Advantech TPC-B610 User manual

User Manual
TPC-B610 電腦
Industrial Touch Panel
Computer - Modular Computing
Box with Intel® 10th Gen Core™
i CPU socket (LGA1200)

TPC-B610 User Manual ii
限用物質含有情況標示聲明書
Declaration of the Presence Condition of the Restricted Substances Marking
設備名稱 : 電腦
Equipment name
型號 ( 型式 )：
Type designation
(Type)
TPC-B610H-A00A
TPC-B610W-A00A
( 系列型號請參見次頁說明書 )
單元 Unit
限用物質及其化學符號
Restricted substances and its chemical symbols
鉛
Lead
(Pb)
汞
Mercury
(Hg)
鎘
Cadmium
(Cd)
六價鉻
Hexavalent
chromium
(Cr+6)
多溴聯苯
Polybrominated
biphenyls
(PBB)
多溴二苯醚
Polybromi-
nateddiphenyl
ethers
(PBDE)
電路板 － ○ ○ ○ ○ ○
內外殼
( 外殼、內部
框架 … 等 )
○ ○ ○ ○ ○ ○
其它固定組件
( 螺絲、夾
具、卡榫 )
－○ ○ ○ ○ ○
配件
( 排線、傳輸
線、網路線
…等)
○ ○ ○ ○ ○ ○
散熱片 － ○ ○ ○ ○ ○
備考 1. 〝超出 0.1 wt % 〞及〝超出 0.01 wt % 〞係指限用物質之百分比含量超出百分比含
量基準值
Note 1: “Exceeding 0.1 wt %” and “exceeding 0.01 wt %” indicate that the percentage con-
tent of the restricted substance exceeds the reference percentage value of presence condi-
tion.
備考 2. 〝○〞係指該項限用物質之百分比含量未超出百分比含量基準值。
Note 2: “○” indicates that the percentage content of the restricted substance does not exceed
the percentage of reference value of presence.
備考 3. 〝－〞係指該項限用物質為排除項目。
Note 3: The “−” indicates that the restricted substance corresponds to the exemption.

iii TPC-B610 User Manual
Copyright
The documentation and the software included with this product are copyrighted 2021
by Advantech Co., Ltd. All rights are reserved. Advantech Co., Ltd. reserves the right
to make improvements in the products described in this manual at any time without
notice. No part of this manual may be reproduced, copied, translated, or transmitted
in any form or by any means without the prior written permission of Advantech Co.,
Ltd. The information provided in this manual is intended to be accurate and reliable.
However, Advantech Co., Ltd. assumes no responsibility for its use, nor for any
infringements of the rights of third parties that may result from its use.
Acknowledgments
Intel and Pentium are trademarks of Intel Corporation.
Microsoft Windows and MS-DOS are registered trademarks of Microsoft Corp.
All other product names or trademarks are properties of their respective owners.
This manual covers the following models:
 TPC-B610H-A00A
 TPC-B610W-A00A
 TPC-B610H-A00AO
 TPC-B610W-A00AO
Part No. 2003B61000 Edition 1
Printed in Taiwan September 2021

TPC-B610 User Manual iv
Product Warranty (2 years)
Advantech warrants the original purchaser that each of its products will be free from
defects in materials and workmanship for two years from the date of purchase.
This warranty does not apply to any products that have been repaired or altered by
persons other than repair personnel authorized by Advantech, or products that have
been subject to misuse, abuse, accident, or improper installation. Advantech
assumes no liability under the terms of this warranty as a consequence of such
events.
Because of Advantech’s high quality-control standards and rigorous testing, most
customers never need to use our repair service. If an Advantech product is defective,
it will be repaired or replaced free of charge during the warranty period. For out-of-
warranty repairs, customers will be billed according to the cost of replacement mate-
rials, service time, and freight. Please consult your dealer for more details.
If you believe your product to be defective, follow the steps outlined below.
1. Collect all the information about the problem encountered. (For example, CPU
speed, Advantech products used, other hardware and software used, etc.) Note
anything abnormal and list any onscreen messages displayed when the prob-
lem occurs.
2. Call your dealer and describe the problem. Please have your manual, product,
and any helpful information readily available.
3. If your product is diagnosed as defective, obtain a return merchandise authori-
zation (RMA) number from your dealer. This allows us to process your return
more quickly.
4. Carefully pack the defective product, a completed Repair and Replacement
Order Card, and a proof of purchase date (such as a photocopy of your sales
receipt) into a shippable container. Products returned without a proof of pur-
chase date are not eligible for warranty service.
5. Write the RMA number clearly on the outside of the package and ship the pack-
age prepaid to your dealer.
Declaration of Conformity
CE
This product has passed the CE test for environmental specifications when shielded
cables are used for external wiring. We recommend the use of shielded cables. This
type of cable is available from Advantech. Please contact your local supplier for
ordering information.
Test conditions for passing also include the equipment being operated within an
industrial enclosure. In order to protect the product from damage caused by electro-
static discharge (ESD) and EMI leakage, we strongly recommend the use of CE-
compliant industrial enclosure products.
FCC Class A
This equipment has been tested and found to comply with the limits for a Class A dig-
ital device, pursuant to part 15 of the FCC Rules. These limits are designed to pro-
vide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can
radiate radio frequency energy and, if not installed and used in accordance with the
instruction manual, may cause harmful interference to radio communications. Opera-

