Woodward MicroNet Simplex User manual

Product Manual 26166V1
(Revision T, 4/2018)
Original Instructions
MicroNet™ Simplex Digital Control
MicroNet™ Plus Digital Control
Manual 26166 consists of 3 volumes (26166V1, 26166V2, & 26166V3).
Installation and Operation Manual
Released

General
Precautions
Read this entire manual and all other publications pertaining to the work to be
performed before installing, operating, or servicing this equipment.
Practice all plant and safety instructions and precautions.
Failure to follow instructions can cause personal injury and/or property damage.
Revisions
This publication may have been revised or updated since this copy was produced.
To verify that you have the latest revision, check manual
26455 , Customer
Publication Cross Reference and Revision Status & Distribution Restrictions, on
the publications page of the Woodward website:
www.woodward.com/publications
The latest version of most publications is available on the publications page. If
your publication is not there, please contact your customer service representative
to get the latest copy.
Proper Use
Any unauthorized modifications to or use of this equipment outside its specified
mechanical, electrical, or other operating limits may cause personal injury and/or
property damage, including damage to the equipment. Any such unauthorized
modifications: (i) constitute "misuse" and/or "negligence" within the meaning of
the product warranty thereby excluding warranty coverage for any resulting
damage, and (ii) invalidate product certifications or listings.
Translated
Publications
If the cover of this publication states "Translation of the Original Instructions"
please note:
The original source of this publication may have been updated since this
translation was made. Be sure to check manual
26455 , Customer Publication
Cross Reference and Revision Status & Distribution Restrictions, to verify whether
this translation is up to date. Out-of-date translations are marked with . Always
compare with the original for technical specifications and for proper and safe
installation and operation procedures.
Revisions— A bold, black line alongside the text identifies changes in this publication since the
last revision.
Woodward reserves the right to update any portion of this publication at any time. Information provided by Woodward is
believed to be correct and reliable. However, no responsibility is assumed by Woodward unless otherwise expressly
undertaken.
Manual 26166V1
Copyright © Woodward, Inc. 2004 - 2018
All Rights Reserved
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 1
Contents
This manual is divided into three volumes:
Volume 1 contains chapters 1–9 (manual 26166V1).
Volume 2 contains chapters 10–16 and the appendixes (manual 26166V2).
Volume 3 contains obsolete sections from Volume1 and Volume 2.
WARNINGS AND NOTICES ...............................................................................................................6
ELECTROSTATIC DISCHARGE AWARENESS......................................................................................7
REGULATORY COMPLIANCE............................................................................................................8
CHAPTER 1. GENERAL INFORMATION............................................................................................12
1.1-Introduction ........................................................................................................................................... 12
CHAPTER 2. MICRONET PLUS SYSTEMS........................................................................................13
2.1—MicroNet Plus Redundant .................................................................................................................. 13
2.2—MicroNet Plus Redundant Operation.................................................................................................. 16
2.3—MicroNet Plus Simplex ....................................................................................................................... 17
2.4—MicroNet Plus Simplex Operation ...................................................................................................... 20
2.5—Module Replacement.......................................................................................................................... 20
2.6—Latent Fault Detection ........................................................................................................................ 20
CHAPTER 3. MICRONET SIMPLEX SYSTEMS ..................................................................................22
3.1—MicroNet Simplex ............................................................................................................................... 22
3.2—MicroNet Simplex Operation .............................................................................................................. 25
3.3—Module Replacement.......................................................................................................................... 26
3.4—Latent Fault Detection ........................................................................................................................ 26
CHAPTER 4. CHASSIS CONFIGURATIONS.......................................................................................27
4.1—MicroNet Plus 14-Slot Chassis........................................................................................................... 27
CHAPTER 5. POWER SUPPLIES .....................................................................................................41
5.1—MicroNet Plus Chassis Power Supplies ............................................................................................. 41
5.2—Simplex Expansion Power Supplies................................................................................................... 46
5.3—Simplex Power Supply Module Specifications ................................................................................... 47
5.4—Installation .......................................................................................................................................... 49
5.5—Power Supply Troubleshooting .......................................................................................................... 51
CHAPTER 6. CPUS.......................................................................................................................53
6.1-Network Topologies .............................................................................................................................. 53
6.2—CPU P1020 Module............................................................................................................................ 56
6.3—PowerPC CPU5200 Module (Motorola) ............................................................................................. 63
6.4—PowerPC CPU5200L Module (Motorola) ........................................................................................... 71
6.5—Windows NT Pentium CPU Module ................................................................................................... 71
6.6—Windows NT CPU (Pentium with Dual Ethernet) Module .................................................................. 71
6.7—040 CPU Module (Motorola 68040).................................................................................................... 71
CHAPTER 7. COMMUNICATION.......................................................................................................72
7.1—Remote RTN Module.......................................................................................................................... 72
7.2—Simplex Main Transceiver (XCVR) Module........................................................................................ 81
7.3—Simplex Remote Transceiver (XCVR) Module................................................................................... 81
7.4—Simplex Transceiver Accessories ...................................................................................................... 81
7.5—Ethernet Module ................................................................................................................................. 81
7.6—SIO Module......................................................................................................................................... 81
CHAPTER 8. DISCRETE I/O MODULES............................................................................................86
8.1—Introduction......................................................................................................................................... 86
8.2—MicroNet Discrete I/O Smart-Plus Module (HDDIO) .......................................................................... 86
