YASKAWA System 300S+ CPU 315-4PN43 User manual

CPU | 315-4PN43 | Manual
HB140 | CPU | 315-4PN43 | en | 18-02
System 300S+
SPEED7 CPU 315PN ECO

315-4PN43_000_CPU 315PN ECO,4,EN - © 2018
YASKAWA Europe GmbH
Hauptstraße 185
65760 Eschborn
Germany
Tel.: [phone]
Fax: [phone]
Email: [email protected]
Internet: www.yaskawa.eu.com

Table of contents
1 General.................................................................................................................... 6
1.1 Copyright © YASKAWA Europe GmbH............................................................ 6
1.2 About this manual............................................................................................. 7
1.3 Safety information............................................................................................. 8
2 Basics...................................................................................................................... 9
2.1 Safety information for users.............................................................................. 9
2.2 Operating structure of a CPU......................................................................... 10
2.2.1 General........................................................................................................ 10
2.2.2 Applications ................................................................................................ 10
2.2.3 Operands..................................................................................................... 10
2.3 CPU 315-4PN43............................................................................................. 12
2.4 General data................................................................................................... 14
2.4.1 Use in difficult operating conditions............................................................. 15
3 Assembly and installation guidelines................................................................ 16
3.1 Installation dimensions................................................................................... 16
3.2 Assembly standard bus.................................................................................. 17
3.3 Cabling........................................................................................................... 19
3.4 Installation guidelines..................................................................................... 20
4 Hardware description........................................................................................... 22
4.1 Properties....................................................................................................... 22
4.2 Structure......................................................................................................... 23
4.2.1 General........................................................................................................ 23
4.2.2 Interfaces..................................................................................................... 23
4.2.3 Memory management.................................................................................. 24
4.2.4 Slot for storage media................................................................................. 25
4.2.5 Battery backup for clock and RAM.............................................................. 25
4.2.6 Operating mode switch................................................................................ 25
4.2.7 LEDs............................................................................................................ 25
4.3 Technical data................................................................................................. 29
5 Deployment CPU 315-4PN43............................................................................... 37
5.1 Assembly........................................................................................................ 37
5.2 Start-up behavior............................................................................................ 37
5.3 Addressing...................................................................................................... 38
5.3.1 Overview...................................................................................................... 38
5.3.2 Addressing Backplane bus I/O devices....................................................... 38
5.4 Hardware configuration - CPU........................................................................ 40
5.5 Hardware configuration - I/O modules............................................................ 41
5.6 Hardware configuration - Ethernet PG/OP channel........................................ 42
5.7 Hardware configuration - Communication...................................................... 43
5.8 Setting standard CPU parameters.................................................................. 43
5.8.1 Parameterization via Siemens CPU............................................................ 43
5.8.2 Parameters CPU......................................................................................... 44
5.8.3 Parameters for MPI/DP .............................................................................. 47
5.9 Setting VIPA specific CPU parameters........................................................... 47
5.9.1 Proceeding.................................................................................................. 47
5.9.2 VIPA specific parameters............................................................................ 48
5.10 Project transfer............................................................................................. 49
System 300S+Table of contents
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5.10.1 Transfer via MPI........................................................................................ 49
5.10.2 Transfer via Ethernet................................................................................. 50
5.10.3 Transfer via memory card.......................................................................... 51
5.11 Accessing the web server............................................................................. 51
5.12 Operating modes.......................................................................................... 57
5.12.1 Overview.................................................................................................... 57
5.12.2 Function security....................................................................................... 59
5.13 Overall reset................................................................................................. 60
5.14 Firmware update........................................................................................... 61
5.15 Reset to factory settings............................................................................... 63
5.16 Deployment storage media - MMC, MCC..................................................... 64
5.17 Extended know-how protection.................................................................... 66
5.18 CMD - auto commands................................................................................. 67
