Arbor Technology EmETXe-i250C User manual

EmETXe-i250C
COM Express Type 6 CPU Module
User’s Manual
Version 1.1
2016.09

This page is intentionally left blank.

- I -
Index
Contents
Chapter 1 - Introduction......................................................1
1.1 Copyright Notice...........................................................................2
1.2 Declaration of Conformity ...........................................................2
1.3 About This User’s Manual ...........................................................4
1.4 Warning .........................................................................................4
1.5 Replacing the Lithium Battery.....................................................4
1.6 Technical Support ........................................................................4
1.7 Warranty ........................................................................................5
1.8 Packing List ..................................................................................6
1.9 Ordering Information....................................................................6
1.10 Specications .............................................................................7
1.11 Board Dimensions ......................................................................8
Chapter 2 - Installation........................................................9
2.1 What is “COM Express”?...........................................................10
2.2 Block Diagram ...........................................................................12
2.3 Connectors..................................................................................13
2.4 COM Express AB Connector (bottom side) .............................14
2.5 COM Express CD Connector (bottom side) ............................15
2.6 The Installation Paths of CD Driver ..........................................16
Chapter 3 - BIOS................................................................17
3.1 BIOS Main Setup.........................................................................18
3.2 Advanced Settings .....................................................................19
3.2.1 PCI Subsystem Settings......................................20
3.2.2 ACPI Settings .......................................................21
3.2.3 CPU Conguration...............................................22
3.2.4 IDE Conguration ................................................23
3.2.5 USB Conguration...............................................24
3.2.6 Super IO Conguration .......................................26
3.2.7 F71869 H/W Monitor.............................................29

- II -
Index
3.3 Chipset ........................................................................................30
3.3.1 Host Bridge Parameters ......................................31
3.3.2 SB Conguration .................................................35
3.4 Boot Settings ..............................................................................40
3.5 Security .......................................................................................41
3.6 Save & Exit..................................................................................43
3.7 AMI BIOS Checkpoints...............................................................44
3.7.1 Checkpoint Ranges .............................................44
3.7.2 Standard Checkpoints.........................................45
Appendix ............................................................................................53
Appendix A: I/O Port Address Map .................................................54
Appendix B: Interrupt Request Lines (IRQ) ...................................57
Appendix C: BIOS Memory Map......................................................58
Appendix D: Digital I/O Setting .......................................................60

- 1 -
Introduction
1Chapter 1
Introduction
Chapter 1 - Introduction

- 2 -
Introduction
1.1 Copyright Notice
All Rights Reserved.
The information in this document is subject to change without prior notice in
order to improve the reliability, design and function. It does not represent a
commitment on the part of the manufacturer.
Under no circumstances will the manufacturer be liable for any direct, indirect,
special, incidental, or consequential damages arising from the use or inability
to use the product or documentation, even if advised of the possibility of such
damages.
This document contains proprietary information protected by copyright.
All rights are reserved. No part of this manual may be reproduced by any
mechanical, electronic, or other means in any form without prior written
permission of the manufacturer.
1.2 Declaration of Conformity
CE
The CE symbol on your product indicates that it is in compliance with the
directives of the Union European (EU). A Certicate of Compliance is available
by contacting Technical Support.
This product has passed the CE test for environmental specications when
shielded cables are used for external wiring. We recommend the use of
shielded cables. This kind of cable is available from ARBOR. Please contact
your local supplier for ordering information.
This product has passed the CE test for environmental specications. Test
conditions for passing included the equipment being operated within an
industrial enclosure. In order to protect the product from being damaged by
ESD (Electrostatic Discharge) and EMI leakage, we strongly recommend the
use of CE-compliant industrial enclosure products.
Warning
This is a class A product. In a domestic environment this product may cause
radio interference in which case the user may be required to take adequate
measures.
FCC Class A
This device complies with Part 15 of the FCC Rules. Operation is subject to
the following two conditions:

