Ublox JODY-W1 Series Quick setup guide

UBX-16012621 - R18
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JODY-W1 series
Host-based modules with Wi-Fi and dual-mode Bluetooth
System integration manual
Abstract
This integration manual describes JODY-W1 series modules with 2x2 MIMO 802.11n/ac and dual-
mode Bluetooth® 5. JODY-W1 is ideal for in-vehicle-infotainment and telematics applications with
simultaneous use cases requiring high data rates, such as in-car hotspots, Wi-Fi display applications
such as Apple CarPlay, or video streaming across multiple clients. Connection to a host processor is
through PCIe, SDIO, or high speed UART interfaces. It comes in an SMD form-factor, providing a
complete solution for easy integration into the application.

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Document information
Title
JODY-W1 series
Subtitle
Host-based modules with Wi-Fi and dual-mode Bluetooth
Document type
System integration manual
Document number
UBX-16012621
Revision and date
R18
23-Aug-2022
Disclosure Restriction
C1-Public
Document status description
Draft
For functional testing. Revised and supplementary data will be published later.
Objective Specification
Target values. Revised and supplementary data will be published later.
Advance Information
Data based on early testing. Revised and supplementary data will be published later.
Early Production Information
Data from product verification. Revised and supplementary data may be published later.
Production Information
Document contains the final product specification.
This document applies to the following products:
Product name
Document status
JODY-W163-A
Initial production
JODY-W164-A
Initial production
JODY-W167-A
Initial production
JODY-W174-A
Engineering sample
For information about the related hardware, software, and status of listed product types, refer to
the respective data sheet [2].
u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this
document. Copying, reproduction, or modification of this document or any part thereof is only permitted with the express
written permission of u-blox. Disclosure to third parties is permitted for clearly public documents only.
The information contained herein is provided “as is”. No warranty of any kind, either express or implied, is made in relation to
the accuracy, reliability, fitness for a particular purpose or content of this document. This document may be revised by u-blox
at any time. For most recent documents, please visit www.u-blox.com.
Copyright © u-blox AG.

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Contents
Document information................................................................................................................................2
Contents ..........................................................................................................................................................3
1System description...............................................................................................................................6
1.1 Overview and applications ........................................................................................................................ 6
1.1.1 Module architecture...........................................................................................................................7
1.1.2 Radio interfaces ..................................................................................................................................9
1.1.3 Power management ...........................................................................................................................9
1.2 Pin configuration and function...............................................................................................................10
1.2.1 Pin attributes.....................................................................................................................................10
1.2.2 Pin list..................................................................................................................................................10
1.3 Supply interfaces ......................................................................................................................................13
1.3.1 Main supply inputs ...........................................................................................................................13
1.3.2 Power-up sequence ..........................................................................................................................14
1.4 System function interfaces ....................................................................................................................14
1.4.1 Module Power-on ..............................................................................................................................14
1.4.2 Module Power-off..............................................................................................................................15
1.4.3 Wake-up signals................................................................................................................................15
1.4.4 Host interface configuration ..........................................................................................................15
1.5 Data communication interfaces ............................................................................................................16
1.5.1 PCIe 3.0 interface..............................................................................................................................16
1.5.2 SDIO 3.0 interface.............................................................................................................................16
1.5.3 High Speed UART interface............................................................................................................17
1.5.4 PCM/I2S –Audio interfaces ............................................................................................................18
1.5.5 LTE Coexistence UART....................................................................................................................19
1.5.6 Low Power Oscillator........................................................................................................................19
1.6 Antenna interfaces...................................................................................................................................19
1.6.1 Wi-Fi and Bluetooth antennas .......................................................................................................19
1.6.2 Approved antenna designs.............................................................................................................20
1.7 Other remarks............................................................................................................................................20
1.7.1 Unused pins .......................................................................................................................................20
2Design-in................................................................................................................................................ 21
2.1 Overview......................................................................................................................................................21
2.2 Antenna interfaces...................................................................................................................................21
2.2.1 RF transmission line design ...........................................................................................................22
2.2.2 Antenna design .................................................................................................................................23
2.3 Supply interfaces ......................................................................................................................................27
2.3.1 Module supply design ......................................................................................................................27
2.4 Data communication interfaces ............................................................................................................29
2.4.1 PCI express.........................................................................................................................................29
2.4.2 SDIO 3.0 ..............................................................................................................................................29

