Arbor Technology EmETXe-a10M3 User manual

EmETXe-a10M3
COM Express®Basic
Type 6 CPU Module
User’s Manual
Version 1.1
2021.06

Revision History
Version Date Description
1.0 2020.04 Initial release
1.1 2021.06 Revise optional accessory items

- i -
Preface iii
Copyright Notice................................................................iii
Declaration of Conformity ................................................iii
CE..........................................................................................iii
FCC Class B.........................................................................iii
RoHS.....................................................................................iv
SVHC / REACH.....................................................................iv
Warning ...............................................................................v
Replacing the Lithium Battery...........................................v
Technical Support ..............................................................v
Warranty .............................................................................vi
Chapter 1 - Introduction 1
1.1 The Product..................................................................2
1.2 About This Manual.......................................................2
1.3 Specifications ..............................................................3
1.4 Inside the Package ......................................................4
1.5 Ordering Information...................................................4
1.5.1 Optional Accessories.................................................5
1.6 Driver(7.2A) Installation ..............................................5
Chapter 2 - Board Overview 7
2.1 What Is “COM Express®”? ..........................................8
2.2 Board Dimensions.......................................................9
2.3 Block Diagram ...........................................................10
2.4 Connector Pin Denition ..........................................11
Chapter 3 - Installation & Maintenance 15
3.1 Installing the CPU Module to Carrier Board............16
Contents

- ii -
Chapter 4 - BIOS 19
4.1 Main ............................................................................20
4.2 Advanced....................................................................22
4.2.1 AMD CBS...................................................................23
4.2.2 CPU Conguration ...................................................24
4.2.3 AMD fTPM Conguration .........................................25
4.2.4 PCI Subsystem Settings ..........................................26
4.2.5 ACPI Settings............................................................27
4.2.6 Trusted Computing...................................................28
4.2.7 NVMe Conguration.................................................29
4.2.8 USB Conguration ...................................................30
4.2.9 Network Stack Conguration ..................................32
4.2.10 Super IO Conguration..........................................33
4.2.11 H/W Monitor.............................................................36
4.2.12 Serial Port Redirection...........................................37
4.2.13 S5 RTC Wake Settings ...........................................39
4.2.14 CSM Conguration.................................................40
4.3 Chipset .......................................................................41
4.3.1 SB USB Cong..........................................................42
4.3.2 PCI-E Port..................................................................43
4.3.3 Display Conguration ..............................................44
4.5 Security ......................................................................45
4.6 Boot ............................................................................46
4.6 Save & Exit .................................................................47
Appendix 49
Appendix A: I/O Port Address Map ................................50
Appendix B: BIOS Memory Mapping .............................52
Appendix C: Interrupt Request Lines (IRQ) ..................54
Appendix D: Watchdog Timer (WDT) Setting................55
Appendix D: DIO Sample Code ......................................58
Content

- iii -
Copyright Notice
All Rights Reserved.
The information in this document is subject to change without prior notice in
order to improve the reliability, design and function. It does not represent a
commitment on the part of the manufacturer.
Under no circumstances will the manufacturer be liable for any direct, indirect,
special, incidental, or consequential damages arising from the use or inability
to use the product or documentation, even if advised of the possibility of such
damages.
This document contains proprietary information protected by copyright.
All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written
permission of the manufacturer.
Declaration of Conformity
CE
The CE symbol on your product indicates that it is in compliance with the
directives of the Union European (EU). A Certicate of Compliance is available
by contacting Technical Support.
This product has passed the CE test for environmental specications when
shielded cables are used for external wiring. We recommend the use of
shielded cables. This kind of cable is available from ARBOR. Please contact
your local supplier for ordering information.
This product has passed the CE test for environmental specications. Test
conditions for passing included the equipment being operated within an
industrial enclosure. In order to protect the product from being damaged by
ESD (Electrostatic Discharge) and EMI leakage, we strongly recommend the
use of CE-compliant industrial enclosure products.
Warning
This is a class A product. In a domestic environment this product may cause
radio interference in which case the user may be required to take adequate
measures.
FCC Class B
This device complies with Part 15 of the FCC Rules. Operation is subject to
the following two conditions:
Preface