- 3 -
Introduction
(1)This device may not cause harmful interference, and
(2)This device must accept any interference received, including interference
that may cause undesired operation.
NOTE:
This equipment has been tested and found to comply with the limits for a
Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are
designed to provide reasonable protection against harmful interference when
the equipment is operated in a commercial environment. This equipment
generates, uses, and can radiate radio frequency energy and, if not installed
and used in accordance with the instruction manual, may cause harmful
interference to radio communications. Operation of this equipment in a
residential area is likely to cause harmful interference in which case the user
will be required to correct the interference at his own expense.
RoHS
ARBOR Technology Corp. certies that all components in its products are in
compliance and conform to the European Union’s Restriction of Use of Haz-
ardous Substances in Electrical and Electronic Equipment (RoHS) Directive
2002/95/EC.
The above mentioned directive was published on 2/13/2003. The main pur-
pose of the directive is to prohibit the use of lead, mercury, cadmium, hexava-
lent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl
ethers (PBDE) in electrical and electronic products. Member states of the EU
are to enforce by 7/1/2006.
ARBOR Technology Corp. hereby states that the listed products do not contain
unintentional additions of lead, mercury, hex chrome, PBB or PBDB that ex-
ceed a maximum concentration value of 0.1% by weight or for cadmium exceed
0.01% by weight, per homogenous material. Homogenous material is dened
as a substance or mixture of substances with uniform composition (such as sol-
ders, resins, plating, etc.). Lead-free solder is used for all terminations (Sn(96-
96.5%), Ag(3.0-3.5%) and Cu(0.5%)).
SVHC / REACH
To minimize the environmental impact and take more responsibility to the
earth we live, Arbor hereby conrms all products comply with the restriction
of SVHC (Substances of Very High Concern) in (EC) 1907/2006 (REACH
--Registration, Evaluation, Authorization, and Restriction of Chemicals)
regulated by the European Union.
All substances listed in SVHC < 0.1 % by weight (1000 ppm)

- 4 -
Introduction
1.3 About This User’s Manual
This user’s manual provides general information and installation instructions
about the product. This User’s Manual is intended for experienced users and
integrators with hardware knowledge of personal computers. If you are not
sure about any description in this booklet. please consult your vendor before
further handling.
1.4 Warning
Single Board Computers and their components contain very delicate
Integrated Circuits (IC). To protect the Single Board Computer and its
components against damage from static electricity, you should always follow
the following precautions when handling it :
1. Disconnect your Single Board Computer from the power source when you
want to work on the inside.
2. Hold the board by the edges and try not to touch the IC chips, leads or cir-
cuitry.
3. Use a grounded wrist strap when handling computer components.
4. Place components on a grounded antistatic pad or on the bag that comes
with the Single Board Computer, whenever components are separated from
the system.
1.5 Replacing the Lithium Battery
Incorrect replacement of the lithium battery may lead to a risk of explosion.
The lithium battery must be replaced with an identical battery or a battery type
recommended by the manufacturer.
Do not throw lithium batteries into the trash-can. It must be disposed of in
accordance with local regulations concerning special waste.
1.6 Technical Support
If you have any technical difculties, please do not hesitate to call or e-mail our
customer service.
http://www.arbor-technology.com
E-mail:[e-mail]

- 5 -
Introduction
1.7 Warranty
This product is warranted to be in good working order for a period of two years
from the date of purchase. Should this product fail to be in good working order
at any time during this period, we will, at our option, replace or repair it at no
additional charge except as set forth in the following terms. This warranty does
not apply to products damaged by misuse, modications, accident or disaster.
Vendor assumes no liability for any damages, lost prots, lost savings or any
other incidental or consequential damage resulting from the use, misuse of,
or inability to use this product. Vendor will not be liable for any claim made by
any other related party.
Vendors disclaim all other warranties, either expressed or implied, including
but not limited to implied warranties of merchantability and tness for a
particular purpose, with respect to the hardware, the accompanying product’s
manual(s) and written materials, and any accompanying hardware. This limited
warranty gives you specic legal rights.
Return authorization must be obtained from the vendor before returned
merchandise will be accepted. Authorization can be obtained by calling or
faxing the vendor and requesting a Return Merchandise Authorization (RMA)
number. Returned goods should always be accompanied by a clear problem
description.