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 2
8.3—48/24 Discrete Combo Module (HDD)................................................................................................ 95
8.4—48 Channel Discrete Input Module ..................................................................................................... 96
8.5—32 Channel Discrete Output Module ................................................................................................ 100
8.6—64 Channel Discrete Output Module ................................................................................................ 100
CHAPTER 9. ANALOG I/O MODULES............................................................................................103
9.1—Introduction....................................................................................................................................... 103
9.2— Combination I/O Modules................................................................................................................ 103
9.3—24/8 Analog Module.......................................................................................................................... 103
9.4—Dataforth 24/8 Analog Module.......................................................................................................... 103
9.5—Analog Combo Module..................................................................................................................... 103
9.6—34Ch High Density Versatile Input Module (HDVIM) ....................................................................... 103
9.7—Current Input Modules...................................................................................................................... 103
9.8—8Ch Current Input (4-20 mA) Module ............................................................................................... 103
9.9—Non-Standard 8Ch Current Input (4-20 mA) Module ....................................................................... 103
9.10—Voltage Input Module ..................................................................................................................... 103
9.11—8 Channel Voltage Input (0-10 Vdc) Module .................................................................................. 103
9.12—Current Output Modules ................................................................................................................. 104
9.13—8Ch Current Output (4-20 mA) Module .......................................................................................... 104
9.14—8Ch Current Output (0–1 mA) Module ........................................................................................... 104
9.15—Voltage Output Modules................................................................................................................. 104
9.16—8Ch Voltage Output (0-5 Vdc ) Module .......................................................................................... 104
9.17—8Ch Voltage Output (0-10 Vdc) Module ......................................................................................... 104
9.18—Thermocouple Input Modules......................................................................................................... 104
9.19—8Ch TC (Fail Low) Module ............................................................................................................. 104
9.20—8Ch TC (Fail High) Module............................................................................................................. 104
9.21—RTD Input Modules......................................................................................................................... 104
9.22—8Ch RTD Input (10 ohm) ................................................................................................................ 104
9.23—8Ch RTD Input (100 ohm) .............................................................................................................. 104
9.24—8Ch RTD Input (200 ohm) .............................................................................................................. 104
9.25—8Ch RTD Input (500 ohm) .............................................................................................................. 104
9.26—4Ch MPU/Proximity Module ........................................................................................................... 104
9.27—Speed Sensor Smart-Plus Module ................................................................................................. 105
9.28—24/8 Analog Smart Plus Module..................................................................................................... 109
9.29—Speed/Analog IO Combo Smart-Plus Module................................................................................ 116
REVISION HISTORY.....................................................................................................................127
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 3
Illustrations and Tables
Figure 2-1. MicroNet Plus Redundant System............................................................................................ 14
Figure 2-2. Input Flow ................................................................................................................................. 15
Figure 2-3. Output Flow .............................................................................................................................. 15
Figure 2-4. Redundant Sensors.................................................................................................................. 15
Figure 2-5. Redundant Inputs ..................................................................................................................... 16
Figure 2-6. MicroNet Plus Simplex System Diagrams ................................................................................ 18
Figure 2-7. Input Flow ................................................................................................................................. 18
Figure 2-8. Output Flow .............................................................................................................................. 19
Figure 2-9. Redundant Sensors.................................................................................................................. 19
Figure 2-10. Redundant Inputs ................................................................................................................... 19
Figure 2-11. CHAS_STAT Block................................................................................................................. 21
Figure 3-1. MicroNet Simplex System Diagrams ........................................................................................ 23
Figure 3-2. Input Flow ................................................................................................................................. 24
Figure 3-3. Output Flow .............................................................................................................................. 24
Figure 3-4. Redundant Sensors.................................................................................................................. 24
Figure 3-5. Redundant Inputs ..................................................................................................................... 25
Figure 4-1. MicroNet Plus 14-Slot I/O Chassis ........................................................................................... 27
Figure 4-2. MicroNet Plus 14-Slot Chassis ................................................................................................. 28
Figure 4-3. Outline Drawing of MicroNet Plus Chassis............................................................................... 30
Figure 4-4. Mounting Template of MicroNet Plus 14-Slot I/O Chassis ....................................................... 31
Figure 4-5. MicroNet Plus 8-Slot I/O Chassis ............................................................................................. 31
Figure 4-6. MicroNet Plus 8-Slot Chassis ................................................................................................... 32
Figure 4-7. Outline Drawing of MicroNet Plus 8-Slot Chassis .................................................................... 34
Figure 4-8. Mounting Template of MicroNet Plus 8-Slot I/O Chassis ......................................................... 34
Figure 4-9. Simplex MicroNet 6-Slot I/O ..................................................................................................... 35
Figure 4-10. Outline Drawing of MicroNet 6-Slot I/O .................................................................................. 36