- iv -
(1)This device may not cause harmful interference, and
(2)This device must accept any interference received, including interference
that may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference when
the equipment is operated in a commercial environment. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment in a
residential area is likely to cause harmful interference in which case the user
will be required to correct the interference at his own expense.
RoHS
ARBOR Technology Corp. certies that all components in its products are in
compliance and conform to the European Union’s Restriction of Use of Haz-
ardous Substances in Electrical and Electronic Equipment (RoHS) Directive
2002/95/EC.
The above mentioned directive was published on 2/13/2003. The main pur-
pose of the directive is to prohibit the use of lead, mercury, cadmium, hexava-
lent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl
ethers (PBDE) in electrical and electronic products. Member states of the EU
are to enforce by 7/1/2006.
ARBOR Technology Corp. hereby states that the listed products do not contain
unintentional additions of lead, mercury, hex chrome, PBB or PBDB that ex-
ceed a maximum concentration value of 0.1% by weight or for cadmium exceed
0.01% by weight, per homogenous material. Homogenous material is dened
as a substance or mixture of substances with uniform composition (such as sol-
ders, resins, plating, etc.). Lead-free solder is used for all terminations (Sn(96-
96.5%), Ag(3.0-3.5%) and Cu(0.5%)).
SVHC / REACH
To minimize the environmental impact and take more responsibility to the
earth we live, Arbor hereby conrms all products comply with the restriction
of SVHC (Substances of Very High Concern) in (EC) 1907/2006 (REACH
--Registration, Evaluation, Authorization, and Restriction of Chemicals)
regulated by the European Union.
All substances listed in SVHC < 0.1 % by weight (1000 ppm)
Preface

- v -
Warning
Single Board Computers and their components contain very delicate
Integrated Circuits (IC). To protect the Single Board Computer and its
components against damage from static electricity, you should always follow
the following precautions when handling it :
1. Disconnect your Single Board Computer from the power source when you
want to work on the inside.
2. Hold the board by the edges and try not to touch the IC chips, leads or cir-
cuitry.
3. Use a grounded wrist strap when handling computer components.
4. Place components on a grounded antistatic pad or on the bag that comes
with the Single Board Computer, whenever components are separated from
the system.
Replacing the Lithium Battery
Incorrect replacement of the lithium battery may lead to a risk of explosion.
The lithium battery must be replaced with an identical battery or a battery type
recommended by the manufacturer.
Do not throw lithium batteries into the trash-can. It must be disposed of in
accordance with local regulations concerning special waste.
Technical Support
If you have any technical di󰀩culties, please contact our website at:
https://www.arbor-technology.com
Preface

- vi -
Warranty
This product is warranted to be in good working order for a period of two years
from the date of purchase. Should this product fail to be in good working order
at any time during this period, we will, at our option, replace or repair it at no
additional charge except as set forth in the following terms. This warranty does
not apply to products damaged by misuse, modications, accident or disaster.
Vendor assumes no liability for any damages, lost prots, lost savings or any
other incidental or consequential damage resulting from the use, misuse of,
or inability to use this product. Vendor will not be liable for any claim made by
any other related party.
Vendors disclaim all other warranties, either expressed or implied, including
but not limited to implied warranties of merchantability and tness for a
particular purpose, with respect to the hardware, the accompanying product’s
manual(s) and written materials, and any accompanying hardware. This limited
warranty gives you specic legal rights.
Return authorization must be obtained from the vendor before returned
merchandise will be accepted. Authorization can be obtained by calling or
faxing the vendor and requesting a Return Merchandise Authorization (RMA)
number. Returned goods should always be accompanied by a clear problem
description.
Preface

- 1 -
Introduction
1Chapter 1
Introduction

- 2 -
Introduction
1.2 About This Manual
This user’s manual provides general information and installation instructions
about the product. This user’s manual is intended for experienced users and
integrators with hardware knowledge of personal computers. If you are not
sure about any description in this booklet. Please consult your vendor before
further handling.
1.1 The Product
The EmETXe-a10M3 is a space-conscious CPU board of 125 mm x 95 mm
to take up only small footprint in your system. By the architecture of Type
6, the board has two high-performance connectors to promise stable data
passing rate. The soldered onboard AMD Ryzen V1000 processor, along
with integrated AMD Vega Core graphics chipset bring LVDS, and DDI solu-
tion for most monitors or LCD video panels.
For system conguration, the board is supported by AMI UEFI BIOS.
EmETXe-a10M3 is an ideal choice for some demanding industrial control
and data communications by its signicant processing performance, low
power consumption and these features:
• Soldered onboard AMD V1605B/V1756B/B1807B APU Processor
• Integrated Gigabit Ethernet
• Dual Channels 24-bit LVDS or 1 x DP port, 3 x DDI ports
• Support 3 independent displays