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Introduction
1.8 Packing List
1.9 Ordering Information
If any of the above items is damaged or missing, contact your vendor
immediately.
Packing List
Before you begin installing your single board, please make sure that the following
materials have been shipped:
1 x COM Express CPU Module
1 x Driver CD
1 x Quick Installation Guide
EmETXe-i250C-D25 Intel® Atom™ D2550 1.86GHz COM
Express CPU module
HS-250C-F2 Heat Spreader (95 x 95 x 11mm)
HS-250C-W1 Heatsink wave type (95 x 95 x 23.2mm)
PBE-1702 COM Express Type 6 evaluation board in
ATX form factor
CBK-04-1702-00
Cable kit
1 x SATA cable
2 x COM port cables
1 x USB cable

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Introduction
1.10 Specications
Form Factor COM Express Type 6 CPU Module
CPU Soldered onboard Intel®Atom™ D2550 1.86GHz
processor
Chipset Intel®PCH NM10
System Memory 1 x DDR3 SO-DIMM socket, supporting up to 4GB
SDRAM
Graphics Integrated Intel®GMA 3650 (Gfx frequency
640MHz)
Displays
●Support Analog RGB
●LCD: SIngle Channel 24-bit LVDS
●2 x DDI ports
Ethernet controller 1 x Intel 82583V Gigabit Ethernet controller
BIOS AMI® UEFI BIOS
Storage 2 x Serial ATA ports w/ 300MB/s HDD transfer rate
Parallel Port SPP/EPP/ECP mode selectable (via COM Express
carrier board)
Universal Serial Bus 8 x USB 2.0 ports
Expansion Interface 6 x PCIe x1 lanes
SPI, and LPC (Low Pin Count) interface
Operation Temp. -20ºC ~ 70ºC (-4ºF ~ 158ºF)
Watchdog Timer 1~ 255 levels Reset
Dimension (L x W) 95 x 95 mm (3.7” x 3.7”)

- 8 -
Introduction
1.11 Board Dimensions
Cedar View D
NM10 SB
Unit: mm
45.35
76.00
4.00
45.85
95.00
95.00
87.00
4.00
Ø2.70

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Installation
2Chapter 2
Installation
Chapter 2 - Installation

- 10 -
Installation
2.1 What is “COM Express”?
With more and more demands on small and embedded industrial boards, a
multi-functioned COM (Computer-on-Module) is the great one of the
solutions.
COM Express, board-to-board connectors consist of two rows of 220 pins
each.
Row AB, which is required, provides pins for PCI Express, SATA, LVDS, LCD
channel, LPC bus, system and power management, VGA, LAN, and power
and ground interfaces.
Row CD, which is optional, provides SDVO and legacy PCI and IDE signals
next to additional PCI Express, LAN and power and ground signals.
By the way, the target markets of COM will be focused on:
●Retail & Advertising
●Medical
●Test & Measurement
●Gaming & Entertainment
●Industrial & Automation
●Military & Government
●Security

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Installation
COM Express supports seven pin-out Type applying to Basic and Extended form
factors:
Module Type 1 and 10 support single connector with two rows of pins (220 pins).
Module Type 2, 3, 4, 5 and 6 support two connectors with four rows of pins (440 pins).
EmETXe-i250C is a Type 6 module. Connector placement and most mounting holes
have transparency between Form Factors.
Connector difference between Standard Type 6 and EmETXe-i250C is tabulated below:
Module Type Standard Type 6 EmETXe-i250C
Connector(s) 2 2
Connector Rows A, B, C, D A, B, C, D
PCIe Lanes (Max) 24 6
PEG Yes No
Serial ATA (Max) 4 2
LAN (Max) 1 1
Serial Ports 0 / 2 0
Digital Display I/F 0 / 3 2
USB 3.0 Ports 0 / 4 0