Figure 4-11. Mounting Template of MicroNet 6-Slot I/O Chassis ............................................................... 37
Figure 4-12. Simplex MicroNet 12-Slot I/O ................................................................................................. 38
Figure 4-13. Outline Drawing of MicroNet 12-Slot I/O ................................................................................ 39
Figure 4-14. Mounting Template of MicroNet 12-Slot I/O Chassis ............................................................. 40
Figure 5-1. Power Supply Module............................................................................................................... 42
Figure 5-2. Power Supply Modules............................................................................................................. 47
Figure 5-3. MicroNet Power Supply ............................................................................................................ 49
Figure 6-1. Simple Teamed NIC Setup....................................................................................................... 53
Figure 6-2. Simple Un-Teamed NIC Setup ................................................................................................. 54
Figure 6-3. Teamed Network with No Direct Connection to MicroNet CPU ............................................... 55
Figure 6-4. CPU Module ............................................................................................................................. 57
Figure 6-5. Modular Configuration Switch (S2)........................................................................................... 57
Figure 6-3. CPU_P1020 Module Hardware Configuration.......................................................................... 57
Figure 6-4. CAN Communication Ports (M8 male) ..................................................................................... 61
Figure 6-5. Micronet to Valve CAN Interface .............................................................................................. 61
Figure 6-6. Example of Woodward supplied 5 Pin Standard Cable............................................................ 61
Figure 6-7. CAN Cable Specification .......................................................................................................... 62
Figure 6-8. PowerPC CPU5200 Module (Motorola) ................................................................................... 64
Figure 6-9. CPU Module Block Diagram..................................................................................................... 64
Figure 6-10. PowerPC CPU5200 Module Hardware Configuration............................................................ 65
Figure 6-11. CPU Communications Port (DB9F)........................................................................................ 68
Figure 6-12. CPU Service Port (mini-DIN6F).............................................................................................. 69
Figure 6-13. CAN Communication Ports (M12 male) ................................................................................. 69
Figure 6-14. Micronet to Valve CAN Interface ............................................................................................ 70
Figure 7-1. Remote RTN Module................................................................................................................ 73
Figure 7-2. Remote RTN Module Block Diagram ....................................................................................... 74
Figure 7-3. MicroNet Plus Redundant System (copper, 3-rack) ................................................................. 75
Figure 7-4. MicroNet Plus Redundant System (copper, 8-rack) ................................................................. 75
Figure 7-5. MicroNet Plus Redundant System (fiber, 2 locations).............................................................. 75
Figure 7-6. MicroNet Plus Redundant System (fiber, 3 locations).............................................................. 76
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 4
Figure 7-7. MicroNet Plus Redundant System (fiber, 8 locations).............................................................. 76
Figure 7-8. Remote RTN Module Hardware Configuration......................................................................... 77
Figure 7-9. RTN Service Port (mini-DIN6F) ................................................................................................ 80
Figure 7-10. SIO Module Block Diagram .................................................................................................... 82
Figure 7-11. SIO Module............................................................................................................................. 82
Figure 7-12. RS-422 Terminator Locations................................................................................................. 83
Figure 7-13. RS-485 Terminator Locations................................................................................................. 83
Figure 7-14. Termination and Cable Connection Examples ....................................................................... 84
Figure 7-15. Preferred Multipoint Wiring Using Shielded Twisted-Pair Cable with a Separate Signal
Ground Wire ........................................................................................................................... 84
Figure 7-16. Alternate Multipoint Wiring Using Shielded Twisted-Pair Cable without a Separate Signal
Ground Wire ........................................................................................................................... 85
Figure 8-1. DI/DO Field Wire Shielding Example (Non-Marine) ................................................................. 86
Figure 8-2. Discrete Combo Module (HDDIO)............................................................................................ 87
Figure 8-3. Configuration 1, One 48/24 Discrete FTM with Relay Module(s)............................................. 88
Figure 8-4. Discrete Input Interface Wiring to a 24 Vdc 48/24 Discrete FTM ............................................. 89
Figure 8-5. Relay Output Interface Wiring to a 16Ch Relay Module .......................................................... 90
Figure 8-6. Relay Output Interface Wiring to a 32Ch Relay Module .......................................................... 90
Figure 8-7. Configuration 2, Two 24/12 Discrete FTMs.............................................................................. 91
Figure 8-8. Discrete Input Interface Wiring to a 24/12 Discrete FTM ......................................................... 92
Figure 8-9. Relay Output Interface Wiring to a 24/12 Discrete FTM........................................................... 93
Figure 8-10. 48/24 Discrete Combo Module Block Diagram ...................................................................... 94
Figure 8-11. Discrete Input Module............................................................................................................. 96
Figure 8-12. 48Ch DI Module with two FTMs ............................................................................................. 97
Figure 8-13. Discrete Input Interface Wiring with Internal Power Source to a 24 Vdc Discrete Input/Output
FTM ........................................................................................................................................ 98
Figure 8-14. Discrete Input Interface Wiring with External Power Source to a Discrete Input (with LEDs)
FTM ........................................................................................................................................ 98
Figure 8-15. Discrete Input Module Block Diagram .................................................................................... 99
Figure 8-16. Discrete Output Module........................................................................................................ 100
Figure 8-17. 64Ch DO Module with Relay Modules ................................................................................. 101
Figure 8-18. Relay Output Interface Wiring to a 16Ch Relay Module ...................................................... 102
Figure 8-19. Relay Output Interface Wiring to a 32Ch Relay Module ...................................................... 102
Figure 9-1. Speed Sensor Smart-Plus Module ......................................................................................... 106
Figure 9-2. Ch MPU/Eddy Module ............................................................................................................ 107
