

3.4.1.1 Intel®Turbo Boost Technology ......................................................................................................................................................... 19

3.4.1.2 Intel®Configurable Thermal Design Power.................................................................................................................................. 19

3.4.2 Graphics ..................................................................................................................................................................................................... 19

3.4.3 Chipset........................................................................................................................................................................................................ 19

3.4.4 Memory...................................................................................................................................................................................................... 20

3.4.4.1 DDR5 SDRAM SO-DIMM....................................................................................................................................................................... 20

3.4.4.2 SPI Boot Flash........................................................................................................................................................................................... 20

3.4.4.3SPI General Purpose .............................................................................................................................................................................. 20

3.4.4.4 EEPROM...................................................................................................................................................................................................... 20

3.4.5 Real Time Clock ....................................................................................................................................................................................... 21

3.4.6 Trusted Platform Module..................................................................................................................................................................... 21

3.4.7 Hardware Monitor.................................................................................................................................................................................. 21

3.4.8 TQ Flexible I/O Configuration (TQ-flexiCFG)................................................................................................................................. 21

3.5 Interfaces ................................................................................................................................................................................................... 22

3.5.1 PCI Express ................................................................................................................................................................................................ 22

3.5.2 PCI Express Graphics (PEG-Port)........................................................................................................................................................ 22

3.5.3 2.5 Gigabit Ethernet............................................................................................................................................................................... 23

3.5.4 Serial ATA................................................................................................................................................................................................... 23

3.5.5 Digital Display Interface....................................................................................................................................................................... 23

3.5.6 LVDS / eDP Interface.............................................................................................................................................................................. 23

3.5.7 USB 2.0 and USB 3.2 Interfaces .......................................................................................................................................................... 24

3.5.8 USB4 interface ......................................................................................................................................................................................... 24

3.5.9 General Purpose Input / Output ....................................................................................................................................................... 24

3.5.10 High Definition Audio Interface ........................................................................................................................................................ 24

3.5.11 LPC / eSPI Bus........................................................................................................................................................................................... 25

3.5.12 I2C Bus ......................................................................................................................................................................................................... 25

3.5.13 SMBus ......................................................................................................................................................................................................... 25

3.5.14 MIPI-CSI Camera Serial Interface....................................................................................................................................................... 25

3.5.15 Serial Ports................................................................................................................................................................................................. 26

3.5.16 Watchdog Timer ..................................................................................................................................................................................... 26

3.6 Connectors................................................................................................................................................................................................ 27

3.6.1 ................................................................................................................................................................... 27

3.6.2 Debug Header ......................................................................................................................................................................................... 27

3.6.3 TQM Debug Card.................................................................................................................................................................................... 28

3.6.4 Debug Module LED................................................................................................................................................................................ 28

3.7 ..................................................................................................................................................... 29

3.7.1 Signal Assignment Abbreviations .................................................................................................................................................... 29

3.7.2 ................................................................................................................................... 30

4. MECHANICS .............................................................................................................................................................................................. 38

4.1 Dimensions ............................................................................................................................................................................................... 38

4.2 Component Placement and Labels.................................................................................................................................................. 39

4.3 Heat Spreader .......................................................................................................................................................................................... 40

4.4 Mechanical and Thermal Considerations ...................................................................................................................................... 40

4.5 Protection against External Effects .................................................................................................................................................. 40

5. SOFTWARE ................................................................................................................................................................................................ 41

5.1 System Resources................................................................................................................................................................................... 41

5.1.1 I2C Bus Devices......................................................................................................................................................................................... 41

5.1.2 SMBus Devices......................................................................................................................................................................................... 41

5.1.3 Memory Mapping................................................................................................................................................................................... 41

5.1.4 Interrupt Mapping.................................................................................................................................................................................. 41

5.2 Operating Systems................................................................................................................................................................................. 42

5.2.1 Supported Operating Systems .......................................................................................................................................................... 42

5.2.2 Driver Download..................................................................................................................................................................................... 42

5.3 TQ-Systems Embedded Application Programming Interface (EAPI)................................................................................... 42

5.4 Software Tools ......................................................................................................................................................................................... 42

6. BIOS MENU ............................................................................................................................................................................................ 43

6.1 Continue .................................................................................................................................................................................................... 43

6.2 Boot Manager .......................................................................................................................................................................................... 43

6.3 Device Manager ...................................................................................................................................................................................... 44

6.3.1 Driver Health Manager ......................................................................................................................................................................... 44

6.3.2 Network Device List............................................................................................................................................................................... 44

6.4 Boot from File........................................................................................................................................................................................... 44

6.5 Administer Secure Boot ....................................................................................................................................................................... 44

6.6 Setup Utility.............................................................................................................................................................................................. 45