5.19 Diagnostic entries......................................................................................... 68
5.20 Control and monitoring of variables with test functions................................ 69
6 Deployment PtP communication........................................................................ 71
6.1 Fast introduction............................................................................................. 71
6.2 Principle of the data transfer........................................................................... 72
6.3 Deployment of RS485 interface for PtP.......................................................... 73
6.4 Parametrization.............................................................................................. 74
6.4.1 FC/SFC 216 - SER_CFG - Parametrization PtP......................................... 74
6.5 Communication............................................................................................... 74
6.5.1 FC/SFC 217 - SER_SND - Send to PtP...................................................... 74
6.5.2 FC/SFC 218 - SER_RCV - Receive from PtP............................................. 75
6.6 Protocols and procedures .............................................................................. 75
6.7 Modbus - Function codes .............................................................................. 79
6.8 Modbus - Example communication................................................................ 83
7 Deployment Ethernet communication - productive.......................................... 85
7.1 Basics - Industrial Ethernet in automation...................................................... 85
7.2 Basics - ISO/OSI reference model................................................................. 86
7.3 Basics - Terms................................................................................................ 88
7.4 Basics - Protocols........................................................................................... 89
7.5 Basics - IP address and subnet...................................................................... 90
7.6 Fast introduction............................................................................................. 92
7.7 Commissioning and initialization.................................................................... 92
7.8 Hardware configuration - CPU........................................................................ 93
7.9 Configure Siemens S7 connections............................................................... 94
7.10 Configure Open Communication................................................................ 100
7.11 NCM diagnostic - Help for error diagnostic................................................. 101
8 Deployment Ethernet communication - PROFINET........................................ 104
8.1 Basics PROFINET........................................................................................ 104
8.2 PROFINET installation guidelines................................................................ 106
8.3 PROFINET system limits.............................................................................. 107
8.4 Fast introduction........................................................................................... 109
8.5 Commissioning and Initialization.................................................................. 110
8.6 Hardware configuration - CPU...................................................................... 111
8.7 Parameters - PROFINET IO controller......................................................... 112
8.7.1 Precondition............................................................................................... 112
8.7.2 PN-IO......................................................................................................... 112
System 300S+
Table of contents
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8.7.3 Port 1......................................................................................................... 113
8.8 Configuration PROFINET IO device............................................................. 114
8.9 Configuration PROFINET-I-Device / Shared-Device.................................... 115
8.10 Topology - Configuration............................................................................. 116
8.11 Device replacement without exchangeable medium/PG............................ 117
8.11.1 Replace device........................................................................................ 118
8.12 Commissioning and start-up behaviour...................................................... 119
8.13 PROFINET diagnostics.............................................................................. 120
8.13.1 Overview.................................................................................................. 120
8.13.2 Diagnostics with the configuration and engineering tool......................... 120
8.13.3 Diagnostics during runtime in the user program...................................... 120
8.13.4 Diagnostics via OB start information....................................................... 122
8.13.5 Diagnostics via status LEDs.................................................................... 123
9 Configuration with TIA Portal............................................................................ 124
9.1 TIA Portal - Work environment .................................................................... 124
9.1.1 General...................................................................................................... 124
9.1.2 Work environment of the TIA Portal.......................................................... 125
9.2 TIA Portal - Hardware configuration - CPU ................................................. 126
9.3 TIA Portal - Hardware configuration - I/O modules....................................... 127
9.4 TIA Portal - Hardware configuration - Ethernet PG/OP channel.................. 128
9.5 TIA Portal - Hardware configuration - PG/OP via PROFINET...................... 130
9.6 TIA Portal - Setting VIPA specific CPU parameters..................................... 132
9.7 TIA Portal - Yaskawa-Include library............................................................ 136
9.8 TIA Portal - Project transfer.......................................................................... 137
Appendix............................................................................................................. 139
A System specific event IDs............................................................................... 141
B Integrated blocks............................................................................................. 189
C SSL partial list................................................................................................. 193
System 300S+Table of contents
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1 General
1.1 Copyright © YASKAWA Europe GmbH
This document contains proprietary information of Yaskawa and is not to be disclosed or
used except in accordance with applicable agreements.