Figure 9-3. MPU and Eddy Probe Interface Wiring .................................................................................. 107
Figure 9-4. Digital Speed Sensor Module Block Diagram ........................................................................ 108
Figure 9-6. 24/8 Analog Smart Plus Module ............................................................................................. 110
Figure 9-7. Simplex System Configuration Example ................................................................................ 112
Figure 9-8. Analog Input Wiring for a 24/8 Analog FTM ........................................................................... 113
Figure 9-9. Analog Output Wiring for a 24/8 Analog FTM ........................................................................ 114
Figure 9-10. Speed/Analog IO Combo Smart-Plus Module...................................................................... 119
Figure 9-11. Simplex System Configuration Example. ............................................................................. 120
Figure 9-12. MPU and Prox Probe Interface Wiring ................................................................................. 121
Figure 9-13. Analog Input Wiring for a 24/8 Analog FTM ......................................................................... 122
Figure 9-14. Analog Output Wiring for a 24/8 Analog FTM ...................................................................... 123
Figure 9-15. Digital Speed Sensor Module Block Diagram ...................................................................... 123
Table 2-1. MicroNet Plus Configurations .................................................................................................... 13
Table 3-1. MicroNet Simplex Configurations .............................................................................................. 22
Table 5-1. Main PS (24 Vdc Input).............................................................................................................. 42
Table 5-2. Main PS (110 Vac/dc Input)....................................................................................................... 43
Table 5-3. Main PS (220 Vac Input)............................................................................................................ 43
Table 5-1. MicroNet Plus Power Supply Requirements.............................................................................. 44
Table 5-5. Simplex Power Supply Module Specifications........................................................................... 47
Table 6-1. CPU P1020 Module Front Panel LEDs ..................................................................................... 58
Table 6-2- CAN Network Trunk Line Specifications ................................................................................... 61
Table 6-3. Recommended Bulk Cable ........................................................................................................ 62
Table 6-4. CPU Fault LED Flash Codes ..................................................................................................... 63
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 5
Table 6-5. PowerPC CPU5200 Module Front Panel LEDs......................................................................... 66
Table 6-6. CAN Network Trunk Line Specifications.................................................................................... 69
Table 6-7. CAN Cable Specification ........................................................................................................... 70
Table 6-8. Recommended Bulk Cable ........................................................................................................ 70
Table 6-9. CPU Fault LED Flash Codes ..................................................................................................... 71
Table 7-1. System Redundancy Options Using Remote RTN Modules ..................................................... 74
Table 7-2. Remote RTN Module Front Panel LED’s................................................................................... 78
Table 7-3. RTN Fault LED Flash Codes ..................................................................................................... 81
Table 7-4. Module Specification.................................................................................................................. 83
Table 8-1. Module Specification.................................................................................................................. 87
Table 8-2—Discrete Outputs/Relay Module Configuration......................................................................... 90
Table 8-3. LED Indications of Failure.......................................................................................................... 94
Table 8-4. Module Specification.................................................................................................................. 97
Table 8-5. Module Specification................................................................................................................ 100
Table 9-1. Specification............................................................................................................................. 105
Table 9-2. LED Indications of Failure........................................................................................................ 108
Table 9-3. Module Specification................................................................................................................ 111
Table 9-2. 4–20 mA Output Ratings ......................................................................................................... 111
Table 9-3. LED Indications of Failure........................................................................................................ 114
Table 9-4. Specifications........................................................................................................................... 116
Table 9-5. Analog Input Ratings ............................................................................................................... 117
Table 9-6. 4–20 mA Output Ratings ......................................................................................................... 118
Table 9-7. LED Indications of Failure........................................................................................................ 124
The following are trademarks of Woodward, Inc.:
GAP
LINKnet
LINKnet HT
MicroNet
RTCnet
Woodward
The following are trademarks of their respective companies:
DeviceNet (Open DeviceNet Vendor Association, Inc.)
Modbus (Schneider Automation Inc.)
VxWorks (Wind River Systems, Inc.)
Windows NT (Microsoft Corporation)
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 6
Warnings and Notices
Important Definitions
This is the safety alert symbol used to alert you to potential personal injury hazards. Obey all
safety messages that follow this symbol to avoid possible injury or death.
DANGER - Indicates a hazardous situation, which if not avoided, will result in death or serious injury.
WARNING - Indicates a hazardous situation, which if not avoided, could result in death or serious
injury.
CAUTION - Indicates a hazardous situation, which if not avoided, could result in minor or moderate
injury.
NOTICE - Indicates a hazard that could result in property damage only (including damage to the
control).
IMPORTANT - Designates an operating tip or maintenance suggestion.
IOLOCK. When a CPU or I/O module fails, watchdog logic drives it
into an IOLOCK condition where all output circuits and signals are
driven to a known de-energized state as described below. The
System MUST be designed such that IOLOCK and power OFF states
will result in a SAFE condition of the controlled device.
CPU and I/O module failures will drive the module into an
IOLOCK state.
CPU failure will assert an IOLOCK signal to all modules and
expansion racks to drive them into an IOLOCK state.
Discrete outputs / relay drivers will be non-active and de-
energized.
Analog and actuator outputs will be non-active and de-energized
with zero voltage or zero current.
The IOLOCK state is asserted under various conditions including:
CPU and I/O module watchdog failures
PowerUp and PowerDown conditions
System reset and hardware/software initialization
Entering configuration mode
NOTE: Additional watchdog details and any exceptions to these
failure states are specified in the related CPU or I/O module section
of the manual.
Overspeed /
Overtemperature /
Overpressure
The engine, turbine, or other type of prime mover should be
equipped with an overspeed shutdown device to protect against
runaway or damage to the prime mover with possible personal injury,
loss of life, or property damage.