6.6.1 Main............................................................................................................................................................................................................. 45

7. BIOS UPDATE ........................................................................................................................................................................................ 46

7.1.1 Step 1: Preparing USB Stick................................................................................................................................................................. 46

7.1.2 Step 2: Preparing Management Engine (ME) FW for update.................................................................................................. 46

7.1.3 Step 3a: Updating uEFI BIOS via EFI Shell ...................................................................................................................................... 48

7.1.4 Step 3b: Updating uEFI BIOS via Windows Operating System .............................................................................................. 49

7.1.5 Step 4: BIOS update check on the TQMx120 Module ............................................................................................................... 49

8. SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS..................................................................................................... 50

8.1 EMC.............................................................................................................................................................................................................. 50

8.2 ESD............................................................................................................................................................................................................... 50

8.3 Shock & Vibration ................................................................................................................................................................................... 50

8.4 Operational Safety and Personal Security ..................................................................................................................................... 50

8.5 Reliability and Service Life................................................................................................................................................................... 50

8.5.1 RoHS ............................................................................................................................................................................................................ 50

8.5.2 WEEE®......................................................................................................................................................................................................... 50

8.6 REACH®....................................................................................................................................................................................................... 50

8.7 EuP ............................................................................................................................................................................................................... 50

8.8 Battery ........................................................................................................................................................................................................ 50

8.9 Packaging.................................................................................................................................................................................................. 50

8.10 Other Entries............................................................................................................................................................................................. 51

9. APPENDIX .................................................................................................................................................................................................. 52

9.1 Acronyms and Definitions................................................................................................................................................................... 52

9.2 References................................................................................................................................................................................................. 54

TABLE DIRECTORY

Table 1: Terms and Conventions...................................................................................................................................................................5

Table 2: .................................9

Table 3: .............................. 10

Table 4: .............................. 11

Table 5: TQMx120 Power Consumption Turbo Mode ON .............................................................................................................. 15

Table 6: TQMx120 Power Consumption Turbo Mode OFF............................................................................................................. 15

Table 7: RTC Current Consumption .......................................................................................................................................................... 16

Table 8: 12th Generation Intel®-Series............................................................................................ 17

Table 9: 12th Generation Intel®-Series ............................................................................................ 18

Table 10: 12th Generation Intel®-Series............................................................................................ 18

Table 11: Maximum Resolution Display Configuration........................................................................................................................ 19

Table 12: PCI Express port 0 7 Configuration Options ...................................................................................................................... 22

Table 13: PCI Express Graphics port Configuration Options .............................................................................................................. 22

Table 14: ................................................................................................................................ 26

Table 15: LED Boot Messages ........................................................................................................................................................................ 28

Table 16: Signal Assignment Abbreviations............................................................................................................................................. 29

Table 17: ........................................................................................................................... 30

Table 18: Labels on TQMx120........................................................................................................................................................................ 39

Table 19: I2 2C Port....................................................................................................................... 41

Table 20: I2............................................................................................................... 41

Table 21: Acronyms........................................................................................................................................................................................... 52

Table 22: Further Applicable Documents and Links ............................................................................................................................. 54

FIGURE DIRECTORY

Figure 1: TQMx120 block diagram .............................................................................................................................................................. 13

Figure 2: TQM Debug Card ............................................................................................................................................................................ 28

Figure 3: Debug Module LED ........................................................................................................................................................................ 28

Figure 4: TQMx120 three view drawing.................................................................................................................................................... 38

Figure 5: TQMx120 Bottom View Drawing............................................................................................................................................... 38

Figure 6: TQMx120 Component Placement Top ................................................................................................................................... 39

Figure 7: TQMx120 Component Placement Bottom............................................................................................................................ 39

Figure 8: TQMx120-HSP Heat Spreader..................................................................................................................................................... 40

Figure 9: InsydeH2O BIOS Front Page........................................................................................................................................................ 43

Figure 10: PCH-FW Configuration menu..................................................................................................................................................... 47

Figure 11: Firmware Update Configuration menu .................................................................................................................................. 47

Figure 12: ME FW Image Re-Flash option ................................................................................................................................................... 47

Figure 13: EFI Shell............................................................................................................................................................................................... 48

Figure 14: EFI Shell uEFI BIOS Update .......................................................................................................................................................... 48

Figure 15: Screen during BIOS Update......................................................................................................................................................... 48

Figure 16: TQMx120 Debug LED .................................................................................................................................................................... 49

Figure 17: EFI BIOS Main Menu ....................................................................................................................................................................... 49

REVISION HISTORY

Rev.

Date

Name

Pos.

Modification

0100

21.03.2023

First release

1. ABOUT THIS MANUAL

1.1 Copyright and License Expenses

This User's Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic,

machine readable, or in any other form without the written consent of TQ-Systems GmbH.