This material is protected by copyright laws. It may not be reproduced, distributed, or
altered in any fashion by any entity (either internal or external to Yaskawa) except in
accordance with applicable agreements, contracts or licensing, without the express
written consent of Yaskawa and the business management owner of the material.
For permission to reproduce or distribute, please contact: YASKAWA Europe GmbH,
European Headquarters, Hauptstraße 185, 65760 Eschborn, Germany
Tel.: [phone]
Fax.: [phone]
Email: [email protected]
Internet: www.yaskawa.eu.com
Every effort has been made to ensure that the information contained in
this document was complete and accurate at the time of publishing. Nev-
ertheless, the authors retain the right to modify the information.
This customer document describes all the hardware units and functions
known at the present time. Descriptions may be included for units which
are not present at the customer site. The exact scope of delivery is
described in the respective purchase contract.
Hereby, YASKAWA Europe GmbH declares that the products and systems are in compli-
ance with the essential requirements and other relevant provisions. Conformity is indi-
cated by the CE marking affixed to the product.
For more information regarding CE marking and Declaration of Conformity (DoC), please
contact your local representative of YASKAWA Europe GmbH.
VIPA, SLIO, System 100V, System 200V, System 300V, System 300S, System 400V,
System 500S and Commander Compact are registered trademarks of YASKAWA Europe
GmbH.
SPEED7 is a registered trademark of YASKAWA Europe GmbH.
SIMATIC, STEP, SINEC, TIA Portal, S7-300, S7-400 and S7-1500 are registered trade-
marks of Siemens AG.
Microsoft and Windows are registered trademarks of Microsoft Inc., USA.
Portable Document Format (PDF) and Postscript are registered trademarks of Adobe
Systems, Inc.
All other trademarks, logos and service or product marks specified herein are owned by
their respective companies.
Contact your local representative of YASKAWA Europe GmbH if you have errors or ques-
tions regarding the content of this document. You can reach YASKAWA Europe GmbH via
the following contact:
Email: [email protected]
All Rights Reserved
EC conformity declaration
Conformity Information
Trademarks
Document support
System 300S+
General
Copyright © YASKAWA Europe GmbH
HB140 | CPU | 315-4PN43 | en | 18-02 6

Contact your local representative of YASKAWA Europe GmbH if you encounter problems
or have questions regarding the product. If such a location is not available, you can reach
the Yaskawa customer service via the following contact:
YASKAWA Europe GmbH,
European Headquarters, Hauptstraße 185, 65760 Eschborn, Germany
Tel.: [phone] (hotline)
Email: [email protected]
1.2 About this manual
This manual describes the SPEED7 CPU 315-4PN43 of the System 300S from Yaskawa.
It contains a description of the construction, project implementation and usage.
Product Order no. as of state:
CPU-HW CPU-FW PN-IO controller-FW
CPU 315PN ECO 315-4PN43 01 V3.7.5 V1.1.2
The manual is targeted at users who have a background in automation technology.
The manual consists of chapters. Every chapter provides a self-contained description of a
specific topic.
The following guides are available in the manual:
nAn overall table of contents at the beginning of the manual
nReferences with page numbers
The manual is available in:
nprinted form, on paper
nin electronic form as PDF-file (Adobe Acrobat Reader)
Important passages in the text are highlighted by following icons and headings:
DANGER!
Immediate or likely danger. Personal injury is possible.
CAUTION!
Damages to property is likely if these warnings are not heeded.
Supplementary information and useful tips.