The overspeed shutdown device must be totally independent of the
prime mover control system. An overtemperature or overpressure
shutdown device may also be needed for safety, as appropriate.
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 7
Personal Protective
Equipment
The products described in this publication may present risks that
could lead to personal injury, loss of life, or property damage.
Always wear the appropriate personal protective equipment (PPE) for
the job at hand. Equipment that should be considered includes but is
not limited to:
Eye Protection
Hearing Protection
Hard Hat
Gloves
Safety Boots
Respirator
Always read the proper Material Safety Data Sheet (MSDS) for any
working fluid(s) and comply with recommended safety equipment.
Start-up
Be prepared to make an emergency shutdown when starting the
engine, turbine, or other type of prime mover, to protect against
runaway or overspeed with possible personal injury, loss of life, or
property damage.
Electrostatic Discharge Awareness
Electrostatic
Precautions
Electronic controls contain static-sensitive parts. Observe the
following precautions to prevent damage to these parts:
Discharge body static before handling the control (with power to
the control turned off, contact a grounded surface and maintain
contact while handling the control).
Avoid all plastic, vinyl, and Styrofoam (except antistatic
versions) around printed circuit boards.
Do not touch the components or conductors on a printed circuit
board with your hands or with conductive devices.
To prevent damage to electronic components caused by improper
handling, read and observe the precautions in Woodward manual
82715 , Guide for Handling and Protection of Electronic Controls,
Printed Circuit Boards, and Modules.
Follow these precautions when working with or near the control.
1. Avoid the build-up of static electricity on your body by not wearing clothing made of synthetic
materials. Wear cotton or cotton-blend materials as much as possible because these do not store
static electric charges as much as synthetics.
2. Do not remove the printed circuit board (PCB) from the control cabinet unless absolutely necessary.
If you must remove the PCB from the control cabinet, follow these precautions:
Do not touch any part of the PCB except the edges.
Do not touch the electrical conductors, the connectors, or the components with conductive
devices or with your hands.
When replacing a PCB, keep the new PCB in the plastic antistatic protective bag it comes in
until you are ready to install it. Immediately after removing the old PCB from the control cabinet,
place it in the antistatic protective bag.
External wiring connections for reverse-acting controls are identical
to those for direct-acting controls.
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 8
Regulatory Compliance
For LINKnet regulatory information, please refer to the appropriate
chapter in Volume 2 of this manual.
European Compliance for CE Marking
These listings are limited only to those units bearing the CE Marking:
EMC Directive: Declared to Directive 2014/30/EU of the European Parliament and
of the Council of 26 February 2014 on the harmonization of the laws
of the Member States relating to electromagnetic compatibility
(EMC)
Low Voltage Directive: Directive 2014/35/EU on the harmonisation of the laws of the
Member States relating to the making available on the market of
electrical equipment designed for use within certain voltage limits
ATEX – Potentially Explosive
Atmospheres Directive: Directive 2014/34/EU on the harmonisation of the laws of the
Member States relating to equipment and protective systems
intended for use in potentially explosive atmospheres
Zone 2, Category 3, Group II G, Ex nA [nL] IIC T3 X
EMC Compliance
The MicroNet Digital Control must be installed inside a metal
enclosure or cabinet to meet the EMC Directive requirements.
Reference Section 15 of manual 26166V2 for considerations
regarding the installation location and specific cabinet construction
requirements.
Other European and International Compliance
Compliance with the following European Directives or standards does not qualify this product for
application of the CE Marking:
EAC Customs Union: Certified for use in Ordinary Locations only to Technical Regulation
CU 004/2011 On the Safety of Low Voltage Equipment and CU
020/2011 On the Electromagnetic Compatibility of Technical
Equipment Declaration of Conformity Registration No: RU C-US
.AЛ32.B.02262.
North American Compliance
These listings are limited only to those units bearing the CSA identification:
CSA: CSA Listed for Class I, Division 2, Groups A, B, C, & D, T3A at 55
°C surrounding air temperature. For use in Canada and the United
States.
5441-694 DIO FTM Relay Driver rated for temperatures up to 75 °C,
Temperature Code T3A per certifcate 2314167.
Marine
American Bureau of
Shipping: Rules for Condition of Classification, Part 1 2015 Steel Vessels
Rules 1-1-4/7.7, 1-1-A3, 1-1-A4, which covers the following: Steel
Vessel (2015): 4-2-1/7.5.1, 4-2-1/7.3, 4-9-8/13, 4-9-6/23, 4-9-5/17;
Steel Vessels Under 90 Meters (295 Feet) in Length (2015):
4-7-4/3.9 Offshore Support Vessels (2015): 4-2-1/7.5.1, 4-2-1/7.3,
4-9-8/13, 4-9-6/23, 4-9-5/17
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 9
DNV/GL: Standard for Certification No. 2.4, 2006: Temperature Class A,
Humidity Class B, Vibration Class B, and EMC Class A
Enclosure protection required according to the Rules to be provided
upon installation on board.
Lloyd’s Register of Shipping: LR Type Approval Test Specification No. 1, 2002 for Environmental
Categories ENV1, ENV2
EMC Compliance
The MicroNet Digital Control must be installed inside an EMC rated
cabinet or enclosure for Marine Applications. Reference Section 15 of
manual 26166V2 for considerations regarding the installation location
and specific cabinet construction requirements.