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2.4.3 High-speed UART interface............................................................................................................31
2.5 General high speed layout guidelines ...................................................................................................31
2.5.1 General considerations for schematic design and PCB floor planning .................................31
2.5.2 Component placement ....................................................................................................................31
2.5.3 Layout and manufacturing.............................................................................................................32
2.5.4 Layout considerations to reduce spurious emissions ..............................................................32
2.6 Module footprint and stencil design .....................................................................................................33
2.7 Thermal guidelines ...................................................................................................................................34
2.8 ESD guidelines ...........................................................................................................................................35
2.9 Design-in checklist....................................................................................................................................36
2.9.1 Schematic checklist.........................................................................................................................36
2.9.2 Layout checklist................................................................................................................................36
3Software ................................................................................................................................................ 37
3.1 Available software packages ..................................................................................................................37
3.1.1 Supported kernel versions ..............................................................................................................37
3.2 Software package content......................................................................................................................38
3.2.1 Wi-Fi firmware images.....................................................................................................................38
3.2.2 Additional u-blox software deliverables .......................................................................................39
3.3 Software architecture overview .............................................................................................................39
3.3.1 Wi-Fi driver.........................................................................................................................................39
3.3.2 Bluetooth host stack........................................................................................................................39
3.4 Compiling the software............................................................................................................................40
3.4.1 Prerequisites......................................................................................................................................40
3.5 Deploying the software............................................................................................................................40
3.5.1 Additional software requirements ................................................................................................41
3.6 Loading the Wi-Fi driver ..........................................................................................................................41
3.7 Bluetooth initialization.............................................................................................................................42
3.8 Usage examples ........................................................................................................................................43
3.8.1 5G SoftAP + 2G SoftAP ...................................................................................................................44
3.8.2 2G SoftAP + 2G Station...................................................................................................................45
3.8.3 Country code selection ....................................................................................................................46
3.8.4 Bluetooth inquiry...............................................................................................................................46
3.9 Bluetooth vendor specific HCI commands...........................................................................................46
3.9.1 SCO/PCM interface configuration ................................................................................................46
3.9.2 PCM/I2S audio interface configuration........................................................................................47
3.9.3 PCM loopback mode.........................................................................................................................48
3.9.4 Set sleep mode parameters ...........................................................................................................49
3.9.5 Enable wide band speech ................................................................................................................51
4Handling and soldering ..................................................................................................................... 52
4.1 Special ESD handling precautions.........................................................................................................52
4.2 Packaging, shipping, storage, and moisture preconditioning .........................................................52
4.3 Reflow soldering process.........................................................................................................................53