v TPC-B610 User Manual
tion of this equipment in a residential area is likely to cause harmful interference. In
this event, users are required to correct the interference at their own expense.
甲類警語
警告使用者：這是甲類資訊產品，在居住的環境中使用時，可能會造成射頻干擾，在
這種情況下，使用者會被要求採取某些適當對策。
Technical Support and Assistance
1. Visit the Advantech website at www.advantech.com/support to obtain the latest
product information.
2. Contact your distributor, sales representative, or Advantech's customer service
center for technical support if you need additional assistance. Please have the
following information ready before calling:
–Product name and serial number
–Description of your peripheral attachments
–Description of your software (operating system, version, application software,
etc.)
–A complete description of the problem
–The exact wording of any error messages
Warnings, Cautions, and Notes
Warning! Warnings indicate conditions that if not observed can cause personal
injury!
Caution! Cautions are included to help prevent hardware damage and data
losses. For example,
“Batteries are at risk of exploding if incorrectly installed. Do not attempt
to recharge, force open, or heat the battery. Replace the battery only
with the same or equivalent type as recommended by the manufacturer.
Discard used batteries according to the manufacturer's instructions.”
Note! Notes provide additional optional information.
Please keep equipment away from sunlight, which may cause equip-
ment damage.

TPC-B610 User Manual vi
Packing List
Before installation, please ensure the following items have been shipped:
TPC-B610 bare-bone system x1
 4-pin power connector x 1. (P/N: 1652006277-01)
Thermal grease for CPU x 1. (P/N: 2170000093-01)
Thermal pad for Memory (Top, Channel 1) x 1. (P/N: 1990031076N000)
Thermal pad for Memory (Bottom, Channel 2) x 1. (P/N: 1990031076N000)
Thermal pad for Memory (Bottom, Channel 2, in between the MB) x 1. (P/N:
1990021847N000)
Thermal pad for M.2 (2280) x 1. (P/N: 1990037589N000)
Thermal pad for M.2 (3052/2242), mPCIe x 2. (P/N: 1990027303N000)
Please find below table for more details about the usage of the thermal pads included
in the packing list.
Ordering Information
TPC-B610H-A00A
Intel® Core™ i CPU Socket (LGA1200), PCIe x16, PCI
TPC-B610W-A00A
Intel® Core™ i CPU Socket (LGA1200), PCIe x16, PCIe x4, NVMe, RAID 0/1
*TPC-B610 is compatible with FPM-Display Module of sizes ranging from 15” to
23.8”.
Item Usage Part Number Qty Placement Dimension
(mm)
K value
Thermal pad Memory (Top,
Channel 1)
1990031076N000 1 On top of Memory
module
65 x 18 x 1.0 6
Thermal pad Memory (Bottom,
Channel 2)
1990031076N000 1 On top of Memory
module
65 x 18 x 1.0 6
Thermal pad Memory (Bottom,
Channel 2)
1990021847N000 1 In between the MB 64 x 24.5 x 2.0 6
Thermal pad M.2 (2280) 1990037589N000 1 On top of M.2
module
60 x 15 x 3.0 6
Thermal pad M.2 (3052/2242) 1990027303N000 1 On top of M.2
module
39 x 29.5 x 1.5 6
Thermal pad mPCIe 1990027303N000 1 On top of mPCIe
module
39 x 29.5 x 1.5 6
Note! Thermal pads included must be employed correctly as indicated in the
table above, and must be completely covered and secured when install-
ing.