The drivers and utilities for the components used as well as the BIOS are subject to copyrights of the respective manufacturers.

The licence conditions of the respective manufacturer are to be adhered to.

BIOS-licence expenses are paid by TQ-Systems GmbH and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and have to be calculated/declared

separately.

1.2 Registered Trademarks

TQ-Systems GmbH aims to adhere to copyrights of all graphics and texts used in all publications, and strives to use original

or license-free graphics and texts.

All brand names and trademarks mentioned in this User's Manual, including those protected by a third party, unless specified

otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present

registered proprietor without any limitation. One should conclude that brand and trademarks are rightly protected by

a third party.

1.3 Disclaimer

TQ-Systems GmbH does not guarantee that the information in this User's Manual is up-to-date, correct, complete or of good

quality. Nor does TQ-Systems GmbH assume guarantee for further usage of the information. Liability claims against

TQ-Systems GmbH, referring to material or non-material related damages caused, due to usage or non-usage of the information

given in this User's Manual, or due to usage of erroneous or incomplete information, are exempted, as long as there is no proven

intentional or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this User's Manual or parts of it without

special notification.

1.4 Imprint

TQ-Systems GmbH

Gut Delling, Mühlstraße 2

D-82229 Seefeld

Tel: +49 8153 9308 0

Fax: +49 8153 9308 4223

E-Mail: Info@TQ-Group

Web: TQ-Group

1.5 Service and Support

Please visit our website www.tq-group.com for latest product documentation, drivers, utilities and technical support.

You can register on our website www.tq-group.com to have access to restricted information and automatic update services.

For direct technical support you can contact our FAE team by email: [email protected].

Our FAE team can also support you with additional information like 3D-STEP files and confidential information, which is not

provided on our public website.

For service/RMA, please contact our service team by email ([email protected]) or your sales team at TQ-Systems GmbH.

1.6 Tips on Safety

Improper or incorrect handling of the product can substantially reduce its life span.

1.7 Symbols and Typographic Conventions

Table 1: Terms and Conventions

Symbol

Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These

components are often damaged / destroyed by the transmission of a voltage higher than about 50 V.

A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V.

Please note the relevant statutory regulations in this regard.

Non-compliance with these regulations can lead to serious damage to your health and also cause

damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to

possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQ-products.

Command

A font with fixed-width is used to denote commands, contents, file names, or menu items.

1.8 Handling and ESD Tips

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the

information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when

switching on, changing jumper settings or connecting other devices without ensuring beforehand

that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the TQMx120 and be dangerous

to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-

product in an ESD-safe environment. Especially when you switch modules on, change jumper settings,

or connect other devices.

1.9 Naming of Signals

A hash mark (#) at the end of the signal name indicates a low-active signal.

Example: RESET#

If a signal can switch between two functions and if this is noted in the name of the signal, the low-active function is marked

with a hash mark and shown at the end.

Example: C / D#

If a signal has multiple functions, the individual functions are separated by slashes when they are important for the wiring.

The identification of the individual functions follows the above conventions.

Example: WE2# / OE#

1.10 Further Applicable Documents / Presumed Knowledge

•Specifications and manual of the modules used:

These documents describe the service, functionality and special characteristics of the module used.

•Specifications of the components used:

The manufacturer's specifications of the components used, for example CompactFlash cards, are to be taken note of.

They contain, if applicable, additional information that has to be taken note of for safe and reliable operation.

These documents are stored at TQ-Systems GmbH.

•Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of.

•Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

•General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.

Implementation information for the carrier board (3), maintained by the

PICMG®. This Carrier Design Guide includes a very good guideline to desi

It includes detailed information with schematics and detailed layout guidelines.

Please refer to the official PICMG®documentation for additional information (2), (4).

2. INTRODUCTION

Based on the internationally established PICMG®(COM.0 Rev. 3.1), the TQMx120 enables the design of

not only powerful but also economical x86 based systems. The user has access to all essential interfaces of the CPU at the Type 6

compliant pin out connector. Hence all features of the 12th Generation Intel®can be used. The direct access to all

interfaces gives the user the freedom to use the features of the CPU in the most suitable way for his application.

The compact and robust design as well as the option of conformal coating extends the use cases to applications within rugged

industry, transportation and aviation environments. Based on the very low-power consumption and the extended temperature

support it is also possible to realize outdoor applications in an easy and reliable way.