Technical support
Objective and contents
Target audience
Structure of the manual
Guide to the document
Availability
Icons Headings
System 300S+General
About this manual
HB140 | CPU | 315-4PN43 | en | 18-02 7

1.3 Safety information
The system is constructed and produced for:
ncommunication and process control
ngeneral control and automation tasks
nindustrial applications
noperation within the environmental conditions specified in the technical data
ninstallation into a cubicle
DANGER!
This device is not certified for applications in
– in explosive environments (EX-zone)
The manual must be available to all personnel in the
nproject design department
ninstallation department
ncommissioning
noperation
CAUTION!
The following conditions must be met before using or commis-
sioning the components described in this manual:
– Hardware modifications to the process control system should only be
carried out when the system has been disconnected from power!
– Installation and hardware modifications only by properly trained per-
sonnel.
– The national rules and regulations of the respective country must be
satisfied (installation, safety, EMC ...)
National rules and regulations apply to the disposal of the unit!
Applications conforming
with specifications
Documentation
Disposal
System 300S+
General
Safety information
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2 Basics
2.1 Safety information for users
The modules make use of highly integrated components in MOS-Technology. These com-
ponents are extremely sensitive to over-voltages that can occur during electrostatic dis-
charges. The following symbol is attached to modules that can be destroyed by electro-
static discharges.
The Symbol is located on the module, the module rack or on packing material and it indi-
cates the presence of electrostatic sensitive equipment. It is possible that electrostatic
sensitive equipment is destroyed by energies and voltages that are far less than the
human threshold of perception. These voltages can occur where persons do not dis-
charge themselves before handling electrostatic sensitive modules and they can damage
components thereby, causing the module to become inoperable or unusable. Modules
that have been damaged by electrostatic discharges can fail after a temperature change,
mechanical shock or changes in the electrical load. Only the consequent implementation
of protection devices and meticulous attention to the applicable rules and regulations for
handling the respective equipment can prevent failures of electrostatic sensitive modules.
Modules must be shipped in the original packing material.
When you are conducting measurements on electrostatic sensitive modules you should
take the following precautions:
nFloating instruments must be discharged before use.
nInstruments must be grounded.
Modifying electrostatic sensitive modules you should only use soldering irons with
grounded tips.
CAUTION!
Personnel and instruments should be grounded when working on electro-
static sensitive modules.
Handling of electrostatic
sensitive modules
Shipping of modules
Measurements and altera-
tions on electrostatic sen-
sitive modules
System 300S+Basics
Safety information for users
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2.2 Operating structure of a CPU
2.2.1 General
The CPU contains a standard processor with internal program memory. In combination
with the integrated SPEED7 technology the unit provides a powerful solution for process
automation applications within the System 300S family. A CPU supports the following
modes of operation:
ncyclic operation
ntimer processing
nalarm controlled operation
npriority based processing
Cyclicprocessing represents the major portion of all the processes that are executed in
the CPU. Identical sequences of operations are repeated in a never-ending cycle.
Where a process requires control signals at constant intervals you can initiate certain
operations based upon a timer, e.g. not critical monitoring functions at one-second inter-
vals.
If a process signal requires a quick response you would allocate this signal to an alarm
controlled procedure. An alarm can activate a procedure in your program.
The above processes are handled by the CPU in accordance with their priority. Since a
timer or an alarm event requires a quick reaction, the CPU will interrupt the cyclic pro-
cessing when these high-priority events occur to react to the event. Cyclic processing will
resume, once the reaction has been processed. This means that cyclic processing has
the lowest priority.
2.2.2 Applications
The program that is present in every CPU is divided as follows:
nSystem routine
nUser application
The system routine organizes all those functions and procedures of the CPU that are not
related to a specific control application.
This consists of all the functions that are required for the processing of a specific control
application. The operating modules provide the interfaces to the system routines.