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4.3.1 Cleaning ..............................................................................................................................................54
4.3.2 Other notes ........................................................................................................................................54
5Regulatory compliance ..................................................................................................................... 56
5.1 General requirements ..............................................................................................................................56
5.2 FCC/ISED End-product regulatory compliance ..................................................................................56
5.2.1 Referring to the u-blox FCC/ISED certification ID ......................................................................57
5.2.2 Obtaining own FCC/ISED certification ID ....................................................................................58
5.2.3 Antenna requirements ....................................................................................................................58
5.2.4 Configuration control and software security of end-products ...............................................59
5.2.5 Operating frequencies .....................................................................................................................60
5.2.6 End product labeling requirements ..............................................................................................60
5.2.7 Original FCC and ISED grant ..........................................................................................................61
5.3 CE end-product regulatory compliance................................................................................................62
5.3.1 Safety standard ................................................................................................................................62
5.3.2 CE Equipment classes .....................................................................................................................62
5.4 Regulatory configuration.........................................................................................................................62
5.4.1 Overview of the regulatory CLM process.....................................................................................63
6Product testing ................................................................................................................................... 64
6.1 u-blox in-line production testing ............................................................................................................64
6.2 OEM manufacturer production test .....................................................................................................65
Appendix ....................................................................................................................................................... 66
ARegulatory transmit output power limits................................................................................... 66
A.1 FCC/IC..........................................................................................................................................................66
A.2 ETSI..............................................................................................................................................................67
BGlossary ................................................................................................................................................. 68
Related documents ................................................................................................................................... 70
Revision history.......................................................................................................................................... 71
Contact.......................................................................................................................................................... 72

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1System description
1.1 Overview and applications
The JODY-W1 series is a range of compact modules based on the Infineon CYW88359/CYW89359
(JODY-W16x) and CYW89459 (JODY-W17x) AEC-Q100 compliant chipsets. The modules enable
Wi-Fi, Bluetooth®, and Bluetooth low energy communication, and is thus ideal for in-vehicle-
infotainment and telematics applications with simultaneous use cases requiring high data rates,
such as in-car hotspots, Wi-Fi display applications such as Apple CarPlay, or video streaming across
multiple clients. JODY-W1 modules can be operated in the following modes:
•Wi-Fi 2x2 MIMO 802.11n/ac in 2.4 GHz or 5 GHz
•Wi-Fi 1x1 802.11ac in 2.4 / 5 GHz real simultaneous dual band (RSDB)
•Dual-mode Bluetooth v5, including audio, can be operated simultaneously with both Wi-Fi modes
JODY-W1 undergoes extended automotive qualification according to ISO 16750-4 and is
manufactured in line with ISO/TS 16949. Connection to a host processor is through PCIe, SDIO, or
High-Speed UART interfaces. The JODY-W1 series modules are radio type approved for Europe, USA
and Canada. Refer to the JODY-W1 series data sheet [2] for the complete list of approvals.
JODY-W1 series modules are suitable for a large number of automotive and industrial applications.
Some example applications are shown in the list below.
Automotive applications
•In-car Access-Point for internet access
•Usage of in-car applications, such as Apple CarPlay, Miracast, etc.
•Rear-seat display
•Rapid sync-n-go applications and fast content download to the vehicle
•Hands-free equipment (Bluetooth)
Industrial applications
•Manufacturing floor automation, wireless control terminals and point-to-point backhaul
•Machine control
•Medical in-hospital applications
•Security and surveillance
•Outdoor content distribution
•Robust wireless connectivity in a broad range of industrial applications

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1.1.1 Module architecture
Table 1 shows the available antenna and host interface configurations for JODY-W1 series module
variants.
Product variant
LTE
filter
Antenna configuration
Host
interface
ANT0
ANT1
ANT2
JODY-W163-04A
JODY-W164-27A
-
•
2.4 GHz Bluetooth
2.4/5 GHz Wi-Fi (RSDB
operation supported)
-
SDIO
JODY-W163-13A
•
5 GHz Wi-Fi and 2.4 GHz
Bluetooth (5 GHz 2x2
MIMO operation supported
in single band mode)
2.4/5 GHz Wi-Fi (RSDB
operation supported)
-
SDIO
JODY-W164-15A
•
2.4 GHz Bluetooth
2.4/5 GHz Wi-Fi (RSDB
operation supported)
-
PCIe
JODY-W164-03A
JODY-W164-13A
JODY-W174-03A
JODY-W174-13A
-
•
-
•
5 GHz Wi-Fi and 2.4 GHz
Bluetooth (5 GHz 2x2
MIMO operation supported
in single band mode)
2.4/5 GHz Wi-Fi (RSDB
operation supported)
-
PCIe
JODY-W167-00A
JODY-W167-03A
-
-
-
2.4/5 GHz Wi-Fi
(2x2 MIMO operation
supported in single band
mode)
2.4/5 GHz Wi-Fi
(2x2 MIMO operation
supported in single band
mode)
2.4 GHz Bluetooth
PCIe
Table 1: Supported configurations of the JODY-W1 module series
☞Some JODY-W1 series modules use an LTE coexistence band-pass filter for BPF_1 (TDK B8343).
All other band-pass filters are normal multilayer ceramic band-pass filters. Module variants
equipped with an LTE coexistence filter, as shown in Table 2, are recommended when co-located
with LTE devices operating in LTE bands 7, 38, 40 or 41.
The module host interface configuration is programmed in OTP memory during production.