SIL Compliance
For MiroNet Simplex and MicroNet Plus Digital Controls, SIL information may be found in manual B26728
which is not included within Volume 1 or Volume 2 of this manual.
Special Conditions for Safe Use
The 24/12 and 16-Channel Relay Interface Modules are suitable for
ordinary or non-hazardous locations only.
The MicroNet Control shall not be installed in areas exceeding Pollution
Degree 2 as defined in IEC 60664-1 and is rated to Overvoltage Category II.
This equipment is suitable for use in European Zone 2, Group IIC environments when installed in an IP54
minimum rated enclosure per self-declaration to EN60079-15.
Wiring must be in accordance with North American Class I, Division 2, or European Zone 2, Category 3
wiring methods as applicable, and in accordance with the authority having jurisdiction.
A fixed wiring installation is required.
The power supply mains should be properly fused according to the National Electrical Code. The
recommended fuse is a European Type T fuse.
Ground leakage current exceeds 3.5 mA. Verify the PE Terminal has been connected prior to applying
power to the MicroNet Control.
Grounding is required using the input PE terminal.
A switch or circuit breaker shall be included in the building installation that is in close proximity to the
equipment and within easy reach of the operator and is clearly marked as the disconnecting device for
the equipment. The switch or circuit breaker shall not interrupt the protective earth conductor.
Field wiring must be suitable for at least 80 °C for operating ambient temperatures expected to exceed 55
°C.
For ATEX compliance, this equipment must be installed in an area providing adequate protection against
the entry of dust or water. A minimum ingress protection rating of IP54 is required for the enclosure per
EN60529. The interior of the enclosure shall not be accessible in normal operation without the use of a
tool and must meet the construction requirements of IEC 60079-0.
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 10
For ATEX compliance, this equipment must be protected externally against transient disturbances.
Provisions shall be made to prevent the power input from being exceeded by transient disturbances of
more than 40% of the rated voltage.
Personnel must discharge their electrostatic build up to the cabinet ground point or use an ESD strap
prior to touching the MicroNet or modules if the engine/turbine is operational.
CPU modules contain internal energy limited circuits. These circuits have no external connections and
are not affected by module loading.
CPU modules contain single cell primary batteries. These batteries are not to be charged and are not
customer replaceable.
For environmental specifications, please refer to the appropriate appendix in Volume 2 of this manual.
This equipment is considered indicator equipment and is not to be
used as metrology equipment. All measurements need to be verified
using calibrated equipment.
EXPLOSION HAZARD—Do not connect or disconnect while circuit is
live unless area is known to be non-hazardous.
Substitution of components may impair suitability for Class I,
Division 2 applications.
Do not remove or install power supply while circuit is live unless
area is known to be non-hazardous.
Do not remove or install modules while circuit is energized unless
area is known to be non-hazardous.
RISQUE D’EXPLOSION—Ne pas raccorder ni débrancher
tant que l’installation est sous tension, sauf en cas
l’ambiance est décidément non dangereuse.
La substitution de composants peut rendre ce matériel
inacceptable pour les emplacements de Classe I,
applications Division 2.
Ne pas enlever ni installer l’alimentation électrique pendant
que le circuit est sous tension avant de s’assurer que la
zone est non dangereuse.
Ne pas enlever ni installer les cartes pendant que le circuit
est sous tension à moins de se trouver dans un
emplacement non dangereux.
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 11
Safety Symbols
Direct Current
Alternating Current
Both Alternating and Direct Current
Caution, risk of electrical shock
Caution, refer to accompanying documents
Protective conductor terminal
Frame or chassis terminal
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 12
Chapter 1.
General Information
1.1-Introduction
The MicroNet Plus and MicroNet Simplex controls are 32-bit microprocessor-based digital controllers that
are programmable for many types of applications in the control of:
Gas and Steam Turbines
Gas and Diesel Engines
Hydro Turbines
The MicroNet Controls family provide a flexible system to control any prime mover and its associated
processes such as high speed control functions, system sequencing, auxiliary system control, surge
control, monitoring and alarming, and station control. The MicroNet platform is available in simplex,
redundant, and Triple Modular Redundant (TMR) configurations. This manual covers only simplex and
redundant based control configurations. Please refer to manual 26167 for TMR-based control
configurations.
The MicroNet Operating System, together with Woodward’s Graphical Application Program (GAP),
produces a powerful control environment. Woodward’s unique rate group structure ensures that control
functions will execute deterministically at rate groups defined by the application engineer. Critical control
loops can be processed within five milliseconds. Less critical code is typically assigned to slower rate
groups. The rate group structure prevents the possibility of changing system dynamics by adding
additional code. Control is always deterministic and predictable.
Dedicated inputs and outputs (I/O) are available onboard for key control signals while distributed I/O can
be used for other less critical parameters.
Communications with the MicroNet platform are available to program and service the control as well as to
interface with other systems (Plant DCS, HMI, etc.). Application code is generated by use of Woodward’s
GAP program or Woodward’s Ladder Logic programming environment. A service interface allows the user
to view and tune system variables. Several tools are available to provide this interface (see Engineering
and Service Access). Communication protocols such as TCP/IP, OPC, Modbus, and other current
designs are included so that the user can correctly interface the control to existing or new plant level
systems.
The MicroNet platform is expandable into multiple chassis as required by the system size and will support
any mix of I/O, including networked and distributed I/O. The MicroNet control is available in chassis sizes
with 6, 8, 12, or 14 VME slots. Each has dedicated power supply and control sections located in a single
chassis. The power supply architecture supports simplex or redundant power supplies.