2.1 Overview

The following key functions are implemented on the TQMx120:

Processor:

12th Generation Inte embedded H-series (Alder Lake-P / H45) with up to 14 processor cores

•Intel®i7-12800HE 6P+8E / 96EU, 24 MB Cache, up to 4.6 GHz , 45 W (cTDP 35 W), 0 °C 100 °C

•Intel®i5-12600HE 4P+8E / 80EU, 18 MB Cache, up to 4.5 GHz , 45 W (cTDP 35 W), 0 °C 100 °C

•Intel®i3-12300HE 4P+4E / 48EU, 12 MB Cache, up to 4.3 GHz , 45 W (cTDP 35 W), 0 °C 100 °C

12th Generation Inte P-series (Alder Lake-P / P28) with up to 12 processor cores

•Intel®i7-1270PE 4P+8E / 96EU, 18 MB Cache, up to 4.5 GHz , 28 W (cTDP 35 W / 20 W), 0 °C 100 °C

•Intel®i5-1250PE 4P+8E / 80EU, 12 MB Cache, up to 4.4 GHz , 28 W (cTDP 35 W / 20 W), 0 °C 100 °C

•Intel®i3-1220PE 4P+4E / 48EU, 12 MB Cache, up to 4.2 GHz , 28 W (cTDP 35 W / 20 W), 0 °C 100 °C

12th Generation Inte U-series (Alder Lake-P / U15) with up to 10 processor cores

•Intel®i7-1265UE 2P+8E / 96EU, 12 MB Cache, up to 4.7GHz , 15 W (cTDP 28 W / 12 W), 0 °C 100 °C

•Intel®i5-1245UE 2P+8E / 80EU, 12 MB Cache, up to 4.4 GHz , 15 W (cTDP 28 W / 12 W), 0 °C 100 °C

•Intel®Cor i3-1215UE 2P+4E / 64EU, 10 MB Cache, up to 4.4 GHz , 15 W (cTDP 28 W / 12 W), 0 °C 100 °C

•Intel®7305E 1P+4E / 48EU, 8 MB Cache, up to 0.9 GHz , 15 W (cTDP 12 W), 0 °C 100 °C

Memory:

•2 × DDR5 SO-DIMM socket with max. 64 Gbyte, dual channel DDR5 up to 4800 MT/s SO-DIMM modules

•EEPROM: 32 kbit (24AA32) (optional)

Graphics:

•3 × Digital Display Interface / DP++ with up to 8K; DisplayPort 1.4a with support for Multi-Stream Transport (MST)

•1 × Embedded Digital Display Interface (eDP) or dual channel LVDS interface (eDP 1.4b or dual LVDS)

Peripheral interfaces:

•1 × 2.5 Gigabit Ethernet (Intel®i226)

•4 × USB 3.2 Gen 2 (up to 10 Gb/s) with USB 3.0 compatibility

•2 × USB4 Support, pins shared with Digital Display Interface (optional)

•8 × USB 2.0

•2 × SATA Gen 3 (up to 6 Gb/s) or 2x PCIe Gen 3 (up to 8 Gb/s)

•4 × PCIe Gen 3 (up to 8 Gb/s) (4 (×1), 2 (×2), or 1 (×4))

•4 × PCIe Gen 4 (up to 16 Gb/s) (1 (×1), 1 (×2), or 1 (×4))

•1 × PCIe PEG port Gen 4 (up to 16 Gb/s) (1 (×4) and 1 (x8) H series only)

•1 × LPC or eSPI bus

•1 × Intel®HD audio (HDA)

•1 × I2C (2nd I2C optional) (master/slave capable)

•1 × SMBus

•1 × SPI for external uEFI BIOS flash

•1 × SPI general purpose interface (optional)

•2 × Serial port (Rx/Tx, legacy compatible), 4-wire (Rx/Tx/RTS/CTS) optionally through TQ-flexiCFG

•8 × GPIO through TQ-flexiCFG

•1 × MIPI-CSI Camera input interface connector (option)

Security components:

•TPM discrete SLB9670 TPM 2.0 controller or internal firmware TPM (FTPM)

Others:

•TQMx86 board controller with Watchdog and TQ-flexiCFG

•Hardware monitor

Power supply voltage:

•Wide input: 8.5 V to 20 V maximum input ripple: ±100 mV (U and P processor series)

•Standard input: nominal voltage 12 V (11.4 V to 12.6 V) (H processor series)

•5 V Standby (optional) 5 V (4.75 V to 5.25 V)

•3 V Battery for RTC

Environment:

•Operating Standard temperature: 0 °C to +60 °C

•Operating Extended temperature: 0 °C to +75 °C

•Storage temperature: 40 °C to +85 °C

•Relative humidity (operation): 10 % to 90 % (non-condensing)

•Relative humidity (storage): 5 % to 95 % (non-condensing, with conformal coating)

Form factor / dimensions:

•COMExpress Compact, Type 6, 95 × 95 mm2

2.2 Compliance

The TQMx120 complies with PICMG®e Base Specification (COM.0 Rev. 3.1).

2.3 Versions

The TQMx120 is available in several standard configurations.