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Block diagrams of the JODY-W1 series modules are shown in Figure 1 and Figure 2.
Figure 1: Block diagram of JODY-W163-A, JODY-W164-A, and JODY-W174-A
Figure 2: Block diagram of JODY-W167-A

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1.1.2 Radio interfaces
JODY-W1 series modules support Wi-Fi 5 802.11a/b/g/n/ac and Bluetooth operations:
•JODY-W163/-W164/-W174 provide two antenna ports, one for dual band Wi-Fi (2.4 GHz and
5 GHz) and one for Bluetooth, shared with 5 GHz Wi-Fi on some variants. See also Table 1.
•JODY-W167 provides three antenna ports, two for dual band Wi-Fi (2.4 GHz and 5 GHz) and one
dedicated for Bluetooth.
1.1.3 Power management
The JODY-W1 series modules have different power management states. Guidelines for Wi-Fi and
Bluetooth operations in different power states are defined in Table 2.
General Status
Power State
Description
Power-Off
Not Powered
VBAT and VIO/VIO_SD supply not present or
below operating range: module is switched off.
VIO supply can be on in order to reduce leakage
current from other devices connected to the I/O’s.
Power Down
Power Down
The module is effectively powered off by shutting
down all internal regulators. This is done by de-
asserting WL_EN and BT_EN. The chip is brought
out of this mode by external logic re-enabling the
internal regulators. The WL_EN and BT_EN pins
can also be used for separate system reset.
Normal Operation
Deep Sleep
Most analog and digital domains of the chip and
most of the regulators are powered off. All main
clocks are shut down to reduce active power to the
minimum. The 32.768 kHz LPO clock is available
only for the PMU sequencer. Upon a wake-up event
triggered by the PMU timers, an external interrupt,
or a host resume through the SDIO bus, logic
states in the digital core are restored to their pre-
deep-sleep settings to avoid lengthy HW re-
initialization. In deep sleep mode, the main source
of power consumption is leakage current.
Active
All blocks are powered up and fully functional with
active carrier sensing and frame transmission and
receiving. All required regulators are enabled and
put in the most efficient mode based on the load
current. Clock speeds are dynamically adjusted by
the PMU sequencer.
Table 2: Description for Wi-Fi power states

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1.2 Pin configuration and function
1.2.1 Pin attributes
1. Function: Pin function.
2. Pin name: The name of the package pin or terminal.
3. Pin number: Package pin numbers associated with each signals.
4. Power: The voltage domain that powers the pin
5. Type: Signal type description:
I = Input
PD = Internal Pull-Down
PWR = Power
I/O = Input and Output
RF = Radio interface
PU = Internal Pull-Up
DS = Differential
O = Output
H = High-Impedance pin
GND = Ground
OD = Open drain
6. Signal name: The signal name for that pin in the mode being used.
7. Remarks: Pin description and notes.
1.2.2 Pin list
Figure 3 and Table 3 list the pin-out of the JODY-W1 module, with pins grouped by function.
Figure 3: JODY-W1 pin assignment (top view)