- 3 -
Introduction
1.3 Specifications
System
CPU
Soldered onboard AMD Ryzen V1000
V1605B 2.0GHz(Base)/ 3.6GHz (Turbo) or
V1756B 3.25GHz(Base)/ 3.6GHz (Turbo) or
V1807B 3.25GHz(Base)/ 3.8GHz (Turbo)
processor
Memory 2 x DDR4 ECC SO-DIMM sockets, supporting up
to 32GB SDRAM
BIOS AMI UEFI BIOS
Watchdog Timer 1~255 levels reset
I/O
USB Port 12 x USB ports:
- 8 x USB 2.0 ports
- 4 x USB 3.1 ports
Serial Port 2 x UART ports (RX/TX only)
Expansion Bus 8 x PCIe x1 lanes
1 x PCIe x8 lane,
LPC, SPI
DIO 8-bit Digital Input/Output
Storage 2 x Serial ATA ports with 600MB/s HDD transfer
rate
Ethernet Chipset 1 x Intel®i210IT GbE controller
Audio HD audio link
TPM Supports TPM 2.0 SLB9665TT
Display
Graphic Chipset Integrated Vega Core Graphics controller
Graphic Interface Dual Channels 24-bit LVDS, with resolution up to
1920 x 1200 @60Hz
3 x DDI ports

- 4 -
Introduction
OS support Windows 10 64-bit,
Linux: Ubuntu
Mechanical & Environmental
Power Requirement 8.5V~28V 5% wide range voltage input
Power Consumption 2.39A@12V (V1605B typical)
Operating Temp. -20 ~ 70°C (-4 ~ 158°F)
Operating Humidity 10 ~ 95% @ 70ºC (non-condensing)
Dimension (L x W) 125 x 95 mm (4.9” x 3.7”)
1.4 Inside the Package
Before you begin installing your single board, please make sure that the
following materials have been shipped:
1 x EmETXe-a10M3 COM Express CPU Module
1 x Quick Installation Guide
If any of the above items is damaged or missing, contact your vendor
immediately.
1.5 Ordering Information
EmETXe-a10M3-V1605B AMD Ryzen Embedded V1000 V1605B COM
Express®Basic Type 6 CPU Module
EmETXe-a10M3-V1756B AMD Ryzen Embedded V1000 V1756B COM
Express®Basic Type 6 CPU Module
EmETXe-a10M3-V1807B AMD Ryzen Embedded V1000 V1807B COM
Express®Basic Type 6 CPU Module

- 5 -
Introduction
1.5.1 Optional Accessories
HS-10M3-C1 Heat sink with Fan, PAD (95x95x51mm)
PBE-1705-F1 COM Express®Type 6 evaluation carrier board with SIO
F71869ED module in ATX form factor
CBK-03-1705-00
Cable kit
1 x SATA cable
2 x COM Flat cables
1.6 Driver(7.2A) Installation
To install the drivers, please visit our website at www.arbor.technology.
com and download the driver pack from the product page.
Driver Path
Audio \EmETXe-a10R0\Audio\Win10_Win8.1_Win8_Win7_WHQLx64
Chipset \EmETXe-a10R0\SOC
LAN \EmETXe-a10R0\LAN

- 6 -
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- 7 -
Board Overview
2Chapter 2
Board Overview

- 8 -
Board Overview
2.1 What Is “COM Express®”?
With more and more demands on small and embedded industrial boards, a
multi-functional COM (Computer-on-Module) surfaces as a great solution.
COM Express®supports seven pin-out types applying to Basic and Extended
form factors:
Module Type 1 and 10 support single connector with two rows (220 pins).
Module Type 2, 3, 4, 5 and 6 support two connectors with four rows (440 pins).
EmETXe-a10M3 is a Type-6 module.
Di󰀨erence between Standard Type 6 and EmETXe-a10M3 is listed as
below:
Module Type Standard Type 6 EmETXe-a10M3
Connectors 2 2
Connector Rows A, B, C, D A, B, C, D
PCIe Lanes (Max) 24 24
LAN (Max) 1 1
Serial Ports (Max) 2 2
Digital Display I/F
(Max) 3 3
USB 3.0 Ports (Max) 4 4
Row AB provides pins for PCI Express, SATA, LVDS, LCD channel, LPC
bus, system and power management, VGA, LAN, and power and ground
interfaces.
Row CD provides SDVO and legacy PCI signals next to additional PCI
Express, LAN and power and ground signals. The COM are targeted at
following applications:
• Retail & Advertising
• Medical
• Test & Measurement
• Gaming & Entertainment
• Industrial & Automation
• Military & Government
• Security