vii TPC-B610 User Manual
Please find below the comparison between TPC-B610H-A00A and TPC-B610W-
A00A.
For more information about the optional panel module, please find "FPM-Display
Module" on Advantech’s website.
Safety Instructions
1. Read these safety instructions carefully.
2. Retain this user manual for future reference.
3. Disconnect the equipment from all power outlets before cleaning. Use only a
damp cloth for cleaning. Do not use liquid or spray detergents.
4. For pluggable equipment, the power outlet socket must be located near the
equipment and easily accessible.
5. Protect the equipment from humidity.
6. Place the equipment on a reliable surface during installation. Dropping or letting
the equipment fall may cause damage.
7. The openings on the enclosure are for air convection. Protect the equipment
from overheating. Do not cover the openings.
8. Ensure that the voltage of the power source is correct before connecting the
equipment to a power outlet.
9. Position the power cord away from high-traffic areas. Do not place anything over
the power cord.
10. All cautions and warnings on the equipment should be noted.
11. If the equipment is not used for a long time, disconnect it from the power source
to avoid damage from transient overvoltage.
12. Never pour liquid into an opening. This may cause fire or electrical shock.
13. Never open the equipment. For safety reasons, the equipment should be
opened only by qualified service personnel.
I/O & Feature TPC-B610H-A00A TPC-B610W-A00A
COM 2 2
USB 6 6
LAN 2 2
DP 1 1
Line out 1 1
mPCIe 1 1
PCIe x 16 1 1
PCIe x 4 0 1
PCI 1 0
2.5" SSD/HDD SATA 2 2
M.2 (2280) SATA 1 0
M.2 (2280) NVMe PCIe x4 0 1
M.2 (3052/3042) SATA/USB 1 1
M.2 (2242) SATA 1 1
SIM 1 1
TPM 2.0 v v
RAID 0, 1 v
ECC v

TPC-B610 User Manual viii
14. If any of the following occurs, have the equipment checked by service person-
nel:
–The power cord or plug is damaged.
–Liquid has penetrated the equipment.
–The equipment has been exposed to moisture.
–The equipment is malfunctioning, or does not operate according to the user
manual.
–The equipment has been dropped and damaged.
–The equipment shows obvious signs of breakage.
15. Do not leave the equipment in an environment with a storage temperature of
below -20 °C (-4 °F) or above 60 °C (140 °F) as this may damage the compo-
nents. The equipment should be kept in a controlled environment.
16. CAUTION: Batteries are at risk of exploding if incorrectly replaced. Replace only
with the same or equivalent type as recommended by the manufacturer. Discard
used batteries according to the manufacturer’s instructions.
17. In accordance with IEC 704-1:1982 specifications, the sound pressure level at
the operator's position does not exceed 70 dB (A).
DISCLAIMER: This set of instructions is given according to IEC 704-1. Advantech
disclaims all responsibility for the accuracy of any statements contained herein.
Caution! Danger of explosion if battery is incorrectly replaced. Replace only with
the same or equivalent type recommended by the manufacturer. Dis-
pose of used batteries according to the manufacturer's instructions.
Danger d'explosion si la pile est remplacée de façon incor- recte. Rem-
placez seulement avec le même type ou équivalent recom- mandé par
le fabricant. disposer des piles usagées selon les instructions du fabri-
cant.