2.2.3 Operands
The following series of operands is available for programming the CPU:
nProcess image and periphery
nBit memory
nTimers and counters
nData blocks
Cyclic processing
Timer processing
Alarm controlled pro-
cessing
Priority based processing
System routine
User application
System 300S+
Basics
Operating structure of a CPU > Operands
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The user application can quickly access the process image of the inputs and outputs PIO/
PII. You may manipulate the following types of data:
nindividual Bits
nBytes
nWords
nDouble words
You may also gain direct access to peripheral modules via the bus from user application.
The following types of data are available:
nBytes
nWords
nBlocks
The bit memory is an area of memory that is accessible by means of certain operations.
Bit memory is intended to store frequently used working data.
You may access the following types of data:
nindividual Bits
nBytes
nWords
nDouble words
In your program you may load cells of the timer with a value between 10ms and 9990s.
As soon as the user application executes a start-operation, the value of this timer is
decremented by the interval that you have specified until it reaches zero.
You may load counter cells with an initial value (max. 999) and increment or decrement
these when required.
A data block contains constants or variables in the form of bytes, words or double words.
You may always access the current data block by means of operands.
You may access the following types of data:
nindividual Bits
nBytes
nWords
nDouble words
Process image and
periphery
Bit Memory
Timers and counters
Data Blocks
System 300S+Basics
Operating structure of a CPU > Operands
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2.3 CPU 315-4PN43
The CPU 315-4PN43 bases upon the SPEED7 technology. This supports the CPU at pro-
gramming and communication by means of co-processors that causes a power improve-
ment for highest needs.
nThe CPU is programmed in STEPÒ7 from Siemens. For this you may use the
SIMATIC Manager or TIA Portal from Siemens. Here the instruction set of the S7-400
from Siemens is used.
nModules and CPUs of the System 300S from Yaskawa and Siemens may be used at
the bus as a mixed configuration.
nThe user application is stored in the battery buffered RAM or on an additionally plug-
gable storage module.
nThe CPU is configured as CPU 315-2 PN/DP (6ES7 315-2EH14-0AB0 V3.2) from
Siemens.
Please always use the CPU 315-2 PN/DP (6ES7 315-2EH14-0AB0 V3.2)
from Siemens of the hardware catalog to configure this CPU from
Yaskawa. For the project engineering, a thorough knowledge of the Sie-
mens SIMATIC Manager and the hardware configurator from Siemens is
required!
The CPU has an integrated memory. Information about the capacity of the memory may
be found at the front of the CPU. The memory is divided into the following parts:
nLoad memory 1MB
nCode memory (50% of the work memory)
Overview
Access
Memory
System 300S+
Basics
CPU 315-4PN43
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nData memory (50% of the work memory)
nWork memory 512kbyte
– There is the possibility to extend the work memory to its maximum printed
capacity 1MB by means of a memory extension card.
The CPU has an integrated PROFINET IO controller which is to be configured via the
PROFINET sub module in the hardware configurator from Siemens.
The CPU has an Ethernet interface for PG/OP communication. After assigning IP
address parameters with your configuration tool, via the "PLC" functions you may directly
access the Ethernet PG/OP channel and program res. remote control your CPU. You may
also access the CPU with a visualization software via these connections.
nWiring by means of spring pressure connections (CageClamps) at the front connector
nCore cross-section 0.08...2.5mm2
nTotal isolation of the wiring at module change
nPotential separation of all modules to the backplane bus
Dimensions of the basic enclosure:
n2tier width: (WxHxD) in mm: 80x125x120
The CPU comes with an integrated power supply. The power supply is to be supplied with
DC 24V. By means of the supply voltage, the internal electronic is supplied as well as the
connected modules via backplane bus. The power supply is protected against inverse
polarity and overcurrent.