- 9 -
Board Overview
2.2 Board Dimensions
(5,2)
(3,9)
(5,2)
(3,9)
95
125
4 76
4 87
4 87
52,58
62,87
2,7* 6.0
2
2
3,1
Unit: mm

- 10 -
Board Overview
2.3 Block Diagram
DDI2
DDI3
DDI1
DDI0 (DP, BOM optional, w/o LVDS)
2 x USB 3.1 ports
1 x GPCIex8
(GFX Port 0 -7)
2 x PCIex1
(From PEX8606)
2 x USB 3.1
ports
1 x USB 3.1
port2
GL3590
Hub-A
1 x USB 2.0
Port 4
3 x USB 2.0
Ports
GL3590
Hub-B
SATA0, 1 (600Gb/s, GPP port 6, 7)
HD Audio Link
5 x USB 2.0 ports
Port 0, 1, 2, 3, 5
SMBus
2 x PCIex1
lanes
2 x PCIex1
lanes
(To Connector CD)
1 x PCIex1 Gen3
(GPP port4)
PEC8606
PCIe switch
Dual Chnnels
24-bit LVDS
DDI0 (DP) CH7511B
DP to LVDS
SMBus 8-GPIO
TCA 6408A
SPI Bus
SPI Bus
SPI BIOS
2 x UART ports
WDT
LPC I/F EC IT8528E
LPC I/F
TPM 2.0
INFINEON
SLB9665TT2.0
DDR4-2400MT/s
4 x PCIex1 Gen3 (GPP port 0, 1, 2, 3, 4)
SODIMM1, 2
DDR4 SO-DIMM
sockets
1 x PCIex1 Gen3
(GPP port5)
GbE
Intel i210IT
GbE controller
AMD
Ryzen
Embedded
V1000
V1605B/
V1756B/
V1807B
Connector CD
Connector AB

- 11 -
Board Overview
2.4 Connector Pin Denition
Being a most commonly-used Type 6, the EmETXe-a10M3 features two board-
to-board connectors on bottom side.
Bottom Side
Top Side
COM Express
AB Connector
COM Express
CD Connector