Table 2: TQMx120HC 12th Generation Inte Series configurations and features

Feature

TQMx120HC-AA

TQMx120HC-AB

TQMx120HC-AC

Intel

i7-12800HE

i5-12600HE

i3-12300HE

CPU

6P + 8E

4P + 8E

4P + 4E

CPU TDP

45 / 35 W

CPU Clock (Base)

2.4 GHz

2.5 GHz

1.9 GHz

GfX

96 EU

80 EU

48 EU

L2 Cache

24 MB

18 MB

12 MB

Heat spreader

TQMx120-HSP-AA

Heatsink incl. fan

TQMx120-KK-AA

DRAM / SO-DIMM

16 / 32 / 64 GB

Use Condition

Embedded

Operating Temperature

0 °C to +60 °C (Turbo ON)

0 °C to +75 °C (35 W Turbo OFF)

0 °C to +60 °C (Turbo ON)

0 °C to +75 °C (35 W Turbo OFF)

0 °C to +60 °C (Turbo ON)

0 °C to +75 °C (35 W Turbo OFF)

TPM 2.0

Independent displays

LVDS or eDP

DP or HDMI

2.5 GbE

USB 2.0 host

USB 3.2 host

SATA Gen 3

PCIe Gen 3 ×1

PEG Gen 4 x4 / x8

1 / 1

I2C / SPI

1 / 1

HDA

LPC or eSPI

UART / GPIO

2 / 8

Table 3: TQMx120PC 12th Generation Inte Series configurations and features

Feature

TQMx120PC-AA

TQMx120PC-AB

TQMx120PC-AC

Intel

-1270PE

-1250PE

-1220PE

CPU

4P + 8E

4P + 4E

CPU TDP

28 / 35 / 20 W

CPU Clock (Base)

1.8 GHz

1.7 GHz

1.5 GHz

GfX

96 EU

80 EU

48 EU

L2 Cache

18 MB

12 MB

Heat spreader

TQMx120-HSP-AA

Heatsink incl. fan

TQMx120-KK-AA

DRAM / SO-DIMM

16 / 32 / 64 GB

Use Condition

Embedded

Operating Temperature

0 °C to +60 °C (Turbo ON)

0 °C to +75 °C (Turbo OFF)

0 °C to +60 °C (Turbo ON)

0 °C to +75 °C (Turbo OFF)

0 °C to +60 °C (Turbo ON)

0 °C to +75 °C (Turbo OFF)

TPM 2.0

Independent displays

LVDS or eDP

DP or HDMI

2.5 GbE

USB 2.0 host

USB 3.2 host

SATA Gen 3

PCIe Gen 3 ×1

PEG Gen 4 x4 / x8

1 / --

I2C / SPI

1 / 1

HDA

LPC or eSPI

UART / GPIO

2 / 8

Table 4: TQMx120UC 12th Generation Inte Series configurations and features

Feature

TQMx120UC-AA

TQMx120UC-AB

TQMx120UC-AC

TQMx120UC-AD

Intel

-1265UE

-1245UE

-1215UE

Celeron 7305E

CPU

2P + 8E

2P + 4E

1P + 4E

CPU TDP

15 / 28 / 12 W

15 / 12 W

CPU Clock (Base)

1.7 GHz

1.5 GHz

1.2 GHz

1.0 GHz

GfX

96 EU

80 EU

64 EU

48 EU

L2 Cache

12 MB

10 MB

8 MB

Heat spreader

TQMx120-HSP-AA

Heatsink incl. fan

TQMx120-KK-AA

DRAM / SO-DIMM

16 / 32 / 64 GB

Use Condition

Embedded

Operating Temperature

0 °C to +60 °C (Turbo ON)

0 °C to +75 °C (Turbo OFF)

0 °C to +60 °C (Turbo ON)

0 °C to +75 °C (Turbo OFF)

0 °C to +60 °C (Turbo ON)

0 °C to +75 °C (Turbo OFF)

0 °C to +60 °C (Turbo ON)

0 °C to +75 °C (Turbo OFF)

TPM 2.0

Independent displays

LVDS or eDP

DP or HDMI

2.5 GbE

USB 2.0 host

USB 3.2 host

SATA Gen 3

PCIe Gen 3 ×1

PEG Gen 4 x4 / x8

1 / --

I2C / SPI

1 / 1

HDA

LPC or eSPI

UART / GPIO

2 / 8

Please refer to www.tq-group.com/ for a full list of standard versions.

Other configurations are available on request.

