1-2
1.3 Specications
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SYSTEM
CPU Intel®7th/ 6th Generation (Kaby Lake-S/ Skylake-S) Core™ i7/ i5/ i3,
Pentium®and Celeron®14nm LGA1151 socket processor
Chipset Intel®H110 Express Chipset
Memory 2 x DIMMs, max. 32 GB, DDR4 2400*/ 2133/ 1867 MHz, non-ECC,
un-buffered memory
Dual channel memory architecture
*2400 MHz can only be reached when a Kaby Lake processor is used.
I/O Chipset NCT6791D + F81216HD
Ethernet 1 x Intel®PHY i219V Giga LAN
1 x Intel®i211AT Giga LAN, RJ45 x 2
Audio Realtek®ALC8876-ChannelHighDenitionAudioCODEC
(Colay/ALC886)
TPM Nuvoton NPCT650ABBYX TPM2.0 onboard (optional)
Expansion slots 1 x PCIe 3.0/2.0 [x16] slot
1 x PCIe 2.0 [x4] slot (open edge)
4 x PCI slots
1 x M.2 M-key (22 x 80mm) slot for SATA
BIOS 1 x 128Mbit Flash ROM, AMI BIOS
Added Buffer IC
H/W Status Monitor Monitors CPU/chasiss temperature
Monitors Vcore/5V/3.3V/12V/3VSB/VBAT voltages
Monitors CPU/chassis fan speed
Watchdog Timer 1~255 steps by software program
Smart Fan Control CPU Fan / Chassis Fan x 2
Wake On LAN / PXE Yes ( WOL, PXE)
Power States S3, S4, S5
Graphics
Graphics Chipset Intel®HD Graphics
VGA support via RTD2168
Graphics Multi Display VGA+HDMI, VGA+DP, HDMI+DP
Resolution VGA: Up to 1920 x 1200 @60Hz (via RTD2168)
HDMI1.4: Up to 4096 x 2304 @24Hz
DP1.2: Up to 4096 x 2304 @60Hz
Environment, Power, and ME
Battery Lithium battery
Power requirement 1 x 24-pin ATX connector
1 x 8-pin (2x4) ATX 12V power connector
Operating temperature 32oF~140oF (0oC~60oC)
Storage temperature -40oF~185oF (-40oC~85oC)
Operating humidity 0%~90% relative humidity, non-condensing
Certicate CE & FCC class A
Form factor ATX form factor: 12 in. x 9.6 in. (305 mm x 244 mm)
Weight 1.76 lb (0.8 Kg)
E13195_IMBA-H110A_Guide.indb 2 2017/9/25 14:05:08