Integrated PROFINET IO
controller
Integrated Ethernet PG/OP
channel
Operation Security
Dimensions/ Weight
Integrated power supply
System 300S+Basics
CPU 315-4PN43
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2.4 General data
Conformity and approval
Conformity
CE 2014/35/EU Low-voltage directive
2014/30/EU EMC directive
Approval
UL Refer to Technical data
others
RoHS 2011/65/EU Restriction of the use of certain hazardous substances in
electrical and electronic equipment
Protection of persons and device protection
Type of protection - IP20
Electrical isolation
to the field bus - electrically isolated
to the process level - electrically isolated
Insulation resistance -
Insulation voltage to reference earth
Inputs / outputs - AC / DC 50V, test voltage AC 500V
Protective measures - against short circuit
Environmental conditions to EN 61131-2
Climatic
Storage / transport EN 60068-2-14 -25…+70°C
Operation
Horizontal installation hanging EN 61131-2 0…+60°C
Horizontal installation lying EN 61131-2 0…+55°C
Vertical installation EN 61131-2 0…+50°C
Air humidity EN 60068-2-30 RH1 (without condensation, rel. humidity 10…95%)
Pollution EN 61131-2 Degree of pollution 2
Installation altitude max. - 2000m
Mechanical
Oscillation EN 60068-2-6 1g, 9Hz ... 150Hz
Shock EN 60068-2-27 15g, 11ms
System 300S+
Basics
General data
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Mounting conditions
Mounting place - In the control cabinet
Mounting position - Horizontal and vertical
EMC Standard Comment
Emitted interference EN 61000-6-4 Class A (Industrial area)
Noise immunity
zone B
EN 61000-6-2 Industrial area
EN 61000-4-2 ESD
8kV at air discharge (degree of severity 3),
4kV at contact discharge (degree of severity 2)
EN 61000-4-3 HF field immunity (casing)
80MHz … 1000MHz, 10V/m, 80% AM (1kHz)
1.4GHz ... 2.0GHz, 3V/m, 80% AM (1kHz)
2GHz ... 2.7GHz, 1V/m, 80% AM (1kHz)
EN 61000-4-6 HF conducted
150kHz … 80MHz, 10V, 80% AM (1kHz)
EN 61000-4-4 Burst, degree of severity 3
EN 61000-4-5 Surge, degree of severity 3 *
*) Due to the high-energetic single pulses with Surge an appropriate external protective circuit with lightning protection
elements like conductors for lightning and overvoltage is necessary.
2.4.1 Use in difficult operating conditions
Without additional protective measures, the products must not be used in
locations with difficult operating conditions; e.g. due to:
–dust generation
–chemically active substances (corrosive vapors or gases)
–strong electric or magnetic fields
System 300S+Basics
General data > Use in difficult operating conditions
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3 Assembly and installation guidelines
3.1 Installation dimensions
2tier width (WxHxD) in mm: 80 x 125 x 120Dimensions Basic enclo-
sure
Installation dimensions
System 300S+
Assembly and installation guidelines
Installation dimensions
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3.2 Assembly standard bus
The single modules are directly installed on a profile rail and connected via the backplane
bus connector. Before installing the modules you have to clip the backplane bus con-
nector to the module from the backside. The backplane bus connector is delivered
together with the peripheral modules.
Order number A B C
390-1AB60 160 140 10
390-1AE80 482 466 8.3
390-1AF30 530 500 15
390-1AJ30 830 800 15
390-9BC00* 2000 Drillings only left 15
*) Unit pack: 10 pieces
Measures in mm
For the communication between the modules the System 300S uses a backplane bus
connector. Backplane bus connectors are included in the delivering of the peripheral
modules and are clipped at the module from the backside before installing it to the profile
rail.
General
Profile rail
Bus connector
System 300S+Assembly and installation guidelines
Assembly standard bus
HB140 | CPU | 315-4PN43 | en | 18-02 17

Please regard the allowed environment temperatures:
1 horizontal assembly: from 0 to 60°C
2 vertical assembly: from 0 to 50°C
3 lying assembly: from 0 to 55°C
1. Bolt the profile rail with the background (screw size: M6), so that you still have min-
imum 65mm space above and 40mm below the profile rail.
2. If the background is a grounded metal or device plate, please look for a low-impe-
dance connection between profile rail and background.