ix TPC-B610 User Manual
Contents
Chapter 1 General Information ............................1
1.1 Introduction ............................................................................................... 2
1.2 Specification.............................................................................................. 2
1.2.1 General ......................................................................................... 2
1.2.2 System Hardware ......................................................................... 3
1.2.3 Safety and Environment................................................................ 3
1.2.4 OS support.................................................................................... 3
1.3 I/O Port Arrangement................................................................................ 4
Figure 1.1 I/O Port Arrangement ................................................. 4
1.4 Dimensions and Cutout............................................................................. 5
Figure 1.2 TPC-B610 Dimension................................................. 5
Chapter 2 System Setup.......................................7
2.1 Transport and Unpacking.......................................................................... 8
2.1.1 Transport....................................................................................... 8
2.1.2 Unpacking ..................................................................................... 8
Figure 2.1 Power Connector........................................................ 8
2.2 Installation ................................................................................................. 9
2.2.1 CPU/Memory (Channel 1)/M.2 (2280) .......................................... 9
Figure 2.2 Removing Top Cover, I/O Bracket.............................. 9
Figure 2.3 Removing Side Door .................................................. 9
Figure 2.4 Top View - CPU/Memory (Channel 1)/M.2 (2280).... 10
2.2.2 Memory (Channel 2)/mPCIe/M.2 (3052/2242)............................ 11
Figure 2.5 Removing Bottom Cover .......................................... 11
Figure 2.6 Top View - Memory (Channel 2)/mPCIe/M.2 (3052/
2242) ........................................................................ 11
2.2.3 HDD/SSD (2.5”)/PCI expansion/iDoor module ........................... 12
Figure 2.7 Installing PCIe/2.5” HDD/SSD .................................. 12
2.2.4 Panel Module .............................................................................. 13
Figure 2.8 Panel Module Assembly (Front View) ...................... 13
Figure 2.9 Panel Module Assembled (Front View) .................... 13
Figure 2.10Panel Module Assembly (Rear View) ....................... 13
Figure 2.11Panel Module Assembled (Rear View)..................... 14
2.3 Panel Mounting ....................................................................................... 15
Figure 2.12Panel Mounting – Positioning ................................... 15
Figure 2.13Panel Mounting – Clamps Insertion.......................... 15
Figure 2.14Panel Mounting – Clamps Fixing.............................. 16
2.4 VESA Mounting....................................................................................... 17
Figure 2.15VESA Mounting ........................................................ 17
Chapter 3 BIOS Setup.........................................19
3.1 Introduction ............................................................................................. 20
Figure 3.1 Main setup screen .................................................... 20
3.2 Entering BIOS Setup............................................................................... 21
3.2.1 Main Setup.................................................................................. 21
Figure 3.2 Main setup screen .................................................... 21
3.2.2 Advanced BIOS Features Setup................................................. 22
Figure 3.3 Advanced BIOS features setup screen .................... 22
Figure 3.4 Platform Misc Configuration ..................................... 23
Figure 3.5 CPU Configuration.................................................... 24
Figure 3.6 Power & Performance .............................................. 25

TPC-B610 User Manual x
Figure 3.7 CPU Power Management Control ............................ 25
Figure 3.8 PCH-FW Configuration............................................. 26
Figure 3.9 TPM Settings............................................................ 27
Figure 3.10ACPI Settings ........................................................... 28
Figure 3.11SMART Settings....................................................... 29
Figure 3.12Super IO Configuration............................................. 30
Figure 3.13Serial Port 1 Configuration ....................................... 30
Figure 3.14Serial Port 2 Configuration ....................................... 31
Figure 3.15PC Health Status...................................................... 32
Figure 3.16S5 RTC Wake Settings ............................................ 32
Figure 3.17Serial Port Console Redirection ............................... 33
Figure 3.18Intel TXT Information................................................ 34
Figure 3.19USB Configuration.................................................... 34
Figure 3.20Network Stack .......................................................... 35
Figure 3.21CSM Configuration ................................................... 36
Figure 3.22NVMe Configuration ................................................. 37
3.2.3 Chipset Configuration ................................................................. 38
Figure 3.23Chipset ..................................................................... 38
Figure 3.24System Agent (SA) Configuration ............................ 38
Figure 3.25Memory Configuration .............................................. 39
Figure 3.26Graphics Configuration............................................. 39
Figure 3.27Primary Display Settings .......................................... 40
Figure 3.28Internal Graphics Settings ........................................ 40
Figure 3.29PEG Port Configuration............................................ 41
Figure 3.30PCH-IO Configuration .............................................. 42
Figure 3.31PCI Express Root Port Setting ................................. 43
Figure 3.32SATA Configuration.................................................. 44
Figure 3.33USB Configuration.................................................... 45
Figure 3.34Security Configuration .............................................. 46
Figure 3.35HD Audio Configuration............................................ 47
3.2.4 Security....................................................................................... 48
Figure 3.36Secure Boot.............................................................. 49
3.2.5 Boot ............................................................................................ 50
Figure 3.37Boot .......................................................................... 50
3.2.6 Save & Exit ................................................................................. 51
Figure 3.38Save & Exit............................................................... 51
Appendix A MB I/O Connector.............................. 53
A.1 Jumper, Dip switch and Connector location............................................ 54
A.1.1 Mother Board Placement ............................................................ 54
Figure A.1 Top View of Motherboard ......................................... 54
Figure A.2 Bottom View of Motherboard.................................... 54
A.2 Jumper setting and Description .............................................................. 55
A.2.1 CMOS Clear Function (JCMOS1)............................................... 55
Table A.1: CMOS Clear Function .............................................. 55
A.3 Connector Pin Definition ......................................................................... 56
A.3.1 Mini PCIE slot (CN16)................................................................. 56
Table A.2: Mini PCIE slot (CN16) .............................................. 56
A.3.2 Power-in connector..................................................................... 57
Table A.3: Power-in connector .................................................. 57
A.3.3 LAN RJ45 connector (CN9) ........................................................ 58
Table A.4: LAN RJ45 connector (CN9)...................................... 58
A.3.4 USB3.2 connector (CN7, CN20, CN21)...................................... 58
Table A.5: USB3.2 connector .................................................... 58
A.3.5 USB 2.0 connector (CN7) ........................................................... 59
Table A.6: USB 2.0 connector ................................................... 59
A.3.6 COM1 RS232/422/485 connector (COM1)................................. 59
A.3.7 COM2 RS232/422/485 connector (COM2)................................. 59