Hardware and software configuration features on request:

•Conformal coating

•Customized BIOS

•USB4 support

•SPI general purpose support

2.4 Accessories

•TQMx120-HSP

ALU Heat spreader with copper inlay for TQMx120,

•Evaluation platform MB-COME6-4

and Compact, Type 6, 170 × 170 mm2, with the following interfaces:

- 3 × DP (2x up to 8k HBR3, 1x up to 4k HBR2)

- 1 x dual LVDS

- 1 x eDP (up to 4k HBR2)

- 2 × 2.5 Gbit Ethernet

- 2 x USB 3.2 USB-A

- 1 x USB 3.2 USB-C

- 3 x USB 2.0 internal

- 2 × Serial Port RS232

- 1x High Definition Audio (Line In, MIC In, HP Out)

- 1x M.2 Socket Key E (Wi-Fi/BT),

- 1x M.2 Socket Key B with µSIM (WWAN or SATA SSD)

- 1x M.2 Socket Key M PCIe x4 (SSD)

- 1x M.2 Socket Key M PCIe x2 (SSD)

- 1x PCIExpress x16 PEG port

- 1x SATA connector

- Fan header

- Debug header

•Debug module

POST debug card for TQMx120, see 3.6.3. It is no standard accessory.

3. FUNCTION

3.1 Block Diagram

The following figure shows the TQMx120 block diagram.

Figure 1: TQMx120 block diagram

3.2 Electrical Characteristics

3.2.1 Supply Voltage

The TQMx120 supports a wide-range voltage input from 8.5 V to 20 V.

The following supply voltages are specif

Wide input: 8.5 V to 20 V maximum input ripple: ±100 mV (U and P processor series)

Standard input: 11.4 V to 12.6 V maximum input ripple: ±100 mV (H processor series)

VCC_5V_SBY: 4.75 V to 5.25 V maximum input ripple: ±50 mV

VCC_RTC: 2.0 V to 3.3 V maximum input ripple: ±20 mV

The input voltages shall rise from 10 % to 90 % of nominal within 0.1 ms to 20 ms ( ).

The increase of each DC output voltage has to be smooth and continuous from 10 % to 90 % of its final set point within the

regulation range.

Note: Power source

For single supply operations, the 5 V Standby voltage is not required.

VCC_5V_SBY can be left unconnected.

3.2.2 Power Consumption

The power consumption values below show the TQMx120 voltage and power specifications.

The values were measured with two power supplies; one for the TQMx120 and the other one for the MB-COME6-4

carrier board.

The power consumption of each TQMx120 version was measured running Windows®10, 64-bit and a dual DDR5 SO-DIMM

configuration (2 × 16 Gbyte). All measurements were done at a temperature of +25 °C and an input voltage of +12 V.

The power consumption of the TQMx120 depends on the application, the mode of operation and the operating system.

The power consumption was measured under the following test modes:

•Suspend mode:

The system is in S5/S4 state, Ethernet port is disconnected.

•Windows®10, 64-bit, idle state:

Desktop idle state, Ethernet port is disconnected.

•Windows®10, 64-bit, maximum workload (cTDP down mode enabled):

These values show the maximum cTDP down power consumption using the Intel®stress test tool to stress the

processor and graphic engine. Ethernet port is connected (1000Base-T Speed).

•Windows®10, 64-bit, maximum workload (nominal configuration):

These values show the maximum worst case power consumption using the Intel®stress test tool to stress the processor

and graphic engine. Ethernet port is connected (1000Base-T Speed).

•Windows®10, 64-bit, maximum workload (turbo mode first 28 seconds)

These values show the maximum worst case power consumption using the Intel®stress test tool to stress the processor

and graphic engine. This value was measured only for a short time (28 s) when the processor is in the turbo mode. This

value should be used for designing the power supply for the TQMx120. Ethernet port is connected

(1000Base-T Speed).

The following table shows the TQMx120 power consumption with different CPUs.

Table 5: TQMx120 Power Consumption Turbo Mode ON

CPU

Mode

Standby 5 V

Input 12 V

Suspend

Win10, 64-bit

idle

Win10, 64-bit

cTDP down

max. load

Win10, 64-bit

nominal

max. load

Win10, 64-bit

Max load

(Turbo mode)

TBD

Table 6: TQMx120 Power Consumption Turbo Mode OFF

CPU

Mode

Standby 5 V

Input 12 V

Suspend

Win10, 64-bit

idle

Win10, 64-bit

cTDP down

max. load

Win10, 64-bit

nominal

max. load

Win10, 64-bit

Max load

(Turbo mode)

TBD

Note: Power requirement

The power supplies on the carrier board for the TQMx120 have to be designed with enough reserve.

The carrier board should be able to provide at least twice the maximum TQMx120 workload power.

The TQMx120 supports several low-power states. The carrier board power supply has to be stable,

even with no load.