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Installation
2.2 Block Diagram
1 x PCIex1
24-bit Single Channel LVDS
DDI0 (TMDS/ DVI/DP)
DDI1 (TMDS/ DVI/DP/eDP)
Analog R.G.B.
2 x Serial ATA Port0, 1
SPI Bus
SPI Bus
2 x PCIex1
SPI BIOS
Fintek
F75111
SMBus
HD Audio Link
GbE LAN1
PCIex1 Intel 82583V
GbE controller
8 x USB ports
SMBus
LPC I/F
8-bit Digital I/O
Intel®
Atom
D2550 at
1.86GHz
1 x SO-DIMM socket
Intel®
NM10
Express
Chipset
PCH
DMIx4 for Cedarview-D
800/ 1067MHz
Single Channel DDR3
Connector CD
Connector AB
PLX PEX8606
PCIe to PCIe
Bridge
4 x PCIex1 (Gen2)

- 13 -
Installation
2.3 Connectors
Top side
COM Express CD Connector
COM Express AB Connector
NM10 SB
Cedar View D
SO-DIMM socket
Bottom side
COM Express AB Connector
COM Express CD Connector

- 14 -
Installation
2.4 COM Express AB Connector (bottom side)
B1 GND
B2 GBE0_ACT#
B3 LPC_FRAME#
B4 LPC_AD0
B5 LPC_AD1
B6 LPC_AD2
B7 LPC_AD3
B8 LPC_DRQ0#
B9 LPC_DRQ1#
B10 LPC_CLK
B11 GND
B12 PWRBTN#
B13 SMB_CK
B14 SMB_DAT
B15 SMB_ALERT#
B16 SATA1_TX+
B17 SATA1_TX-
B18 SUS_STAT#
B19 SATA1_RX+
B20 SATA1_RX-
B21 GND
B22 N/C
B23 N/C
B24 PWR_OK
B25 N/C
B26 N/C
B27 WDT
B28 AC_SDIN2
B29 AC_SDIN1
B30 AC_SDIN0
B31 GND
B32 SPKR
B33 N/C
B34 N/C
B35 THRM#
B36 USB7-
B37 USB7+
B38 USB_4_5_OC#
B39 USB5-
B40 USB5+
B41 GND
B42 USB3-
B43 USB3+
B44 USB_0_1_OC#
B45 USB1-
B46 USB1+
B47 EXCD1_PERST#
B48 EXCD1_CPPE#
B49 SYS_RESET#
B50 CB_RESET#
B51 GND
B52 PCIE_RX5+
B53 PCIE_RX5-
B54 GPO1
B55 PCIE_RX4+
GND A1
GBE0_MDI3- A2
GBE0_MDI3+ A3
GBE0_LINK100# A4
GBE0_LINK1000# A5
GBE0_MDI2- A6
GBE0_MDI2+ A7
GBE0_LINK# A8
GBE0_MDI1- A9
GBE0_MDI1+ A10
GND A11
GBE0_MDI0- A12
GBE0_MDI0+ A13
GBE0_CTREF A14
SUS_S3# A15
SATA0_TX+ A16
SATA0_TX- A17
SUS_S4# A18
SATA0_RX+ A19
SATA0_RX- A20