- 12 -
Board Overview
COM Express AB Connector (bottom side)
B1
GND(FIXED)
B2
GBE0_ACT#
B3
LPC_FRAME#
B4
LPC_AD0
B5
LPC_AD1
B6
LPC_AD2
B7
LPC_AD3
B8
LPC_DRQ0#
B9
LPC_DRQ1#
B10
LPC_CLK
B11
GND(FIXED)
B12
PWRBTN#
B13
SMB_CK
B14
SMB_DAT
B15
SMB_ALERT#
B16
SATA1_TX+
B17
SATA1_TX-
B18
SUS_STAT#
B19
SATA1_RX+
B20
SATA1_RX-
B21
GND(FIXED)
B22
N/C
B23
N/C
B24
PWR_OK
B25
N/C
B26
N/C
B27
WDT
B28
AD/HAD_SDIN2
B29
AD/HAD_SDIN1
B30
AD/HAD_SDIN0
B31
GND(FIXED)
B32
SPKR
B33
I2C_CK
B34
I2C_DAT
B35
THRM#
B36
USB7-
B37
USB7+
B38
USB_4_5_OC#
B39
USB5-
B40
USB5+
B41
GND(FIXED)
B42
USB3-
B43
USB3+
B44
USB_0_1_OC#
B45
USB1-
B46
USB1+
B47
EXCD1_PERST#
B48
EXCD1_CPPE#
B49
SYS_RESET#
B50
CB_RESET#
B51
GND(FIXED)
B52
PCIE_RX5+
B53
PCIE_RX5-
B54
GPO1
B55
PCIE_RX4+
GND(FIXED)
A1
GBE0_MDI3-
A2
GBE0_MDI3+
A3
GBE0_LINK100#
A4
GBE0_LINK1000#
A5
GBE0_MDI2-
A6
GBE0_MDI2+
A7
N/C
A8
GBE0_MDI1-
A9
GBE0_MDI1+
A10
GND(FIXED)
A11
GBE0_MDI0-
A12
GBE0_MDI0+
A13
N/C
A14
SUS_S3#
A15
SATA0_TX+
A16
SATA0_TX-
A17
SUS_S4#
A18
SATA0_RX+
A19
SATA0_RX-
A20
GND(FIXED)
A21
N/C
A22
N/C
A23
SUS_S5#
A24
N/C
A25
N/C-
A26
BATLOW#
A27
(S)ATA_ACT#
A28
AC/HAD_SYNC
A29
AC/HAD_RST#
A30
GND(FIXED)
A31
AC/HAD_BITCLK
A32
AC/HAD_SDOUT
A33
BIOS_DIS0#
A34
THRMTRIP#
A35
USB6-
A36
USB6+
A37
USB_6_7_OC#
A38
USB4-
A39
USB4+
A40
GND(FIXED)
A41
USB2-
A42
USB2+
A43
USB_2_3_OC#
A44
USB0-
A45
USB0+
A46
VCC_RTC
A47
EXCD0_PERST#
A48
EXCD0_CPPE#
A49
LPC_SERIRQ
A50
GND(FIXED)
A51
PCIE_TX5+
A52
PCIE_TX5-
A53
GPI0
A54
PCIE_TX4+
A55
B56
PCIE_RX4-
B57
GND
B58
PCIE_RX3+
B59
PCIE_RX3-
B60
GND(FIXED)
B61
PCIE_RX2+
B62
PCIE_RX2-
B63
GPO3
B64
PCIE_RX1+
B65
PCIE_RX1-
B66
WAKE0#
B67
WAKE1#
B68
PCIE_RX0+
B69
PCIE_RX0-
B70
GND(FIXED)
B71
LVDS_B0+
B72
LVDS_B0-
B73
LVDS_B1+
B74
LVDS_B1-
B75
LVDS_B2+
B76
LVDS_B2-
B77
LVDS_B3+
B78
LVDS_B3-
B79
LVDS_BKLT_EN
B80
GND(FIXED)
B81
LVDS_B_CK+
B82
LVDS_B_CK-
B83
LVDS_BKLT_CTRL
B84
VCC_5V _SBY
B85
VCC_5V _SBY
B86
VCC_5V _SBY
B87
VCC_5V _SBY
B88
BIOS_DIS1#
B89
N/C
B90
GND(FIXED)
B91
N/C
B92
N/C
B93
N/C
B94
N/C
B95
N/C
B96
N/C
B97
SPI_CS#
B98
N/C
B99
N/C
B100
GND(FIXED)
B101
FAN_PWNOUT
B102
FAN_TACHIN
B103
SLEEP#
B104
VCC_12V
B105
VCC_12V
B106
VCC_12V
B107
VCC_12V
B108
VCC_12V
B109
VCC_12V
B110
GND(FIXED)
PCIE_TX4-
A56
GND
A57
PCIE_TX3+
A58
PCIE_TX3-
A59
GND(FIXED)
A60
PCIE_TX2+
A61
PCIE_TX2-
A62
GPI1
A63
PCIE_TX1+
A64
PCIE_TX1-
A65
GND
A66
GPI2
A67
PCIE_TX0+
A68
PCIE_TX0-
A69
GND(FIXED)
A70
LVDS_A0+
A71
LVDS_A0-
A72
LVDS_A1+
A73
LVDS_A1-
A74
LVDS_A2+
A75
LVDS_A2-
A76
LVDS_VDD_EN
A77
LVDS_A3+
A78
LVDS_A3-
A79
GND(FIXED)
A80
LVDS_A_CK+
A81
LVDS_A_CK-
A82
LVDS_I2C_CK
A83
LVDS_I2C_DAT
A84
GPI3
A85
RSVD
A86
RSVD
A87
PCIE_CLK_REF+
A88
PCIE_CLK_REF-
A89
GND(FIXED)
A90
SPI_POWER
A91
SPI_MISO
A92
GPO0
A93
SPI_CLK
A94
SPI_MOSI
A95
TPM_PP
A96
N/C
A97
SER0_TX
A98
SER0_RX
A99
GND(FIXED)
A100
SER1_TX
A101
SER1_RX
A102
LID#
A103
VCC_12V
A104
VCC_12V
A105
VCC_12V
A106
VCC_12V
A107
VCC_12V
A108
VCC_12V
A109
GND(FIXED)
A110