1.2—Specifications and Compatibility
For environmental specifications and MicroNet compatibility information, please refer to the appropriate
appendix in Volume 2 of this manual.
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 13
Chapter 2.
MicroNet Plus Systems
2.1—MicroNet Plus Redundant
The MicroNet controls family is developed around the VME chassis and a CPU module that goes into the
first active slot of the VME chassis. All I/O modules plug into the remaining slots of the VME chassis.
The MicroNet Plus chassis offers both simplex (single CPU) and redundant (dual CPU) operation with up to
14 VME slots per chassis. The system may be expanded using copper or fiber cables to multiple chassis to
accommodate additional system I/O requirements.
2.1.1—MicroNet Plus Configurations
Table 2-1. MicroNet Plus Configurations
System Config Main and Expansion rack configurations
Main Rack Optional Exp #1 Optional Exp #2
Full Redundancy Redundant CPU's Redundant RTNs Redundant RTNs
Partial Redundancy Redundant CPU's Redundant RTNs Single RTN
Partial Redundancy Redundant CPU's Single RTN Redundant RTNs
Partial Redundancy Redundant CPU's Single RTN Single RTN
Simplex Single CPU Single RTN Single RTN
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 14
MicroNet Plus
MicroNet 14 or 8 VME Slot
Chassis
Dual CPU's for redundant
operation
Single CPU for simplex
operation
CPU5200/ CPU5200L and
CPU P1020
Simplex or Redundant I/O
modules
Simplex or Redundant Power
Redundant smart fans
5
i
RS2-TX
+24V +24V*
FAULT
LA1
LA3
LA2
LA4
LA5
LA6
01
6
78
DA/STAT
13
2468
5
FAULT
12
LA7
LA8
7
P
12
34
Figure 2-1. MicroNet Plus Redundant System
2.1.2—Redundant CPU Theory
The MicroNet Plus control system uses redundant CPU5200/CPU5200L modules that must be located in
the first and last VME slots (A1 and A8 / A14). The chassis has a single motherboard and houses 2 power-
supplies, 2 CPUs, and 12 I/O slots. The CPUs share a single data path to the VME modules and each
other.
In a redundant system, there are two CPU modules, running the same application program, receiving power from
the same pins on the VME backplane, and with access to the I/O modules over the same VME bus. The CPU
modules communicate their health to each other over the VME bus, and arbitrate for control of the bus. The CPU
which is in slot 1 and in good “health” first, gains control of the I/O modules, and is called the System Controller or
SYSCON. The other CPU is then the backup or STANDBY CPU. The SYSCON sends all necessary state
information to the backup CPU, allowing it to take control of the I/O modules if the SYSCON fails.
The following conditions will cause a failover from the SYSCON CPU to the backup STANDBY CPU:
Failure of the on board CPU module power supplies
Failure of the processor core, including the processor, RAM, flash, oscillator, and supporting internal
circuitry.
A reset of the SYSCON CPU, caused by the front panel or remote Resets
An application requested failover
An application stop
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 15
2.1.3—Redundant Power Supplies
Two load sharing power supplies provide redundant power to the motherboard, CPU and I/O modules. The
MicroNet Plus power supplies are 2-slot wide each and are located at each end of the chassis in the
designated PS1 and PS2 slots.
2.1.4—Simplex Inputs and Outputs
Each I/O module has connectors on the faceplate. For analog and discrete I/O, cables connect the module
to a Field Terminal module (FTM). The FTM is used to connect to the field wiring. For communication
modules, FTMs are not used. Cables are connected directly to the faceplate of the communications module.
The following diagram shows the flow of analog and discrete inputs from the field to the application.
Figure 2-2. Input Flow
Figure 2-3. Output Flow
2.1.5—Redundant Inputs and Outputs
Two levels of redundancy are available. The first involves wiring two external input devices to two separate
input channels. See Figure 2-3. In the event of a failed sensor or a failure in the connection from the sensor
to the control, a valid input is still available
Figure 2-4. Redundant Sensors
The second level is wiring two external input devices to two separate I/O modules. See Figure 2-4. In the
event of a failure in one of the sensors, connections, cables, FTMs, or I/ O modules, a valid input is still
available.
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 16
Figure 2-5. Redundant Inputs
This process can be expanded for triplicated inputs. With triplicated inputs, redundant inputs are available if
an input fails. It is also possible to determine which input is not valid when using triplicated inputs.
2.1.6—Redundant Outputs
Redundancy can be added to the outputs as well. Additional external relays can be used to prevent a
faulted output from affecting the external device. For discrete outputs, this would require four relays for each
output. For the actuator outputs, a dual coil actuator can be used. The dual coils will allow one coil to
operate the actuator in the event of a failure.
The value of redundancy is dependent on the ability of the application to detect the failure. For analog and
actuator outputs, current and/or voltage read back is provided. For discrete outputs, fault detection requires
sensing the relay contact state.
2.2—MicroNet Plus Redundant Operation
To use the MicroNet Plus for redundant operation, a CPU must be in the first VME slot (slot A1) and a CPU
must be in the last VME slot (slot A14). In the GAP application select the MICRONET14 or MICRONET8
chassis type and place a MicroNet Plus compatible CPU module in both A1 and A14 / A8 slots.
Start-up
Load and start the application on each CPU using AppManager.