GND A21
N/C A22
N/C A23
SUS_S5# A24
N/C A25
N/C A26
BATLOW# A27
ATA_ACT# A28
AC_SYNC A29
AC_RST# A30
GND A31
AC_BITCLK A32
AC_SDOUT A33
BIOS_DISABLE0# A34
THRMTRIP# A35
USB6- A36
USB6+ A37
USB_6_7_OC# A38
USB4- A39
USB4+ A40
GND A41
USB2- A42
USB2+ A43
USB_2_3_OC# A44
USB0- A45
USB0+ A46
VCC_RTC A47
EXCD0_PERST# A48
EXCD0_CPPE# A49
LPC_SERIRQ A50
GND A51
PCIE_TX5+ A52
PCIE_TX5- A53
GPI0 A54
PCIE_TX4+ A55
B56 PCIE_RX4-
B57 GND
B58 PCIE_RX3+
B59 PCIE_RX3-
B60 GND
B61 PCIE_RX2+
B62 PCIE_RX2-
B63 GPO3
B64 PCIE_RX1+
B65 PCIE_RX1-
B66 WAKE0#
B67 WAKE1#
B68 PCIE_RX0+
B69 PCIE_RX0-
B70 GND
B71 N/C
B72 N/C
B73 N/C
B74 N/C
B75 N/C
B76 N/C
B77 N/C
B78 N/C
B79 LVDS_BKLT_EN
B80 GND
B81 N/C
B82 N/C
B83
CKLVDS_BKLT_CTRL
B84 VCC_5V_SBY
B85 VCC_5V_SBY
B86 VCC_5V_SBY
B87 VCC_5V_SBY
B88
BIOS_DISABLE1#
B89 VGA_RED
B90 GND
B91 VGA_GRN
B92 VGA_BLU
B93 VGA_HSYNC
B94 VGA_VSYNC
B95 VGA_I2C_CK
B96 VGA_I2C_DAT
B97 SPI_CS#
B98 N/C
B99 N/C
B100 GND
B101 FAN_PWMOUT
B102 FAN_TACHIN
B103 SLEEP#
B104 VCC_12V
B105 VCC_12V
B106 VCC_12V
B107 VCC_12V
B108 VCC_12V
B109 VCC_12V
B110 GND
PCIE_TX4- A56
GND A57
PCIE_TX3+ A58
PCIE_TX3- A59
GND A60
PCIE_TX2+ A61
PCIE_TX2- A62
GPI1 A63
PCIE_TX1+ A64
PCIE_TX1- A65
GND A66
GPI2 A67
PCIE_TX0+ A68
PCIE_TX0- A69
GND A70
LVDS_A0+ A71
LVDS_A0- A72
LVDS_A1+ A73
LVDS_A1- A74
LVDS_A2+ A75
LVDS_A2- A76
LVDS_VDD_EN A77
LVDS_A3+ A78
LVDS_A3- A79
GND A80
LVDS_A_CK+ A81
LVDS_A_CK- A82
LVDS_I2C_CK A83
LVDS_I2C_DAT A84
GPI3 A85
N/C A86
N/C A87
PCIE0_CK_REF+ A88
PCIE0_CK_REF- A89
GND A90
SPI_POWER A91
SPI_MISO A92
GPO0 A93
SPI_CLK A94
SPI_MOSI A95
GND A96
N/C A97
N/C A98
N/C A99
GND A100
N/C A101
N/C A102
LID# A103
VCC_12V A104
VCC_12V A105
VCC_12V A106
VCC_12V A107
VCC_12V A108
VCC_12V A109
GND A110