Carrier power supply example:

Processor i7-12800HE max. load Turbo ON Power Consumption = 130 W: carrier power design 200 W

Processor i7-12800HE max. load Turbo OFF Power Consumption = 55 W: carrier power design 110 W

Processor i7-1270PE max. load Turbo ON Power Consumption = 90 W: carrier power design 150 W

Processor i7-1270PE max. load Turbo OFF Power Consumption = 35 W: carrier power design 70 W

Processor i7-1265UE max. load Turbo ON Power Consumption = 80 W: carrier power design 120 W

Processor i7-1265UE max. load Turbo OFF Power Consumption = 29 W: carrier power design 60 W

3.2.3 Real Time Clock Power Consumption

The RTC (VCC_RTC) current consumption is shown below.

The values were measured at +25 °C under battery operating conditions.

Table 7: RTC Current Consumption

Mode

Voltage

Current

12th Generation Intel®series integrated RTC

3.0 V

3 µA

The current consumption of the RTC in the 12th Generation Intel®series Product Family Datasheet is specified with 6 µA in

average, but the measured values on several TQMx120 are lower.

3.3 Environmental Conditions

•Operating Standard temperature: 0 °C to +60 °C

•Operating Extended temperature: 0 °C to +75 °C

•Storage temperature: 40 °C to +85 °C

•Relative humidity (operating): 10 % to 90 % (non-condensing)

•Relative humidity (storage): 5 % to 95 % (non-condensing)

Attention: Maximum operating temperature

Do not operate the TQMx120 without properly attached heat spreader and heat sink.

The heat spreader is not a sufficient heat sink.

3.4 System Components

3.4.1 Processor

The TQMx120 supports the 12th Generation Intel®processor series (Alder Lake-P).

The following list illustrates some key features of the 12th Generation Intel®U, P, H processor series:

•First Intel® hybrid processor design combines Performance-cores with Efficient cores, together up to 14 cores

•10nm SuperFin technology

•DDR5 up to 4800 MT/s

•Intel® Hyper-Threading Technology (Intel® HT Technology)

•Intel® Advanced Vector Extensions 2 (Intel® AVX2)

•Intel® AVX2 Vector Neural Network Instructions (Intel® AVX2 VNNI)

•Intel® 64 Architecture

•Intel® Turbo Boost Max Technology 3.0

•Intel® Configurable Thermal Design Power (Intel® cTDP up and down)

•Intel® Enhanced Intel® SpeedStep® technology

•12th generation Intel® UHD Graphics / Iris® XeGraphics with up to 96 Execution Units (EUs)

•High Definition Content Protection (HDCP) 2.3

•Up to four independent displays

Table 8: 12th Generation Intel®i7, i5, i3 Embedded H-Series

Mode

i7-12800HE

i5-12600HE

i3-12300HE

Processor Cores

6P + 8E

4P + 8E

4P + 4E

Cache

24 Mbyte

18 Mbyte

12 Mbyte

P-Core Base frequency

2.4 GHz

2.5 GHz

1.9 GHz

P-Core Base frequency (cTDP down)

1.6 GHz

1.7 GHz

1.1 GHz

P-Core Max. Turbo frequency

4.6 GHz

4.5 GHz

4.3 GHz

E-Core Base frequency

1.8 GHz

1.5 GHz

P-Core Max. Turbo frequency

3.5 GHz

3.3 GHz

Tjunction

0 °C to +100 °C

Memory speed DDR5

4800 MT/s

Max. memory

64 Gbyte

Graphics

Intel® Iris® Xe Graphics

Intel® UHD Graphics

Graphics Execution Units

Graphics Turbo frequency

1.35 GHz

1.3 GHz

1.15 GHz

Thermal Design Power (TDP nominal)

45 W

Configurable Thermal Design Power (cTDP down)

35 W

Processor Power Limit 2 (PL2)

115 W

90 W

Intel®Hyper-Threading Technology

Yes

Chipset

600 Series

Table 9: 12th Generation Intel®i7, i5, i3 Embedded P-Series

Mode

i7-1270PE

i5-1250PE

i3-1220PE

Processor Cores

4P + 8E

4P + 4E

Cache

18 Mbyte

12 Mbyte

P-Core Base frequency

1.8 GHz

1.7 GHz

1.5 GHz

P-Core Base frequency (cTDP up)

1.9 GHz

1.8 GHz

1.7 GHz

P-Core Base frequency (cTDP down)

1.2 GHz

1.1 GHz

1.0 GHz

P-Core Max. Turbo frequency

4.5 GHz

4.4 GHz

4.2 GHz

E-Core Base frequency

1.2 GHz

1.1 GHz

P-Core Max. Turbo frequency

3.3 GHz

3.2 GHz

3.1 GHz

Tjunction

0 °C to +100 °C

Memory speed DDR5

4800 MT/s

Max. memory

64 Gbyte

Graphics

Intel® Iris® Xe Graphics

Intel® UHD Graphics

Graphics Execution Units

Graphics Turbo frequency

1.35 GHz

1.3 GHz

1.25 GHz

Thermal Design Power (TDP nominal)