3. Connect the profile rail with the protected earth conductor. For this purpose there is
a bolt with M6-thread.
4. The minimum cross-section of the cable to the protected earth conductor has to be
10mm2.
5. Stick the power supply to the profile rail and pull it to the left side to the grounding
bolt of the profile rail.
6. Fix the power supply by screwing.
7. Take a backplane bus connector and click it at the CPU from the backside like
shown in the picture.
8. Stick the CPU to the profile rail right from the power supply and pull it to the power
supply.
9. Click the CPU downwards and bolt it like shown.
10. Repeat this procedure with the peripheral modules, by clicking a backplane bus
connector, stick the module right from the modules you've already fixed, click it
downwards and connect it with the backplane bus connector of the last module and
bolt it.
Assembly possibilities
Approach
System 300S+
Assembly and installation guidelines
Assembly standard bus
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3.3 Cabling
CAUTION!
– The power supplies must be released before installation and repair
tasks, i.e. before handling with the power supply or with the cabling
you must disconnect current/voltage (pull plug, at fixed connection
switch off the concerning fuse)!
– Installation and modifications only by properly trained personnel!
For the cabling of power supply of a CPU, a green plug with CageClamp technology is
deployed. The connection clamp is realized as plug that may be clipped off carefully if it is
still cabled.
Here wires with a cross-section of 0.08mm2 to 2.5mm2 may be connected. You can use
flexible wires without end case as well as stiff wires.
1 Test point for 2mm test tip
2 Locking (orange) for screwdriver
3 Round opening for wires
The picture on the left side shows the cabling step by step from top view.
1. For cabling you push the locking vertical to the inside with a suiting screwdriver and
hold the screwdriver in this position.
2. Insert the de-isolated wire into the round opening. You may use wires with a cross-
section from 0.08mm2 to 2.5mm2
3. By removing the screwdriver the wire is connected safely with the plug connector
via a spring.
CageClamp technology
(green)
System 300S+Assembly and installation guidelines
Cabling
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3.4 Installation guidelines
The installation guidelines contain information about the interference free deployment of a
PLC system. There is the description of the ways, interference may occur in your PLC,
how you can make sure the electromagnetic compatibility (EMC), and how you manage
the isolation.
Electromagnetic compatibility (EMC) means the ability of an electrical device, to function
error free in an electromagnetic environment without being interfered respectively without
interfering the environment.
The components of Yaskawa are developed for the deployment in industrial environments
and meets high demands on the EMC. Nevertheless you should project an EMC planning
before installing the components and take conceivable interference causes into account.
Electromagnetic interferences may interfere your control via different ways:
nElectromagnetic fields (RF coupling)
nMagnetic fields with power frequency
nBus system
nPower supply
nProtected earth conductor
Depending on the spreading medium (lead bound or lead free) and the distance to the
interference cause, interferences to your control occur by means of different coupling
mechanisms.
There are:
ngalvanic coupling
ncapacitive coupling
ninductive coupling
nradiant coupling
In the most times it is enough to take care of some elementary rules to guarantee the
EMC. Please regard the following basic rules when installing your PLC.
nTake care of a correct area-wide grounding of the inactive metal parts when installing
your components.
– Install a central connection between the ground and the protected earth conductor
system.
– Connect all inactive metal extensive and impedance-low.
– Please try not to use aluminium parts. Aluminium is easily oxidizing and is there-
fore less suitable for grounding.
nWhen cabling, take care of the correct line routing.
– Organize your cabling in line groups (high voltage, current supply, signal and data
lines).
– Always lay your high voltage lines and signal respectively data lines in separate
channels or bundles.
– Route the signal and data lines as near as possible beside ground areas (e.g.
suspension bars, metal rails, tin cabinet).
General
What does EMC mean?
Possible interference
causes
Basic rules for EMC
System 300S+
Assembly and installation guidelines
Installation guidelines
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