If the CPUs are started within 20 seconds of each other they will boot in the “Redundant” mode.
If the CPUs are not started within 20 seconds of each other the first CPU started will become the
master and the second CPU will have to re-sync to the running CPU.
If the applications are not the same and both CPUs are started together, CPU1 (located in slot A1) will
be the SYSCON and the backup CPU will be failed.
Normal Operation (Redundant)
Normally the CPUs will be powered up together and will start running the application within the 20
second window.
The first CPU to start running the application will remove the WATCHDOG (as indicated by the red
LED on the CPU) and become the SYSCON (as indicated by the green LED on the CPU).
When the second CPU starts running the application the SYSCON control will go to CPU1 (located in
slot A1).
Both CPUs will establish communication and CPU2 will temporarily become SYSCON (as indicated by
the green LED on the CPU) to do a diagnostic test to ensure it can drive the VME bus.
This diagnostic test will switch the SYSCON between both CPU1 and CPU2 three times before
proceeding.
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 17
After this diagnostics test is completed, the CPUs will determine if the GAP application on both CPUs is the
same.
If they have the EXACT same application CPU1 (located in slot A1) will be SYSCON and initialize the
I/O.
CPU2 will wait at a rendezvous point for the SYSCON CPU to be ready.
When the SYSCON CPU is ready it will turn out IO_LOCK (as indicated by the LED on the CPU) and
start running the GAP application.
After the SYSCON starts running the real-time code, the CPUs will start sharing data.
If the SYSCON CPU fails, the Backup CPU will take over running the GAP application and the I/O.
If the CPUs do not have the same application, CPU1 (located in slot A1) will become the SYSCON and
start up in the SIMPLEX mode (see section Only One CPU) with the Backup failed flag set to TRUE.
(see picture of CHAS_STAT block)
Single CPU operation (Simplex)
If only one CPU is started (or the second CPU is started 20 seconds after the first CPU) this CPU will
start up in the SIMPLEX mode.
When this occurs the CPU (in A1 or A14) will remove the WATCHDOG then wait 20 seconds for the
second CPU then continue with normal SYSCON start-up of initializing the I/O and running the real-
time application.
When the 2nd CPU is started, it will determine the other CPU is running and ask the SYSCON to allow
it to sync-in.
The SYSCON CPU will communicate with the BACKUP and if the BACKUP has the EXACT same
application and is functioning properly, the SYSCON will allow the BACKUP CPU to sync.
If the BACKUP syncs in correctly, the backup fault indication in the GAP will go FALSE (see Figure 2-
9).
2.3—MicroNet Plus Simplex
The MicroNet Controls family is developed around the VME chassis and a CPU module that goes into the
first active slot of the VME chassis. All I/O modules plug into the remaining slots of the VME chassis.
The MicroNet Plus chassis offers both simplex (single CPU) and redundant (dual CPU) operation with up to
14 VME slots per chassis. The system may be expanded to use multiple chassis to accommodate additional
system I/O requirements.
Released

Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 18
System Diagrams—MicroNet Plus Simplex
MicroNet Plus
MicroNet 14 or 8 VME Slot Chassis
Single CPU for simplex operation
Simplex or Redundant I/O modules
Simplex or Redundant Power
Redundant smart fans
MicroNet Plus - Simplex (2-rack)
FAN_2
FAN_1 FAN_3
FAN_4 FAN_6
CPU1
2-Slot
PS
PS1
2-Slot
PS
PS2
MicroNet Plus
- Main CPU rack
- Single CPU_5200
FAN_2FAN_1 FAN_3
FAN_4 FAN_6
RTN
A1
2-Slot
PS
PS1
2-Slot
PS
PS2
MicroNet Plus
- Expansion rack
- Single Remote RTN
RTN-1 and 2
FAN_2
FAN_1 FAN_3
FAN_4 FAN_6
RTN
A1
2-Slot
PS
PS1
2-Slot
PS
PS2
MicroNet Plus
- Expansion rack
- Single Remote RTN
FAN_2
FAN_1 FAN_3
FAN_4 FAN_6
CPU1
2-Slot
PS
PS1
2-Slot
PS
PS2
MicroNet Plus
- Main CPU rack
- Single CPU_5200
FAN_2
FAN_1 FAN_3
FAN_4 FAN_6
RTN
A1
2-Slot
PS
PS1
2-Slot
PS
PS2
MicroNet Plus
- Expansion rack
- Single Remote RTN
RTN1
SW
MicroNet Plus - Simplex (3-rack)
RTN2
SW
Figure 2-6. MicroNet Plus Simplex System Diagrams
2.3.1—Redundant Power Supplies
Two load sharing power supplies provide redundant power to the motherboard, CPU and I/O modules. The
MicroNet Plus power supplies are 2-slot wide each and are located at each end of the chassis in the
designated PS1 and PS2 slots.
2.3.2—Single CPU Options
The MicroNet Plus control system may be used in simplex mode with a single CPU module that must be
located in slot A1 of the main chassis. No other options are available.
2.3.3—Simplex Inputs and Outputs
Each I/O module has connectors on the faceplate. For analog and discrete I/O, cables connect the module
to a Field Terminal Module (FTM). The FTM is used to connect to the field wiring. For communication
modules, FTMs are not used. Cables are connected directly to the faceplate of the communications module.
The following diagram shows the flow of analog and discrete inputs from the field to the application.
Figure 2-7. Input Flow
Released