28 W

Configurable Thermal Design Power (cTDP up)

35 W

Configurable Thermal Design Power (cTDP down)

20 W

Processor Power Limit 2 (PL2)

64 W

Intel®Hyper-Threading Technology

Yes

Chipset

600 Series

Table 10: 12th Generation Intel®i7, i5, i3 Embedded U-Series

Mode

i7-1265UE

i5-1245UE

i3-1215UE

7305E

Processor Cores

2P + 8E

2P + 4E

1P + 4E

Cache

12 Mbyte

10 Mbyte

8 Mbyte

P-Core Base frequency

1.7 GHz

1.5 GHz

1.2 GHz

1.0 GHz

P-Core Base frequency (cTDP up)

2.6 GHz

2.5 GHz

P-Core Base frequency (cTDP down)

1.1 GHz

0.8 GHz

P-Core Max. Turbo frequency

4.7 GHz

4.4 GHz

E-Core Base frequency

1.2 GHz

1.1 GHz

0.9 GHz

P-Core Max. Turbo frequency

3.5 GHz

3.3 GHz

Tjunction

0 °C to +100 °C

Memory speed DDR5

4800 MT/s

Max. memory

64 Gbyte

Graphics

Intel® Iris® Xe

Graphics

Intel® Iris® Xe

Graphics

Intel® UHD

Graphics

Intel® UHD

Graphics

Graphics Execution Units

Graphics Turbo frequency

1.25 GHz

1.2 GHz

1.1 GHz

Thermal Design Power (TDP nominal)

15 W

Configurable Thermal Design Power (cTDP up)

28 W

Configurable Thermal Design Power (cTDP

down)

12 W

Processor Power Limit 2 (PL2)

55 W

Intel®Hyper-Threading Technology

Yes

Chipset

600 Series

3.4.1.1 Intel®Turbo Boost Technology

Intel®Turbo Boost Technology accelerates processor and graphics performance for peak loads, automatically allowing processor

cores to run faster than the rated operating frequency if they are operating below power, current, and temperature specification

limits. Whether the processor enters into Intel®Turbo Boost Technology and the amount of time the processor spends in that

state depends on the workload and operating environment.

The Intel® Turbo Boost Technology allows the processor to operate at a power level that is higher than its Thermal Design Power

(TDP) configuration for short durations to maximize performance.

The Intel®

Only the Intel® i3 processors support Intel® Turbo Boost Technology.

3.4.1.2 Intel®Configurable Thermal Design Power

The Intel®Configurable Thermal Design Power (cTDP) feature allows adjustment of the processor power consumption.

The cTDP consists of three modes:

1. The cTDP nominal mode specifies the processor rated frequency and maximum power consumption.

2. The cTDP down mode specifies a lower maximum processor power consumption and lower guaranteed frequency

versus the nominal mode. This mode can be selected for ultra low-power applications, e.g. systems with reduced

cooling solutions.

3. The cTDP up mode specifies a higher maximum processor power consumption and a higher guaranteed frequency

versus the nominal mode. This mode can be selected for high performance applications with optimized cooling

solutions.

3.4.2 Graphics

The 12th Generation Intel®series includes an integrated Intel®HD graphics accelerator.

It provides excellent 2D / 3D graphics performance with support of up to four simultaneous displays.

The following list illustrates some key features of the 12th Generation Intel®processor:

•Intel® Iris® Xe Graphics with up to 96 Execution Units

•Hardware accelerated video decoding/encoding for AVC/VC-1/MPEG2/HEVC/VP8/JPEG

•Direct3D* 2015, Direct3D 12, Direct3D 11.2, Direct3D 11.1, Direct3D 9, Direct3D 10, Direct2D Video API support

•OpenGL 4.5

•Open CL 2.1, Open CL 2.0, Open CL 1.2

•Single 8K60Hz (HBR3) panel support

The TQMx120 supports three external Digital Display Interfaces (DDI1, DDI2 and DDI3) and one internal display, either dual

channel LVDS or eDP , depending on TQMx120 and carrier configuration.

The 12th Generation series supports up to four displays (P and H series) at the same time.

Table 11: Maximum Resolution Display Configuration

Display

Maximum Display Resolution

LVDS

1920 × 1200 @ 60 Hz

eDP 1.4b

4096 × 2304 @ 60 Hz

DP 1.4a

7680 × 4320 @ 60 Hz

HDMI 2.0b

4096 × 2160 @ 60 Hz

3.4.3 Chipset

The 12th Generation Intel®processor series includes the embedded 600 series platform controller hub (PCH).

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