- 15 -
Installation
2.5 COM Express CD Connector (bottom side)
D1 GND (FIXED)
D2 GND
D3 N/C
D4 N/C
D5 GND
D6 N/C
D7 N/C
D8 GND
D9 N/C
D10 N/C
D11 GND (FIXED)
D12 N/C
D13 N/C
D14 GND
D15 DDI1_CTRLCLK_AUX+
D16 DDI1_CTRLCLK_AUX-
D17 RSVD
D18 RSVD
D19 N/C
D20 N/C
D21 GND(FIXED)
D22 N/C
D23 N/C
D24 RSVD
D25 RSVD
D26 DDI1_PAIR0+
D27 DDI1_PAIR0-
D28 RSVD
D29 DDI1_PAIR1+
D30 DDI1_PAIR1-
D31 GND(FIXED)
D32 DDI1_PAIR2+
D33 DDI1_PAIR2-
D34
DDI1_DDC_AUX_SEL
D35 RSVD
D36 DDI1_PAIR3+
D37 DDI1_PAIR3-
D38 RSVD
D39 DDI2_PAIR0+
D40 DDI2_PAIR0-
D41 GND(FIXED)
D42 DDI1_PAIR1+
D43 DDI1_PAIR1-
D44 DDI2_HPD
D45 RSVD
D46 DDI2_PAIR2+
D47 DDI2_PAIR2-
D48 RSVD
D49 DDI2_PAIR3+
D50 DDI2_PAIR3-
D51 GND (FIXED)
D52 N/C
D53 N/C
D54 N/C
D55 N/C
GND (FIXED) C1
GND C2
N/C C3
N/C C4
GND C5
N/C C6
N/C C7
GND C8
N/C C9
N/C C10
GND (FIXED) C11
N/C C12
N/C C13
GND C14
N/C C15
N/C C16
RSVD C17
RSVD C18
N/C C19
N/C C20
GND(FIXED) C21
N/C C22
N/C C23
DDI1_HPD C24
N/C C25
N/C C26
RSVD C27
RSVD C28
N/C C29
N/C C30
GND (FIXED) C31
DDI2_CTRLCLK_AUX+
C32
DDI2_CTRLCLK_AUX-
C33
DDI2_DDC_AUX_SEL
C34
RSVD C35
N/C
C36
N/C
C37
N/C
C38
N/C
C39
N/C
C40
GND(FIXED) C41
N/C
C42
N/C
C43
N/C
C44
RSVD C45
N/C
C46
N/C
C47
RSVD C48
N/C
C49
N/C
C50
GND (FIXED) C51
N/C
C52
N/C
C53
TYPE0# C54
N/C
C55
D56 N/C
D57 TYPE2#
D58 N/C
D59 N/C
D60 GND (FIXED)
D61 N/C
D62 N/C
D63 RSVD
D64 RSVD
D65 N/C
D66 N/C
D67 RSVD
D68 N/C
D69 N/C
D70 GND (FIXED)
D71 N/C
D72 N/C
D73 GND
D74 N/C
D75 N/C
D76 GND
D77 RSVD
D78 N/C
D79 N/C
D80 GND (FIXED)
D81 N/C
D82 N/C
D83 RSVD
D84 GND
D85 N/C
D86 N/C
D87 GND
D88 N/C
D89 N/C
D90 GND (FIXED)
D91 N/C
D92 N/C
D93 GND
D94 N/C
D95 N/C
D96 GND
D97 RSVD
D98 N/C
D99 N/C
D100 GND (FIXED)
D101 N/C
D102 N/C
D103 GND
D104 VCC_12V
D105 VCC_12V
D106 VCC_12V
D107 VCC_12V
D108 VCC_12V
D109 VCC_12V
D110 GND (FIXED)
N/C C56
TYPE1# C57
N/C C58
N/C C59
GND (FIXED) C60
N/C C61
N/C C62
RSVD C63
RSVD C64
N/C C65
N/C C66
RSVD C67
N/C C68
N/C C69
GND (FIXED) C70
N/C C71
N/C C72
GND C73
N/C C74
N/C C75
GND C76
RSVD C77
N/C C78
N/C C79
GND (FIXED) C80
N/C C81
N/C C82
RSVD C83
GND C84
N/C C85
N/C C86
GND C87
N/C C88
N/C C89
GND (FIXED) C90
N/C C91
N/C C92
GND C93
N/C C94
N/C C95
GND C96
RSVD C97
N/C C98
N/C C99
GND (FIXED) C100
N/C C101
N/C C102
GND C103
VCC_12V C104
VCC_12V C105
VCC_12V C106
VCC_12V C107
VCC_12V C108
VCC_12V C109
GND (FIXED) C110

- 16 -
Installation
2.6 The Installation Paths of CD Driver
Windows 7
Driver Path
Chipset \EmETXe-i250x\CHIPSET\WIN7
LAN \EmETXe-i250x\ETHERNET
VGA \EmETXe-i250x\GRAPHICS
Audio \EmETXe-i250x\AUDIO