xi TPC-B610 User Manual
A.3.8 M.2 (B-Key) Slot (CN26 PCIe/USB/SATA) ................................. 60
Table A.7: M.2 (B-Key) Slot (CN26 PCIe/USB/SATA)............... 60
A.3.9 M.2 (M-Key) Slot (CN17 NVMe/SATA Storage) ......................... 61
Table A.8: M.2 (M-Key) Slot (CN17 NVMe/SATA Storage) ....... 61

TPC-B610 User Manual xii

Chapter 1
1General Information

TPC-B610 User Manual 2
1.1 Introduction
Advantech's TPC-B610 is a performance Panel PC solution to future-proof your
Industry 4.0 applications. This modular computing box, with its fanless design, is
powered by 10th Gen. Intel Core i Socket (LGA1200), a total of 64GB DDR4, com-
prehensive I/Os including 6 x USBs, expansion via PCIe x16 and bountiful storage
through M.2 SATA/NVME and 2 x 2.5" HDD/SSD slots. TPC-B610 allows easy pair-
ing with panel modules ranging from 15" to 23.8" up to FHD resolutions.
*For the optional Panel Modules, please find ‘FPM-Display Module’ on Advantech's
official website.
Key Features
High Performance Computing Box powered by Intel® 10th Gen. Core™ i CPU
Socket (LGA1200) with fanless design.
6 x panel modules (IP66) ranging from 15" to 23.8" in selection.
Dual channel memory slots (DDR4) support up to 64GB in total
Comprehensive I/Os, including 6 x USB, 2 x COM, 2 x RJ45...etc.
Supports expansion via 1 x PCIe x16, 1 x mPCIe, 2 x M.2 (NVMe, SATA, 5G).
Supports storage via 2 x 2.5" HDD/SSD (RAID 0/1), 2 x M.2 (2242/2280).
Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technology.
Supports diverse system I/O, DIO, PoE...etc. via iDoor technology.
Supports TPM 2.0 hardware security.
1.2 Specification
1.2.1 General
BIOS: AMI UEFI BIOS
Certification: BSMI, CCC, CE, FCC Class A, CB/UL
Cooling System: Fanless design
Dimension (L x W x H): 269 mm x 224 mm x 70 mm (10.6” x 8.8” x 2.8”)
Enclosure: Die cast aluminum alloy
Mounting: VESA Mount, Desktop, Wall or Panel Mount
Power Input: 24 VDC ± 20% 9.58A
Watchdog Timer: 15-255 sec (system)
Weight (Net): 4.5kg (9.92lbs)
Power Consumption: 35.3W (Typical)
This product is intended to be supplied by IEC/UL 62368-1 listed adapter com-
plies with limited power source and rated from:24Vdc ± 20%, minimum 9.58A,
maximum operation temperature of TPC-B610 is 50°C.
Note! 1. PCI and M.2 2280 (SATA) are only for TPC-B610H-A00A.
2. PCIex4, NVMe, RAID 0/1 and ECC are only for TPC-B610W-A00A.
3. Both SKUs support iBMC via LAN B.

3 TPC-B610 User Manual
Chapter 1 General Information
1.2.2 System Hardware
CPU: Intel® Gen. 10th Core™ I CPU socket (LGA1200)
Chipset: H420E (TPC-B610H-A00A), W480E (TPC-B610W-A00A)
Memory: Dual-channel DDR4 2933/2666 MHz (TPC-B610W supports ECC)
260-pin SODIMM (up to 32GB per socket)
LAN: 2 x 10/100/1000BASE-T (LAN A: i219, LAN B: i210)
Expansion Slot:
1 x Full-size mini PCIe
1 x M.2 key-B (3052/3042)
1 x SIM card slot
Storage Slots:
1 x M.2 key-M (2280): NVMe PCIe x4 (only for TPC-B610W); SATA (only for
TPC-B610H)
1 x M.2 key-B (2242): SATA
2 x 2.5” HDD/SSD: SATA (max. 7mm)
I/O Ports:
1 x RS-232 (COM 2)
1 x RS-232/422/485 (COM1)
5 x USB 3.2 (Gen1)
1 x USB 2.0
1 x DisplayPort 1.2
1 x Audio line out/ mic in
1.2.3 Safety and Environment
1.2.3.1 Safety
FCC Class A
CE certificated
1.2.3.2 Environment
Humidity: 10~95% Relative humidity @ 40°C, non-condensing
Ingress Protection: Front panel IP66 (optional FPM-display module)
Vibration Protection: With SSD: 1 Grms (5 ~ 500 Hz) (operating, random vibra-
tion)
Operating Temperature: -10 ~ 40°C (65W CPU) & -10 ~ 50°C (35W CPU) with
0.7m/sec air flow: with 1 x Industrial SSD without PC expansion boards
Storage Temperature: -20~70°C (-4~158°F)
1.2.4 OS support
Windows 10
AdvLinux
Note! TPC-B610 supports only wide temperature (~85°C or wider) M.2 stor-
age.

TPC-B610 User Manual 4
1.3 I/O Port Arrangement
The arrangement of TPC-B610 I/O ports is shown in Figure 1.1.
A. PCI expansion slot F. Remote Power
B. 2.5” HDD/SSD slot G. RS-232, RS-232/422/485
C. DisplayPort H. RJ45
D. Power Receptor I. Audio line out/Mic in
E. USB (5 x 3.2, 1 x 2.0)
Figure 1.1 I/O Port Arrangement

5 TPC-B610 User Manual
Chapter 1 General Information
1.4 Dimensions and Cutout
Weight (Net): 4.5 kg (9.92 lbs)
Dimensions (L x W x H): 269 mm x 224 mm x 70 mm (10.6” x 8.8” x 2.8”)
Figure 1.2 TPC-B610 Dimension




TPC-B610 User Manual 6

Chapter 2
2System Setup

TPC-B610 User Manual 8
2.1 Transport and Unpacking
2.1.1 Transport
When accepting a delivery, please check the packaging for visible transport damage
and check the delivery for completeness by comparing it with your order. If you notice
any shipping damage or inconsistencies between the contents and your order,
please inform the responsible delivery service immediately.
During transportation, the TPC should be protected from excessive mechanical
stress. If the TPC is transported or stored without packaging, shocks, vibrations,
pressure, and moisture may impact the unprotected unit. Damaged packaging indi-
cates that ambient conditions have already had a massive impact on the device.
Therefore, please use the original packaging during transportation and storage.
If the TPC is transported in cold weather or is exposed to extreme variations in tem-
perature, make sure that moisture (condensation) does not build up on or inside the
HMI device. Moisture can result in short-circuits in electrical circuits and damage the
device. To avoid that, please store the TPC in a dry place and bring the TPC to room
temperature before starting it up. If condensation occurs, a delay time of approxi-
mately 12 hours must be allowed to make sure the TPC is completely dry before the
TPC is switched on.
2.1.2 Unpacking
1. Unpack the TPC-B610 package. Check the packing list at the beginning of this
manual to make sure all items have been included.
2. Connect the power connector (P/N: 1652006277-01) to the 24 VDC power lines.
The power lines can either be of some power adapter or in-house power source.
Figure 2.1 Power Connector
3. Plug the power lines into the system’s power receptor.
4. Attach power to the system.
5. Calibrate the touchscreen. (optional FPM-Display Module)